MOLEX 455600161

HANDYLINK™
APPLICATION SPECIFICATION
HANDYLINK™
I/O CONNECTORS
44828 SMT Receptacle
Connector
45560 SMT Cradle
Connector
45339 and 45593
Plug Connector Modules
3 REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
3 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
Table of Contents
Page
Section
Section
1.0
2.0
3.0
4.0
4.1
4.2
5.0
5.1
5.2
5.3
5.4
4 REVISION:
B
Scope
Product Description
Applicable Documents and Specifications
Mating and Un-Mating of Connectors
Recommendations for Mating and Un-Mating
Mating Alignment Tolerances
Soldering Process Recommendations
44828 SMT Receptacle Connector
5.1.1 PCB Layout
5.1.2 Solder Paste Stencil Layout
5.1.3 Reflow Profile
5.1.4 Inspection
45560 SMT Cradle Connector
5.2.1 PCB Layout
5.2.2 Solder Paste Stencil Layout
5.2.3 Reflow Profile
5.2.4 Inspection
45339 Plug Module for Wire Termination
5.3.1 Applicable Wire Sizes
5.3.2 Wire Preparation
5.3.3 Inspection
45593 Plug Module for PCB Termination
5.4.1 PCB Layout
5.4.2 Inspection
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
3
3
3
Page
6.0
Mechanical Design Recommendations
6.1 Mechanical Fasteners and Support
6.1.1 Receptacle Connector
6.1.2 Plug Connector Modules
6.1.3 Cradle Connector
6.2 Ingress Protection
6.3 Plug Cable Over-Molding
6.3.1 Wire Soldering
6.3.2 Encapsulation
6.3.3 Strain Relief
6.3.4 Final Over-Molding
6.4 Design Best Practices
6.4.1 Plug Over-mold Designs
6.4.2 Cradle Designs
7.0
Electrical Recommendations
7.1 Power Considerations
7.2 High Speed Signal Transmission
4
4
6
6
8
10
11
14
21
21
7
7
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
1.0 SCOPE
This specification addresses the manufacturing techniques and end-usage considerations for Molex’s 0.8mm pitch HandyLink™ I/O
Connectors. The common contact interface used in this family of connectors consists of a flat pad mated to a radiussed edge on a
compression spring blade. The flat pad is enclosed by plastic in an over-molded receptacle housing which provides a sealed
ineterface to facilitate ingress protection. The compression spring blades are extremely durable and are capable of sustaining over
20,000 mating cycles. Two “passive” latches counteract the compression springs to keep the connector pairs mated but enable
simple disconnection by the end-user.
The customer is encouraged to contact Molex with any questions regarding the application of this product.
2.0 PRODUCT DESCRIPTION
2.1 Product Names and Part Numbers
SMT Receptacle Connectors
Series: 44828
SMT Cradle Connectors
Series 45560 (Perpendicular and Parallel Mating)
Plug Connector Modules
Series 45339 (Wire Termination)
Series 45593 (PCB Termination)
2.2 Dimensions, Materials, Platings, and Markings
(See applicable sales drawings for information)
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
Product Specification: PS-44828-001;
5 REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
Sales Drawing s: SD-44828-162, SD-45560-160, SD-45560-161, SD-45339-160, SD-45593-160
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
4.0 MATING AND UN-MATING OF CONNECTORS
This section describes the preferred methods for mating and un-mating the HandyLink™ connectors.
4.1
Recommendations for Mating and Un-Mating
This connector system utilizes a “passive” latching feature. There is no button to press to latch or unlatch. To latch, simply push the
plug into the receptacle (the connectors are polarized to discourage improper mating). To unlatch, simply grip the plug body firmly and
pull it straight out of the receptacle.
