LUGUANG ZTTCW24.0MX

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1. SCOPE
This specification shall cover the characteristics of the ceramic
resonator with the type ZTTCW24.0MX.
2. PART NO.:
PART NUMBER
CUSTOMER PART NO SPECIFICATION NO
ZTTCW24.0MX
3. OUTLINE DRAWING AND DIMENSIONS:
Appearance: No visible damage and dirt.
Dimensions:
NOTES:
1.All dimensions are in millimeters.
2.Marking: A and EIAJ Monthly Code.
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4. STRUCTURE
NO:
Components
Materials
1
Ceramic Substrate
Insulation Substrate
2
Ceramic Substrate
Piezoelectric Ceramics (PZT)
3
Ceramic Substrate
Insulation Substrate
4
Adhesive
Epoxy Resin
5
UV Ink for Marking
6
Outer Electrodes
Top and Bottom Electrodes
Ag+Ni(under plating)+Sn(over plating)
Side Electrodes
Ni+Cu+Ag(under
plating)+Sn(over
plating)
7
Electrode
Cu+Ag
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5. ELECTRICAL SPECIFICATIONS:
Requirements
No
Item
5.1
Oscillation Frequency Fosc (MHz)
24.0
Frequency Accuracy (%)
±0.5
Resonant Impedance Ro (Ω)max
40
Temperature Coefficient of
±0.2 (Oscillation Frequency
Oscillation Frequency (%) max
drift -25℃ to +85℃)
Withstanding Voltage
50 VDC, 1 min
Rating Voltage UR (V)
(1) D.C. Voltage
6 VDC.
(2) A.C. Voltage
15 Vp-p.
5.2
5.3
5.4
5.5
5.6
Insulation Resistance Ri,(MΩ)min
500
5.7
5.8
5.9
5.10
Operating Temperature (℃)
Storage Temperature
(℃)
Aging Rate (%) max
Loop Gain (dB) min
-25~+85
-55~+85
±0.2 (For 10 years)
12.0
6. MEASUREMENT:
Measurement Conditions: Parts shall be measured under a condition
( Temp. : 20±15 ℃ ,Humidity : 65±20% R.H.) unless the standard
condition(Temp. : 25±3 ℃ ,Humidity : 65±5% R.H.) is regulated to
measure.
Test Circuit:
IC: 1/6 TC74HCU04P×2
X: Ceramic Resonator
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Email: [email protected]
7. PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
No
Item
7.1
Humidity
7.2
Vibration
7.3
Mechanical
Shock
7.4
Soldering
Test
7.5
Solder
Ability
7.6
High
Temperature
Exposure
Condition of Test
Performance
Requirements
Keep the resonator at 60±2 ℃ and It shall fulfill the
90-95% RH for 96±4 hours. Then release specifications in Table
the resonator into the room condition for 1 1.
hour prior to the measurement.
Subject the resonator to vibration for 2
It shall fulfill the
hours each in x、y and z axis with the
specifications in Table
amplitude of 1.5mm, the frequency shall
1.
be varied uniformly between the limits of
10Hz—55Hz.
Drop the resonator randomly onto a
It shall fulfill the
wooden floor from the height of 100cm 3 specifications in Table
times.
1.
Passed through the re-flow oven under the It shall fulfill the
following condition and left at room
specifications in Table
temperature for 1 hour before
1.
measurement.
Temperature at the
Time
surface of the
substrate
Preheat 150±5℃
60±10 sec
Peak
240±5℃
10±3 sec
Dipped in
The terminals shall
230±5℃ solder
be at least 95%
bath for 3±0.5 sec
covered by solder.
seconds with rosin
flux 25wt% ethanol
solution.
Subject the
It shall fulfill the
resonator to 85±5℃ specifications
in
for 96±4 hours.
Table 1.
Then release the
resonator into the
room conditions for
1 hour prior to the
measurement.
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Email: [email protected]
7. PHYSICAL AND ENVIRONMENAL CHARACTERISICS
(Continued from the preceding page)
No
Item
Condition of Test
7.7
Low
Temperature
Exposure
7.8
Temperature
Cycling
7.9
Board
Bending
Subject the resonator to –25±5℃ for
96±4 hours. Then release the resonator
into the room conditions for 1 hour prior
to the measurement.
Subject the resonator to -40℃ for
30 min. followed by a high temperature of
85℃ for 30 min. cycling shall be
repeated 5 times with a transfer time of 15
sec. At the room temperature for 1 hour
prior to the measurement.
Mount a glass-epoxy board
(Width=40mm,thickness=1.6mm), then
bend it to 1mm displacement and keep It
for 5 seconds. (See the following Figure)
Performance
Requirements
It shall fulfill the
specifications in Table
1.
It shall fulfill the
specifications in Table
1.
Mechanical damage
such as breaks shall
not occur.
PRESS
PRESS HEAD
D
SUPPORT BAR
TABLE 1
Item
Specification
Oscillation Frequency Change
△Fosc/Fosc (%) max
±0.3
Resonant Impedance (Ω) max
60
8. REVIEW OF SPECIFICATIONS
When something gets doubtful with this specifications, we shall
jointly work to get an agreement.
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9. RECOMMENDED LAND PATTERN AND REFLOW SOLDERING
STANDARD CONDITIONS
a) Recommended land pattern
:Land Pattern
b) Recommended reflow soldering standard conditions
within 10 sec
℃
Pre-heating
within
80-120sec.
within
20-40sec
10. PACKAGE
To protect the products in storage and transportation ,it is
necessary to pack them(outer and inner package).On paper pack, the
following requirements are requested.
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a) Dimensions and Mark
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At the end of package, the warning (moisture proof, upward put)
should be stick to it.
Dimensions and Mark (see below)
b)
NO.
Name
Quantity
1
Package
1
2
Certificate of approval
1
3
Label
1
4
Tying
2
5
Adhesive tape
1.2m
6
Belt
2.9m
7
Inner Box
10
Notes
Section of package
Package is made of corrugated paper with thickness of
0.8cm.Package has 12 inner boxes, each box has 6 reels (each reel for
plastic bag).
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c)
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Quantity of package
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Per plastic reel
3000 pieces of piezoelectric ceramic part
Per inner box
6 reels
Per package
12 inner boxes(216000 pieces of
piezoelectric
ceramic part )
d)
Inner Packing Dimensions
1
Label
2
QC Label
3
Inner Box
UNIT: mm
Pars shall be packaged in box with hold down tape upside. Part No.,
quantity and lot No.
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e)
Email: [email protected]
Reel
φ
max
f)
Packing Method Sketch Map
Blank Pocket
10 Pitches
Loaded Pocket
Leader
200mm Max
Blank Pocket
10 Pitches
g) Test Condition Of Peeling Strength
T op T ape
g th
S tre n
g
n
i
l
e
Pe
g
20-70
10° Max
C a rrie r T a p e
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