TLV3011 TLV3012 SBOS300B – FEBRUARY 2004 – REVISED JUNE 2004 Nanopower, 1.8V, SOT23 Comparator with Voltage Reference FEATURES DESCRIPTION ● LOW QUIESCENT CURRENT: 5µA (max) ● INTEGRATED VOLTAGE REFERENCE: 1.242V ● INPUT COMMON-MODE RANGE: 200mV Beyond Rails ● VOLTAGE REFERENCE INITIAL ACCURACY: 1% ● OPEN-DRAIN LOGIC COMPATIBLE OUTPUT: TLV3011 ● PUSH-PULL OUTPUT: TLV3012 ● LOW-SUPPLY VOLTAGE: 1.8V to 5.5V ● FAST RESPONSE TIME: 6µs Propagation Delay with 100mV Overdrive (TLV3011: RPULL-UP = 10kΩ) ● MicroSIZE PACKAGES: SOT23-6 and SC70-6 The TLV3011 is a low-power, open-drain output comparator; the TLV3012 is a push-pull output comparator. Both feature an uncommitted on-chip voltage reference. Both have 5µA (max) quiescent current, input common-mode range 200mV beyond the supply rails, and single-supply operation from 1.8V to 5.5V. The integrated 1.242V series voltage reference offers low 100ppm/°C (max) drift, is stable with up to 10nF capacitive load, and can provide up to 0.5mA (typ) of output current. APPLICATIONS TLV3011 and TLV3012 RELATED PRODUCTS ● ● ● ● ● The TLV3011 and TLV3012 are available in the tiny SOT23-6 package for space-conservative designs. It is also available in the SC70 package for even greater board area savings. Both versions are specified for the temperature range of –40°C to +125°C. PRODUCT BATTERY-POWERED LEVEL DETECTION DATA ACQUISITION SYSTEM MONITORING OSCILLATORS SENSOR SYSTEMS: Smoke Detectors, Light Sensors, Alarms TLV349x TLV370x TLV340x OUT 1 6 V+ V− 2 5 REF IN+ 3 4 IN− FEATURES 1.2µA, 1.8V to 5.5V Push-Pull Comparator 560nA, 2.5V to 16V Push-Pull CMOS Output Comparator 550nA, 2.5V to 16V Open-Drain Comparator TLV3011 TLV3012 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage .................................................................................... +7V Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V Current(2) .................................................. ±10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –55°C to +150°C Storage Temperature ..................................................... –55°C to +150°C Junction Temperature .................................................................... +150°C Lead Temperature (soldering, 10s) ............................................... +300°C ESD Rating (Human Body Model) .................................................. 2000V NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. (2) Input terminals are diode-clamped to the power-supply rails. In put signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground. PACKAGE/ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. PIN CONFIGURATIONS Top View TLV3012AIDBV TLV3011AIDBV V− 2 IN+ 3 V− 2 IN+ 3 REF V− 2 IN− IN+ 3 5 4 SOT23-6 TLV3011AIDCK TLV3012AIDCK 6 V+ 5 4 OUT 1 REF V− 2 IN− IN+ 3 SC70-6 ALT 1 1 V+ SOT23-6 AJX OUT OUT 6 ALS 1 ALR OUT 6 V+ 5 REF 4 IN− 6 V+ 5 REF 4 IN− SC70-6 NOTE: Pin 1 is determined by orienting package marking as shown. 2 TLV3011, TLV3012 www.ti.com SBOS300B ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, VOUT = VS, unless otherwise noted; for TLV3011, RPULL-UP = 10kΩ connected to VS. TLV3011, TLV3012 PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage vs Temperature vs Power Supply VOS dVOS/dT PSRR INPUT BIAS CURRENT Input Bias Current Input Offset Current IB IOS INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio VCM CMRR MIN t(PLH) Propagation Delay Time, High-to-Low t(PHL) Rise Time, TLV3011 Rise Time, TLV3012 Fall Time OUTPUT Voltage Output Low from Rail Voltage Output High From Rail, TLV3012 Short-Circuit Current, TLV3012 VOLTAGE REFERENCE Initial Accuracy Temperature Drift Load Regulation Sourcing Sinking Output Current Line Regulation VOL 0.5 12 100 1000 mV µV/°C µV/V VCM = VS/2 VCM = VS/2 ±1 ±1 ±10 ±10 pA pA (V+) + 0.2V 74 62 V dB dB 1013 2 1013 4 Ω pF Ω pF 12 6 13.5 6.5 See