Z-Power LED X10490 Technical Data Sheet Specification XZ10150 Preliminary spec. SSC Drawn Approval Kang Seok Jin 2008.10.17 Pyo Byoung ki 2008.11.21 CUSTOMER Approval Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Full code of Z-power LED series 2. Feature & Application 3. Absolute Maximum Ratings 4. Electro Characteristics 5. Outline Dimension 6. Optical characteristics 7. Packing 8. Soldering 9. Precaution for use 10. Handling of Silicone Resin LEDs Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Full Code of Z-Power LED Series Full code form : X1 X2 X3 X4 X5 X6 X7 – X8 X9 –X10X11 X12 X13X14 1. Part Number - X1 : Color - X2 : New Z-Power LED - ‘Z’ - X3 : New Z-Power LED series number - X4 : LENS type - X5 : Chip quantity (or Power Dissipation) - X6 : Package outline size -X7: Type of PCB 2. Internal Number - X8 - X9 3. Code Labeling - X10 : Luminous flux (or Radiant flux for royal blue) - X11 X12 X13: Dominant wavelength (or x,y coordinates rank code) - X1 4: Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag PART NO. : X1 X2 X3 X4 X5 X6 X7 – X8 X9 QUANTITY : ### LOT NUMBER : ########## BIN CODE : X10 X11 X12 X13 X14 For more information about binning and labeling, refer to the Application Note -1 Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet XZ10150 Z1 Description Features Z-Power series is designed for high • Super high Flux output and high Luminance current operation and high flux output • Designed for high current operation applications. • Low thermal resistance Z-Power LED's thermal management • SMT solderbility perform exceeds other power LED • Lead Free product solutions. • RoHS compliant It incorporates state of the art SMD design and Thermal emission material. Z Power LED is ideal light sources for general Illumination applications, custom designed solutions, automotive large LCD backlights Applications • Mobile phone flash • Automotive interior / exterior lighting • Automotive signal lighting • Automotive forward lighting • General Torch • Architectural lighting • LCD TV / Monitor Backlight • Projector light source • Traffic signals • Task lighting • Decorative / Pathway lighting • Remote / Solar powered lighting • Household appliances *The appearance and specifications of the product may be changed for improvement without notice. Rev. 00 December 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 3.Absolute maximum ratings 3-1. Pure White (WZ10150) Parameter Symb ol Forward Current IF Power Dissipation Pd 2.16 W Junction Temperature Tj 125 ºC Operating Temperature Topr -30 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC - ±10,000V HBM - ESD Sensitivity [2] Value Unit 450(@ Tj = 90 ºC) [1] mA 800(@ Pulse width 10ms, 1/10 duty) 4. Electric & Optical characteristics 1-1 Electro-Optical characteristics at IF=400mA, TA=25ºC Parameter Luminous Flux Symbol [3] Correlated Color Temperature CRI Forward Voltage [6] View Angle [5] Value Unit Min Typ Max ФV [4] - 105 - lm CCT - 6300 - K Ra - 68 - - VF - 4.2 4.8 V 2Θ ½ 120 deg. Thermal resistance [7] RθJ-B 16.5 ºC /W Thermal resistance [8] RθJ-C 11 ºC /W *Notes : [1] IF Max is guaranteed under the TJ ≤90 ºC. [2] It is included the zener chip to protect the product from ESD. [3] SSC maintains a tolerance of ±10% on flux and power measurements. [4] ФV is the total luminous flux output as measured with an integrated sphere. [5] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance. [6] A tolerance of ±0.06V on forward voltage measurements [7], [8] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) RθJ-C is measured with only emitter. (25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC. * All measurements were made under the standardized environment of SSC --------------------------Caution-------------------------- Rev. 01 Please do not drive at rated current more than 5 sec. without proper heat sink November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 3.Absolute maximum ratings 3-1. Warm White (NZ10150) Parameter Symb ol Forward Current IF Power Dissipation Pd 2.16 W Junction Temperature Tj 125 ºC Operating Temperature Topr -30 ~ +85 ºC Storage Temperature Tstg -40 ~ +100 ºC - ±10,000V HBM - ESD Sensitivity [2] Value Unit 450(@ Tj = 90 ºC) [1] mA 800(@ Pulse width 10ms, 1/10 duty) 4. Electric & Optical characteristics 4-1 Electro-Optical characteristics at IF=400mA, TA=25ºC Parameter Luminous Flux Symbol [3] Correlated Color Temperature CRI Forward Voltage [6] View Angle [5] Value Unit Min Typ Max ФV [4] - 80 - lm CCT - 3000 - K Ra - 80 - - VF - 4.2 4.8 V 2Θ ½ 120 deg. Thermal resistance [7] RθJ-B 16.5 ºC /W Thermal resistance [8] RθJ-C 11 ºC /W *Notes : [1] IF Max is guaranteed under the TJ ≤90 ºC. [2] It is included the zener chip to protect the product from ESD. [3] SSC maintains a tolerance of ±10% on flux and power measurements. [4] ФV is the total luminous flux output as measured with an integrated sphere. [5] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance. [6] A tolerance of ±0.06V on forward voltage measurements [7], [8] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) RθJ-C is measured with only emitter. (25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC. * All measurements were made under the standardized environment of SSC --------------------------Caution-------------------------- Rev. 01 Please do not drive at rated current more than 5 sec. without proper heat sink November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5.Outline Dimension 1. Flat Type [Package Outlines] [Top VIEW] [Bottom VIEW] Cathode Mark Cathode Pad Thermal Pad Anode Pad [Front VIEW] [Circuit Diagram] Anode [Recommended Solder Pad] Cathode Notes : 1. 