Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 CC2538 Powerful Wireless Microcontroller System-On-Chip for 2.4-GHz IEEE 802.15.4, 6LoWPAN, and ZigBee® Applications 1 Device Overview 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 With Code Prefetch – Up to 32-MHz Clock Speed – 512KB, 256KB or 128KB of In-SystemProgrammable Flash – Supports On-Chip Over-the-Air Upgrade (OTA) – Supports Dual ZigBee Application Profiles – Up to 32KB of RAM (16KB With Retention in All Power Modes) – cJTAG and JTAG Debugging • RF – 2.4-GHz IEEE 802.15.4 Compliant RF Transceiver – Excellent Receiver Sensitivity of –97 dBm – Robustness to Interference With ACR of 44 dB – Programmable Output Power up to 7 dBm • Security Hardware Acceleration – Future Proof AES-128/256, SHA2 Hardware Encryption Engine – Optional – ECC-128/256, RSA Hardware Acceleration Engine for Secure Key Exchange – Radio Command Strobe Processor and Packet Handling Processor for Low-Level MAC Functionality • Low Power – Active-Mode RX (CPU Idle): 20 mA – Active-Mode TX at 0 dBm (CPU Idle): 24 mA – Power Mode 1 (4-µs Wake-Up, 32-KB RAM Retention, Full Register Retention): 0.6 mA – Power Mode 2 (Sleep Timer Running, 16-KB RAM Retention, Configuration Register Retention): 1.3 µA – Power Mode 3 (External Interrupts, 16-KB RAM Retention, Configuration Register Retention): 0.4 µA – Wide Supply-Voltage Range (2 V to 3.6 V) 1.2 • • • • Peripherals – µDMA – 4 × General-Purpose Timers (Each 32-Bit or 2 × 16-Bit) – 32-Bit 32-kHz Sleep Timer – 12-Bit ADC With 8 Channels and Configurable Resolution – Battery Monitor and Temperature Sensor – USB 2.0 Full-Speed Device (12 Mbps) – 2 × SPI – 2 × UART – I2C – 32 General-Purpose I/O Pins (28 × 4 mA, 4 × 20 mA) – Watchdog Timer • Layout – 8-mm × 8-mm QFN56 Package – Robust Device for Industrial Operation up to 125°C – Few External Components – Only a Single Crystal Needed for Asynchronous Networks • Development Tools – CC2538 Development Kit – Reference Design Certified Under FCC and ETSI Regulations – Full Software Support for Contiki/6LoWPAN, Smart Grid, Lighting, and ZigBee Home Automation With Sample Applications and Reference Designs Available – Code Composer Studio™ – IAR Embedded Workbench® for ARM – SmartRF™ Studio – SmartRF Flash Programmer Applications Smart Grid and Home Area Network Home and Building Automation Intelligent Lighting Systems • • Wireless Sensor Networks Internet of Things 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 1.3 www.ti.com Description The CC2538xFnn is the ideal wireless microcontroller System-on-Chip (SoC) for high-performance ZigBee applications. The device combines a powerful ARM Cortex-M3-based MCU system with up to 32KB onchip RAM and up to 512KB on-chip flash with a robust IEEE 802.15.4 radio. This enables the device to handle complex network stacks with security, demanding applications, and over-the-air download. Thirtytwo GPIOs and serial peripherals enable simple connections to the rest of the board. The powerful hardware security accelerators enable quick and efficient authentication and encryption while leaving the CPU free to handle application tasks. The multiple low-power modes with retention enable quick startup from sleep and minimum energy spent to perform periodic tasks. For a smooth development, the CC2538xFnn includes a powerful debugging system and a comprehensive driver library. To reduce the application flash footprint, CC2538xFnn ROM includes a utility function library and a serial boot loader. Combined with the robust and comprehensive Z-Stack software solutions from TI, the CC2538 provides the most capable and proven ZigBee solution in the market. Device Information (1) PART NUMBER CC2538RTQ (1) 2 PACKAGE BODY SIZE RTQ (56) 8.00 mm × 8.00 mm For more information, see Section 8, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com 1.4 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 Functional Block Diagram JTAG ARM CortexTM± M3 SWO 128KB/256KB/512KB Flash NVIC 32 MHz MPU 16KB Standard SRAM cJTAG/JTAG 4KB ROM ICEPick 2 UARTS Systick Timer 2 SSI/SPI Timer/PWM/CCP 4x (32 bit or 2x16 bit) USB Full-Speed Device Watchdog Timer I2C 32 GPIO SYSTEM SERIAL INTERFACES DEBUG INTERFACE 16KB Retention SRAM SECURITY 32-ch DMA AES-128/256 SHA-256 32-MHz XTAL and 16-MHz RC Oscillator ECC RSA-2048 32-kHz XTAL and 32-kHz RC Oscillator 32-bit Sleep Timer Command-Strobe Processor LDO Regulator Power-on Reset and BrownOut Detection MAC Timer Low-Power Comparator RF Chain Demod Modulator ANALOG IEEE 802.15.4 RADIO Packet-Handling Processor 8-ch 12-bit ADC RX Synth TX With Temp Sensor Figure 1-1. CC2538 Block Diagram Device Overview Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 3 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 www.ti.com Table of Contents 1 2 3 4 Device Overview ......................................... 1 5.15 Analog Temperature Sensor ........................ 15 1.1 Features .............................................. 1 5.16 ADC Characteristics................................. 16 1.2 Applications ........................................... 