4.2
Mating Alignment Tolerances
4.2.a 44828 Receptacle to 45339 or 45593 Plug Connectors
The HandyLink™ plug and receptacle have been appropriately designed and toleranced to be mated and unmated by hand. The
connectors’ alignment features are manufactured with clearances to allow axial mating mis-alignment, as illustrated in the Figure 1,
below:
Figure 1. Receptacle to Plug Connector
Axial Alignment (units: mm)
6 REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
6 of 27
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CHECKED BY:
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S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
4.2
Mating Alignment Tolerances (continued)
4.2.b 44828 Receptacle to 45560 Cradle Connectors
The HandyLink™ receptacle and cradle connectors’ alignment features are manufactured with clearances to allow some axial mating
mis-alignment as illustrated in the Figure 2, below:
Figure 2. Receptacle to
Cradle Connector Axial
Alignment (units: mm)
NOTE: Mating misalignment may significantly influence the long-term durability of the connectors. The risk of housing wear diminishes
with increasing the accuracy of connector alignment.
7 REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
7 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
4.3
Clearances Between Mated Parts
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see
Section 6.4 Design Best Practices for further detailed information.
5.0 SOLDERING PROCESS RECOMMENDATIONS
5.1 44828 SMT Receptacle Connector
5.1.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.
5.1.2 Solder Paste Stencil Layout
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.
5.1.4 Inspection
Solder joints should be inspected using established conventional methods.
5.2 45560 SMT Cradle Connector
5.2.1 PCB Layout
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is
required.
5.2.2 Solder Paste Stencil Layout
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
8 REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
8 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
5.2.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.
5.2.4 Inspection
Solder joints should be inspected using established conventional methods.
5.3 45339 Plug Module for Wire Termination
5.3.1 Applicable Wire Sizes
Copper conductor size: 22 to 34 AWG (stranded wires are recommended for flexibility) may be used,
however, 22 to 28 AWG conductors are necessary to transmit 1.5 Amperes DC continuously.
Maximum insulation diameter: 1.6mm
NOTE: Small conductor sizes are suitable for the transmission of digital signals, and may improve wire bundle flexibility and harness
workability.
5.3.2 Wire Preparation
Strip length: 2.0 ~ 2.5mm
Pre-tinning is recommended.
5.3.3 Inspection
Solder joints should be inspected using established conventional methods.
5.4 45593 Plug Module for PCB Termination
5.4.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB hole layout.
5.4.2 Inspection
Solder joints should be inspected using established conventional methods.
9 REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
9 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
6.0 MECHANICAL MOUNTING RECOMMENDATIONS
6.1
Mechanical Fasteners and Support
6.1.1 Receptacle Connector
Molex recommends that the receptacle connector be mounted within the end-application enclosure such that it is recessed by 1.6 to
2.4mm from the outermost faces and with a 0.10mm maximum clearance with the casing inner walls. Such a recess provides multiple
advantages in terms of protecting the contact surfaces from accidental impact with foreign objects, providing mechanical support when
the mating plug connector assembly is torqued by abusive handling, and helps to reduce direct contact with hand oils or other
contamination. See Figures 3A and 3B, below, for recommendations on recess dimensions.
Figure 3A. Receptacle Connector Recess When Mating with the Plug Only (units: mm)
10REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
Figure 3B. Receptacle Connector Recess When Mating with the Plug or Cradle Connectors (units: mm)
Wherever possible, the 0.10 maximum clearance condition with the receptacle should be minimized by utilizing a clam-shell style
package design.
6.1.2 Plug Connector Module
The plug connector module is intended to be used as a part of a assembly using either direct wire soldering (45339) or using an
intermediary PCB (45593). Overmolding and/or clam shell style covers must be used to protect the wire connections and the
appropriate service loops and wire strain reliefs must be incorporated in a cable assembly to prevent damage during use. Please refer
to section 6.3 for further details about the over-molding process.
If the connector module is used as a stand-alone component on a PCB, the mating interface must be adequately supported. Please
refer to section 6.4.2 for further details concerning cradle design recommendations.
