ZXCL SERIES Micropower SC70-5 & SOT23-5 low dropout regulators ZXCL5213V25, ZXCL5213V26, ZXCL5213V28, ZXCL5213V30, ZXCL5213V33, ZXCL250, ZXCL260, ZXCL280, ZXCL300, ZXCL330 Description Features The ZXCL series have been designed with space sensitive systems in mind. They are available in the ultra small SC70-5 package, which is half the size of SOT23 based regulators. • Low 85mV dropout at 50mA load • 50A ground pin current with full 150mA load • 2.5, 2.6, 2.8, 3, & 3.3 volts output The devices can be used with all types of output capacitors including low ESR ceramics and typical dropout voltage, is only 85mV at 50mA load. Supply current is minimised with a ground pin current of only 50A at full 150mA load. Logic control allows the devices to be shut down, consuming typically less than 10nA. These features make the device ideal for battery powered applications where power economy is critical. • Very low noise, without bypass capacitor • 5-pin SC70 and SOT23 package • No-load stable For applications requiring improved performance over alternative devices, the ZXCL is also offered in the 5 pin SOT23 package with an industry standard pinout. The devices feature thermal overload and over-current protection and are available with output voltages of 2.5V, 2.6V, 2.8V, 3V, 3.3V. Applications • Cellular and Cordless phones • PDA • Hand held instruments • Camera, Camcorder, Personal stereo • PC cards • Portable and battery-powered equipment No-Load Stability, the ZXCL device will maintain regulation and is stable with no external load. e.g. CMOS RAM applacations. Typical application circuit Package footprint SOT23-5 (see P7 for SC70-5) Package suffix - E5 VO VIN GND EN NC Top view Issue 8 - October 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXCL SERIES Ordering information Order reference Voltage (V) Package Part marking Status Reel size (inches) Tape width (mm) Quantity per reel ZXCL250H5TA 2.5 SC70-5 L25A Active 7 8 3000 ZXCL260H5TA 2.6 SC70-5 L26A Active 7 8 3000 ZXCL280H5TA 2.8 SC70-5 L28A Active 7 8 3000 ZXCL300H5TA 3.0 SC70-5 L30A Active 7 8 3000 ZXCL330H5TA 3.3 SC70-5 L33A Active 7 8 3000 ZXCL400H5TA 4.0 SC70-5 L40A Obsolete 7 8 3000 ZXCL5213V25H5TA 2.5 SC70-5 L25C Active 7 8 3000 ZXCL5213V26H5TA 2.6 SC70-5 L26C Active 7 8 3000 ZXCL5213V28H5TA 2.8 SC70-5 L28C Active 7 8 3000 ZXCL5213V30H5TA 3.0 SC70-5 L30C Active 7 8 3000 ZXCL5213V33H5TA 3.3 SC70-5 L33C Active 7 8 3000 ZXCL5213V40H5TA 4.0 SC70-5 L40C Not rec. for new designs 7 8 3000 ZXCL250E5TA 2.5 SOT23-5 L25B Active 7 8 3000 ZXCL260E5TA 2.6 SOT23-5 L26B Active 7 8 3000 ZXCL280E5TA 2.8 SOT23-5 L28B Active 7 8 3000 ZXCL300E5TA 3.0 SOT23-5 L30B Active 7 8 3000 ZXCL330E5TA 3.3 SOT23-5 L33B Active 7 8 3000 ZXCL400E5TA 4.0 SOT23-5 L40B Obsolete 7 8 3000 Absolute maximum rating Terminal Voltage with respect to GND Output short circuit duration Infinite VIN -0.3V to 7.0V Continuous power dissipation Internally limited EN -0.3V to 10V Operating temperature range -40°C to +85°C VO -0.3V to 5.5V Storage temperature range -55°C to +125°C Package power dissipation (TA=25°C) SC70-5 300mW (Note 1) SOT23-5 450mW (Note 1) Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability. Issue 8 - October 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXCL SERIES Recommended operating conditions Symbol Parameter Min Max Units VIN Input voltage range 2.0* 5.5 V VENH Enable pin logic level High pin 2.2 10 V VENL Enable pin logic level Low pin 0 0.8 V TA Ambient temperature range -40 85 °C * Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation, VIN(min) > VOUT(nom) + 0.5V. Pin description Symbol Parameter VIN Supply voltage GND Ground EN Active HIGH enable input. TTL/CMOS logic compatible. Connect to VIN or logic high for normal operation N/C No connection VO Regulator output Issue 8 - October 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXCL SERIES Electrical characteristics VIN = VO = 0.5V, all values at TA = 25°C (Unless otherwise stated) Symbol Parameter Conditions VO IO=1mA IO=100mA VO+0.5V < VIN < VIN max ⌬VO/⌬T Output voltage IO(Max) Output voltage temperature coefficient Output current IOLIM Over current limit IO Ground pin current VDO Dropout voltage note 3 VENHS IEN IOSD TSD -3% +3% -15 XCL250/5213V25 only ⌬VLNR ⌬VLDR EN Limits Min. Typ. Max. -2% +2% XCL250/5213V25 only No Load IO=150mA IO=100mA IO=10mA All variants IO=50mA IO=100mA ZXCL250 / 5213V25 IO=100mA ZXCL260 / 5213V26 IO=100mA ZXCL280 / 5213V28 IO=100mA ZXCL300 / 5213V30 IO=100mA ZXCL330 / 5213V33 IO=100mA ZXCL400 / 5213V40 VIN=(VO+0.5V) to 5.5V, IO=1mA IO=1mA to 100mA f=10Hz to 100kHz, CO=10F Line regulation Load regulation Output noise voltage Enable pin hysteresis Enable pin input VEN=5.5V current Shutdown supply VEN=0V current Thermal shutdown temperature 150 100 160 105 V V ppm/°C mA 230 25 50 40 15 85 163 155 140 140 140 140 0.02 0.01 50 800 750 50 120 100 325 310 280 280 280 280 0.1 0.04 150 125 Units mA A A A mV mV mV mV mV mV mV mV %/V %/mA VRMS mV 100 nV 1 A 165 °C Device testing is performed at TA=25°C. Device thermal performance is guaranteed by design. Note1: Maximum power dissipation is calculated assuming the device is mounted on a PCB measuring 2 inches square Note2:Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation, VIN(min) > VOUT(nom) + 0.5V. Note3:Dropout voltage is defined as the difference between VIN and VO, when VO has dropped 100mV below its nominal value. Nominal value of VO is defined at VIN=VO+0.5V. Issue 8 - October 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXCL SERIES Typical characteristics (ZXCL280 / 5213 shown) 0.25 Dropout Voltage (V) 6 Voltage (V) 5 4 VIN 3 2 IOUT = 100mA 1 0.20 0.15 0.10 0.05 IOUT = 1mA 0 0.00 0 1 2 3 4 5 6 0 50 75 100 125 150 175 Output Current (mA) Input to Output Characteristics Dropout Voltage v Output Current 25.0 2.81 VIN = 3.3V No Load Ground Current (µA) Output Voltage (V) 25 Input Voltage (V) 2.80 VIN = 3.3V No Load 24.8 24.6 24.4 24.2 24.0 23.8 23.6 23.4 23.2 2.79 -50 -25 0 25 50 75 23.0 -50 100 0 25 50 75 Temperature (˚C) Output Voltage v Temperature Ground Current v Temperature 100 60 30 No Load Ground Current (µA) Ground Current (µA) -25 Temperature (˚C) 25 20 15 10 5 0 55 50 VIN = 5V 45 VIN = 3.3V 40 35 30 25 20 0 1 2 3 4 5 0 25 50 75 100 125 Input Voltage (V) Load Current (mA) Ground Current v Input Voltage Ground Current v Load Current Issue 8 - October 2007 © Zetex Semiconductors plc 2007 5 150 www.zetex.com ZXCL SERIES Typical characteristics 400 100 6 COUT = 1μF 3 VIN = 3.3V IL = 1mA IL = 100mA 2 1 0 10 20 30 40 50 60 70 Time (μs) VIN = 5V IL = 1mA to 50mA 350 50 300 0 100 ΔVOUT (mV) Voltage (V) VIN = 5V IL = 1mA IL = 100mA 4 0 IL(mA) Enable 5 80 COUT = 1μF 50 COUT = 10μF 0 COUT = 10μF -50 -100 0.0 90 100 COUT = 1μF 0.1 6 COUT = 1μF Tr & Tf = 2.5μs 5 4 0.5 COUT = 1μF Tr & Tf = 2.5μs 5 4 ΔVOUT (mV) 3 0.1 0.2 0.3 0.4 0.5 1 20 0 10 -1 0 -2 -10 -3 -20 -4 0.0 0.1 0.2 0.3 0.4 Time (ms) Time (ms) Line Rejection IL = 1mA Line Rejection IL = 100mA 10 80 70 All Caps Ceramic Surface Mount 60 IL = 50mA Noise μV/√Hz ΔVOUT (mV) 3 Power Supply Rejection (dB) 0.4 Load Response VIN (V) VIN(V) 6 50 40 COUT = 10μF 30 COUT = 2.2μF 20 COUT = 1μF 10 0 10 0.3 Time (ms) Start-Up Response 1 20 0 10 -1 0 -2 -10 -3 -20 -4 0.0 0.2 100 1k 10k IL = 100mA, COUT = 1μF IL = 100mA, COUT = 10μF 1 0.1 No Load, COUT = 1μF No Load, COUT = 10μF 100k 0.01 10 1M 100 1k 10k 100k Frequency (Hz) Frequency (Hz) Power Supply Rejection v Frequency Output Noise v Frequency Issue 8 - October 2007 © Zetex Semiconductors plc 2007 0.5 6 1M www.zetex.com ZXCL SERIES Connection diagrams SC70-5 (H5) VIN SC70-5 (H5) VO EN VIN N/C* GND NC EN Top view ZXCLxxx VO GND Top view * Should be left open circuit or connected to pin 3 ZXCL5213Vxx Schematic diagram Issue 8 - October 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXCL SERIES Input to Output Diode Increased Output current In common with many other LDO regulators, the ZXCL device has an inherent diode associated with the output series pass transistor. This diode has its anode connected to the output and its