TYSEMI ZXM61P02FTA

Product specification
ZXM61P02F
20V P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
•
•
•
•
•
•
•
ID
RDS(on)
V(BR)DSS
TA = 25°C
600mΩ @ VGS = -4.5V
-0.92A
900mΩ @ VGS = -2.7V
-0.75A
-20V
Description and Applications
This MOSFET utilizes a unique structure that combines the benefits
of low on-resistance with fast switching speed, making it ideal for
high-efficiency power management applications.
•
•
•
•
Mechanical Data
•
•
•
•
DC - DC converters
Power management functions
Disconnect switches
Motor control
Fast switching speed
Low on-resistance
Low threshold
Low gate drive
“Lead Free”, RoHS Compliant (Note 1)
Halogen and Antimony Free. "Green" Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
•
Case: SOT23
Case Material: Molded Plastic, UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish; Solderable per MIL-STD-202,
Method 208
Weight: 0.008 grams (approximate)
SOT23
D
S
G
D
G
Top View
S
Equivalent Circuit
Top View
Pin Out
Ordering Information (Note 3)
Product
ZXM61P02FTA
Notes:
Marking
P02
Reel size (inches)
7
Tape width (mm)
8
Quantity per reel
3000 Units
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free.
2. Diodes Inc’s “Green” Policy can be found on our website at http://www.twtysemi.com
3. For packaging details, go to our website at http://www.twtysemi.com
Marking Information
P02
http://www.twtysemi.com
P02 = Product Type Marking Code
[email protected]
1 of 3
Product specification
ZXM61P02F
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
VGS = 4.5V
TA = 25°C (Note 5)
TA = 70°C (Note 5)
ID
Pulsed Drain Current (Note 6)
Continuous Source Current (Body Diode) (Note 5)
Pulsed Source Current (Body Diode) (Note 6)
IDM
IS
ISM
Value
-20
±12
-0.9
-0.7
-4.9
-0.9
-4.9
Units
V
V
Value
625
5
806
6.4
200
155
-55 to +150
Unit
mW
mW/°C
mW
mW/°C
°C/W
°C/W
°C
A
A
A
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Power Dissipation (Note 4)
Linear Derating Factor
Power Dissipation (Note 5)
Linear Derating Factor
Thermal Resistance, Junction to Ambient (Note 4)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Notes:
Symbol
PD
PD
RθJA
RθJA
TJ, TSTG
4. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
5. For a device surface mounted on FR4 PCB measured at t ≤5 secs.
6. Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10μs - pulse current limited by maximum junction temperature.
http://www.twtysemi.com
[email protected]
2 of 3
Product specification
ZXM61P02F
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-20
⎯
⎯
⎯
⎯
⎯
⎯
-0.1
±100
V
μA
nA
ID = -250μA, VGS = 0V
VDS = -20V, VGS = 0V
VGS = ±12V, VDS = 0V
VGS(th)
-0.7
⎯
V
Static Drain-Source On-Resistance (Note 7)
RDS (ON)
⎯
⎯
Forward Transconductance (Notes 7 and 9)
Diode Forward Voltage (Note 7)
Reverse Recovery Time (Note 9)
Reverse Recovery Charge (Note 9)
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time (Note 8)
Turn-On Rise Time (Note 8)
Turn-Off Delay Time (Note 8)
Turn-Off Fall Time (Note 8)
Total Gate Charge (Note 8)
Gate-Source Charge (Note 8)
Gate-Drain Charge (Note 8)
gfs
VSD
trr
Qrr
0.56
⎯
⎯
⎯
⎯
⎯
14.9
5.6
⎯
0.6
0.9
⎯
-0.95
⎯
⎯
ID = -250μA, VDS = VGS
VGS = -4.5V, ID = -0.61A
VGS = -2.7V, ID = -0.31A
VDS = -10V, ID = -0.31A
TJ = 25°C, IS = -0.61A, VGS = 0V
TJ = 25°C, IF = -0.61A,
di/dt = 100A/μs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
150
70
30
2.9
6.7
11.2
10.1
3.5
0.5
1.5
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Notes:
Ω
S
V
ns
nC
Test Condition
pF
VDS = -15V, VGS = 0V
f = 1.0MHz
ns
VDD = -110V, ID = -0.93A,
RG ≅ 6.2Ω, RD ≅ 11Ω,
nC
VDS = -16V, VGS = -4.5V,
ID = -0.61A
7. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤ 2%.
8. Switching characteristics are independent of operating junction temperature.
9. For design aid only, not subject to production testing.
http://www.twtysemi.com
[email protected]
3 of 3