Plastic Packages for Integrated Circuits Single-In-Line Plastic Packages (SIP) -A- A 0.006 -B- (0.15) E Z5.067A 5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT “GULLWING” LEAD FORM C2 INCHES L2 HEATSLUG PLANE D -CL 0.00 - 0.0098 (0.00 - 0.25) L1 PIN #1 c o e 0 -8 o b 0.010 (0.25) M B A M C M 0.004 (0.10) L3 MIN MAX MIN MAX 0.450 (11.43) MIN A 0.170 0.180 4.32 4.57 - 0.048 0.055 1.22 1.39 5 D 0.350 0.370 8.89 9.39 - E 0.395 0.405 10.04 10.28 - D1 0.310 - 7.88 - - E1 0.310 - 7.88 - - L 0.549 0.569 13.95 14.45 - L1 0.068 0.088 1.72 2.24 - L2 0.045 0.055 1.15 1.40 0.609 (15.46) MIN 0.030 BSC - 0.76 BSC 4 b 0.028 0.037 0.71 0.94 5, 6, 7 c 0.018 0.024 0.46 0.60 5 e 0.350 (8.89) MIN D1 NOTES C2 L3 E1 MILLIMETERS SYMBOL 0.067 BSC 1.70 BSC Rev. 3 4/03 NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-169AB, Issue A. 2. Controlling dimension: Inch. BACK VIEW 0.129 (3.27) TYP 0.043 (1.09) TYP e LAND PATTERN 1 3. Dimensioning and tolerance per ANSI Y14.5M-1982. 4. Gauge plane L3 is parallel to heatslug plane. 5. Dimensions include lead finish. 6. Leads are not allowed above the datum -B- . 7. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum “b” by more than 0.003’’ (0.08mm).