cathode to the input. The internal diode is normally reverse biased, but will conduct if the output is forced above the input by more than a VBE (approximately 0.6V). Current will then flow from Vout to Vin. For safe operation, the maximum current in this diode should be limited to 5mA continuous and 30mA peak. An external schottky diode may be used to provide protection when this condition cannot be satisfied. Any ZXCL series device may be used in conjunction with an external PNP transistor to boost the output current capability. In the application circuit shown below, a FMMT717 device is employed as the external pass element. This SOT23 device can supply up to 2.5A maximum current subject to the thermal dissipation limits of the package (625mW). Alternative devices may be used to supply higher levels of current. Note that with this arrangement, the dropout voltage will be increased by the VBE drop of the external device. Also, care should be taken to protect the pass transistor in the event of excessive output current. Scheme to boost output current to 2A Issue 8 - October 2007 © Zetex Semiconductors plc 2007 8 www.zetex.com ZXCL SERIES Applications information Enable control A TTL compatible input is provided to allow the regulator to be shut down. A low voltage on the Enable pin puts the device into shutdown mode. In this mode the regulator circuit is switched off and the quiescent current reduces to virtually zero (typically less than 10nA) for input voltages above the minimum operating threshold of the device. A high voltage on the Enable pin ensures normal operation. The Enable pin can be connected to VIN or driven from an independent source of up to 10V maximum. (e.g. CMOS logic) for normal operation. There is no clamp diode from the Enable pin to VIN, so the VIN pin may be at any voltage within its operating range irrespective of the voltage on the Enable pin. However input voltage rise time should be kept below 5ms to ensure consistent start-up response. R C Figure 1 Circuit Connection Current Limit The ZXCL devices include a current limit circuit which restricts the maximum output current flow to typically 230mA. Practically the range of over-current should be considered as minimum 160mA to maximum 800mA. The device’s robust design means that an output short circuit to any voltage between ground and VOUT can be tolerated for an indefinite period. Td Figure 2 Start up delay (Td) Thermal Overload Thermal overload protection is included on chip. When the device junction temperature exceeds a minimum 125°C the device will shut down. The sense circuit will re-activate the output as the device cools. It will then cycle until the overload is removed. The thermal overload protection will be activated when high load currents or high input to output voltage differentials cause excess dissipation in the device. ⎛ VIN ⎞ Td(NOM) = RCIn⎜ ⎟ ⎝ VIN − 1.5 ⎠ Calculation of start up delay as above Start up delay A small amount of hysteresis is provided on the Enable pin to ensure clean switching. This feature can be used to introduce a start up delay if required. Addition of a simple RC network on the Enable pin provides this function. The following diagram illustrates this circuit connection. The equation provided enables calculation of the delay period. Issue 8 - October 2007 © Zetex Semiconductors plc 2007 9 www.zetex.com ZXCL SERIES Applications information (Cont) Power dissipation The maximum allowable power dissipation of the device for normal operation (Pmax), is a function of the package junction to ambient thermal resistance (θja), maximum junction temperature (Tjmax), and ambient temperature (Tamb), according to the expression: Pmax = (Tjmax – Tamb) / θja The dielectric of the ceramic capacitance is an important consideration for the ZXCL Series operation over temperature. Zetex recommends minimum dielectric specification of X7R for the input and output capacitors. For example a ceramic capacitor with X7R dielectric will lose 20% of its capacitance over a -40⬚C to 