ZPM3570 ZigBee Pro Module Data Sheet www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 1 of 18 ZPM3570 Data Sheet - 05/25/11 Table of Contents 1 System Description .................................................................................................................................... 4 1.1 Applications............................................................................................................................................. 4 1.2 Module Summary.................................................................................................................................... 4 1.3 Block Diagram......................................................................................................................................... 4 1.4 Acronyms ................................................................................................................................................ 5 2 Mechanical Specifications ......................................................................................................................... 5 2.1 Module Dimensions ................................................................................................................................ 5 2.2 Module Outline Drawing ......................................................................................................................... 5 2.3 Module Bottom View............................................................................................................................... 6 2.4 Detailed Mechanical Data (Top View) .................................................................................................... 6 2.5 Module Pin Out ....................................................................................................................................... 7 3 DC Electrical Specifications....................................................................................................................... 8 3.1 Typical Power Consumption ................................................................................................................... 8 3.2 Digital IO Specifications .......................................................................................................................... 8 4 RF Specifications ....................................................................................................................................... 9 5 Environmental Specifications..................................................................................................................... 9 5.1 Absolute Maximum Ratings .................................................................................................................... 9 5.2 Recommended Operating Conditions .................................................................................................... 9 6 Application Information ............................................................................................................................ 10 6.1 Connection Reference for the UART Host Interface ............................................................................ 10 6.2 Connection Reference for the SPI Host Interface ................................................................................ 10 6.3 Recommended Host (Customer) Circuit Board PCB Land Pattern...................................................... 11 6.4 Host PCB Layout Recommendations ................................................................................................... 12 6.5 Module Location ................................................................................................................................... 13 6.5.1 Location in x-y Plane ......................................................................................................................... 13 6.5.2 Location in z Plane ............................................................................................................................ 14 7 Assembly Information .............................................................................................................................. 14 7.1 Lead-free Reflow Soldering Profile ...................................................................................................... 14 8 Package Information ................................................................................................................................ 15 8.1 Tape and Reel Specifications ............................................................................................................... 15 9 Ordering Information ................................................................................................................................ 16 10 RoHS Declaration .................................................................................................................................. 16 11 Regulatory Information .......................................................................................................................... 