DATA SHEET MeshConnect™ EM357 Module ZICM357P2-1 Ember EM357 Transceiver Based Module Integrated Transceiver Modules for ZigBee / IEEE 802.15.4 Development Kit available: ZICM357P2-KIT1-1 DESCRIPTION CEL’s MeshConnect™ EM357 Module combines high performance RF solution with the market's premier ZigBee stack. The addition of on board memory enables Over-The-Air (OTA) programming without the need for additional in system memory. The integrated power amplifier maximizes range and performance. The small module footprint makes it suitable for a wide range of ZigBee applications. The MeshConnect EM357 module is certified and qualified enabling customers to accelerate time to market by greatly reducing the design and certification phases of development. CEL’s MeshConnect™ EM357 module (ZICM357P2-1) is based on the Ember EM357 Zigbee compliant SOC IC. The IC is a single-chip solution, compliant with ZigBee specifications and IEEE 802.15.4, a complete wireless solution for all ZigBee applications. The IC consists of an RF transceiver with the baseband modem, a hardwired MAC and an embedded 32-bit ARM® Cortex™-M3 microcontroller with internal RAM (12kB) and Flash (192kB) memory. The device provides numerous general-purpose I/O pins and peripheral functions such as timers and UARTs. The MeshConnect EM357 module adds a power amplifier (PA) to increase range up to 2.5 miles, provide more reliable transmission, and reduce the number of nodes in your network. It is especially useful for open outdoor applications where the nodes are physically far apart or for indoor use where the nodes have to operate in a noisy RF environment. The Module’s outstanding 120dB link budget ensures high quality connections even in such harsh environments. The MeshConnect EM357 module also integrates an 1MB Flash memory for Over-The-Air program updates, making this device ready for Smart Energy Applications. MeshConnect™ EM357 Module • FLASH Memory: 192 kB (EM357 internal) 1MB (on module board) • 12 kB SRAM • 32-bit ARM® Cortex™-M3 • Up to 23 GPIO Pins • SPI (Master/Slave), TWI, UART • Timers, Serial Wire/JTAG Interface • 5-channel 14-bit ADC • Transmit power +20dBm • 1MB additional flash for Over-The-Air programming • +120 dB RF link budget • Range up to 2.5 miles FEATURES •High RF performance: •Integrated PCB trace antenna Up to 120 dB RF Link Budget Optional U.FL external Antenna RX Sensitivity: -100 dBm •15 RF channels RF TX Power: +20 dBm •Up to 13,000 feet of range •Data Rate: 250 kbps •AES encryption •Small footprint: 1” x 1.41” (25.4 mm x 35.9 mm) •FCC, CE and IC certifications •ROHS compliant •Advanced Power Management Scheme w/ Deep Sleep Mode APPLICATIONS • Smart Energy / Grid Markets Smart Meters • Building automation and control • Home automation and control Thermostats Displays Energy Management Security Devices HVAC control Lighting control • General ZigBee wireless sensor networking ORDERING INFORMATION Part Number MeshConnect™ EM357 Module Order Number Description ZICM357P2-1 +20 dBm Output power, PCB Trace antenna ZICM357P2-1C +20 dBm Output power, with U.FL Connector for external antenna ZICM357P2-KIT1-1 +20 dBm Engineering Development Kit The information in this document is subject to change without notice, please confirm data is current Document No: 0008-00-07-00-000 (Issue A) Date Published: January 21, 2011 Page 1 MeshConnect™ EM357 Module MODULE BLOCK DIAGRAM EM357 Module PWR Reg 24 MHz XTAL Flash 1MB Castellation Edge Connector SPI Bus ANT Ember EM357 Micro processor Radio Balun PA Balun DEVELOPMENT KIT CEL's Development Kit assists users in both evaluation and development. As a stand-alone radio system, the kit allows users to place the modules into the target environment and evaluate performance on-site. The Development Kit also serves as an invaluable aid in application development. Through the many interface headers on the board, the user has access to all of the MeshConnect module pins, enabling easy connection to target systems for application development. MeshConnect™ EM357 Module Development Kit The interface board features a serial communication interface, a power management module, and peripherals such as a buzzer, a temperature sensor, push-button switches, LEDs, and GPIO headers. For more detail information regarding MeshConnect Development Kits, refer to the respective development kit user guides documents. (Available at CEL’s website http://www.cel.com) Kit Contents: • Evaluation Boards w/Module (2) • USB Cables (1) • AA Batteries (4) • Software & Technical Information CD (1) DEVELOPMENT KIT ORDERING INFORMATION Part Number MeshConnect™ EM357 Module Development Kit Order Number ZICM357P2-KIT1-1 Description +20 dBm Engineering Development Kit Page 2 MeshConnect™ EM357 Module TABLE OF CONTENTS Introduction and Overview Description.............................................................................................................................................................................................. 1 Features.................................................................................................................................................................................................. 1 Applications............................................................................................................................................................................................ 1 Ordering Information............................................................................................................................................................................. 