TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 NANOPOWER 1.8-V SOT23 COMPARATORS WITH VOLTAGE REFERENCE FEATURES APPLICATIONS • • • • • • • • • • • • • • • • • • • (1) Controlled Baseline – One Assembly/Test Site – One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree(1) Low Quiescent Current = 5 µA (Max) Integrated Voltage Reference = 1.242 V Input Common-Mode Range = 200 mV Beyond Rails Voltage Reference Initial Accuracy = 1% Open-Drain Logic Compatible Output (TLV3011) Push-Pull Output (TLV3012) Low Supply Voltage = 1.8 V to 5.5 V Fast Response Time = 6-µs Propagation Delay With 100-mV Overdrive (TLV3011: RPULLUP = 10 kΩ) Microsize Package: SOT23-6 Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. Battery-Powered Level Detection Data Acquisition System Monitoring Oscillators Sensor Systems – Smoke Detectors – Light Sensors – Alarms DESCRIPTION The TLV3011 and TLV3012 are low-power, open-drain output comparators. The devices feature an uncommitted on-chip voltage reference, have 5-µA (max) quiescent current, input common-mode range 200 mV beyond the supply rails, and single-supply operation from 1.8 V to 5.5 V. The integrated 1.242-V series voltage reference offers low 100-ppm/°C (max) drift, is stable with up to 10-nF capacitive load, and can provide up to 0.5 mA (typ) of output current. The TLV3011 and TLV3012 are available in the tiny SOT23-6 package for space-conservative designs. The devices are specified for the temperature range of –55°C to 125°C. DBV PACKAGE (TOP VIEW) OUT 1 6 V+ V 2 5 REF IN+ 3 4 IN- Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE ORDERING INFORMATION TA PACKAGE (1) ORDERABLE PART NUMBER TOP SIDE MARKING -55°C TO 125°C DBV-SOT TLV3011AMDBVREP BTV DBV-SOT TLV3012AMDBVREP (2) TBD (1) (2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Product Preview Pin Configurations Top View (1) TLV3011AMDBV V– 2 IN+ 3 6 V+ 5 4 OUT 1 REF V– 2 IN– IN+ 3 SOT23-6 TBD 1 BTV OUT TLV3012AMDBV 6 V+ 5 REF 4 IN– SOT23-6 Note: Pin 1 is determined by orienting package marking as shown. (1) Product Preview ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN Supply voltage 7 Voltage (2) Signal input terminals –0.5 (V+) +0.5 ±10 Current (2) Output short circuit (3) UNIT V V mA Continous Operating temperature range –55 125 °C Tstg Storage temperature range –65 150 °C TJ Junction temperature 150 °C Lead ambient temperature (soldering, 10 s) 300 °C 2000 V ESD rating (Human-Body Model) (1) (2) (3) 2 MAX Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal. Short circuit to ground Submit Documentation Feedback TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 0.5 15 UNIT Offset Voltage VOS Input offset voltage VCM = 0 V, IO = 0 V dVOS/dT Input offset voltage vs temperature TA = –55°C to 125°C ±12 PSRR Power supply rejection ratio VS = 1.8 V to 5.5 V 100 mV µV/°C 1000 µV/V Input Bias Current IS Input bias current VCM = VS/2 ±10 pA IOS Input offset current VCM = VS/2 ±10 pA Input Voltage Range VCM Common-mode voltage range CMRR (V–) – 0.2 Common-mode rejection ratio (V+) + 0.2 VCM = –0.2 V to (V+) – 1.5 V 60 74 VCM = –0.2 V to (V+) + 0.2 V 54 62 V dB Input Impedance Common mode 1013 2 Ω pF Differential 1013 4 Ω pF Switching Characteristics Low to high Propagation delay time High to low f = 10 kHz, VSTEP = 1 V, input overdrive = 10 mV 12 f = 10 kHz, VSTEP = 1 V, input overdrive = 100 mV 6 µs f = 10 kHz, VSTEP = 1 V, input overdrive = 10 mV 13.5 f = 10 kHz, VSTEP = 1 V, input overdrive = 100 mV 6.5 TLV3011 See (1) tr Rise time CL = 10 pF 100 ns tf Fall time CL = 10 pF 100 ns Voltage output low from rail VS = 5 V 160 200 mV Voltage output high from rail TLV3012 (2) IOUT = –5 mA 90 200 mV