1 5.17 Control Input AC Characteristics .................... 17 1.3 Description ............................................ 2 5.18 DC Characteristics .................................. 17 1.4 Functional Block Diagram ............................ 3 5.19 5.20 USB Interface DC Characteristics .................. 17 Thermal Resistance Characteristics for RTQ Package ............................................. 18 Revision History ......................................... 5 Device Comparison ..................................... 6 Terminal Configuration and Functions .............. 7 6.1 Input, Output Matching .............................. 20 Specifications 6.2 Crystal ............................................... 20 5.1 ............................................ 9 Absolute Maximum Ratings .......................... 9 ESD Ratings .......................................... 9 Recommended Operating Conditions ................ 9 Electrical Characteristics ............................ 10 General Characteristics ............................. 11 RF Receive Section ................................. 12 RF Transmit Section ................................ 13 32-MHz Crystal Oscillator ........................... 14 32.768-kHz Crystal Oscillator ....................... 14 32-kHz RC Oscillator ................................ 14 16-MHz RC Oscillator ............................... 15 RSSI/CCA Characteristics .......................... 15 FREQEST Characteristics .......................... 15 Frequency Synthesizer Characteristics ............. 15 6.3 On-Chip 1.8-V Voltage-Regulator Decoupling ...... 21 6.4 Power-Supply Decoupling and Filtering............. 21 6.5 References .......................................... 21 5.2 5.3 5.4 5.5 5.6 5.7 5.8 5.9 5.10 5.11 5.12 5.13 5.14 4 Applications, Implementation, and Layout........ 19 Signal Descriptions ................................... 7 4.1 5 6 7 8 Device and Documentation Support ............... 22 7.1 Device Support ...................................... 22 7.2 Documentation Support ............................. 23 7.3 Additional Information ............................... 23 7.4 Trademarks.......................................... 24 7.5 Electrostatic Discharge Caution ..................... 24 7.6 Export Control Notice 7.7 Glossary ............................................. 24 ............................... 24 Mechanical Packaging and Orderable Information .............................................. 25 8.1 Packaging Information Table of Contents .............................. 25 Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 2 Revision History Changes from Revision C (February 2015) to Revision D • Changed Figure 6-1 CC2538xFnn Application Circuit Page ......................................................................... Changes from Revision B (September 2014) to Revision C • • • 19 Page Changed ZigBee Smart Energy 1.x and ZigBee Light Link to Smart Grid and Lighting..................................... 1 Added 8-ch to the 12-bit ADC ....................................................................................................... 3 Added ESD Ratings table. .......................................................................................................... 9 Revision History Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 5 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 www.ti.com 3 Device Comparison Table 3-1. CC2538 Family of Devices Available 6 DEVICE FLASH (KB) RAM (KB) SECURITY HW AES/SHA SECURITY HW ECC/RSA CC2538SF53 512 32 Yes Yes CC2538SF23 256 32 Yes Yes CC2538NF53 512 32 Yes No CC2538NF23 256 32 Yes No CC2538NF11 128 16 Yes No Device Comparison Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 43 AVDD_GUARD 44 PD6/XOSC32K_Q1 45 PD7/XOSC32K_Q2 46 JTAG_TMS 47 JTAG_TCK 48 PB7 49 PB6 50 PB5 51 PB4 52 PB3 53 PB2 54 PB1 55 DVDD 56 DCOUPL1 4 Terminal Configuration and Functions DGND_USB 1 42 R_BIAS USB_P 2 41 AVDD USB_N 3 40 AVDD DVDD_USB 4 39 AVDD PB0 5 38 RF_N PC7 6 37 RF_P PC6 7 36 AVDD PC5 8 35 XOSC32M_Q2 PC4 9 34 XOSC32M_Q1 DVDD 10 33 AVDD RESET_N 28 PD2 27 PD1 26 PD0 25 DVDD 24 PA7 23 PA6 22 29 PD3 PA5 21 PC0 14 PA4 20 30 PD4 PA3 19 PC1 13 PA2 18 31 PD5 PA1 17 PC2 12 PA0 16 32 DCOUPL2 DVDD 15 PC3 11 P0142-01 Connect the exposed ground pad to a solid ground plane, as this is the ground connection for the chip. Figure 4-1. 