6.1.3 Cradle Connector
The cradle connector is designed to be fastened to the PCB with screws. See Sales Drawings for recommended screw size and
positions. Please refer to section 6.4.2 for further details concerning cradle design recommendations.
11REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
11 of 27
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CHECKED BY:
APPROVED BY:
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M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
6.2
Ingress Protection
Ingress protection, as described by IEC 60529, is a function of the customer’s enclosure. The HandyLink™ Receptacle Connector has
been designed to facilitate enclosure design when ingress protection is required. The interfaces between the metal and plastic
components of the connector are sealed to discourage intrusion of dust and liquid through the connector into the enclosure. The
customer is expected to design an appropriate seal around the periphery of the connector to adequately seal the finished enclosure.
Contact Molex for additional information.
Gaskets may be applied to the top and sides, or
front surfaces.
The bottom surface, once soldered, forms a continuous seal with the PCB
Figure 4. Sealing to achieve ingress protection with the receptacle connector
12REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
12 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
6.3
Plug Cable Over-Molding
6.3.1 Wire Soldering
This section provides an outline of the recommended plug cable over-molding practices
for the 45339 and 45593 plug connector modules. The 45339 connector (a 16-circuit wire termination version) is shown, below, prior to
soldering. Please note the following features:
Latch soldertails (2 places)
Wire soldertails (2 rows)
Cavities under the latches (2 places)
Figure 5. Soldertail side of the plug connector
Pre-tinned wires should be terminated to the appropriate solder tails working in sequence and one row at a time, taking care that
the insulation does not become exposed more than 1mm from the end of the terminals. The completed assembly after soldering of
the wires is shown below. Dressing of the wires should be avoided until after the soldering and encapsulation processes are
complete.
13REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
Figure 6.
Plug Soldering Set-Up
NOTE: The wire bundle must be properly supported or clamped
as shown, during soldering and handling, to avoid dislodging
terminals or latches from the housing prior to encapsulation,
application of a strain relief, and the final over-mold.
14REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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HANDYLINK™
APPLICATION SPECIFICATION
6.3.2 Encapsulation
The next step after soldering is to pre-seal or encapsulate the back end of the connector and hold the wires in place using a silicone
sealant or a low-pressure Macro-melt polyamide adhesive molding. The sealant will prevent accidental shorting between adjacent
terminals and discourage intrusion of over-mold resin into the terminal and latch cavities. An illustration of the pre-seal coverage is
shown below. Care must be taken to ensure that no encapsulant enters the terminal or latch cavities.
Figure 7.
Encapsulated plug connector
An alternate method is to combine one or more molded ‘covers’ to block entire sections where void circuits are present, then use a
pre-seal or encapsulant to hold the wires separate. This is illustrated below.
Figure 8.
Covered and encapsulated plug connector
NOTE: The sealant or cover should enclose the cavities under the latches, whether or not wires are soldered to the latches. Omission
of this step would allow the final over-mold resin to extrude into cavities in the housing that could disable latch and terminal function.
15REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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HANDYLINK™
APPLICATION SPECIFICATION
6.3.3 Strain Relief
Molex strongly recommends the use of a crimp barrel or ferrule over the wire bundle
(including ground or drain wire) that also captures the cable jacket and tension member, if used. This will uniformly distribute
mechanical loads through the wire bundle and provide mechanical support to the cable jacket and tension member.
Figure 9.
Crimp barrel installed
6.3.4 Final Over-Molding
The final PVC over-mold may be injection-molded to completely cover the prepared cable assembly to provide an esthetically
pleasing finished product. Please see Section 6.4.1 for a discussion of design best practices for the over-mold.
Figure 10.
Finished over-mold (shown transparent)
16REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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CREATED / REVISED BY:
CHECKED BY:
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M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
6.4
Design Best Practices
The information provided so far in this document has been related to the basic usage conditions of the HandyLink™ connectors. The
sections that follow contain important information and guidelines for design that apply to specific applications or industrial design
constraints for the end-product accessories. In all cases, Molex advises that prototype assemblies be used as early in the design and
development cycle as possible to simulate and assess true usage conditions in the actual end-products.