Note 1 100 100 µs µs µs µs VCM = –0.2V to (V+) – 1.5V VCM = –0.2V to (V+) + 0.2V (V–) – 0.2V 60 54 f = 10kHz, VSTEP = 1V Input Overdrive = 10mV Input Overdrive = 100mV Input Overdrive = 10mV Input Overdrive = 100mV CL = 10pF CL = 10pF VS = 5V IOUT = –5mA IOUT = 5mA ns ns 160 90 See Typical Characteristics 200 200 mV mV 1.242 1.254 ±1 100 V % ppm/°C 1 mV/mA mV/mA mA µV/V VIN = 5V VOUT dVOUT/dT dVOUT/dILOAD ILOAD dVOUT/dVIN NOISE Reference Voltage Noise POWER SUPPLY Specified Voltage Operating Voltage Range Quiescent Current UNITS ±12 tR tF MAX VCM = 0V, IO = 0V TA = –40°C to +125°C VS = 1.8V to 5.5V INPUT IMPEDANCE Common-Mode Differential SWITCHING CHARACTERISTICS Propagation Delay Time, Low-to-High TYP 1.230 –40°C ≤ TA ≤ 125°C 40 0mA < ISOURCE ≤ 0.5mA 0mA < ISINK ≤ 0.5mA 1.8V ≤ VIN ≤ 5.5V 0.36 6.6 0.5 10 f = 0.1Hz to 10Hz 0.2 VS IQ 1.8 1.8 VS = 5V, VO = High TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance, θJA SOT23-6 SC70-6 2.8 –40 –55 –55 200 250 100 mVPP 5.5 5.5 5 V V µA +125 +150 +150 °C °C °C °C/W °C/W NOTE: (1) tR dependent on RPULL-UP and CLOAD. TLV3011, TLV3012 SBOS300B www.ti.com 3 TYPICAL CHARACTERISTICS At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. QUIESCENT CURRENT vs OUTPUT SWITCHING FREQUENCY QUIESCENT CURRENT vs TEMPERATURE 3.8 8 3.6 7 Quiescent Current (µA) Quiescent Current (µA) 3.4 3.2 3.0 2.8 2.6 2.4 TLV3011 RPULL-UP = 1MΩ 6 VS = 3V 5 4 3 VS = 1.8V 2 1 2.2 2.0 0 –50 –25 0 25 50 75 100 125 1 10 Temperature (°C) 100 INPUT BIAS CURRENT vs TEMPERATURE TLV3012 VS = 5V 40 Input Bias Current (pA) 12 10 VS = 3V 8 6 4 VS = 1.8V 2 35 30 25 20 15 10 5 0 0 –5 1 10 100 1k 10k –50 100k –25 0 25 50 75 100 125 Temperature (°C) Output Transition Frequency (Hz) OUTPUT LOW vs OUTPUT CURRENT OUTPUT HIGH vs OUTPUT CURRENT 0.25 0.25 TLV3012 VDD = 3V 0.20 0.20 VS = 1.8V VDD = 1.8V VS = 3V VS – VOH (V) VOL (V) 10k 45 14 0.15 VS = 5V 0.10 0.15 0.10 VDD = 5V 0.05 0.05 0 0 0 2 4 6 8 10 0 12 Output Current (mA) 4 1k Output Transition Frequency (Hz) QUIESCENT CURRENT vs OUTPUT SWITCHING FREQUENCY Quiescent Current (µA) VS = 5V 2 4 6 8 10 12 Output Current (mA) TLV3011, TLV3012 www.ti.com SBOS300B TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. PROPAGATION DELAY (tPLH) vs CAPACITIVE LOAD 80 PROPAGATION DELAY (tPHL) vs CAPACITIVE LOAD 80 TLV3012 70 70 60 60 50 tPHL (µs) tPLH (µs) 50 VS = 5V 40 VS = 3V 30 VS = 1.8V 20 VS = 3V 30 20 10 10 0 0.01 0.1 1 10 100 VS = 1.8V 0 0.01 1k 0.1 1 PROPAGATION DELAY (tPLH) vs INPUT OVERDRIVE 20 100 1k PROPAGATION DELAY (tPHL) vs INPUT OVERDRIVE 20 18 18 16 16 VS = 5V 14 tPHL (µs) 14 tPLH (µs) 10 Capacitive Load (nF) Capacitive Load (nF) 12 VS = 3V 10 VS = 1.8V 12 VS = 1.8V 10 8 8 6 6 4 4 0 10 20 30 40 50 60 70 80 90 VS = 3V VS = 5V 0 100 10 20 30 Input Overdrive (mV) 40 50 60 70 80 90 100 Input Overdrive (mV) PROPAGATION DELAY (tPLH) vs TEMPERATURE 8.0 PROPAGATION DELAY (tPHL) vs TEMPERATURE 8.0 7.5 7.5 7.0 6.5 VS = 1.8V 7.0 VS = 1.8V VS = 3V 6.5 VS = 3V tPHL (µs) tPLH (µs) VS = 5V 40 6.0 5.5 6.0 5.5 VS = 5V 5.0 5.0 VS = 5V 4.5 4.5 4.0 4.0 –50 –25 0 25 50 75 100 125 –50 Temperature (°C) 0 25 50 75 100 125 Temperature (°C) TLV3011, TLV3012 SBOS300B –25 www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. PROPAGATION DELAY (tPLH) PROPAGATION DELAY (tPHL) VS = ±2.5V VIN+ 500mV/div 500mV/div VS = ±2.5V VIN– VIN– VIN+ 2V/div TLV3012 VOUT 2V/div TLV3011 VOUT 2µs/div 2µs/div PROPAGATION DELAY (tPLH) PROPAGATION DELAY (tPHL) VS = ±0.9V VIN+ 500mV/div 500mV/div VS = ±0.9V VIN– VIN– 2V/div VOUT 2µs/div REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT (Sourcing) REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT (Sinking) 1.24205 1.250 1.24200 1.249 1.24195 1.248 1.24190 1.24185 1.24180 1.24175 1.24170 1.24165 1.247 1.246 1.245 1.244 1.243 1.242 1.24160 1.241 0 0.2 0.4 0.6 0.8 1.0 1.2 Output Load Current, Sourcing (mA) 6 VOUT 2µs/div