56-Pin RTQ Package (Top View) 4.1 Signal Descriptions Table 4-1. Signal Descriptions NAME AVDD NUMBER PIN TYPE 33, 36, 39, 40, 41 Power (analog) DESCRIPTION 2-V–3.6-V analog power-supply connection AVDD_GUARD 43 Power (analog) 2-V–3.6-V analog power-supply connection DCOUPL1 56 Power (digital) 1.8-V regulated digital-supply decoupling capacitor DCOUPL2 32 Power (digital) 1.8-V regulated digital-supply decoupling capacitor. Short this pin to pin 56. DGND_USB 1 Ground (USB pads) USB ground DVDD Power (digital) 2-V–3.6-V digital power-supply connection DVDD_USB 10, 15, 24, 55 4 Power (USB pads) 3.3-V USB power-supply connection JTAG_TCK 47 Digital I/O JTAG TCK JTAG_TMS 46 Digital I/O JTAG TMS PA0 16 Digital/analog I/O GPIO port A pin 0. ROM bootloader UART RXD PA1 17 Digital/analog I/O GPIO port A pin 1. ROM bootloader UART TXD PA2 18 Digital/analog I/O GPIO port A pin 2. ROM bootloader SSI CLK Terminal Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 7 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 www.ti.com Table 4-1. Signal Descriptions (continued) NAME NUMBER PIN TYPE DESCRIPTION PA3 19 Digital/analog I/O GPIO port A pin 3. ROM bootloader SSI SEL PA4 20 Digital/analog I/O GPIO port A pin 4. ROM bootloader SSI RXD PA5 21 Digital/analog I/O GPIO port A pin 5. ROM bootloader SSI TXD PA6 22 Digital/analog I/O GPIO port A pin 6 PA7 23 Digital/analog I/O GPIO port A pin 7 PB0 5 Digital I/O GPIO port B pin 0 PB1 54 Digital I/O GPIO port B pin 1 PB2 53 Digital I/O GPIO port B pin 2 PB3 52 Digital I/O GPIO port B pin 3 PB4 51 Digital I/O GPIO port B pin 4 PB5 50 Digital I/O GPIO port B pin 5 PB6 49 Digital I/O GPIO port B pin 6, TDI (JTAG) PB7 48 Digital I/O GPIO port B pin 7, TDO (JTAG) PC0 14 Digital I/O GPIO port C pin 0, 20 mA output capability, no pull-up or pull-down PC1 13 Digital I/O GPIO port C pin 1, 20 mA output capability, no pull-up or pull-down PC2 12 Digital I/O GPIO port C pin 2, 20 mA output capability, no pull-up or pull-down PC3 11 Digital I/O GPIO port C pin 3, 20 mA output capability, no pull-up or pull-down PC4 9 Digital I/O GPIO port C pin 4 PC5 8 Digital I/O GPIO port C pin 5 PC6 7 Digital I/O GPIO port C pin 6 PC7 6 Digital I/O GPIO port C pin 7 PD0 25 Digital I/O GPIO port D pin 0 PD1 26 Digital I/O GPIO port D pin 1 PD2 27 Digital I/O GPIO port D pin 2 PD3 29 Digital I/O GPIO port D pin 3 PD4 30 Digital I/O GPIO port D pin 4 PD5 31 Digital I/O GPIO port D pin 5 PD6/XOSC32K_Q1 44 Digital/analog I/O GPIO port D pin 6 / 32-kHz crystal oscillator pin 1 PD7/XOSC32K_Q2 45 Digital/analog I/O GPIO port D pin 7 / 32-kHz crystal oscillator pin 1 R_BIAS 42 Analog I/O External precision bias resistor for reference current RESET_N 28 Digital input Reset, active-low RF_N 38 RF I/O Negative RF input signal to LNA during RX Negative RF output signal from PA during TX RF_P 37 RF I/O Positive RF input signal to LNA during RX Positive RF output signal from PA during TX USB_P 2 USB I/O USB differential data plus (D+) USB_N 3 USB I/O USB differential data minus (D–) XOSC32M_Q1 34 Analog I/O 32-MHz crystal oscillator pin 1 or external-clock input XOSC32M_Q2 35 Analog I/O 32-MHz crystal oscillator pin 2 8 Terminal Configuration and Functions Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 5 Specifications Absolute Maximum Ratings (1) (2) (3) 5.1 over operating free-air temperature range (unless otherwise noted) Supply voltage All supply pins must have the same voltage Voltage on any digital pin MIN MAX –0.3 3.9 –0.3 VDD + 0.3, ≤ 3.9 Input RF level Tstg (1) (2) (3) Storage temperature range V 10 dBm 125 °C ESD Ratings VESD 5.3 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS, unless otherwise noted. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 5.2 (1) (2) –40 UNIT Electrostatic discharge (ESD) performance: VALUE UNIT ±1 kV ±500 V Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1) Charged device model (CDM), per JESD22-C101 (2) All pins JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Operating ambient temperature range, TA Operating supply voltage (1) (1) MIN MAX UNIT –40 125 °C 2 3.6 V The CC2538 contains a power on reset (POR) module and a brown out detector (BOD) that prevent the device from operating under unsafe supply voltage conditions. In the two lowest power modes, PM2 and PM3, the POR is active but the BOD is powered down, which gives a limited voltage supervision. If the supply voltage is lowered to below 1.4 V during PM2/PM3, at temperatures of 70°C or higher, and then brought back up to good operating voltage before active mode is re-entered, registers and RAM contents that are saved in PM2, PM3 may become altered. Hence, care should be taken in the design of the system power supply to ensure that this does not occur. The voltage can be periodically supervised accurately by entering active mode, as a BOD reset is triggered if the supply voltage is below approximately 1.7 V. Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 9 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 5.4 www.ti.com Electrical Characteristics Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V, and 8-MHz system clock, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER Icore Core current consumption TEST CONDITIONS MIN TYP MAX UNIT Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active. CPU running at 16-MHz with flash access 7 mA 32-MHz XOSC running. No radio or peripherals active. CPU running at 32-MHz with flash access,. 