16 11.1 FCC Notice (USA) .............................................................................................................................. 16 11.1.1 FCC Labeling Requirements ........................................................................................................... 17 11.1.2 RF Exposure .................................................................................................................................... 17 11.2 IC Notice (CANADA)........................................................................................................................... 17 11.3 CE Notice (EUROPE) ......................................................................................................................... 18 12 Technical Support Contact .................................................................................................................... 18 13 References............................................................................................................................................. 18 www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 2 of 18 ZPM3570 Data Sheet - 05/25/11 List of Figures Figure 1 ZPM3750 Module Block Diagram................................................................................................... 4 Figure 2 Module Top and Side View............................................................................................................. 5 Figure 3 Module Bottom View....................................................................................................................... 6 Figure 4 Detailed Mechanical Data (Top View) ............................................................................................ 6 Figure 5 UART Host Interface Reference Diagram ................................................................................... 10 Figure 6 SPI Host Interface Reference Diagram ........................................................................................ 10 Figure 7 Recommended Host (Customer) PCB Pattern............................................................................. 11 Figure 8 Recommended Host Circuit Board Design Underneath the Module............................................ 12 Figure 9 Recommended Locations in x-y Plane......................................................................................... 13 Figure 10 Locations Not Recommended in x-y Plane ................................................................................ 13 Figure 11 Recommended Locations in z Plane.......................................................................................... 14 Figure 12 Locations not Recommended IN x-y Plane ................................................................................ 14 Figure 13 Recommended Solder Reflow Profile ........................................................................................ 15 Figure 14 Tape Dimensions........................................................................................................................ 15 www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 3 of 18 ZPM3570 Data Sheet - 05/25/11 1 System Description 1.1 Applications RFM’s ZPM3750 module is a standards-based wireless transceiver designed for Smart Energy and other short range wireless markets that require low power consumption, high transmit power (20 dBm typical) and high receiver sensitivity (-103 dBm). The ZPM3750 is based upon the IEEE 802.15.4 wireless network specification and includes the ZigBee PRO stack. The module can be used to develop applications supporting the ZigBee PRO Smart Energy and Home Automation application profiles. The ZPM3750 module operates in the 2.4 GHz unlicensed ISM frequency band for worldwide deployment. 1.2 Module Summary • Dimensions: 27.20 x 14.75 x 2.90 mm • Ember EM357 high-performance, integrated ZigBee/802.15.4 chipset • Supply voltage: 2.4 to 3.4 V • Data logging memory: 8 Mbits serial flash • Security: 128-bit AES • Antenna: on-module • Host Interface: SPI, UART • Meter interface: I2C, GPIO • ADC ports: 6 x 14-bit • RoHS compliant • MSL JEDEC level 3 1.3 Block Diagram Figure 1 - ZPM3750 Module Block Diagram www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 4 of 18 ZPM3570 Data Sheet - 05/25/11 1.4 Acronyms ADC AMR GPIO I2C ISM MAC MSL PER ROHS SPI UART WPAN Analog to Digital Converter Automatic Meter Reading General-Purpose Input-Output Intelligent Interface Controller Industrial, Scientific and Medical Medium Access Control Moisture Sensitivity Level Packet Error Rate Restriction of Hazardous Substances Serial Peripheral Interface Universal Asynchronous Receiver-Transmitter Wireless Personal Area Network 2 Mechanical Specifications 2.1 Module Dimensions Parameter Typical Units Dimensions (L x W x H) 27.20 x 14.75 x 2.90 mm Dimensional Tolerances (L, W, H) ±0.20, ±0.20, ±0.15 mm 2.2 Module Top and Side View Figure 2 - ZMP3570 