ONSEMI TRA2525/D

TRA2525 MR3025
Medium-Current Silicon
Rectifiers
250 Volts, 25 Amperes
Compact, highly efficient silicon rectifiers for medium–current
applications requiring:
• High Current Surge — 400 Amperes @ TJ = 175°C
• Peak Performance @ Elevated Temperature — 25 Amperes
• Low Cost
• Compact, Molded Package for Optimum Efficiency in a Small Case
Configuration
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MICRODE BUTTON
CASE 193
Mechanical Characteristics
• Finish: All External Surfaces are Corrosion Resistant, and Contact
•
•
•
•
Areas are Readily Solderable
Polarity: Indicated by Cathode Band
Weight: 1.8 Grams (Approximately)
Maximum Temperature for Soldering Purposes: 260°C
Marking: 2525 or MR3025
MARKING DIAGRAM
2525 LYYWW
2525
L
YY
WW
MAXIMUM RATINGS
Rating
DC Blocking Voltage
Non–Repetitive Peak Reverse Voltage
(Halfwave, Single Phase, 60 Hz)
Average Forward Current
(Single Phase, Resistive Load,
TC = 150°C)
Non–Repetitive Peak Surge Current
(Halfwave, Single Phase, 60 Hz)
Symbol
Value
Unit
VR
250
Volts
VRSM
310
Volts
IO
25
Amps
= Device Code
= Location Code
= Year
= Work Week
MARKING DIAGRAM
MR3025 YYWWL
IFSM
400
Amps
Operating Junction Temperature Range
TJ
–65 to
+175
°C
Storage Temperature Range
Tstg
–65 to
+175
°C
MR3025 = Device Code
L
= Location Code
YY
= Year
WW
= Work Week
ORDERING INFORMATION
Device
 Semiconductor Components Industries, LLC, 2000
October, 2000 – Rev. 1
1
Package
Shipping
TRA2525
Microde Button
5000 Units/Box
MR3025
Microde Button
5000 Units/Box
Publication Order Number:
TRA2525/D
TRA2525 MR3025
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
Value
Unit
RθJC
1.0
°C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Min
Max
Unit
Instantaneous Forward Voltage (Note 1.)
(IF = 100 Amps, TC = 25°C)
VF
—
1.18
Volts
Reverse Current(1)
(VR = 250 V, TC = 25°C)
(VR = 250 V, TC = 100°C)
IR
—
—
10
250
2*
2*
Forward Voltage Temperature Coefficient @ IF = 10 mA
VFTC
1. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2%.
*Typical
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2
µA
mV/°C
IFSM, PEAK HALF WAVE CURRENT (A)
TRA2525 MR3025
1400
1350
PW = 300 s
TJ = 25°C
1300
1200
1150
1100
TJ = 25°C
1 Cycle
TJ = 175°C
100
1
1050
10
100
NUMBER OF CYCLES
Maximum
1000
Figure 2. Non–Repetitive Surge Current
950
0
900
Typical
850
COEFFICIENT (mV/ ° C)
V F, INSTANTANEOUS FORWARD VOLTAGE (mV)
1250
VRRM may be applied between
each cycle of surge. The TJ
noted is TJ prior to surge
F = 60 Hz
1000
800
750
700
–0.5
Typical Range
–1.0
–1.5
650
–2.0
600
1
100
10
0.1
200
IF, INSTANTANEOUS FORWARD CURRENT (A)
PF(AV), AVERAGE POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
50
DC
40
IFM/IFAV = 20
10
0
130
140
150
160
100 200
Figure 3. VF Temperature Coefficient
60
120
10
IF, INSTANTANEOUS FORWARD CURRENT (A)
Figure 1. Forward Voltage
30
1
170
180
50
IFM/IFAV = 40
DC
30
20
10
0
0
TC, CASE TEMPERATURE (°C)
10
20
30
40
IF, AVERAGE FORWARD CURRENT (A)
Figure 4. Current Derating
Figure 5. Forward Power Dissipation
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3
50
r(t), TRANSIENT THERMAL RESISTANCE
TRA2525 MR3025
100
RJC(t) = RJC • r(t)
Note 1
10–1
10–2
0.1
1
10
100
300
10
100
t, TIME (ms)
Figure 6. Thermal Response
NOTE 1
Ppk
Ppk
DUTY CYCLE, D = tp/t1
PEAK POWER, Ppk is peak of an
equivalent square power pulse
tp
1000
C, CAPACITANCE (pF)
t1
To determine maximum junction temperature of the diode in a given
situation, the following procedure is recommended.