Short-circuit current TLV3012 (2) IOUT = 5 mA TLV3012 (2) Output VOL See Typical Characteristics Voltage Reference VOUT Output voltage 1.208 1.242 V ±1% Initial accuracy dVOUT/dT 1.276 –55°C ≤ TA ≤ 125°C Temperature drift Sourcing 0 mA < ISOURCE ≤ 0.5 mA Sinking 0 mA < ISINK ≤ 0.5 mA 40 100 0.36 1 dVOUT/dILOAD Load regulation ILOAD Output current dVOUT/dVIN Line regulation 1.8 V ≤ VIN ≤ 5.5 V 10 Reference voltage noise f = 0.1 Hz to 10 Hz 0.2 6.6 0.5 ppm/°C mV/mA mA 100 µV/V Noise mVPP Power Supply VS Specified voltage 1.8 Operating voltage range IQ (1) (2) Quiescent current 5.5 1.8 VS = 5 V, VO = High 2.8 V 5.5 V 5 µA tr dependent on RPULLUP and CLOAD. Product Preview Submit Documentation Feedback 3 TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Temperature Operating range –55 125 °C Storage range –65 150 °C Thermal resistance SOT23-6 °C/W 200 TYPICAL CHARACTERISTICS QUIESCENT CURRENT vs OUTPUT SWITCHING FREQUENCY 3.8 8 3.6 7 Quiescent Current – µA Quiescent Current – µA QUIESCENT CURRENT vs TEMPERATURE 3.4 3.2 3 2.8 2.6 2.4 2.2 2 -50 6 0 25 50 75 Temperature – °C 5 4 3 VS = 1.8 V 2 1 100 1 125 10 100 1k Output Transition Frequency – Hz Figure 1. Figure 2. QUIESCENT CURRENT vs OUTPUT SWITCHING FREQUENCY INPUT BIAS CURRENT vs TEMPERATURE 10k 45 TLV3012 VS = 5 V 10 VS = 3 V 8 6 4 VS = 1.8 V 2 40 Input Bias Current – pA 12 35 30 25 20 15 10 5 0 0 -5 1 10 100 1k 10k Output Switching Frequency – Hz 100k -50 Figure 3. 4 VS = 5 V VS = 3 V 0 -25 14 Quiescent Current – µA TLV3011 RPULLUP = 1 MΩ -25 0 25 50 75 Temperature – °C Figure 4. Submit Documentation Feedback 100 125 TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) OUTPUT LOW vs OUTPUT CURRENT OUTPUT HIGH vs OUTPUT CURRENT 0.25 0.25 VS = 1.8 V VS = 3 V 0.15 VS = 5 V 0.10 VDD = 1.8 V 0.15 0.10 VDD = 5 V 0.05 0.05 0 0 0 2 4 6 8 Output Current – mA 10 0 12 4 6 8 Output Current – mA 10 Figure 6. PROPAGATION DELAY (tPLH) vs CAPACITIVE LOAD PROPAGATION DELAY (tPHL) vs CAPACITIVE LOAD 12 80 TLV3012 tPHL – Propagation Delay – µs tPLH – Propagation Delay – µs 2 Figure 5. 80 70 60 50 VS = 5 V 40 VS = 3 V 30 VS = 1.8 V 20 10 0 0.01 0.1 1 10 Capacitive Load – nF 100 70 60 50 VS = 3 V 1k VS = 5 V 40 30 20 10 VS = 1.8 V 0 0.01 0.1 1 10 Capacitive Load – nF 100 Figure 7. Figure 8. PROPAGATION DELAY (tPLH) vs INPUT OVERDRIVE PROPAGATION DELAY (tPHL) vs INPUT OVERDRIVE 1k 20 tPHL – Propagation Delay – µs 20 tPLH – Propagation Delay – µs VDD = 3 V 0.20 0.20 (VS – VOH) – V VOL – Output Low – V TLV3012 18 16 VS = 5 V 14 12 VS = 3 V 10 VS = 1.8 V 8 6 4 18 16 14 12 VS = 1.8 V 10 VS = 3 V 8 6 VS = 5 V 4 0 10 20 30 40 50 60 70 Input Overdrive – mV 80 90 100 0 Figure 9. 10 20 30 40 50 60 70 Input Overdrive – mV 80 90 100 Figure 10. Submit Documentation Feedback 5 TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) PROPAGATION DELAY (tPLH) vs TEMPERATURE PROPAGATION DELAY (tPHL) vs TEMPERATURE 8 tPHL – Propagation Delay – µs 7 6.5 VS = 1.8 V VS = 3 V 6 5.5 5 VS = 5 V 4.5 4 -50 -25 0 25 50 75 Temperature – °C 100 VS = 3 V 6.5 6 5.5 VS = 5 V 5 4.5 4 -50 125 -25 VIN– VIN+ 2 V/div TLV3011 VOUT VS = 2.5 V VIN+ VIN– VOUT 2 µs/div Figure 13. Figure 14. PROPAGATION DELAY (tPLH) PROPAGATION DELAY (tPHL) VS = 0.9 V VIN– 2 V/div 500 mV/div 500 mV/div 100 PROPAGATION DELAY (tPHL) VIN+ 2 V/div 25 50 75 Temperature – °C PROPAGATION DELAY (tPLH) 2 µs/div VOUT 2 µs/div VIN+ VS = 0.9 V VIN– VOUT 2 µs/div Figure 15. 