13 mA 32-MHz XOSC running, radio in RX mode, –50-dBm input power, no peripherals active, CPU idle 20 mA 32-MHz XOSC running, radio in RX mode at –100-dBm input power (waiting for signal), no peripherals active, CPU idle 24 32-MHz XOSC running, radio in TX mode, 0-dBm output power, no peripherals active, CPU idle 24 mA 32-MHz XOSC running, radio in TX mode, 7-dBm output power, no peripherals active, CPU idle 34 mA Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention 0.6 mA Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention 1.3 2 µA Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention 0.4 1 µA 27 mA Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) General-purpose timer Iperi 120 µA SPI 300 µA I2C 0.1 mA UART 0.7 mA Sleep timer Including 32.753-kHz RCOSC 0.9 µA USB 48-MHz clock running, USB enabled 3.8 mA ADC When converting 1.2 mA Erase 12 mA 8 mA Flash 10 Timer running, 32-MHz XOSC used Burst-write peak current Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com 5.5 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 General Characteristics Measured on TI's CC2538 EM reference design with TA = 25 °C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Wake-Up and Timing Power mode 1 → active Digital regulator on, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of 16-MHz RCOSC 4 µs Power mode 2 or 3 → active Digital regulator off, 16-MHz RCOSC and 32-MHz crystal oscillator off. Start-up of regulator and 16-MHz RCOSC 136 µs Initially running on 16-MHz RCOSC, with 32-MHz XOSC off 0.5 Active → TX or RX With 32-MHz XOSC initially on RX/TX and TX/RX turnaround USB PLL start-up time With 32-MHz XOSC initially on ms 192 µs 192 µs 32 µs Radio Part RF frequency range Programmable in 1-MHz steps, 5 MHz between channels for compliance with (1) Radio baud rate As defined by (1) Radio chip rate As defined by (1) 2394 2507 250 2 MHz kbps MChip/s Flash Memory Flash erase cycles 20 Flash page size (1) k Cycles 2 KB IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 11 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 5.6 www.ti.com RF Receive Section Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted. Bold limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER TEST CONDITIONS PER = 1%, as specified by (25 °C, 3 V, 2440 MHz) (1) requires –85 dBm (1) PER = 1%, as specified by (1) requires –85 dBm (1) PER = 1%, as specified by (1) requires –20 dBm (1) Saturation (maximum input level) Adjacent-channel rejection, 5-MHz channel spacing Receiver sensitivity MIN TYP MAX UNIT –97 –92 dBm –88 dBm , normal operating conditions , entire operating conditions 10 dBm Wanted signal –82 dBm, adjacent modulated channel at 5 MHz, PER = 1%, as specified by (1). (1) requires 0 dB 44 dB Adjacent-channel rejection, –5-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –5 MHz, PER = 1%, as specified by (1). (1) requires 0 dB 44 dB Alternate-channel rejection, 10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at 10 MHz, PER = 1%, as specified by (1) (1) requires 30 dB 52 dB Alternate-channel rejection, –10-MHz channel spacing Wanted signal –82 dBm, adjacent modulated channel at –10 MHz, PER = 1%, as specified by (1) (1) requires 30 dB 52 dB 51 51 dB Channel rejection Wanted signal at –82 dBm. Undesired signal is an IEEE ≥ 20 MHzXXXXX 802.15.4 modulated channel, stepped through all channels ≤ –20 MHzXXXXX from 2405 to 2480 MHz. Signal level for PER = 1%. Blocking/desensitization 5 MHz from band edgeXXXXX Wanted signal 3 dB above the sensitivity level, CW jammer, 10 MHz from band edgeXXXXX PER = 1%. Measured according to EN 300 440 class 2. 20 MHz from band edgeXXXXX 50 MHz from band edgeXXXXX –5 MHz from band edgeXXXXX –10 MHz from band edgeXXXXX –20 MHz from band edgeXXXXX –50 MHz from band edgeXXXXX –35 –34 –37 –32 –37 –38 –35 –34 Spurious emission. Only largest spurious Conducted measurement with a 50-Ω single-ended load. emission stated within each band. Suitable for systems targeting compliance with EN 300 328, 30 MHz–1000 MHzXXXXX EN 300 440, FCC CFR47 Part 15, and ARIB STD-T-66. 1 GHz–12.75 GHzXXXXX –80 –80 Frequency error tolerance (2) Symbol rate error tolerance (1) (2) (3) 12 (3) dBm dBm (1) requires minimum 80 ppm ±150 ppm (1) requires minimum 80 ppm ±1000 ppm IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf Difference between center frequency of the received RF signal and local oscillator frequency Difference between incoming symbol rate and the internally generated symbol rate Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com 5.7 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 RF Transmit Section Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz. PARAMETER Nominal output power TEST CONDITIONS MIN Delivered to a single-ended 50-Ω load through a balun using maximum-recommended output-power setting (1) requires minimum –3 dBm Programmable output-power range Spurious emissions TYP MAX UNIT 7 dBm 30 dB –56 –58 –58 –60 –54 –51 –42 dBm Maximum recommended output power setting (2) Measured according to stated regulations. 