ZXTP08400BFF 400V, SOT23F, PNP medium power high voltage transistor Summary; BVCEO > -400V BVECO > -6V IC(cont) = -0.2A VCE(sat) < 220mV @ 100mA PD = 1.5W Complementary part number ZXTN08400BFF Description C This PNP transistor has been designed for applications requiring high blocking voltage. The SOT23F package is pin compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance. B Features E • High voltage • Low saturation voltage E Applications • C Telecoms switching B Ordering information Device ZXTP08400BFFTA Pinout - top view Reel size (inches) Tape width (mm) Quantity per reel 7 8 3000 Device marking 1D6 Issue 2 - August 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXTP08400BFF Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO -400 V Collector-emitter voltage VCEO -400 V Emitter-collector voltage (reverse blocking) VECO -6 V Emitter-base voltage VEBO -7 V IC -0.2 A ICM -1 A IB -0.2 A 0.84 W 6.72 mW/°C 1.34 W 10.72 mW/°C 1.50 W 12.0 mW/°C 2.0 W PD 16.0 mW/°C Tj, Tstg -55 to 150 °C Continuous collector current(c) Peak pulse current Base current Power dissipation at Tamb =25°C(a) Linear derating factor PD Power dissipation at Tamb =25°C(b) Linear derating factor PD Power dissipation at Tamb =25°C(c) Linear derating factor PD Power dissipation at Tamb =25°C(d) Linear derating factor Operating and storage temperature range Thermal resistamce Parameter Symbol Limit Unit ambient(a) R⍜JA 149 °C/W Junction to ambient(b) R⍜JA 93 °C/W Junction to ambient(c) R⍜JA 83 °C/W Junction to ambient(d) R⍜JA 60 °C/W Junction to NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs. Issue 2 - August 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXTP08400BFF Characteristics Issue 2 - August 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXTP08400BFF Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Max. Unit Conditions Collector-base breakdown voltage BVCBO -400 -500 V IC = -100A Collector-emitter breakdown voltage (base open) BVCEO -400 -480 V IC = -10mA (*) Emitter-base breakdown voltage BVEBO -7 -8.1 V IE = -100A Emitter-collector breakdown voltage (reverse blocking) BVECX -6 -8.2 V IE = -100A, RBC < 1k⍀ or 0.25V > VBC > -0.25V Emitter-collector breakdown voltage (base open) BVECO -6 -8.6 V IE = -100A, Collector-base cut-off current ICBO <-1 -50 -20 nA A VCB = -320V VCB = -320V, Tamb= 100°C Emitter-base cut-off current IEBO <-1 -50 nA VEB = -5.6V Collector-emitter saturation voltage VCE(sat) -10 -145 mV IC = -20mA, IB = -1mA(*) -95 -125 mV IC = -50mA, IB = -5mA(*) -140 -220 mV IC = -100mA, IB = -10mA(*) -140 -190 mV IC = -200mA, IB = -40mA(*) VBE(sat) -810 -900 mV IC = -200mA, IB = -40mA(*) Base-emitter turn-on voltage VBE(on) -705 -800 mV IC = -200mA, VCE = -10V(*) Base-emitter saturation voltage Static forward current transfer ratio hFE Transition frequency fT Output capacitance Cobo Delay time td Rise time 100 220 100 200 100 200 50 70 12.9 IC = -1mA, VCE = -5V(*) 300 IC = -50mA, VCE = -5V(*) IC = -200mA, VCE = -10V(*) MHz IC = -20mA, VCE = -20V f = 20MHz 20 pF VCB = -20V, f = 1MHz(*) 95 ns tr 73.8 ns Storage time ts 1790 ns VCC = -100V. IC = -100mA, IB1 = 10mA, IB2= -20mA. Fall time tf 153.8 ns NOTES: (*) Measured under pulsed conditions. Pulse width ⱕ300s; duty cycle ⱕ2%. Issue 2 - August 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXTP08400BFF Typical characteristics Issue 2 - August 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXTP08400BFF Package outline - SOT23F c D b e1 b e L1 L E E1 b A1 R A Dim. Millimeters Inches Min. Max. Min. Max. A 0.80 1.00 0.0315 0.0394 A1 0.00 0.10 0.00 b 0.35 0.45 c 0.10 D 2.80 e e1 Millimeters Inches Min. Max. Min. Max. E 2.30 2.50 0.0906 0.0984 0.0043 E1 1.50 1.70 0.0590 0.0669 0.0153 0.0161 L 0.48 0.68 0.0189 0.0268 0.20 0.0043 0.0079 L1 0.30 0.50 0.0153 0.0161 3.00 0.1102 0.1181 R 0.05 0.15 0.0019 0.0059 O 0° 12° 0° 12° - - - - - 0.95 ref 1.80 Dim. 2.00 0.0374 ref 0.0709 0.0787 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 2 - August 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXTP08400BFF Intentionally left blank Issue 2 - August 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXTP08400BFF Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. 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A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. 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Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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