6 0 Figure 12. TLV3012 2 V/div VS = 1.8 V 7 Figure 11. VS = 2.5 V 500 mV/div 7.5 500 mV/div tPLH – Propagation Delay – µs 8 7.5 Figure 16. Submit Documentation Feedback 125 TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT (SINKING) 1.24205 1.250 1.24200 1.249 Reference Voltage – V Reference Voltage – V REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT (SOURCING) 1.24195 1.24190 1.24185 1.24180 1.24175 1.24170 1.24165 1.248 1.247 1.246 1.245 1.244 1.243 1.242 1.24160 1.241 0 0.2 0.4 0.6 0.8 1 Output Load Current, Sourcing – mA 0 1.2 0.2 0.4 0.6 0.8 1 Output Load Current, Sinking – mA Figure 17. Figure 18. REFERENCE VOLTAGE vs TEMPERATURE SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 1.2 140 1.250 TLV3012 Short-Circuit Current – mA 1.240 1.235 1.230 1.225 1.220 1.215 120 100 Sink 80 60 Source 40 20 0 0 50 Temperature – °C 100 1.5 150 2 2.5 3 3.5 4 4.5 Supply Voltage – V Figure 19. 5 5.5 Figure 20. REFERENCE VOLTAGE DISTRIBUTION 500 450 400 350 300 250 200 150 100 1.252 1.254 1.250 1.246 1.248 1.242 1.244 1.238 1.240 1.234 0 1.236 50 1.230 -50 1.232 1.210 -100 Units Reference Voltage – V 1.245 Reference Voltage – V Figure 21. Submit Documentation Feedback 7 TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 APPLICATION INFORMATION The TLV3011 is a low-power, open-drain comparator with on-chip 1.242-V series reference. The open-drain output allows multiple devices to be driven by a single pullup resistor to accomplish an OR function, making the TLV3011 useful for logic applications. The TLV3012 comparator with on-chip 1.242-V series reference has a push-pull output stage optimal for reduced power budget applications and features no shoot-through current. A typical supply current of 2.8 µA and small packaging combine with 1.8-V supply requirements to make the TLV3011 and TLV3012 optimal for battery and portable designs. Board Layout Typical connections for the TLV3011 and TLV3012 are shown in Figure 22. The TLV3011 is an open-drain output device. A pullup resistor must be connected between the comparator output and supply to enable operation. To minimize supply noise, power supplies should be capacitively decoupled by a 0.01-µF ceramic capacitor in parallel with a 1-µF electrolytic capacitor. Comparators are sensitive to input noise and precautions such as proper grounding (use of ground plane), supply bypassing, and guarding of high-impedance nodes minimize the effects of noise and help to ensure specified performance. V+ 0.01 µF VIN– 4 3 VIN+ 6 TLV301x 5 REF 2 10 µF 1 RPULLUP 10 kΩ (1) VOUT V- (1) Use RPULLUP with the TLV3011 only. Figure 22. Basic Connections of the TLV3011 and TLV3012 Open-Drain Output (TLV3011) The open-drain output of the TLV3011 is useful in logic applications. The value of the pullup resistor and supply voltage used affects current consumption due to additional current drawn when the output is in a low state. This effect can be seen in Figure 3. External Hysteresis Comparator inputs have no noise immunity within the range of specified offset voltage (±12 mV). For noisy input signals, the comparator output may display multiple switching as input signals move through the switching threshold. The typical comparator threshold of the TLV3011 and TLV3012 is ±0.5 mV. To prevent multiple switching within the comparator threshold of the TLV3011 or TLV3012, external hysteresis may be added by connecting a small amount of feedback to the positive input. Figure 23 shows a typical topology used to introduce hysteresis, described by this equation: VHYST = 8 V+ × R1 R 1 + R2 Submit Documentation Feedback TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 APPLICATION INFORMATION (continued) V+ 5V (1) RPULLUP – VIN VOUT TLV301x + REF R1 39 kΩ R2 560 kΩ VHYST = 0.38 V VREF (1) Use RPULLUP with the TLV3011 only. Figure 23. Adding Hysteresis VHYST sets the value of the transition voltage required to switch the comparator output by increasing the threshold