ETC ZXFV203N14

ZXFV201, ZXFV203
QUAD AND TRIPLE VIDEO AMPLIFIER
Device description
The ZXFV201/203 are quad and triple, high speed amplifiers
designed for video and other high speed applications.
They feature low differential gain and phase performance. Together
with high output drive and slew rate capability, this brings high
performance to video applications.
The ZXFV203 is ideal for RGB buffer applications, with
the ZXFV201 ideal for RGSB applications.
Features and benefits
· Unity gain bandwidth 300MHz
· Slew rate 400V/␮s
Connection diagram
· Differential gain 0.01%
· Differential phase 0.01⬚
· Output current 40mA
· Characterized up to 300pF load
· ±5 Volt supply
· Supply current 7mA per amplifier
· 14 pin SO package
Applications
· Video gain stages
ZXFV201
· CCTV buffer
· Video distribution
Connection diagram
· RGB buffering
· Home theatre
· Fast ADC signal input drive
· Cable driving
Ordering Information
Part number
Container
Increment
ZXFV201N14TA
reel 7”
500
ZXFV201N14TC
reel 13”
2500
ZXFV203N14TA
reel 7”
500
ZXFV203
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SEMICONDUCTORS
ZXFV201, ZXFV203
ABSOLUTE MAXIMUM RATINGS Over Operating Free-Air Temperature (Unless Otherwise Stated (1)
Supply voltage, V+ to VInput voltage (V-IN, V+IN)*
-0.5V to +11V
V- -0.5V to V+ +0.5V
Differential input voltage, VID
±3V
Inverting input current (I-IN) (2)
±5 mA
Output current, (continuous, TJ < 110°C)
±60 mA
Internal power dissipation
See power dissipation derating table
Operating free air temperature range, TA
-40 to 85°C
Storage temperature range
-65°C to +150°C
Operating ambient junction temperature TJMAX 150°C
Notes:
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(2) At high closed loop gains and low gain setting resistors care must be taken if large input signals are applied to the device which cause the
output stage to saturate for extended periods of time.
(3) The power dissipation of the device when loaded must be designed to keep the device junction temperature below TJMAX.
Package
Theta-ja
Power rating at 25°C
SO14
120°C/W
1.04W
*During power-up and power-down, these voltage ratings require that signals be applied only when the power supply is connected.
ESD: This device is sensitive to static discharge and proper handling precautions are required.
ELECTRICAL CHARACTERISTICS
±5V power supplies, Tamb= 25°C unless otherwise stated. Rf = 1k⍀, RL = 150⍀, CL⭐ = 10pF
PARAMETER
Supply voltage V+ operating range
Supply voltage V- operating range
Supply current/per channel
Input common mode voltage range
Input offset voltage
Output offset voltage
Input bias current, non-inverting input
Input resistance
Output voltage swing
Output drive current
Positive PSRR
Negative PSRR
Bandwidth –3dB
Bandwidth –0.1dB
Slew rate
Rise time
Fall time
Propagation delay
Differential gain
Differential phase
CONDITIONS
TEST MIN
TYP
MAX
UNIT
4.75
-5.25
5.0
5
-5
7.5
⫾3
1
2
5
2
⫾3
5.25
-4.75
10
V
V
mA
V
mV
mV
␮A
M⍀
V
mA
dB
dB
MHz
MHz
V/␮s
P
P
P
P
P
P
P
I OUT = 40mA
P
V IN = 3V
P
⌬V+ = ±0.25
P
⌬V- = ±0.25
Av= +1, Vout = 200mV pk-pk C
Av= +1, Vout = 200mV pk-pk C
Av= +1
C
Av = +2
Av = +10
C
V OUT = ⫾1 V, 10% - 90%
C
V OUT = ⫾1 V, 10% - 90%
C
V OUT = ⫾2 V, 50%
3.58MHz (NTSC) and
C
4.43MHz (PAL) DC = -714 to C
+714 mV, 280mVpp
1.5
40
49
49
57
57
300
30
400
400
400
4.0
3.2
4.0
0.02
0.02
10
20
10
6.5
ns
ns
ns
%
deg
Test – P = production tested. C = characterised
ISSUE 3 - DECEMBER 2003
SEMICONDUCTORS
2
ZXFV201, ZXFV203
Figure 1: Typical video signal application circuit, gain = 2 (overall gain = 1 for 75
load)
Figure 2: Pulse response, unity gain, 1V pk-pk, RF = 510
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SEMICONDUCTORS
ZXFV201, ZXFV203
Figure 3: Graphs of gain and phase vs frequncy (RL=150 )
APPLICATIONS INFORMATION
Introduction
Note particularly that the inverting input of this current
feedback type of amplifier is sensitive to small
amounts of capacitance to ground which occur as part
of the practical circuit board layout. This capacitance
affects bandwidth, frequency response peaking and
pulse overshoot. Therefore to minimise this
capacitance, the feedback components R2 and R3 of
Figure1 should be positioned as close as possible to
the inverting input connection.
A typical circuit application is shown in Figure 1, above.
This is suitable for 75⍀ transmission line connections
at both the input and the output and is useful for
distribution of wide-band signals such as video via
cables. The 75⍀ reverse terminating resistor R4 gives
the correct matching condition to a terminated video
cable. The amplifier load is then 150⍀ in parallel with
the local feedback network.
The wide bandwidth of this device necessitates some
care in the layout of the printed circuit. A continuous
ground plane is required under the device and its
signal connection paths, to provide the shortest
possible ground return paths for signals and power
supply filtering. A double-sided or multi-layer PCB
construction is required, with plated-through via holes
providing closely spaced low-inductance connections
from some components to the continuous ground
plane.
The frequency response and pulse response will vary
according to particular values of resistors and layout
capacitance. The response can be tailored for the
application to some extent by choice of the value of
feedback resistor. Figure 2 shows an oscilloscope
display of the pulse response for a practical double
sided printed circuit board where RF = 510⍀.
For the power supply filtering, low inductance surface
mount capacitors are normally required. It has been
found that very good RF decoupling is provided on
each supply using a 1000pF NPO size 0805 or smaller
ceramic surface mount capacitor, closest to the device
pin, with an adjacent 0.1uF X7R capacitor. Other
configurations are possible and it may be found that a
single 0.01uF X7R capacitor on each supply gives good
results. However this should be supported by larger
decoupling capacitors elsewhere on the printed circuit
board. Values of 1 to 10µF are recommended,
particularly where the voltage regulators are located
more than a few inches from the device. These larger
capacitors are recommended to be solid tantalum
electrolytic or ceramic types.
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SEMICONDUCTORS
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ZXFV201, ZXFV203
Notes
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SEMICONDUCTORS
ZXFV201, ZXFV203
Notes
ISSUE 3 - DECEMBER 2003
SEMICONDUCTORS
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ZXFV201, ZXFV203
Notes
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SEMICONDUCTORS
ZXFV201, ZXFV203
PACKAGE OUTLINE
PACKAGE DIMENSIONS
Millimeters
Inches
DIM
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
b
0.33
0.51
c
0.19
D
8.55
e
Millimeters
Inches
DIM
Min
Max
Min
Max
E
3.80
4.00
0.15
0.157
0.01
H
5.80
6.20
0.228
0.244
0.013
0.020
L
0.40
1.27
0.016
0.05
0.25
0.008
0.010
␪
0°
8°
0°
8°
8.75
0.337
0.344
-
-
-
-
-
-
-
-
-
-
1.27 BSC
0.05 BSC
© Zetex plc 2003
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This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to
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ISSUE 3 - DECEMBER 2003
SEMICONDUCTORS
8