25–1000 MHz (outside restricted bands) 25–1000 MHz (within FCC restricted bands) 25–1000 MHz (within ETSI restricted bands) Only largest spurious emission 1800–1900 MHz (ETSI restricted band) stated within each band. 5150–5300 MHz (ETSI restricted band) 1–12.75 GHz (except restricted bands) At 2483.5 MHz and above (FCC restricted band), fc= 2480 MHz (3) (1) Error vector magnitude (EVM) Measured as defined by using maximum-recommended outputpower setting (1) requires maximum 35%. Optimum load impedance Differential impedance on the RF pins (1) (2) (3) 3% 66 + j64 Ω IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf TI's CC2538 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15, and ARIB STD-T-66. To improve margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz, use a lower output-power setting or less than 100% duty cycle. Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 13 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 5.8 www.ti.com 32-MHz Crystal Oscillator Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Crystal frequency 32 Crystal frequency accuracy requirement (1) ESR Equivalent series resistance C0 CL –40 40 ppm 60 Ω pF 16 Crystal shunt capacitance 1 1.9 7 Crystal load capacitance 10 13 16 0.3 Power-down guard time The crystal oscillator must be in power down for a guard time before using it again. This requirement is valid for all modes of operation. The need for power-down guard time can vary with crystal type and load. UNIT MHz 6 Start-up time (1) MAX pF ms 3 ms Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 5.9 32.768-kHz Crystal Oscillator Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Crystal frequency TYP MAX 32.768 Crystal frequency accuracy requirement (1) –40 UNIT kHz 40 ppm ESR Equivalent series resistance 40 130 Ω C0 Crystal shunt capacitance 0.9 2 pF CL Crystal load capacitance 12 16 pF Start-up time 0.4 (1) s Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 5.10 32-kHz RC Oscillator Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER Calibrated frequency TEST CONDITIONS (1) 0.4 (3) Calibration time (4) 14 MAX UNIT kHz ±0.2% Temperature coefficient (2) (1) (2) (3) (4) TYP 32.753 Frequency accuracy after calibration Supply-voltage coefficient MIN %/ °C 3 %/V 2 ms The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977. Frequency drift when temperature changes after calibration Frequency drift when supply voltage changes after calibration When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC32K_CALDIS is 0. Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 5.11 16-MHz RC Oscillator Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER Frequency TEST CONDITIONS MIN TYP (1) MAX 16 Uncalibrated frequency accuracy ±18% Calibrated frequency accuracy ±0.6% MHz ±1% Start-up time 10 Initial calibration time (1) (2) UNIT (2) µs 50 µs The calibrated 16-MHz RC oscillator frequency is the 32-MHz xtal frequency divided by 2. When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator is performed while SLEEPCMD.OSC_PD is set to 0. 5.12 RSSI/CCA Characteristics Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN RSSI range TYP MAX UNIT 100 dB Absolute uncalibrated RSSI/CCA accuracy ±4 dB RSSI/CCA offset (1) 73 dB 1 dB Step size (LSB value) (1) Real RSSI = Register value – offset 5.13 FREQEST Characteristics Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN FREQEST range TYP MAX UNIT ±250 kHz FREQEST accuracy ±10 kHz FREQEST offset (1) 15 kHz Step size (LSB value) 7.8 kHz (1) Real FREQEST = Register value – offset 5.14 Frequency Synthesizer Characteristics Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted. PARAMETER Phase noise, unmodulated carrier 5.15 TEST CONDITIONS MIN TYP At ±1-MHz offset from carrier –111 At ±2-MHz offset from carrier –119 At ±5-MHz offset from carrier –126 MAX UNIT dBc/Hz Analog Temperature Sensor Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS Output at 25°C Initial accuracy without calibration Accuracy using 1-point calibration (entire temperature range) TYP 1422 Temperature coefficient Voltage coefficient MIN 4.2 Measured using integrated ADC, using internal band-gap voltage reference and maximum resolution Current consumption when enabled (ADC current not included) 1 MAX UNIT 12-bit ADC /1°C /0.1 V ±10 °C ±5 °C 0.3 mA Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 15 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 5.16 www.ti.com ADC Characteristics TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER ENOB (1) 0 VDD V VDD is voltage on AVDD5 pin 0 VDD V External reference voltage differential VDD is voltage on AVDD5 pin 0 VDD Input resistance, signal Using 4-MHz clock speed 197 kΩ Full-scale signal (1) Peak-to-peak, defines 0 dBFS 2.97 V Effective number of bits Single-ended input, 7-bit setting 5.7 Single-ended input, 9-bit setting 7.5 Single-ended input, 10-bit setting 9.3 Single-ended input, 12-bit setting 10.8 Differential input, 7-bit setting 8.3 Differential input, 10-bit setting 10.0 Differential input, 12-bit setting 11.5 7-bit setting, both single and differential 0–20 Single-ended input, 12-bit setting, –6 dBFS –75.2 Differential input, 12-bit setting, –6 dBFS –86.6 V Bits kHz dB Single-ended input, 12-bit setting 70.2 Differential input, 12-bit setting 79.3 Single-ended input, 12-bit setting, –6 dBFS 78.8 Differential input, 12-bit setting, –6 dBFS 88.9 Common-mode