1 Module Block Diagram........................................................................................................................................................................... 2 Development Kit..................................................................................................................................................................................... 2 System Level Function Transceiver IC......................................................................................................................................................................................... 4 Additional Flash Memory....................................................................................................................................................................... 4 Antenna................................................................................................................................................................................................... 4 Power Amplifier....................................................................................................................................................................................... 4 Electrical Specification Absolute Maximum Ratings................................................................................................................................................................... 5 Recommended (Operating Condition).................................................................................................................................................. 5 DC Characteristics.................................................................................................................................................................................. 5 RF Characteristics.................................................................................................................................................................................. 5 Pin Signal & Interfaces Pin Signals I/O Configuration................................................................................................................................................................ 6 I/O Pin Assignment................................................................................................................................................................................. 6 Software/Firmware.................................................................................................................................................................................. 8 Module Dimensions................................................................................................................................................................................ 9 Module Footprint.................................................................................................................................................................................... 9 Processing......................................................................................................................................................................................... 11 Agency Certifications................................................................................................................................................................... 12 Shipment, Storage & Handling................................................................................................................................................. 14 References & Revision History................................................................................................................................................. 15 Page 3 MeshConnect™ EM357 Module TRANSCEIVER IC The MeshConnect EM357 module uses the Ember EM357 transceiver IC. This IC incorporates the RF transceiver with the baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller, offering an excellent low cost high performance solution for all IEEE 802.15.4 / ZigBee applications. For more information about the Ember EM357 IC, visit http://www.ember.com ADDITIONAL FLASH MEMORY The MeshConnect EM357 module incorporates an additional 1MB external Flash memory for Over-The-Air program updates. The Flash memory communicates over the EM357’s second serial controller using SPI. The flash memory is wired to the following castellation pins: PA0 - SC2MOSI PA1 - SC2MISO PA2 - SC2SCLK PA3 - SC2nSSEL WP - Flash memory Write Protect line (has internal pull-up resistor, but not connected to the EM357) The instruction set for the Flash memory is similar to the Micron M25P80. Note that in order to achieve the specified sleep current for the module, it is necessary to send a Deep Power-Down command to the Flash memory. See http://www.micron.com for more information on the instruction set. ANTENNA CEL’s MeshConnect modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional U.FL connector can be specified, providing connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on page 1. The PCB antenna employs an Inverted F-Antenna topology that is compact and highly efficient. To maximize range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna performance (it should not be directly under the Inverted F-Antenna). The position of the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: • Never place the ground plane or route copper traces directly underneath the antenna portion of the module. • Never place the antenna close to metallic objects. • In the overall