Reference Voltage (V) Reference Voltage (V) 2V/div VIN+ 0 0.2 0.4 0.6 0.8 1.0 1.2 Output Load Current, Sinking (mA) TLV3011, TLV3012 www.ti.com SBOS300B TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted. REFERENCE VOLTAGE vs TEMPERATURE SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 1.250 140 1.245 120 Short-Circuit Current (mA) Reference Voltage (V) TLV3012 1.240 1.235 1.230 1.225 1.220 100 Sink 80 60 Source 40 20 1.215 1.210 –100 0 –50 0 50 100 150 1.5 2.0 2.5 3.0 Temperature (°C) 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) REFERENCE VOLTAGE DISTRIBUTION 500 450 Reference Voltage (V) 400 350 300 250 200 150 100 50 1.254 1.252 1.250 1.248 1.246 1.244 1.242 1.240 1.238 1.236 1.234 1.232 1.230 0 Volts TLV3011, TLV3012 SBOS300B www.ti.com 7 APPLICATIONS INFORMATION The TLV3011 is a low-power, open-drain comparator with on-chip 1.242V series reference. The open-drain output allows multiple devices to be driven by a single pull-up resistor to accomplish an OR function, making the TLV3011 useful for logic applications. may be added by connecting a small amount of feedback to the positive input. Figure 2 shows a typical topology used to introduce hysteresis, described by the equation: VHYST = The TLV3012 comparator with on-chip 1.242V series reference has a push-pull output stage optimal for reduced power budget applications and features no shoot-through current. V+ 5.0V A typical supply current of 2.8µA and tiny packaging combine with 1.8V supply requirements to make the TLV3011 and TLV3012 optimal for battery and portable designs. RPULL-UP(1) VIN TLV301x BOARD LAYOUT REF Typical connections for the TLV3011 and TLV3012 are shown in Figure 1. The TLV3011 is an open-drain output device. A pull-up resistor must be connected between the comparator output and supply to enable operation. To minimize supply noise, power supplies should be capacitively decoupled by a 0.01µF ceramic capacitor in parallel with a 10µF electrolytic capacitor. Comparators are sensitive to input noise, and precautions such as proper grounding (use of ground plane), supply bypassing, and guarding of high-impedance nodes will minimize the effects of noise and help to ensure specified performance. 0.01µF 4 TLV301x VIN+ 10µF 6 3 5 REF 2 R1 39kΩ VREF VOUT R2 560kΩ VHYST = 0.38V NOTE: (1) Use RPULL-UP with the TLV3011 only. FIGURE 2. Adding Hysteresis. VHYST will set the value of the transition voltage required to switch the comparator output by increasing the threshold region, thereby reducing sensitivity to noise. APPLICATIONS V+ VIN– V + × R1 R1 + R 2 1 BATTERY LEVEL DETECT RPULL-UP(1) 10kΩ The low power consumption and 1.8V supply voltage of the TLV3011 make it an excellent candidate for battery-powered applications. Figure 3 shows the TLV3011 configured as a low battery level detector for a 3V battery. VOUT V– NOTE: (1) Use RPULL-UP with the TLV3011 only. Battery − Okay Trip Voltage = 1.242 R1 + R 2 R2 FIGURE 1. Basic Connections of the TLV3011 and TLV3012. OPEN-DRAIN OUTPUT (TLV3011) R1 1MΩ The open-drain output of the TLV3011 is useful in logic applications. The value of the pull-up resistor and supply voltage used will affect current consumption due to additional current drawn when the output is in a low state. This effect can be seen in the typical curve Quiescent Current vs Output Switching Frequency. RPULL-UP(1) + − TLV301x R2 2MΩ Battery Okay REF 1.242V EXTERNAL HYSTERESIS Comparator inputs have no noise immunity within the range of specified offset voltage (±12mV). For noisy input signals, the comparator output may display multiple switching as input signals move through the switching threshold. The typical comparator threshold of the TLV3011 and TLV3012 is ±0.5mV. To prevent multiple switching within the comparator threshold of the TLV3011 or TLV3012, external hysteresis 8 When the battery voltage