rejection ratio Differential input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution >84 dB Crosstalk Single-ended input, 12-bit setting, 1-kHz sine (0 dBFS), limited by ADC resolution < –84 dB Offset Midscale –3 mV DNL (1) Differential nonlinearity INL (1) Integral nonlinearity (1) Signal-to-noise-and-distortion Conversion time dB 0.68% 12-bit setting, mean 12-bit setting, maximum 12-bit setting, mean 0.05 0.9 4.6 12-bit setting, maximum 13.3 Single-ended input, 7-bit setting 35.4 Single-ended input, 9-bit setting 46.8 Single-ended input, 10-bit setting 57.5 Single-ended input, 12-bit setting 66.6 Differential input, 7-bit setting 40.7 Differential input, 9-bit setting 51.6 Differential input, 10-bit setting 61.8 Differential input, 12-bit setting 70.8 7-bit setting 20 9-bit setting 36 10-bit setting 68 12-bit setting 132 Current consumption Internal reference voltage Internal reference VDD coefficient 16 6.5 Differential input, 9-bit setting Gain error (1) UNIT VDD is voltage on AVDD5 pin Signal to nonharmonic ratio (1) SINAD (–THD+N) TYP MAX External reference voltage Total harmonic distortion CMRR MIN Input voltage Useful power bandwidth THD (1) TEST CONDITIONS LSB LSB dB µs 1.2 mA 1.19 V 2 mV/V Measured with 300-Hz sine-wave input and VDD as reference Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 ADC Characteristics (continued) TA = 25°C and VDD = 3 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Internal reference temperature coefficient 5.17 TYP MAX 0.4 UNIT mV/10 °C Control Input AC Characteristics TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN System clock, fSYSCLK tSYSCLK = 1/fSYSCLK The undivided system clock is 32 MHz when crystal oscillator is used. The undivided system clock is 16 MHz when calibrated 16-MHz RC oscillator is used. RESET_N low duration (1) See item 1, Figure 5-1. This is the shortest pulse that is recognized as a complete reset pin request. Interrupt pulse duration See item 2, Figure 5-1.This is the shortest pulse that is recognized as an interrupt request. (1) TYP MAX UNIT 32 MHz 16 1 µs 20 ns Shorter pulses may be recognized, but might not lead to a complete reset of all modules within the chip. RESET_N 1 2 Px.n T0299-01 Figure 5-1. Control Input AC Characteristics 5.18 DC Characteristics TA = 25°C, VDD = 3 V, drive strength set to high with CC_TESTCTRL.SC = 1, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Logic-0 input voltage Logic-1 input voltage MAX UNIT 0.5 V 2.5 V Logic-0 input current Input equals 0 V –300 300 nA Logic-1 input current Input equals VDD –300 300 nA I/O-pin pullup and pulldown resistors 20 Logic-0 output voltage, 4-mA pins Output load 4 mA Logic-1 output voltage, 4-mA pins Output load 4 mA Logic-0 output voltage, 20-mA pins Output load 20 mA Logic-1 output voltage, 20-mA pins Output load 20 mA 5.19 kΩ 0.5 V 2.4 V 0.5 V 2.4 V USB Interface DC Characteristics TA = 25°C, VDD = 3 V to 3.6 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT USB pad voltage output, high VDD 3.6 V, 4-mA load 3.4 V USB pad voltage output, low VDD 3.6 V, 4-mA load 0.2 V Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 17 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 www.ti.com 5.20 Thermal Resistance Characteristics for RTQ Package NAME DESCRIPTION RθJC-top Junction-to-case (top) RθJB RθJA °C/W (1) (2) AIR FLOW (m/s) (3) 8.9 0.00 Junction-to-board 3.1 0.00 Junction-to-free air 25.0 0.00 PsiJT Junction-to-package top 3.1 0.00 PsiJB-bottom Junction-to-board (bottom) 0.4 0.00 (1) (2) (3) 18 °C/W = degrees Celsius per watt. These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements m/s = meters per second. Specifications Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 6 Applications, Implementation, and Layout NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. Few external components are required for the operation of the CC2538xFnn. Figure 6-1 is a typical application circuit. For a complete USB reference design, see the CC2538xFnn product page on www.ti.com. Table 6-1 lists typical values and descriptions of external components. The USB_P and USB_N pins require series resistors R21 and R31 for impedance matching, and the D+ line must have a pullup resistor, R32. The series resistors should match the 90-Ω ±15% characteristic impedance of the USB bus. Notice that the pullup resistor and DVDD_USB require connection to a voltage source between 3 V and 3.6 V (typically 3.3 V). To accomplish this, it is recommend to connect the D+ pull-up to a port/pin that does not have an internal pullup (that is, PC0..3), instead of connecting it directly to a 3.3 V supply (that is, software control of D+ pullup recommended). Optional 32 kHz crystal 2.0 V-3.6 V power supply 3.3 V power supply C451 XTAL C561 AVDD_GUARD 43 PD7/XOSC32K_Q2 45 PD6/XOSC32K_Q1 44 JTAG_TCK 47 1 DGND_USB R31 JTAG_TMS 46 PB6 49 PB7 48 PB4 51 PB5 50 PB3 52 PB1 54 PB2 53 DVDD 55 DCOUPL 56 C441 R_BIAS 42 D+ 2 USB_P D- 3 USB_N AVDD 40 4 DVDD_USB AVDD 39 R21 R32 C31 C21 Antenna (50 Ω) R421 AVDD 41 5 PB0 C381 C382 L373 RF_N 38 6 PC7 RF_P 37 7 PC6 AVDD 36 