design, ensure that wiring and other components are not placed near the antenna. • Do not place the antenna in a metallic or metalized plastic enclosure. • Keep plastic enclosures 1cm or more from the antenna in any direction. For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna. The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout. POWER AMPLIFIER The MeshConnect EM357 Module includes a Power Amplifier (PA). This PA delivers high efficiency, high gain, and high output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission for fewer nodes in a network. The PA is connected to the alternate EM357 IC TX output, so EM357 TX power modes 2 or 3 must be used to achieve the specified output power. Page 4 MeshConnect™ EM357 Module ABSOLUTE MAXIMUM RATINGS Description MeshConnect™ EM357 Module Unit Min Max Power Supply Voltage (VDD) -0.3 3.6 VDC Voltage on any I/O Line -0.3 VDD + 0.3 VDC – 15 dBm -40 125 °C – 260 °C RF Input Power Storage Temperature Range Reflow Soldering Temperature Note: Exceeding the maximum ratings may cause permanent damage to the module or devices. RECOMMENDED (OPERATING CONDITIONS) Description Power Supply Voltage (VDD) Input Frequency Ambient Temperature Range MeshConnect™ EM357 Module Min Typ Max Unit 2.7 3.3 3.6 V 2405 – 2475 MHz -40 25 85 °C DC CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted) Description MeshConnect™ EM357 Module Unit Min Typ Max Transmit Mode Current – 170 – mA Receive Mode Current – 28 – mA Sleep Mode Current – 6 – µA RF CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM357P2 TX power mode 2, unless otherwise noted) Description MeshConnect™ EM357 Module Min Typ Max 2405 – 2475 Unit General Characteristics RF Frequency Range RF Channels MHz 11 – 25 – -96.2 – 96.2 kHz Maximum Output Power – 20 – dBm Minimum Output Power – -40 – dBm Offset Error Vector Magnitude – 15 35 % Sensitivity (1% PER, boost mode) – -100 -94 dBm Sensitivity (1% PER, normal mode) – -98 -92 dBm Saturation (maximum input level) 0 – – dBm Frequency Error Tolerance Transmitter Receiver Page 5 MeshConnect™ EM357 Module PIN SIGNALS I/O PORT CONFIGURATION MeshConnect module has 56 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module Dimensions shows the layout of the 56 edge castellations. MeshConnect I/O PIN ASSIGNMENTS CEL Ember MeshConnect EM357 IC Pin EM357 Module Number PIN Number Name Notes 1 2 3 4 5 6 7 8 9 49 N/C 21 22 24 25 49 16, 23, 28, 37 12 GROUND WP PA0 PA1 PA2 PA3 GROUND VCC RESET 10 13 PC6 11 14 PC7 Digital I/O OSC32A - 32.768 kHz crystal oscillator OSC32_EXT - Digital 32.768 kHz clock input source PA7 Digital I/O TIM1C4 - Timer 1 Channel 4 output TIM1C4 - Timer 1 Channel 4 input REG_EN - External regulator open drain output 12 18 13 19 PB3 14 20 PB4 15 26 PA4 16 27 PA5 17 29 PA6 Flash memory write protect (internal pull-up) Dedicated as SC2MOSI due to Flash memory Dedicated as SC2MISO due to Flash memory Dedicated as SC2SCLK due to Flash memory Reserved as SC2nSSEL for Flash memory Active Low (Input) Digital I/O OSC32B - 32.768 kHz crystal oscillator nTX_ACTIVE - Inverted TX_ACTIVE signal Digital I/O TIM2C3 - Timer 2 channel 3 output TIM2C3 - Timer 2 channel 3 input SC1nCTS - UART CTS handshake of Serial Controller 1 SC1SCLK - SPI master/slave clock of Serial Controller 1 Digital I/O TIM2C4 - Timer 2 channel 4 output TIM2C4 - Timer 2 channel 4 input SC1nRTS - UART RTS handshake of Serial Controller 1 SC1nSSEL - SPI slave select of Serial Controller 1 Digital I/O ADC4 - ADC Input 4 PTI_EN - Frame signal of Packet Trace Interface (PTI) TRACEDATA2 - Synchronous CPU trace data bit 2 Digital I/O ADC5 - ADC Input 5 PTI_DATA - Data signal of Packet Trace Interface (PTI) nBOOTMODE - Embedded serial bootloader activation out of rest TRACEDATA3 - Synchronous CPU trace data bit 3 Digital I/O TIM1C3 - Timer 1 channel 3 output TIM1C3 - Timer 1 channel 3 input Page 6 MeshConnect™ EM357 Module MeshConnect I/O PIN ASSIGNMENTS (Continued) CEL Ember MeshConnect EM357 IC Pin EM357 Module Number PIN Number Name 18 30 PB1 19 20 21 49 49 49 GROUND GROUND GROUND 22 31 PB2 23 32 JTCK 24 33 PC2 25 NC 26 34 PC3 27 35 PC4 28 49 GROUND 29 36 PB0 30 38 PC1 31 40 PC0 32 33 NC 41 PB7 Notes Digital I/O SC1MISO - SPI slave data out of Serial Controller 1 SC1MOSI - SPI master data out of Serial Controller 1 SC1SDA - TWI data of Serial Controller 1 SC1TXD - UART transmit data of Serial Controller 1 TIM2C1 - Timer 2 channel 1 output TIM2C1 - Timer 2 channel 1 input Digital I/O SCIMISO - SPI master data in of Serial Controller 1 SC1MOSI - SPI slave data in of Serial Controller 1 SC1SCL - TWI clock of Serial Controller 1 SC1RXD - UART receive data of Serial Controller 1 TIM2C2 - Timer 2 channel 2 output TIM2C2 - Timer 2 channel 2 input JTAG clock input from debugger SWCLK - Serial Wire clock input/output with debugger Digital I/O JTDO - JTAG data out to debugger SWO - Serial Wire Output asynchronous trace output to debugger No connect Digital I/O JTDI - JTAG data in from debugger Digital I/O JTMS - JTAG mode select from debugger SWDIO - Serial Wire bidirectional data to/from debugger Digital I/O VREF - ADC reference output VREF - ADC reference input IRQA - External interrupt source A TRACECLK - Synchronous CPU trace clock TIM1CLK - Timer 1 external clock input TIM2MSK - Timer 2 external clock mask input cc Digital I/O JRST - JTAG reset input from debugger IRQD - Default external interrupt source D TRACEDATA1 - Synchronous CPU trace data bit 1 No connect Digital I/O ADC2 - ADC Input 2 IRQC - Default external interrupt source C TIM1C2 - Timer 1 channel 2 output TIM1C2 - Timer 