region, thereby reducing sensitivity to noise. Applications Battery-Level Detect The low power consumption and 1.8-V supply voltage of the TLV3011 make it an excellent candidate for battery-powered applications. Figure 24 shows the TLV3011 configured as a low battery level detector for a 3-V battery. Battery Okay trip voltage = 1.242 R1 + R2 R2 R1 1 MΩ RPULLUP(1) + + – TLV301x – R2 2 MΩ 1.242 V Battery Okay REF When the battery voltage drops below 1.9 V, the Battery Okay output goes low. (1) Use RPULLUP with the TLV3011 only. Figure 24. TLV3011 Configured as Low Battery Level Detector Submit Documentation Feedback 9 TLV3011-EP, TLV3012-EP www.ti.com SGLS349 – OCTOBER 2006 APPLICATION INFORMATION (continued) Power-On Reset The reset circuit shown in Figure 25 provides a time-delayed release of reset to the MSP430 microcontroller. Operation of the circuit is based on a stabilization time constant of the supply voltage, rather than on a predetermined voltage value. The negative input is a reference voltage created by the internal voltage reference. The positive input is an RC circuit that provides a power-up delay. When power is applied, the output of the comparator is low, holding the processor in the reset condition. Only after allowing time for the supply voltage to stabilize does the positive input of the comparator become higher than the negative input, resulting in a high output state, releasing the processor for operation. The stabilization time required for the supply voltage is adjustable by the selection of the RC component values. Use of a lower-valued resistor in this portion of the circuit does not increase current consumption, because no current flows through the RC circuit after the supply has stabilized. V+ R1 1 MΩ DI (1) RPULLUP 10 kΩ MSP430 + C1 10 nF 1.242 V RESET TLV301x – REF (1) Use RPULLUP with the TLV3011 only. Figure 25. TLV3011 or TLV3012 Configured as Power-Up Reset Circuit for the MSP430 The reset delay needed depends on the power-up characteristics of the system power supply. R1 and C1 are selected to allow enough time for the power supply to stabilize. D1 provides rapid reset if power is lost. In this example, the R1 × C1 time constant is 10 ms. Relaxation Oscillator The TLV3012 can be configured as a relaxation oscillator to provide a simple and inexpensive clock output (see Figure 26). The capacitor is charged at a rate of T = 0.69RC and discharges at a rate of 0.69RC. Therefore, the period is T = 1.38RC. R1 may be a different value than R2. VC 2/3 (V+) 1/3 (V+) V+ C 1000 pF t V+ T1 T2 R1 1 MΩ VOUT TLV3012 R2 1 MΩ R2 1 MΩ t F = 724 Hz V+ R2 1 MΩ Figure 26. TLV3012 Configured as Relaxation Oscillator 10 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 21-May-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV3011AMDBVREP ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart V62/07604-01XE ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Add to cart (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. 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OTHER QUALIFIED VERSIONS OF TLV3011-EP : • Catalog: TLV3011 NOTE: Qualified Version Definitions: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2011 • Catalog - TI's standard catalog product Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLV3011AMDBVREP Package Package Pins Type Drawing SPQ SOT-23 3000 DBV 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 179.0 8.4 Pack Materials-Page 1 3.2 B0 (mm) K0 (mm) P1 (mm) 3.2 1.4 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV3011AMDBVREP SOT-23 DBV 6 3000 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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