Diodes DMNH6012LK3Q 60v 175â°c n-channel enhancement mode mosfet Datasheet

DMNH6012LK3Q
Q MOSFET
60V 175°C N-CHANNEL ENHANCEMENT MODE
Green
Product Summary
BVDSS
RDS(ON) Max
60V
12mΩ @ VGS = 10V
18mΩ @ VGS = 4.5V
Features

ID Max
TC = +25°C
80A
70A







Description and Applications
This MOSFET is designed to meet the stringent requirements of
Automotive applications. It is qualified to AECQ101, supported by a
PPAP and is ideal for use in:

Engine Management Systems

Body Control Electronics

DC/DC Converters
Top View
Rated to +175°C – Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching – Ensures more Reliable
and Robust End Application
Low On-Resistance
Low Input Capacitance
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Mechanical Data






Case: TO252 (DPAK)
Case Material: Molded Plastic, ―Green‖ Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Matte Tin Finish Annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208 e3

Weight: 0.33 grams (Approximate)
Pin Out Top View
Equivalent Circuit
Ordering Information (Note 5)
Part Number
DMNH6012LK3Q-13
Notes:
Case
TO252 (DPAK)
Packaging
2500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
H6012L
YYWW
DMNH6012LK3Q
Document number: DS37431 Rev. 1 - 2
=Manufacturer’s Marking
H6012L = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 16 = 2016)
WW = Week Code (01 to 53)
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DMNH6012LK3Q
Q
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Drain-Source Voltage
Gate-Source Voltage
TC = +25°C
TC = +100°C
Continuous Drain Current (Note 8), VGS = 10V
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
VDSS
Value
60
Unit
V
VGSS
±20
V
ID
80
60
A
IDM
120
A
Maximum Continuous Body Diode Forward Current (Note 8)
IS
80
A
Avalanche Current, L = 0.1mH (Note 9)
IAS
45
A
Avalanche Energy, L = 0.1mH (Note 9)
EAS
100
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Value
2.0
Steady State
RJA
74
°C/W
PD
3.8
W
Steady State
RJA
40
RJC
1.2
TJ, TSTG
-55 to +175
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Case (Note 8)
Operating and Storage Temperature Range
Unit
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 10)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current, TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 10)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Symbol
Min
Typ
Max
BVDSS
IDSS
60
—
—
V
—
—
1
µA
VGS = 0V, ID = 250μA
VDS = 60V, VGS = 0V
IGSS
—
—
±100
nA
VGS = ±20V, VDS = 0V
V
VDS = VGS, ID = 250μA
VGS(TH)
RDS(ON)
1
—
3
—
8
12
—
10
18
Unit
mΩ
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 11)
Input Capacitance
VSD
—
0.7
1.2
V
Ciss
—
1926
—
pF
Output Capacitance
Reverse Transfer Capacitance
Coss
—
330
—
—
—
112
Gate Resistance
Crss
Rg
2.0
—
—
pF
pF
Total Gate Charge (VGS = 4.5V)
Qg
—
16.3
—
nC
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Qg
—
nC
—
35.2
7.6
—
Qgs
—
Ω
Qgd
—
6.9
—
nC
nC
—
6.4
—
ns
Turn-On Rise Time
tD(ON)
tR
—
11.9
—
ns
Turn-Off Delay Time
tD(OFF)
—
16.5
—
ns
tF
—
ns
—
—
5
28
—
tRR
—
—
ns
nC
Turn-On Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
QRR
23
Test Condition
VGS = 10V, ID = 25A
VGS = 4.5V, ID = 25A
VGS = 0V, IS = 1.7A
VDS = 30V, VGS = 0V,
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = 30V, ID = 25A
VGS = 10V, VDS = 30V,
Rg = 3Ω, ID = 25A
IF = 25A, di/dt = 100A/μs
IF = 25A, di/dt = 100A/μs
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
8. Thermal resistance from junction to soldering point (on the exposed drain pad).
9. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.
10. Short duration pulse test used to minimize self-heating effect.
11. Guaranteed by design. Not subject to product testing.
DMNH6012LK3Q
Document number: DS37431 Rev. 1 - 2
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DMNH6012LK3Q
Q
15
30.0
VGS=4.0V
12
ID, DRAIN CURRENT (A)
25.0
ID, DRAIN CURRENT (A)
VDS=5V
VGS=4.5V
20.0
VGS=10.0V
15.0
10.0
VGS=3.5V
