LUGUANG ZTTCS16.0MX

ZTTCS16.0MX
1 SCOPE
This specification shall cover the characteristics of the ceramic resonator with the type ZTTCS16.0MX
2 PART NO.
PART NUMBER
CUSTOMER PART NO.
SPECIFICATION NO.
ZTTCS16.0MX
3 OUTLINE DRAWING AND STRUCTURE
3.1 Appearance
No visible damage and dirt.
3.2 Dimensions
DRAWING 1
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ZTTCS16.0MX
4 ELECTRICAL SPECIFICATIONS
TABLE 1
Items
Oscillation Frequency Fosc(MHz)
Frequency Accuracy (%)
Resonant Impedance Ro(Ω) max.
Content
16.0
±0.5
40
Remark
Insulation Resistance Ri,(MΩ)min.
500
(100V,1min)
Temperature Coefficient of Oscillation
Frequency (%) max.
±0.3
(Oscillation Frequency
drift,-25℃~+85℃)
Rating Voltage
UR(V)max.
Withstanding Voltage
(V)
6V DC
15V p-p
50
(DC,1min)
Operating Temperature (℃)
Storage Temperature
(℃)
-20~+80
-55~+85
Aging Rate (%) max.
±0.3
(For Ten Years)
5 TEST
5.1 Test Conditions
Parts shall be tested under a condition (Temperature:+20℃±15℃,
Humidity:65%±20%R.H.)unless
the
standard
condition(Temperature:+25℃±3℃,Humidity:65%±5% R.H.) is regulated
to test.
5.2 Test Circuit:
IC: 1/6TC74HCU04×2
X: Ceramic Resonator
①INPUT ②GROUND ③OUTPUT
DRAWING 2
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ZTTCS16.0MX
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
TABLE 2
No
Item
2.1
Humidity
2.2
High
Temperature
Exposure
2.3
Low
Temperature
Exposure
2.4
Temperature
Cycling
2.5
Vibration
2.6
2.7
2.8
Performance
Requirements
Condition of Test
Keep the resonator at 40 ℃ ±2 ℃ and
90%~95% RH for 96h±4h. Then Release the
resonator into the room Condition for 1h prior
to the Measurement.
Subject the resonator to 85℃±5℃ for 96h,
then release the resonator into the room
conditions for 1h prior to the measurement.
Subject the resonator to -25℃±5℃ for 96h,
then release the resonator into the room
conditions for 1h prior to the measurement.
Subject the resonator to -40℃ for 30 min.
followed by a high temperature of 85℃ for
30 min.Cycling shall be repeated 5 times with
a transfer time of 15s. At the room
temperature for 1h prior to the measurement.
Subject the resonator to vibration for 2h each
in x、y and z axis With the amplitude of
1.5mm, the frequency shall be varied
uniformly between the limits of 10 Hz~55Hz.
It shall fulfill the
specifications in
Table 3.
It shall fulfill the
specifications in
Table 3.
It shall fulfill the
specifications in
Table 3.
It shall fulfill the
specifications in
Table 3.
It shall fulfill the
specifications in
Table 3.
No visible
damage and it
Drop the resonator randomly onto a wooden
Mechanical
shall fulfill the
Shock
floor from the height of 100cm 3 times.
specifications in
Table 3.
Passed through the re-flow oven under the
following condition and left at room
Resistance to temperature for 1 hour before measurement.
It shall fulfill the
Temperature at the surface of
Time
Soldering
specifications in
the substrate
Heat
Table 3.
Preheat 150℃±5℃
60s±10s
Peak
240℃±5℃
10s±3s
Solderability
The
terminals
Dipped in 230℃±5℃ solder bath for 3s±0.5s
shall be at least
with rosin flux (25wt% ethanol solution.)
95% covered by
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ZTTCS16.0MX
solder.
Mount a glass-epoxy board (Width=40mm,
thickness=1.6mm),then bend it to 1mm
displacement and keep it for 5s. (See the
following figure)
PRESS
Board
Bending
2.9
PRESS HEAD
Mechanical
damage such as
breaks shall not
occur.
SUPPORT BAR
TABLE 3 SPECIFICATION AFTER TEST ABOUT CHARACTERISTICS
No.
3.1
3.2
Item
Oscillation Frequency Change
△Fosc/Fosc (%) max
Resonant Impedance Change
△Ro(Ω)max
Specification after test
±0.3
±30
Note : The limits in the above table are referenced to the initial measurements.
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
7.1 Recommended land pattern
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ZTTCS16.0MX
DRAWING 4
7.2 Recommended reflow soldering standard conditions
℃
w ith in 1 0 s
℃
P re - h e a tin g
w ith in
8 0 s -1 2 0 s .
w ith in
2 0 s -4 0 s
DRAWING 5
8 PACKAGE
To protect the products in storage and transportation,it is necessary to
pack them(outer and inner package).On paper pack, the following
requirements are requested.
8.1 Dimensions and Mark
At the end of package, the warning (moisture proof, upward put) should
be stick to it.
Dimensions and Mark (see below)
1
2
3
4
5
6
7
Package
Certificate ofapproval
Label
Tying
Adhesive tape
Belt Box
Inner
U N IT :m m
DRAWING 6
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ZTTCS16.0MX
8.2 Section of package
Package is made of corrugated paper with thickness of
0.8cm.Package has 12 inner boxes, each box has 5 reels (each reel for
plastic bag).
8.3 Quantity of package
Per plastic reel
1000 pieces of piezoelectric ceramic part
Per inner box
5 reels
Per package
12 inner boxes(60000 pieces of piezoelectric ceramic
part )
8.4 Reel
φ
max
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ZTTCS16.0MX
8.5 Packing Method Sketch Map
Blank Pocket
10 Pitches
Loaded Pocket Blank Pocket
10 Pitches
Leader
200mm Max
8.6 Test Condition Of Peeling Strength
T op T ape
S tre n g t
g
n
i
l
e
e
P
h 20-70g
10° Max
C a rrie r T a p e
9 OTHERS
9.1 Caution of use
9.1.1 Do not use this product with bend. Please don’t apply axcess
mechanical stress to the component and terminals at soldering.
9.1.2 The component may be damaged when an excess stress will be
applied.
9.1.3 Comformal coating of the component is acceptable,However the
resin materials ,curing temperature and other process conditions should
be evaluated to conform stable electrical characteristics are maintained.
9.2 Notice
9.2.1 This specification mentions the quality of the component as a
single unit. Please insure the component is thoroughly evaluated in your
application circuit.
9.2.2 Please return one of this specification after your signature of
acceptance.
9.2.3 When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
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