85⬚C temperature range, whereas a capacitor with a Y5V dielectric loses 80% of its capacitance at -40⬚C and 75% at 85⬚C. The maximum output current (Imax) at a given value of Input voltage (VIN) and output voltage (VOUT) is then given by An input capacitor of 1F (ceramic or tantalum) is recommended to filter supply noise at the device input and will improve ripple rejection. Imax = Pmax / (VIN - VOUT) The input and output capacitors should be positioned close to the device, and a ground plane board layout should be used to minimise the effects of parasitic track resistance. Max Power Dissipation (mW) The value of qja is strongly dependent upon the type of PC board used. Using the SC70 package it will range from approximately 280°C/W for a multi-layer board to around 450°C/W for a single sided board. It will range from 180°C/W to 300°C/W for the SOT23-5 package. To avoid entering the thermal shutdo wn state, Tjmax should be assumed to be 125°C and Imax less than the over-current limit,(IOLIM). Power derating for the SC70 and SOT23-5 packages is shown in the following graph. 500 Dropout voltage The output pass transistor is a large PMOS device, which acts like a resistor when the regulator enters the dropout region. The dropout voltage is therefore proportional to output current as shown in the typical characteristics. Ground current The use of a PMOS device ensures a low value of ground current under all conditions including dropout, start-up and maximum load. 400 SOT23 Power supply rejection and load transient response 300 200 SC70 Line and Load transient response graphs are shown in the typical characteristics. 100 0 -40 -20 0 20 40 60 80 100 Temperature (°C) Derating Curve Capacitor selection and regulator stability The device is designed to operate with all types of output capacitor, including tantalum and low ESR ceramic. For stability over the full operating range from no load to maximum load, an output capacitor with a minimum value of 1μF is recommended, although this can be increased without limit to improve load transient performance. Higher values of output capacitor will also reduce output noise. Capacitors with ESR less than 0.5V are recommended for best results. Issue 8 - October 2007 © Zetex Semiconductors plc 2007 These show both the DC and dynamic shift in the output voltage with step changes of input voltage and load current, and how this is affected by the output capacitor. If improved transient response is required, then an output capacitor with lower ESR value should be used. Larger capacitors will reduce over/ undershoot, but will increase the settling time. Best results are obtained using a ground plane layout to minimise board parasitics. 10 www.zetex.com ZXCL SERIES S70-5 Package outline ␣ Dim. Millimeters Inches Dim. Millimeters Min. Max. Min. Max. A 0.80 1.10 0.0315 0.0433 E 2.10 BSC 0.0826 BSC A1 - 0.10 - 0.0039 E1 1.25 BSC 0.0492 BSC A2 0.80 1.00 0.0315 0.0039 e 0.65 BSC 0.0255 BSC b 0.15 0.30 0.006 0.0118 e1 1.30 BSC 0.0511 BSC C 0.08 0.25 0.0031 0.0098 L 0.26 0.46 0.010 0.018 ␣ 0° 8° 0° 8° D 2.00 BSC Min. 0.0787 BSC Max. Inches Max. Max. Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 8 - October 2007 © Zetex Semiconductors plc 2007 11 www.zetex.com ZXCL SERIES SOT23-5 Package outline DIM A A1 A2 b C D E E1 e e1 L a° Millimeters Min. 0.90 0.00 0.90 0.20 0.09 2.70 2.20 1.30 Inches Max. 1.45 0.15 1.30 0.50 0.26 3.10 3.20 1.80 Min. 0.0354 0.00 0.0354 0.0078 0.0035 0.1062 0.0866 0.0511 0.95 REF 1.90 REF 0.10 0° Max. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 0.1181 0.0708 0.0374 REF 0.0748 REF 0.60 30° 0.0039 0° 0.0236 30° Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 8 - October 2007 © Zetex Semiconductors plc 2007 12 www.zetex.com ZXCL SERIES Intentionally left blank Issue 8 - October 2007 © Zetex Semiconductors plc 2007 13 www.zetex.com ZXCL SERIES Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labelling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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