Outline Drawing www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 5 of 18 ZPM3570 Data Sheet - 05/25/11 2.3 Module Bottom View Figure 3 - ZMP3570 Bottom View 2.4 Detailed Mechanical Data (Top View) Figure 4 - Detailed Mechanical Data (top view) www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 6 of 18 ZPM3570 Data Sheet - 05/25/11 2.5 Module Pin Out Pin Name I/O 1 GND - Description Ground 2 Reserved O Internal serial flash on/off control (active low),for debugging use only 3 PC4/JTMS I/O Programmable I/O control available to the host, or JTAG mode select 4 PB0/IRQA I/O Programmable I/O control available to the host, or an interrupt input 5 Reserved O Internal serial flash nCS, for debugging use only PB6/ADC1/IRQB I/O Programmable I/O control available to the host, or ADC input, or an interrupt input 7 PC1/ADC3 I/O 8 SWCLK/JTCK I 9 PC0/JRST/IRQD I/O 10 GND - 11 PB5/ADC0 I/O 12 GND - Ground 13 GND - Ground 14 GND - Ground 15 GND - Ground 16 Reserved I/O 17 GND - Ground 18 Reserved O Used internally as the LNA on (active low), for debugging use only 19 nRESET I Module reset signal (Internal pull-up) 20 GND - Ground 21 GND - 22 PA3 I/O 23 GND - 24 PC6/OSC32B I/O Programmable I/O control available to the host, or 32.768 kHz crystal 25 PC7/OSC32A I/O Programmable I/O control available to the host, or 32.768 kHz crystal 26 SC1SCLK/PB3 I/O SPI port 1 clock, or programmable I/O control available to the host 27 Reserved O Used internally as the serial flash MOSI, for debugging use only 28 Reserved O Used internally as the serial flash MISO, for debugging use only 29 VBATT PI Module power supply 30 Reserved O Used internally as the serial flash clock, for debugging use only 31 PA4/ADC4 I/O Programmable I/O control available to the host, or ADC input 32 GND - 33 PA5/ADC5/nBOOTMODE I/O 6 34 35 SC1MISO(s) /SC1MOSI(m)/TXD/PB1/SC1SDA SC1MOSI(s) /SC1MISO(m)/RXD/PB2/SC1SCL I/O I/O Programmable I/O control available to the host, or an ADC input JTAG/Serial Wire debugging port clock Programmable I/O control available to the host, or an interrupt input, or the JTAG reset input Ground Programmable I/O control available to the host, or an ADC input Not connected in ZPM3750 Ground Programmable I/O control available to the host Ground Ground Programmable I/O control available to the host, or ADC input, or Boot control, must be left open or pulled high during the reset to enable the normal firmware boot process. SPI port 1 MISO (slave)/ MOSI (master) signal, UART TXD signal, I2C port 1 DATA signal, or programmable I/O control available to the host SPI port 1 MOSI (slave)/ MISO (master) signal, UART RXD signal, I2C port 1 CLK signal, or programmable I/O control available to the host. Programmable I/O control available to the host, or Serial Wire port OUTPUT signal, or JTAG data out 36 PC2/JTDO/SWO I/O 37 SC1nSSEL/PB4 I/O SPI port 1 slave select, or programmable I/O control available to the host 38 PC3/JTDI 39 GND I/O - Programmable I/O control available to the host, or JTAG data in Ground 40 GND - Ground 41 GND - Ground www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 7 of 18 ZPM3570 Data Sheet - 05/25/11 Pin Name 42 GND I/O - Ground Description 43 GND - Ground 44 GND - Ground 3 DC Electrical Specifications 3.1 Typical Power Consumption Specification Sleep Mode Standby Mode Receive Mode Transmit Mode, +20 dBm Serial Controller Current Conditions Min Typical VCC = 3.0 V, TAMB = 25 °C ,internal RC oscillator on, processor, radio, peripherals off VCC = 3.0 V, TAMB = 25 °C, processor on, radio and peripherals off VCC = 3.0 V, TAMB = 25 °C, radio receive chain on VCC = 3.0 V, TAMB = 25 °C radio transmit chain on Serial controller current for each controller at maximum data rate Max Units 1.2 µA 12 mA 35 mA 175 mA 0.2 mA General Purpose Timer Current For each timer at maximum clock rate 0.25 mA General Purpose ADC Current At maximum sample rate, DMA enabled 1.1 mA 3.2 Digital IO Specifications VCC = 3.0 V, TAMB = 25 °C, NORMAL MODE1 unless otherwise stated Specification Conditions Symbol Input Current for Logic 0 Minimum IIL Input Current for Logic 1 Units -0.5 µA 0.5 µA Low Schmidt Switching Threshold Input going from high to low VSWIL 0.42 * VCC 0.5 * VCC V High Schmidt Switching Threshold Input going from low to high VSWIH 0.62 * VCC 0.80 * VCC V VOL 0 0.18 * VCC V VOH 0.82 * VCC VCC V Output Voltage for Logic 0 Output Voltage for Logic 1 IIH Maximum IOL = 4 mA for standard pads IOL = 8 mA for high current pads IOH = 4 mA for standard pads IOH = 8 mA for high current pads Output Source Current Standard pad IOHS 4 mA Output Sink Current Standard pad IOLS 4 mA Output Source Current High current pad IOOH 8 mA Output Sink Current High current pad Total Output Current IOLH 8 mA IOH + IOL 40 mA 1. NORMAL MODE as defined by Ember for EM357 www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 8 of 18 ZPM3570 Data Sheet - 05/25/11 4 RF Specifications VCC = 3.0 V, TAMB = 25 °C, NORMAL MODE measured at 50 Ω terminal load connected to the RF