2. 3. 4. All dimensions are in millimeters. (tolerance : ±0.2 ) Scale : none Thermal pad is isolated. Paste thickness:(0.2±0.05)mm *The appearance and specifications of the product may be changed for improvement withoutRev. 01 notice. November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 6-1. Forward Voltage vs. Forward Current, TA=25℃ Average Forward Current [mA] 500 Pure White Warm White 400 300 200 100 0 0 1 2 3 4 5 6 Forward Voltage [V] 6-2. Forward Current vs. Normalized Relative Luminous Flux TA=25℃ 1.2 Relative Lumious Flux(a.U) Z-Power LED X10490 Technical Data Sheet 6. Optical characteristics Pure White Warm white 1.0 0.8 0.6 0.4 0.2 0.0 0 100 200 300 400 Forward Current [mA] 500 Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Pure White,Warm white (TJMAX = 125 ℃, 400mA) 500 400 Current [mA] Z-Power LED X10490 Technical Data Sheet 6-3. Ambient Temperature vs Allowable Forward Current o RjaT = 20 C/W 300 o RjaT = 30 C/W o RjaT = 40 C/W 200 100 0 0 25 50 75 100 125 o Ambient Temperature [ C] Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Pure White, Warm white 0 1.0 30 0.8 Relative luminous flux Z-Power LED X10490 Technical Data Sheet 6-4. Typical Flat Type Radiation pattern 0.6 60 0.4 0.2 0.0 -80 -60 -40 -20 0 90 Angle(deg.) Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Pure White 1.0 Standard eye response curve 0.8 Relative Spectral Power Distribution 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength (nm) 2. Warm White 1.0 0.8 Relative Intensity Z-Power LED X10490 Technical Data Sheet 6-5. color spectrum, TA=25ºC 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Dominant Wavelength Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 160 Relative Light Output [%] Z-Power LED X10490 Technical Data Sheet 6-6. Relative Light Output vs. Junction Temperature at IF=400mA, TA=25℃ 140 120 100 80 60 40 20 0 20 WZ10150 NZ10150 40 60 80 100 120 140 o Junction Temperature, TJ [ C] Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) vs Junction Temperature at IF=400mA, TA=25℃ 5.0 Pure White Warm white Forwrd Voltage(Vf) Z-Power LED X10490 Technical Data Sheet 6-7. Forward Voltage 4.5 4.0 3.5 3.0 0 20 40 60 80 100 120 140 o Junction Temperature, TJ [ C] Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) vs Forward Current, TA=25℃ Pure White Warm white 6 Forwrd Voltage(Vf) Z-Power LED X10490 Technical Data Sheet 6-8. Forward Voltage 4 2 0 100 200 300 400 500 600 Foward Current(mA) Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 0.8 0.6 0.4 0.2 0.2 0.4 0.6 0.8 Z-Power LED X10490 Technical Data Sheet 7. Packing Note: 1)Quantity : 500 or 1000pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 5) The appearance and specifications of the product may be changed for improvement without notice. Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) a c b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c TUV QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. MADE IN KOREA Acriche 1 Semiconductor EcoLight b RoHS a Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 1. Reflow Soldering Conditions / Profile Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 Pre-heating ~ Z-Power LED X10490 Technical Data Sheet 8. Soldering Rising 5 °C/sec Cooling -5 °C/sec 150 0 Time [Hr] 2. Hand Soldering conditions Lead : Not more than 3 seconds @MAX280℃ Slug : Use a thermal-adhesives * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones. Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. Precaution for use • Storage To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box (or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30 degrees Centigrade. Humidity 50% maximum. • Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40℃ Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 60±5℃ • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. • Please avoid rapid cooling after soldering. • Components should not be mounted on warped direction of PCB. • Anti radioactive ray design is not considered for the products listed here in. • Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. • When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. • LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. • The appearance and specifications of the product may be modified for improvement without notice. • Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. • The slug is connected to the anode. Therefore, we recommend to isolate the heat sink. • Attaching LEDs, don’t use adhesives to generate organic vapor. Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 01 November 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)