5.0
9
6
125℃
85℃
150℃
3
25℃
175℃
VGS=3.0V
-55℃
0
0.0
0
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
1.5
3
25.00
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(mΩ)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(mΩ)
Figure 1. Typical Output Characteristic
20.00
VGS=4.5V
15.00
10.00
VGS=10.0V
5.00
5
10
15
20
25
30
35
40
45
35
30
25
20
ID=25A
15
10
5
2
150℃
175℃
0.015
85℃
0.01
25℃
-55℃
0.005
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(mΩ)
125℃
0
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Temperature
DMNH6012LK3Q
Document number: DS37431 Rev. 1 - 2
4
6
8
10
12
14
16
18
20
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current
and Gate Voltage
VGS=10V
4
40
50
0.02
2
2.5
3
3.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
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2.4
2.2
2
VGS=10V, ID=25A
1.8
1.6
1.4
1.2
VGS=4.5V, ID=25A
1
0.8
0.6
0.4
-50 -25
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
June 2016
© Diodes Incorporated
0.03
3
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(Ω)
DMNH6012LK3Q
Q
0.025
VGS=4.5V, ID=25A
0.02
0.015
0.01
VGS=10V, ID=25A
0.005
2.8
2.6
2.4
ID=1mA
2.2
2
ID=250μA
1.8
1.6
1.4
1.2
1
0
0.8
-50 -25
0
25
50
75 100 125 150 175
-50 -25
0
25
50
75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Temperature
1000000
30
TJ=175℃
IS, SOURCE CURRENT (A)
25
VGS=0V, TA=125℃
20
VGS=0V, TA=150℃
VGS=0V, TA=175℃
15
VGS=0V,
TA=85℃
VGS=0V,
TA=25℃
10
5
VGS=0V,
TA=-55℃
IDSS, LEAKAGE CURRENT (nA)
100000
10000
TJ=125℃
1000
100
TJ=85℃
10
1
TJ=25℃
0.1
0
0
0.3
0.6
0.9
VSD, SOURCE-DRAIN VOLTAGE (V)
0
10
20
30
40
50
60
VDS, Drain-SOURCE VOLTAGE (V)
Figure 10. Typical Drain-Source Leakge Current vs.
Voltage
1.2
Figure 9. Diode Forward Voltage vs. Current
10
10000
f=1MHz
Ciss
8
1000
VGS (V)
CT, JUNCTION CAPACITANCE (pF)
TJ=150℃
6
VDS=30V, ID=25A
4
Coss
100
2
Crss
0
10
0
5 10 15 20 25 30 35 40 45 50 55 60
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure: 11. Typical Junction Capacitance
DMNH6012LK3Q
Document number: DS37431 Rev. 1 - 2
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0
5
10
15
20
25
30
Qg (nC)
Figure 12. Gate Charge
35
40
June 2016
© Diodes Incorporated
DMNH6012LK3Q
Q
1000
1600
RDS(ON) Limited
PW =1ms
1400
EAS, Avalanche Energy (mJ)
ID, DRAIN CURRENT (A)
100
10
PW =10ms
1
0.1
0.01
PW =100ms
TJ(MAX)=175℃
PW =1s
TC=25℃
Single Pulse
PW =10s
DUT on 1*MRP board
DC
VGS=10V
0.01
0.1
1
ID=8A
1200
1000
800
600
400
200
0
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 13. SOA, Safe Operation Area
25
50
75
100
125
150
175
TJ, JUNCTION TEMPERATURE (℃)
Figure 14. Avalanche Energy vs. Junction
Temperature
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.5
D=0.3
D=0.9
D=0.7
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA (t)=r(t) * RθJA
RθJA=73.5℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
0.001
DMNH6012LK3Q
Document number: DS37431 Rev. 1 - 2
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 15. Transient Thermal Resistance
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100
1000
June 2016
© Diodes Incorporated
DMNH6012LK3Q
Q
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
E
A
b3
7° ± 1°
c
L3
D
A2
L4
e
H
b(3x)
b2(2x)
Gauge Plane
0.508
D1
E1
Seating Plane
a
L
A1
2.74REF
TO252 (DPAK)
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c
0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21
e
2.286
E 6.45 6.70 6.58
E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK)
X1
Y1
Dimensions
C
X
X1
Y
Y1
Y2
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
DMNH6012LK3Q
Document number: DS37431 Rev. 1 - 2
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Q
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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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DMNH6012LK3Q
Document number: DS37431 Rev. 1 - 2
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