connector Specification Minimum Frequency Range Typical Maximum Units 2500 MHz 2400 Receiver Sensitivity -103 Maximum Input Signal Level dBm -20 dBm Transmitter Power at Maximum Setting 20 dBm Adjacent Channel Rejection 24 dB Alternate Channel Rejection 42 dB Carrier Frequency Error -40 +40 ppm 5 Environmental Specifications 5.1 Absolute Maximum Ratings Specification Operating Temperature Symbol Minimum Maximum Units TOP -40 85 °C Storage Temperature TST -40 85 °C Power Supply Voltage VBATT -0.3 3.6 V RF Input Power RFIN 10 dBm Moisture Sensitivity Level 3 RoHS Restriction of Hazardous Substances Compliant 5.2 Recommended Operating Conditions Specification Symbol Minimum Typical Maximum Units Power Supply Voltage VBATT 2.4 3.0 3.41 V Operating Temperature TOP -40 85 °C 1. This value is handled by Firmware to meet FCC regulation for modular approval. www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 9 of 18 ZPM3570 Data Sheet - 05/25/11 6 Application Information 6.1 Connection Reference for the UART Host Interface Figure 5 illustrates the connections between ZPM3750 module and the host MCU via UART interface. A level shifter may be needed if the host UART interface level does not match the 3.3V ZPM3750 interface. V B A T T G P IO n R E S E T R X D T X D T X D R X D H o s t µ C Z M P 3 7 5 0 Figure 5 - UART Host Interface Reference Diagram 6.2 Connection Reference for the SPI Host Interface Figure 6 illustrates the connections between ZPM3750 module and the host MCU via SPI interface. V B A T T G P IO n R E S E T S C L K S C 1 S C L K S C S S C 1 n S S E L M O S I S C 1 M O S I M IS O S C 1 M IS O H o s t µ C Z M P 3 7 5 0 Figure 6 - SPI Host Interface Reference Diagram www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 10 of 18 ZPM3570 Data Sheet - 05/25/11 6.3 Recommended Host (customer) Circuit Board PCB Land Pattern Figure 7 - Recommended Host (customer) PCB Pattern www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 11 of 18 ZPM3570 Data Sheet - 05/25/11 6.4 Host PCB Layout Recommendations The ZPM3750 module has an onboard antenna and requires some host PCB layout considerations underneath the module to provide the best RF performance. Refer to Figure 8 for the requirements. Notes: 1. Due to the surface mount antenna on the module, the area in ‘Zone1’ on all layers of the customer circuit board should be free of any metal objects. Specifically, there should be no ground plane, traces, or metal shield case. 2. The area in ‘Zone2’ on the top layer of the customer circuit board should have ground only with no signal traces. Figure 8 - Recommended Host Circuit Board Design underneath the Module. www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 12 of 18 ZPM3570 Data Sheet - 05/25/11 6.5 Module Location For optimum EIRP, customer is advised to use the recommended module location on their respective PCB. 6.5.1 Location in x-y Plane Figure 9 - Recommended Locations in x-y Plane Figure 10 - Locations Not Recommended in x-y Plane www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 13 of 18 ZPM3570 Data Sheet - 05/25/11 6.5.2 Location in z Plane Figure 11 - Recommended Locations in z Plane Figure 12 - Locations Not Recommended in z Plane 7 Assembly Information 7.1 Lead-free Soldering Reflow Profile The lead-free solder reflow profile is recommended in the table and graph below. The profile is used to attach the module to its host PCB. The module is designed to withstand 2 reflows. Opposite side reflow is prohibited due to the module weight. Specification Recommendation Ramp-up Rate 3 °C per second maximum Maximum Time Above 217 °C 120 seconds Peak Temperature 250 °C Maximum Time within 5 °C of Peak Temperature 20 seconds Ramp-down Rate 6 °C per second maximum www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 14 of 18 ZPM3570 Data Sheet - 05/25/11 Figure 13 - Reflow Profile Pattern 8 Package Information 8.1 Tape and Reel Specifications This product is shipped in tape and reel packaging. Figure 14 - Tape Dimensions www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 15 of 18 ZPM3570 Data Sheet - 05/25/11 9 Ordering Information Module: ZPM3570 Development Kit: ZPM3570DK 10 RoHS Declaration Given supplier declarations, this product does not contain substances that are banned by Directive 2002/95/EC or contains a maximum concentration of 0.1% by weight in homogeneous materials for • Lead and lead compounds • Mercury and mercury compounds • Chromium (VI) • PBB (polybrominated biphenyl) • PBDE (polybrominated biphenyl ether) And a maximum concentration of 0.01% by weight in homogeneous materials for • Cadmium and cadmium compounds 11 Regulatory Information ZPM3750 has obtained the certifications described below. 