DIODES ZXTN07012EFF

ZXTN07012EFF
12V, SOT23F, NPN high gain power transistor
Summary
BVCEO > 12V
BVECO > 3V
IC(cont) = 4.5A
VCE(sat) < 70mV @ 1A
RCE(sat) = 43m
PD = 1.5W
Complementary part number ZXTP07012EFF
Description
C
This low voltage NPN transistor has been designed for applications
requiring high gain and very low saturation voltage. The SOT23F
package is pin compatible with the industry standard SOT23 footprint
but offers lower profile and higher dissipation for applications where
power density is of utmost importance.
B
Features
E
•
Low profile SOT23F package
•
Low saturation voltage
•
High gain
•
High power dissipation
E
Applications
•
LED driver
•
Boost converter
•
Logic interface
•
Motor drive
C
B
Pinout - top view
Ordering information
Device
Reel size
(inches)
Tape width
(mm)
Quantity
per reel
7
8
3000
ZXTN07012EFFTA
Device marking
1D3
Issue 1 - September 2006
© Zetex Semiconductors plc 2006
1
www.zetex.com
ZXTN07012EFF
Absolute maximum ratings
Parameter
Symbol
Limit
Unit
Collector-base voltage
VCBO
20
V
Collector-emitter voltage
VCEO
12
V
Emitter-collector voltage (reverse blocking)
VECO
3
V
Emitter-base voltage
VEBO
7
V
Continuous collector current(c)
IC
4.5
A
Base current
IB
1
A
ICM
10
A
0.84
W
6.72
mW/°C
1.34
W
10.72
mW/°C
1.50
W
12.0
mW/°C
2.0
W
PD
16.0
mW/°C
Tj, Tstg
- 55 to 150
°C
Peak pulse current
Power dissipation at Tamb =25°C(a)
Linear derating factor
PD
Power dissipation at Tamb =25°C(b)
Linear derating factor
PD
Power dissipation at Tamb =25°C(c)
Linear derating factor
PD
Power dissipation at Tamb =25°C(d)
Linear derating factor
Operating and storage temperature range
Thermal resistance
Parameter
Symbol
Limit
Unit
ambient(a)
RJA
149
°C/W
Junction to ambient(b)
RJA
93
°C/W
Junction to ambient(c)
RJA
83
°C/W
Junction to ambient(d)
RJA
60
°C/W
Junction to
NOTES:
(a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
(b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(d) As (c) above measured at t<5secs.
Issue 1 - September 2006
© Zetex Semiconductors plc 2006
2
www.zetex.com
ZXTN07012EFF
Characteristics
Issue 1 - September 2006
© Zetex Semiconductors plc 2006
3
www.zetex.com
ZXTN07012EFF
Electrical characteristics (at Tamb = 25°C unless otherwise stated)
Parameter
Symbol
Min.
Typ.
Collector-base breakdown
voltage
Max.
Unit Conditions
BVCBO
20
40
V
IC = 100A
Collector-emitter breakdown
voltage (base open)
BVCEO
12
17
V
IC = 10mA (*)
Emitter-base breakdown
voltage
BVEBO
7
8.3
V
IE = 100A
Emitter-collector breakdown
voltage (reverse blocking)
BVECX
6
8.2
V
IE = 100A, RBC < 1k or
0.25V > VBC > -0.25V
Emitter-collector breakdown
voltage (base open)
BVECO
3.0
5.3
V
IE = 100A,
Collector-base cut-off current ICBO
<1
50
20
nA
A
VCB = 16V
VCB = 16V, Tamb= 100°C
Emitter-base cut-off current
IEBO
<1
50
nA
VEB = 5.6V
Collector-emitter saturation
voltage
VCE(sat)
25
40
mV
IC = 100mA, IB = 0.5mA(*)
60
85
mV
IC = 1A, IB = 10mA(*)
50
70
mV
IC = 1A, IB = 100mA(*)
105
150
mV
IC = 2A, IB = 20mA(*)
215
320
mV
IC = 4.5A, IB = 45mA(*)
VBE(sat)
945
1050
mV
IC = 4.5A, IB = 45mA(*)
Base-emitter turn-on voltage VBE(on)
850
950
mV
IC = 4.5A, VCE = 2V(*)
500
800
1500
400
650
IC = 2A, VCE = 2V(*)
330
530
IC = 4.5A, VCE = 2V(*)
140
230
IC = 10A, VCE = 2V(*)
150
220
MHz IC = 50mA, VCE = 5V
f = 50MHz
Base-emitter saturation
voltage
Static forward current
transfer ratio
hFE
Transition frequency
fT
Input capacitance
Cibo
229
Output capacitance
CObo
40
Delay time
td
Rise time
IC = 0.1A, VCE = 2V(*)
pF
VEB = 0.5V, f = 1MHz(*)
pF
VCB = 10V, f = 1MHz(*)
26.8
ns
tr
14.2
ns
Storage time
ts
250
ns
VCC = 10V.
IC = 500mA,
IB1 = IB2= 50mA.
Fall time
tf
67.7
ns
50
NOTES:
(*) Measured under pulsed conditions. Pulse width 300s; duty cycle 2%.
Issue 1 - September 2006
© Zetex Semiconductors plc 2006
4
www.zetex.com
ZXTN07012EFF
Typical characteristics
Issue 1 - September 2006
© Zetex Semiconductors plc 2006
5
www.zetex.com
ZXTN07012EFF
Package outline - SOT23F
c
D
b
e1
b
e
L1
L
E
E1
b
E2
A1
R
A
Dim.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
0.80
1.00
0.0315
0.0394
A1
0.00
0.10
0.00
b
0.35
0.45
c
0.10
D
2.80
e
e1
Millimeters
Inches
Min.
Max.
Max.
Max.
E
2.30
2.50
0.0906
0.0984
0.0043
E1
1.50
1.70
0.0590
0.0669
0.0153
0.0161
E2
1.10
1.26
0.0433
0.0496
0.20
0.0043
0.0079
L
0.48
0.68
0.0189
0.0268
3.00
0.1102
0.1181
L1
0.30
0.50
0.0153
0.0161
R
0.05
0.15
0.0019
0.0059
O
0°
12°
0°
12°
0.95 ref
1.80
Dim.
2.00
0.0374 ref
0.0709
0.0787
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches.
Europe
Americas
Asia Pacific
Corporate Headquarters
Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
[email protected]
Zetex Inc
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA
Zetex (Asia Ltd)
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
United Kingdom
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
[email protected]
Telephone: (852) 26100 611
Fax: (852) 24250 494
[email protected]
Telephone: (44) 161 622 4444
Fax: (44) 161 622 4446
[email protected]
For international sales offices visit www.zetex.com/offices
Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 1 - September 2006
© Zetex Semiconductors plc 2006
6
www.zetex.com