L374 3.3 nH L381 C372 C371 2 nH CC2538 8 PC5 XOSC32M_Q2 35 DIE ATTACH PAD: C373 1.2 pF L372 XOSC32M_Q1 34 9 PC4 10 VDD AVDD 33 11 PC3 DCOUPL2 32 12 PC2 PD5 31 13 PC1 PD4 30 14 PC0 PD3 29 C321 PD2 27 RESET_N 28 PD0 25 PD1 26 VDD 24 PA6 22 PA7 23 PA4 20 PA5 21 PA2 18 PA3 19 PA0 16 PA1 17 VDD 15 XTAL C341 C351 C281 Power supply decoupling capacitors are not shown Digital I/O not connected R281 RESET_N Figure 6-1. CC2538xFnn Application Circuit Applications, Implementation, and Layout Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 19 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 www.ti.com Table 6-1. Overview of External Components (Excluding Supply Decoupling Capacitors) Component 6.1 Description Value C21 USB D– decoupling 47 pF C31 USB D+ decoupling 47 pF C341 32-MHz xtal-loading capacitor 12 pF C351 32-MHz xtal-loading capacitor 12 pF C371 Part of the RF matching network 18 pF C381 Part of the RF matching network 18 pF C382 Part of the RF matching network 1 pF C372 Part of the RF matching network 1 pF C441 32-kHz xtal-loading capacitor 22 pF C451 32-kHz xtal-loading capacitor 22 pF C561 Decoupling capacitor for the internal digital regulator 1 µF C321 Decoupling capacitor for the internal digital regulator 1 µF C281 Filter capacitor for reset line 1 nF L372 Part of the RF matching network 2 nH L381 Part of the RF matching network 2 nH R21 USB D– series resistor 33 Ω R31 USB D+ series resistor R32 USB D+ pullup resistor to signal full-speed device presence R281 Filter resistor for reset line 2.2 Ω R421 Resistor used for internal biasing 56 kΩ 33 Ω 1.5 kΩ Input, Output Matching When using an unbalanced antenna such as a monopole, use a balun to optimize performance. One can implement the balun using low-cost, discrete inductors and capacitors. The recommended balun shown in Figure 6-1 consists of L372, C372, C382 and L381. If a balanced antenna such as a folded dipole is used, omit the balun. 6.2 Crystal The 32-MHz crystal oscillator uses an external 32-MHz crystal, XTAL1, with two loading capacitors (C341 and C351). See the 32-MHz Crystal Oscillator section for details. Calculate the load capacitance across the 32-MHz crystal by Equation 1. 1 CL = + Cparasitic 1 1 + C341 C351 (1) XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C441 and C451) used for the 32.768-kHz crystal oscillator. Use the 32.768-kHz crystal oscillator in applications where both low sleepcurrent consumption and accurate wake-up times are needed. Calculate the load capacitance across the 32.768-kHz crystal by Equation 2. 1 CL = + Cparasitic 1 1 + C441 C451 (2) Use a series resistor, if necessary, to comply with the ESR requirement. 20 Applications, Implementation, and Layout Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com 6.3 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 On-Chip 1.8-V Voltage-Regulator Decoupling The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires decoupling capacitors (C561, C321) and an external connection between them for stable operation. 6.4 Power-Supply Decoupling and Filtering Optimum performance requires proper power-supply decoupling. The placement and size of the decoupling capacitors and the power supply filtering are important to achieve the best performance in an application. TI provides a recommended compact reference design for the user to follow. 6.5 References 1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 2. CC2538xFnn User's Guide 3. Universal Serial Bus Revision 2.0 Specification http://www.usb.org/developers/docs/usb_20_052709.zip Applications, Implementation, and Layout Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 21 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 www.ti.com 7 Device and Documentation Support 7.1 7.1.1 Device Support Development Support TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE). The following products support development of the CC2538 device applications: Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any CC2538 device application. Hardware Development Tools: Extended Development System (XDS™) Emulator For a complete listing of development-support tools for the CC2538 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. 7.1.2 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC2538). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: X and P devices are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RTQ) and the temperature range (for example, blank is the default commercial temperature range). For orderable part numbers of CC2538 devices in the RTQ package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. 