1 channel 2 input Page 7 MeshConnect™ EM357 Module MeshConnect I/O PIN ASSIGNMENTS (Continued) CEL Ember MeshConnect EM357 IC Pin EM357 Module Number PIN Number Name 34 42 PB6 35 43 PB5 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 49 49 49 GROUND GROUND GROUND NC NC NC NC NC NC GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND GROUND 49 49 49 49 49 49 49 49 49 49 49 49 Notes Digital I/O ADC1 - ADC Input 1 IRQB - External interrupt source B TIM1C1 - Timer 1 channel 1 output TIM1C1 - Timer 1 channel 1 input Digital I/O ADC0 - ADC Input 0 TIM2CLK - Timer 2 external clock input TIM1MSK - Timer 1 external clock mask input No connect No connect No connect No connect No connect No connect Note: PC5 is not brought out to a castellation since it is required to control the PA. For additional Pin-out details please reference Ember's EM357 IC Data sheet. SOFTWARE/FIRMWARE The MeshConnect EM357 Module is an ideal platform for the EmberZNet PRO, the industry’s most deployed and field proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee protocol software package containing all the elements required for mesh networking applications. For more information regarding the software development for this IC, visit http://www.ember.com The MeshConnect Development Kit provides a guide on how to access the EM357 IC and utilize the Ember software development environment. It also provides a point to point demo application (transfer data between 2 devices) to conduct a range test and supports low level peripheral tests. Page 8 MeshConnect™ EM357 Module MODULE DIMENSIONS MeshConnect™ EM357 Module w/PCB Trace Antenna EM357 Module RF Shield ZICM357P2 0000000000000 Pin 1 U1 C6A C1 L6 C6B C6 R2 C9 ARM R6 R5 C4A C17 EM357 Series C10 C22 R8 C5B C2 R4 1.413” C14 L2 R7 C24 R11 C23 0.903” R1 R10 L5 C11 L3 C13 L4 C20 C20 Pin 56 C21 C7 C7B C16 R9 XTAL1 C15 Pin 38 Pin 19 0.062” 1.000” 0.195” MeshConnect™ EM357 Module w/U.FL Connector for external antenna 0.120” EM357 Module RF Shield ZICM357P2 0000000000000 Pin 1 R1 C14 L2 R7 U1 C9 C24 C5B C6A C1 L6 C6B C6 R2 C4A ARM R6 EM357 Series C10 R9 C22 R8 L5 C11 L3 C13 L4 R11 C23 C17 R5 C2 R4 1.413” R10 0.903” C7B C20 Pin 56 C21 C7 C16 XTAL1 C15 Pin 38 Pin 19 1.000” 0.062” 0.195” For layout recommendation for optimum antenna performance, refer to Antenna section in this document. Page 9 MeshConnect™ EM357 Module MODULE LAND FOOTPRINT Note: Unless otherwise specified. Dimensions are in Inches [mm]. Page 10 MeshConnect™ EM357 Module PROCESSING Recommended Reflow Profile Parameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Pb-Free Solder Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section. Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the Module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads, or vias. Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Page 11 MeshConnect™ EM357 Module PROCESSING (Continued) Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711) Rework The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250 ºC. Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage. Additional Grounding Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference. AGENCY CERTIFICATIONS FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation Distance To comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC Rules and Regulations The MeshConnect Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label is placed on the outside of the final product. The MeshConnect Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-ICP0” or “Contains FCC ID: W7Z-ICP0” The OEM of the MeshConnect Module must only use the approved antenna, (PCB Trace Antenna) that has been certified with this module. The OEM of the MeshConnect Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules. Page 12 MeshConnect™ EM357 Module AGENCY CERTIFICATIONS (Continued) IC Certification — Industry Canada Statement The term "IC" before the certification / registration number only signifies that the Industry Canada technical specifications were met. Certification IC - Déclaration d'Industrie Canada Le terme "IC" devant le numéro de certification / d'enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php L'article 14 du CNR-210 Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/ index-eng.php CE Certification — Europe The MeshConnect RF module has been tested and certified for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to make a submission to the notified body for compliance testing. OEM Labeling Requirements The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials “CE” with the following form: · · · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. The CE mark must be a minimum of 5mm in height The CE marking must be affixed visibly, legibly, and indelibly. Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the “CE” marking as shown in the picture Page 13 MeshConnect™ EM357 Module SHIPMENT, HANDLING, AND STORAGE Shipment The MeshConnect Modules are delivered in trays of 28. Handling The MeshConnect Modules are designed and packaged to be processed in an automated assembly line. Warning The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. Page 14 MeshConnect™ EM357 Module REFERENCES & REVISION HISTORY Previous Versions Changes to Current Version Page(s) 0008-00-07-00-000 (Issue ES) October 14, 2010 Initial preliminary datasheet. N/A 0008-00-07-00-000 (Issue A) January 21, 2011 Updated RF Channels to 15 for FCC Certification. Updated Pin out table. Updated processing guidelines. 1, 5 Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. Page 15