drops below 1.9V, the battery-okay output will go low. NOTE: (1) Use RPULL-UP with the TLV3011 only. FIGURE 3. TLV3011 Configured as a Low Battery Level Detector. TLV3011, TLV3012 www.ti.com SBOS300B POWER-ON RESET The reset circuit shown in Figure 4 provides a time delayed release of reset to the MSP430 microcontroller. Operation of the circuit is based on a stabilization time constant of the supply voltage, rather than on a predetermined voltage value. The negative input is a reference voltage created by the internal voltage reference. The positive input is an RC circuit that provides a power-up delay. When power is applied, the output of the comparator is low, holding the processor in the reset condition. Only after allowing time for the supply voltage to stabilize does the positive input of the comparator become higher than the negative input, resulting in a high output state, releasing the processor for operation. The stabilization time required for the supply voltage is adjustable by the selection of the RC component values. Use of a lower-valued resistor in this portion of the circuit will not increase current consumption because no current flows through the RC circuit after the supply has stabilized. The reset delay needed depends on the power-up characteristics of the system power supply. R1 and C1 are selected to allow enough time for the power supply to stabilize. D1 provides rapid reset if power is lost. In this example, the R1 • C1 time constant is 10mS. RELAXATION OSCILLATOR The TLV3012 can be configured as a relaxation oscillator as in Figure 5 to provide a simple and inexpensive clock output. The capacitor is charged at a rate of T = 0.69RC. It also discharges at a rate of 0.69RC. Therefore, the period is T = 1.38RC. R1 may be a different value than R2. VC 2/3 (V+) 1/3 (V+) t V+ T1 T2 V+ V+ C 1000pF R1 1MΩ VOUT DI R1 1MΩ RPULL-UP(1) 10kΩ C1 10nF 1.242V TLV301x MSP430 TLV3012 R2 1MΩ R2 1MΩ RESET t F = 724Hz V+ REF R2 1MΩ NOTE: (1) Use RPULL-UP with the TLV3011 only. FIGURE 4. The TLV3011 or TLV3012 Configured as a Power Up Reset Circuit for the MSP430. FIGURE 5. TLV3012 Configured as a Relaxation Oscillator. TLV3011, TLV3012 SBOS300B www.ti.com 9 PACKAGE OPTION ADDENDUM www.ti.com 16-Mar-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TLV3011AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3011AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3011AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3011AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3011AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV3011AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV3011AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV3011AIDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV3012AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3012AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3012AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3012AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV3012AIDCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV3012AIDCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV3012AIDCKT ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV3012AIDCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 16-Mar-2007 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV3011AIDBVR DBV 6 SITE 21 180 8 3.23 3.17 1.37 4 8 Q3 TLV3011AIDBVT DBV 6 SITE 21 180 8 3.23 3.17 1.37 4 8 Q3 TLV3012AIDBVR DBV 6 SITE 21 180 8 3.23 3.17 1.37 4 8 Q3 TLV3012AIDBVT DBV 6 SITE 21 180 8 3.23 3.17 1.37 4 8 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) TLV3011AIDBVR DBV 6 SITE 21 214.0 199.0 55.0 TLV3011AIDBVT DBV 6 SITE 21 214.0 199.0 55.0 TLV3012AIDBVR DBV 6 SITE 21 214.0 199.0 55.0 TLV3012AIDBVT DBV 6 SITE 21 214.0 199.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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