11.1 FCC Notice (USA) This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The FCC requires the user to be notified that any changes or modifications not expressly approved by RFM, Inc. may void the user’s authority to operate the equipment. While an application of the ZPM3570 module in a product is not required to obtain a new FCC authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for that end product. This device using the integrated antenna has been tested to comply with FCC CFR Part 15. The device meets the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter, given the following considerations: • Maximum output power for the channels as defined by IEEE 802.15.4 [1] must be set to the value below using emberSetRadioPower or equivalent under NORMAL mode as specified in [2]. - For channels 11 to 24, the value of -11 - For channel 25, the value of -17 - For channel 26, the value of -27 • Duty cycle of 67% allowed. • The firmware disables power out if the source voltage is greater than 3.4 V. • VBATT must be between 2.4 and 3.4 V. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 16 of 18 ZPM3570 Data Sheet - 05/25/11 installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: reorient or relocate the receiving antenna, increase the separation between the equipment and receiver, connect the equipment into an outlet on a circuit different from that to which the receiver is connected, or consult the dealer or an experienced radio/TV technician for help. 11.1.1 FCC Labeling Requirements When integrating the ZPM3750 into a product the FCC labeling requirements must be met. This includes a clearly visible label on the outside of the finished product specifying the ZPM3750 FCC identifier (FCC ID: QPU3020) as well as the notice above. The exterior label can use wording such as “Contains Transmitter Module FCC ID: QPU3020” or “Contains FCC ID: QPU3020” although any similar wording that expresses the same meaning may be used. 11.1.2 RF Exposure This module has been certified for remote and base radio applications and is not intended to be operated within 20 cm of the body. If the module will be used for portable applications, the device must undergo SAR testing. The following statement must be included as a CAUTION statement in manuals for the products to alert users on FCC RF exposure compliance: “WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operations at closer distances than this are not recommended.” 11.2 IC Notice (Canada) The term “IC” before the certification/registration number only signifies that the Industry Canada technical specifications were met. Le terme “IC” devant le numéro de certification /d’enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to The following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence (s). Son utilisation est soumise à Les deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter Toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement du dispositif. This device complies with Health Canada’s Safety Code 6 / IC RSS-210. The installer of this device should ensure that RF radiation is not emitted in excess of the Health Canada’s requirement. Information can be obtained at: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guidelignes_direct-eng.php www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 17 of 18 ZPM3570 Data Sheet - 05/25/11 Cet appareil est conforme avec Santé Canada Code de sécurité 6 / IC RSS-210. Le programme d'installation de cet appareil doit s'assurer que les rayonnements RF n'est pas émis au-delà de l'exigence de Santé Canada. Les informations peuvent être obtenues: http://www.hc-sc.gc.ca/ewhsemt/ pubs/radiation/radio_guide-lignes_direct-eng.php The host device should be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC:4523A-ZPM3750 where 4523AZPM3750 is the module’s certification number. 11.3 CE Notice (Europe) This device has been tested and certified for use in the European Union. If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards. A Declaration of Conformity must be issued and kept on file as described in Annex II of the Radio and Telecommunications Terminal Equipment Directive. The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive. Given that the operating frequency band is not harmonized by a few European countries, the restriction or alert sign must be placed along side the ‘CE’ mark as shown below. As of the date of this document, only France has a restriction. The restriction is that, if the radio is operated outdoors in the 2450-2483.5 MHz band, the power must be limited to 10 mW instead of 100 mW. The OEM must account for this and the product must have the alert mark. It does not require country notifications, however. 12 Technical Support Contact For technical support call RFM at +1 678 684-2000 between the hours of 8:30 AM and 5:30 PM US Eastern Time, or E-mail [email protected]. 13 References [1] IEEE Standard 802.15.4 - 2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2] Ember, “EmberZNet API Reference: For the EM35x SoC Platform”, 120-3022-000G, October 28 2010 Note: Specifications subject to change without notice. Part # M-3570-0000, Rev A www.RFM.com © 2011 by RF Monolithics, Inc. Technical support +1.678.684.2000 E-mail: [email protected] Page 18 of 18 ZPM3570 Data Sheet - 05/25/11