The temperature of the case should be measured using a thermocouple placed on the case at the temperature reference point (see the
outline drawing on page 1). The thermal mass connected to the case
is normally large enough so that it will not significantly respond to heat
surges generated in the diode as a result of pulse operation once
steady state conditions are achieved.
TJ = 25°C
100
Using the measured value of TC, the junction temperature may be
determined by:
TJ = TC + TJC
10
Where TJC is the increase in junction temperature above the case
temperature, it may be determined by:
0.1
1
VR, REVERSE VOLTAGE (V)
TJC = Ppk RJC [D + (1 – D) r(t1 + tp) + r(tp) – r(t1)]
where:
r(t) = normalized value of transient thermal resistance at
time, t, from Figure 6, i.e.:
Figure 7. Typical Capacitance
1
TRR , REVERSE RECOVERY TIME (s)
TFR , FORWARD RECOVERY TIME (s)
r(t1 + tp) = normalized value of transient thermal resistance
at time t1 + tp.
TJ = 25°C
VF
TFR
VFR
VFR = 1.0 V
VFR = 2.0 V
0.1
1
100
IF
0.25 IR
IR
TRR
IF = 1 A
10
IF = 10 A
1
0.1
10
TJ = 25°C
0
IF, FORWARD CURRENT (A)
1
IR/IF, RATIO OF REVERSE TO FORWARD CURRENT
Figure 8. Forward Recovery Time
Figure 9. Reverse Recovery Time
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4
10
∂, EFFICIENCY FACTOR (%)
TRA2525 MR3025
square wave input
50
sine wave input
TJ = 25°C
10
5
10
1
100
f, FREQUENCY (kHz)
Figure 10. Rectification Waveform Efficiency
RECTIFICATION EFFICIENCY NOTE
RS
RL
VO
Figure 11. Single Phase Half–Wave Rectifier Circuit
The rectification efficiency factor ∂ shown in Figure 10
was calculated using the formula:
P (dc)
P (rms)
V2o(dc)
RL
V2o(rms) .100% RL
For a square wave input of amplitude Vm, the efficiency
factor becomes:
V 2m
2R L
(square) V 2m .100% 50%
RL
(1)
V 2o (dc)
.100%
2
(
ac)
V o
V 2o (dc)
(a full wave circuit has twice these efficiencies)
As the frequency of the input signal is increased, the
reverse recovery time of the diode (Figure 9) becomes
significant, resulting in an increase ac voltage component
across RL which is opposite in polarity to the forward
current, thereby reducing the value of the efficiency factor
∂, as shown on Figure 10.
It should be emphasized that Figure 10 shows waveform
efficiency only; it does not provide a measure of diode
losses. Data was obtained by measuring the ac component of
VO with a true rms ac voltmeter and the dc component with
a dc voltmeter. The data was used in Equation 1 to obtain
points for Figure 10.
For a sine wave input Vm sin(wt) to the diode, assume
lossless, the maximum theoretical efficiency factor
becomes:
V2m
2R L
(sine) V2m .100% 4 .100% 40.6%
π2
4R L
(3)
(2)
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TRA2525 MR3025
MECHANICAL STRESS
Assembly and Soldering Information
There are two basic areas of consideration for successful
implementation of button rectifiers:
1. Mounting and Handling
2. Soldering
Each should be carefully examined before attempting a
finished assembly or mounting operation.
COMPRESSION
TORSION
Mounting and Handling
The button rectifier lends itself to a multitude of assembly
arrangements, but one key consideration must always be
included: One Side of the Connections to the Button Must
be Flexible!
This stress relief to the button should also be chosen for
maximum contact area to afford the best heat transfer — but
not at the expense of flexibility. For an annealed copper
terminal a thickness of 0.015″ is suggested.
TENSION
SHEAR
Exceeding these recommended maximums can result in
electrical degradation of the device.
Strain Relief Terminal
for Button Rectifier
Soldering
Copper
Terminal
The button rectifier is basically a semiconductor chip
bonded between two nickel–plated copper heat sinks with an
encapsulating material of epoxy compound. The exposed
metal areas are also tin plated to enhance solderability.
