UC1710 UC2710 UC3710 High Current FET Driver FEATURES DESCRIPTION • Totem Pole Output with 6A Source/Sink Drive The UC1710 family of FET drivers is made with a high-speed Schottky process to interface between low-level control functions and very high-power switching devices-particularly power MOSFET’s. These devices accept low-current digital inputs to activate a high-current, totem pole output which can source or sink a minimum of 6A. • 3ns Delay • 20ns Rise and Fall Time into 2.2nF • 8ns Rise and Fall Time into 30nF • 4.7V to 18V Operation • Inverting and Non-Inverting Outputs • Under-Voltage Lockout with Hysteresis • Thermal Shutdown Protection Supply voltages for both VIN and VC can independently range from 4.7V to 18V. These devices also feature under-voltage lockout with hysteresis. The UC1710 is packaged in an 8-pin hermetically sealed dual in-line package for –55°C to +125°C operation. The UC2710 and UC3710 are specified for a temperature range of –40°C to +85°C and 0°C to +70°C respectively and are available in either an 8-pin plastic dual in-line or a 5-pin, TO-220 package. Surface mount devices are also available. • MINIDIP and Power Packages ORDERING INFORMATION TRUTH TABLE INV N.I. Out H H L OUT= INV and N.I. L H H OUT= INV or N.I. H L L L L L UC1710J UC2710DW UC2710J UC2710N UC2710T UC3710DW UC3710N UC3710T TEMPERATURE RANGE –55°C to +125°C –40°C to +85°C 0°C to +70°C PACKAGE 8 pin CDIP 16 pin SOIC-wide 8 pin CDIP 8 pin PDIP 5 pin TO220 16 pin SOIC-wide 8 pin PDIP 5 pin TO220 BLOCK DIAGRAM INTERNALLY CONNECTED IN T PACKAGE VIN 5 OUTPUT BIAS 4 VC 3 Out 2 Pwr Gnd LOGIC BIAS N.I. IN 8 INV IN 1 Logic Gnd 7 TSD UVLO INTERNALLY CONNECTED IN T PACKAGE UDG-99079 05/99 UC1710 UC2710 UC3710 ABSOLUTE MAXIMUM RATINGS N-Package J-Package T-Package Supply Voltage, Vin . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V . . . . . . . . . . . . . . 20V Operating Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V . . . . . . . . . . . . . . 18V Output Current (Source or Sink) Steady-State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 500mA. . . . . . . . . . . . ± 500mA . . . . . . . . . . . . . ± 1A Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V-VIN . . . . . . . . –0.3V – VIN . . . . . . . . –0.3V – VIN Power Dissipation at Ta=25°C . . . . . . . . . . . . . . . . . . . 1W . . . . . . . . . . . . . . . 1W . . . . . . . . . . . . . . . 3W Power Dissipation at T (Case) = 25°C. . . . . . . . . . . . . . 2W . . . . . . . . . . . . . . . 2W . . . . . . . . . . . . . . 25W Operating Junction Temperature . . . . . . . –55°C to +150°C . . . . –55°C to +150°C . . . . –55°C to +150°C Storage Temperature . . . . . . . . . . . . . . . –65°C to +150°C . . . . –65°C to +150°C . . . . –65°C to +150°C Lead Temperature (Soldering, 10 seconds) . . . . . . . 300°C . . . . . . . . . . . . 300°C . . . . . . . . . . . . 300°C Note 1: All currents are positive into, negative out of the specified terminal. Note 2: Consult Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages. CONNECTION DIAGRAMS DIL-8 MINIDIP (Top View) J or N Package SOIC-16 (Top View) DW Package 5-Pin TO-220 (Top View) T Package ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC = 15V, No load, TA = TJ. PARAMETERS VIN Supply Current VC Supply Current UVLO Threshold TEST CONDITIONS MIN TYP MAX UNITS VIN =18V, VC =18V, Output Low 26 35 mA VIN =18V, VC =18V, Output High 21 30 mA VIN =18V, VC =18V, Output Low 1.5 5.0 mA VIN =18V, VC =18V,Output High 5.0 8 mA VIN High to Low 3.8 4.1 4.4 V VIN Low to High 4.1 4.4 4.8 V 2 UC1710 UC2710 UC3710 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VIN = VC = 15V, No load, TA = TJ. PARAMETERS TEST CONDITIONS UVLO Threshold Hysteresis MIN TYP 0.1 0.3 Digital Input Low Level Digital Input High Level MAX UNITS 0.5 V 0.8 V 2.0 V Digital Input = 0.0V Output High Sat., VC – VO IO= –100mA 1.35 2.2 V IO= –6A 3.2 4.5 V IO= 100mA 0.25 0.6 V IO= 6A 3.4 4.5 V Output Low Sat., VO Thermal Shutdown –70 µA Digital Input Current –4.0 165 °C From Inv., Input to Output (Note 3, 4): Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 70 ns CL = 0 20 40 ns CL = 2.2nF 25 40 ns CL = 30nF 85 150 ns CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 80 ns CL = 0 15 40 ns CL = 2.2nF 20 40 ns CL = 30nF 85 150 ns CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 70 ns From N.I. Input to Output (Note 3,4): Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall Total Supply Current at 200kHz Input Switching Frequency CL = 0 20 40 ns CL = 2.2nF 25 40 ns CL = 30nF 85 150 ns CL = 0 35 70 ns CL = 2.2nF 35 70 ns CL = 30nF 35 80 ns CL = 0 15 40 ns CL = 2.2nF 20 50 ns CL = 30nF 85 150 ns TA = 25°C (Note 5) CL = 0 30 40 mA Note: 3. Delay measured from 50% input change to 10% output change. Note: 4. Those parameters with CL = 30nF are not tested in production. Note: 5. Inv. Input pulsed at 50% duty cycle with N.I. Input = 3V. or N.I. Input pulsed at 50% duty cycle with Inv. Input = 0V. UNITRODE CORPORATION 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. (603) 424-2410 FAX (603) 424-3460 3 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) 5962-0152001QPA ACTIVE CDIP JG 8 1 TBD Call TI 5962-0152001VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type 5962-0152001VXA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1710J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1710J883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type UC1710L883B OBSOLETE TO/SOT L 20 TBD Call TI Call TI UC1710SP OBSOLETE CDIP J 16 TBD Call TI Call TI UC2710N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2710NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC2710T ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type UC2710TG3 ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type UC3710DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3710DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3710N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3710NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3710T ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type UC3710TG3 ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type (1) Call TI The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF UC1710, UC1710-SP, UC3710 : • Catalog: UC3710, UC1710 • Military: UC1710 • Space: UC1710-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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