Sample & Buy Product Folder Support & Community Tools & Software Technical Documents ADS8920B ADS8922B ADS8924B SBAS729 – JUNE 2016 1 Features 3 Description • • The ADS8920B, ADS8922B, and ADS8924B (ADS892xB) belong to a family of pin-to-pin compatible, high-speed, high-precision successsive approximation register (SAR) based, analog-to-digital convertors (ADCs) with an integrated reference buffer and integrated low-dropout regulator (LDO). These devices support unipolar, fully-differential analog input signals with ±0.5-LSB INL (max) and 96-dB SNR (min) specifications over the specified range of operating conditions. 1 • • • • • • • • Resolution: 16-bit High Sample Rate With No Latency Output: – ADS8920B : 1 MSPS – ADS8922B : 500 kSPS – ADS8924B : 250 kSPS Integrated LDO Enables Single-Supply Operation Burst-Mode Operation With Precise First Sample Excellent AC and DC Performance: – SNR: 96.8 dB, THD: –125 dB – INL: ±0.5 LSB (Max) – DNL: ±0.5 LSB (Max), 16-Bit NMC Wide Input Range: – Unipolar Differential Input Range: ±VREF – VREF Input Range: 2.5 V to 5 V Single-Supply, Low-Power Operation (Includes Internal Reference Buffer and LDO) – ADS8920B : 21 mW at 1 MSPS – ADS8922B : 16 mW at 500 kSPS – ADS8924B : 14 mW at 250 kSPS multiSPI™ Digital Interface Extended Temperature Range: –40°C to +125°C Small Footprint: 4-mm × 4-mm VQFN 2 Applications • • • Test and Measurement Medical Imaging High-Precision, High-Speed Industrial Data Acquisition The integrated LDO enables single-supply operation with low power consumption. The integrated reference buffer supports burst-mode data acquisition with 16-bit precision for the first sample. External reference voltages in the range 2.5 V to 5 V are supported, offering a wide selection of input ranges without additional input scaling. The integrated multiSPI digital interface is backwardcompatible to the traditional SPI protocol. Additionally, configurable features simplify board layout, timing, and firmware, and support high throughput at lower clock speeds. The multiSPI digital interface allows for easy interface with a variety of microcontrollers, digital signal processors (DSPs), and field-programmable gate arrays (FPGAs). The ADS892x family is offered in a space-saving, 4-mm × 4-mm, VQFN package, and is fully specified over the extended temperature range of –40°C to +125°C. Device Information PART NUMBER PACKAGE ADS892xB VQFN (24) BODY SIZE (NOM) 4.00 mm × 4.00 mm (1) For all available packages, see the package option addendum at the end of the datasheet. Functional Block Diagram REFIN REFBUFOUT BUF REFM RVDD LDO DVDD DECAP AINP AINM multiSPITM Digital Interface SAR ADC To Digital Host GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW ADS892xB 16-bit, High-Speed SAR ADCs With Integrated Reference Buffer, Integrated LDO, and multiSPI™ Digital Interface ADS8920B ADS8922B ADS8924B SBAS729 – JUNE 2016 www.ti.com 4 Device and Documentation Support 4.1 Related Links The following table lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY ADS8920B Click here Click here Click here Click here Click here ADS8922B Click here Click here Click here Click here Click here ADS8924B Click here Click here Click here Click here Click here 4.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. PRODUCT PREVIEW TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.3 Trademarks multiSPI, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 4.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: ADS8920B ADS8922B ADS8924B PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS8920BRGER PREVIEW VQFN RGE 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 8920B ADS8920BRGET PREVIEW VQFN RGE 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 8920B ADS8922BRGER PREVIEW VQFN RGE 24 3000 TBD Call TI Call TI -40 to 125 ADS8922BRGET PREVIEW VQFN RGE 24 250 TBD Call TI Call TI -40 to 125 ADS8924BRGER PREVIEW VQFN RGE 24 3000 TBD Call TI Call TI -40 to 125 ADS8924BRGET PREVIEW VQFN RGE 24 250 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2016 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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