22 Device and Documentation Support Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com 7.2 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 Documentation Support The following documents describe the CC2538 processor. Copies of these documents are available on the Internet at www.ti.com. 7.2.1 SWRZ045 CC2538 SoC for 2.4-GHz IEEE 802.15.4, 6LoWPAN and ZigBee Applications Errata SWRA467 Developing a Low-Cost, Zigbee-Enabled Smart Energy Meter On CC2538 SWRA456 Pwr Consumption Meas & Optimization for CC2538 End Device With Z-Stack SWRA447 Using CC2592 Front End with CC2538 SWRA437 CC2538 + CC1200 Evaluation Module SWRA443 Using GCC/GDB With CC2538 SWRU325 CC2538 Peripheral Driver Library User's Guide SWRU319 CC2538 SoC for 2.4-GHz IEEE 802.15.4 & ZigBee/ZigBee IP Apps User's Guide SWRU333 CC2538 ROM User's Guide Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 7.3 Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world. With a broad selection of product solutions, end-application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. 7.3.1 Texas Instruments Low-Power RF Web Site Texas Instruments' Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to www.ti.com/lprf. Device and Documentation Support Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 23 CC2538 SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 7.3.2 www.ti.com Low-Power RF Online Community • • • Forums, videos, and blogs RF design help E2E interaction Join at: www.ti.com/lprf-forum. 7.3.3 Texas Instruments Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: • RF circuit, low-power RF, and ZigBee design services • Low-power RF and ZigBee module solutions and development tools • RF certification services and RF circuit manufacturing For help with modules, engineering services or development tools: Search the Low-Power RF Developer Network to find a suitable partner. www.ti.com/lprfnetwork 7.3.4 Low-Power RF eNewsletter The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up at: www.ti.com/lprfnewsletter 7.4 Trademarks Code Composer Studio, SmartRF, E2E are trademarks of Texas Instruments. Cortex is a registered trademark of ARM Limited. ARM is a registered trademark of ARM Physical IP, Inc. IAR Embedded Workbench is a registered trademark of IAR Systems AB. ZigBee is a registered trademark of ZigBee Alliance. 7.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.6 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 7.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 24 Device and Documentation Support Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2538 CC2538 www.ti.com SWRS096D – DECEMBER 2012 – REVISED APRIL 2015 8 Mechanical Packaging and Orderable Information 8.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2012–2015, Texas Instruments Incorporated Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: CC2538 25 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC2538NF11RTQR ACTIVE QFN RTQ 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538NF11 CC2538NF11RTQT ACTIVE QFN RTQ 56 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538NF11 CC2538NF23RTQR ACTIVE QFN RTQ 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538NF23 CC2538NF23RTQT ACTIVE QFN RTQ 56 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538NF23 CC2538NF53RTQR ACTIVE QFN RTQ 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538NF53 CC2538NF53RTQT ACTIVE QFN RTQ 56 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538NF53 CC2538SF23RTQR ACTIVE QFN RTQ 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538SF23 CC2538SF23RTQT ACTIVE QFN RTQ 56 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538SF23 CC2538SF53RTQR ACTIVE QFN RTQ 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538SF53 CC2538SF53RTQT ACTIVE QFN RTQ 56 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC2538SF53 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2016 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jan-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC2538NF11RTQR QFN RTQ 56 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2000 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538NF11RTQT QFN RTQ 56 250 180.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538NF23RTQR QFN RTQ 56 2000 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538NF23RTQT QFN RTQ 56 250 180.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538NF53RTQR QFN RTQ 56 2000 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538NF53RTQT QFN RTQ 56 250 180.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538SF23RTQR QFN RTQ 56 2000 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538SF23RTQT QFN RTQ 56 250 180.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538SF53RTQR QFN RTQ 56 2000 330.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 CC2538SF53RTQT QFN RTQ 56 250 180.0 16.4 8.3 8.3 2.25 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jan-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2538NF11RTQR QFN RTQ 56 2000 336.6 336.6 28.6 CC2538NF11RTQT QFN RTQ 56 250 213.0 191.0 55.0 CC2538NF23RTQR QFN RTQ 56 2000 336.6 336.6 28.6 CC2538NF23RTQT QFN RTQ 56 250 213.0 191.0 55.0 CC2538NF53RTQR QFN RTQ 56 2000 336.6 336.6 28.6 CC2538NF53RTQT QFN RTQ 56 250 213.0 191.0 55.0 CC2538SF23RTQR QFN RTQ 56 2000 336.6 336.6 28.6 CC2538SF23RTQT QFN RTQ 56 250 213.0 191.0 55.0 CC2538SF53RTQR QFN RTQ 56 2000 336.6 336.6 28.6 CC2538SF53RTQT QFN RTQ 56 250 213.0 191.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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