In the soldering process it is important that the
temperature not exceed 260°C if device damage is to be
avoided. Various solder alloys can be used for this operation
but two types are recommended for best results:
1. 95% Sn, 5% Sb; melting point 237°C
2. 96.5% tin, 3.5% silver; melting point 221°C
3. 63% tin, 37% lead; melting point 183°C
Solder is available as preforms or paste. The paste
contains both the metal and flux and can be dispensed
rapidly. The solder preform requires the application of a flux
to assure good wetting of the solder. The type of flux used
depends upon the degree of cleaning to be accomplished and
is a function of the metal involved. These fluxes range from
a mild rosin to a strong acid; e.g., Nickel plating oxides are
best removed by an acid base flux while an activated rosin
flux may be sufficient for tin plated parts.
Since the button is relatively lightweight, there is a
tendency for it to float when the solder becomes liquid. To
prevent bad joints and misalignment, it is suggested that a
weighting or spring loaded fixture be employed. It is also
important that severe thermal shock (either heating or
cooling) be avoided as it may lead to damage of the die or
encapsulant of the part.
Button
Base
(Heat Sink Material)
The base heat sink may be of various materials whose
shape and size are a function of the individual application
and the heat transfer requirements.
Common
Materials
Steel
Copper
Aluminum
Advantages and Disadvantages
Low Cost: relatively low heat conductivity
High Cost: high heat conductivity
Medium Cost: medium heat conductivity.
Relatively expensive to plate and not all
platers can process aluminum.
Handling of the button during assembly must be relatively
gentle to minimize sharp impact shocks and avoid nicking
of the plastic. Improperly designed automatic handling
equipment is the worst source of unnecessary shocks.
Techniques for vacuum handling and spring loading should
be investigated.
The mechanical stress limits for the button diode are as
follows:
Compression
Tension
Torsion
Shear
32 lbs.
32 lbs.
6–inch lbs.
55 lbs.
142.3 Newton
142.3 Newton
0.68 Newtons–meters
244.7 Newton
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6
TRA2525 MR3025
control but requires sophisticated temperature
monitoring systems such as infrared.
3. Ovens are good for batch soldering and are
production limited. There are handling problems
because of slow cooling. Response time is load
dependent, being a function of the watt rating of the
oven and the mass of parts. Large ovens may not
give an acceptable temperature gradient. Capital
cost is low compared to belt furnaces and flame
soldering.
4. Hot Plates are good for soldering small quantities
of prototype devices. Temperature control is fair
with overshoot common because of the exposed
heating surface. Solder flow and positioning can be
corrected during soldering since the assembly is
exposed. Investment cost is very low.
Button holding fixtures for use during soldering may be
of various materials. Stainless steel has a longer use life
while black anodized aluminum is less expensive and will
limit heat reflection and enhance absorption. The assembly
volume will influence the choice of materials. Fixture
dimension tolerances for locating the button must allow for
expansion during soldering as well as allowing for button
clearance.
Heating Techniques
The following four heating methods have their
advantages and disadvantages depending on volume of
buttons to be soldered.
1. Belt furnaces readily handle large or small
volumes and are adaptable to establishment of
“on–line’’ assembly since a variable belt speed sets
the run rate. Individual furnace zone controls make
excellent temperature control possible.
2. Flame Soldering involves the directing of natural
gas flame jets at the base of a heatsink as the
heatsink is indexed to various loading–heating–
cooling–unloading positions. This is the most
economical labor method of soldering large
volumes. Flame soldering offers good temperature
Regardless of the heating method used, a soldering profile
giving the time–temperature relationship of the particular
method must be determined to assure proper soldering.
Profiling must be performed on a scheduled basis to
minimize poor soldering. The time–temperature
relationship will change depending on the heating method
used.
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TRA2525 MR3025
PACKAGE DIMENSIONS
CASE 193–04
ISSUE J
DIM
A
B
D
F
M
A
MILLIMETERS
MIN
MAX
8.43
8.69
4.19
4.45
5.54
5.64
5.94
6.25
5 NOM
INCHES
MIN
MAX
0.332
0.342
0.165
0.175
0.218
0.222
0.234
0.246
5 NOM
M
D
B
F
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TRA2525/D