Please contact Molex for technical assistance with design feasibility studies or design reviews.
6.4.0 Mating Over-Travel Clearance
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage, as illustrated in
Figure 11. This clearance must be accommodated in all device and accessory designs top assure proper function.
Receptacle Connector
0.20mm over-travel
clearance between
connectors when mated
Hook
Latch
Plug Connector
17REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
6.4.1 Plug Over-Mold Designs
Supplemental guide features to align the connectors during mating or un-mating are strongly recommended if any of the following
conditions are present:
o A great deal of curvature in the end product (such as that illustrated, below);
o The accessory cable is stiff or bent abruptly;
o The mass of the end-product itself is greater than 1000grams and is likely to experience more than 1g of acceleration during use or
under vibration;
o The cable connection and disconnection cycles are numerous (more than 5000 cycles);
o There is significant risk of the end users pulling at connections in off-axis directions.
Figure 12. Example of an application
with a great degree of curvature near
the connector interface.
Supplemental guide features may be incorporated into or complement the over-mold design as illustrated in Figures 12 and 13:
18REVISION:
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ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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HANDYLINK™
APPLICATION SPECIFICATION
Contouring with a Lip
To provide mechanical support for torque out of the axial plane of the connectors, the over-mold must be designed to mimic the
outer surfaces of the end product and include a lip such as illustrated below. NOTE: The axial clearance condition between the
connectors noted in section 4.2 must be maintained.
o
Off-axis
Torque
directions
Surfaces are contoured
to mimic the end product
Over-molded lip
Figure 13. Example of an over-mold with contouring and a lip
This type of design will provide support for the end-user to hold the product by the connector or where a heavy or stiff accessory cable
is used.
19REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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HANDYLINK™
APPLICATION SPECIFICATION
Supplemental Latching and Alignment Posts
Where the mass of the end product is greater than 1000 grams and is subject to sudden accelerations or strong vibrations during
use, a cup-style receptacle needs to be considered to adequately protect the connection interface. The cup-style receptacle should
incorporate separate external latching features and supplemental alignment posts similar to those illustrated below. NOTE: The cupstyle receptacle’s dimensions must restrict angular misalignment, when mated, to within the limits specified in Section 4.2.
o
External latching feature (each side)
Supplemental alignment posts
Cup-style receptacle (separate
molded part)
Guide ribs (each side)
Figure 14. Use of a cup-style receptacle for added support and alignment
20REVISION:
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ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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HANDYLINK™
APPLICATION SPECIFICATION
Supplemental alignment posts must be longer than the protrusion of the plug connector posts from the base surface of the cup-style
receptacle. Further, the alignment posts’ centerlines must lie in the same plane as the centerlines of the plug connector posts to
provide the greatest benefits. Guide ribs are necessary to prevent front-to back rocking motion as the device is loaded into the cupstyle receptacle.
NOTE: The fastening of the cup-style receptacle to the over-molded plug must be kept tight to avoid misalignment. If this is not
achieved, excessive wear between the connector housings and/or electrical discontinuities may occur.
21REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
6.4.2 Cradle Designs
o Cup Style
The cup or holster style of cradle provides the greatest degree of alignment between mating connectors. Where the end product
mass is greater than 1000 grams the use of supplemental alignment posts is recommended. The alignment posts’ effective length (not
including any lead-in taper) must be longer than the protrusion of the connector posts from the base surface of the cup-style receptacle.
Further, the alignment posts’ centerlines must lie in the same plane as the centerlines of the plug connector posts to provide the greatest
benefits. Guide ribs are necessary on each side to limit front-to back rocking motion as the device is loaded into the cup-style cradle.
Guide Rails
(each side)
Supplemental
Alignment Posts
Figure 15. Cup-Style Cradle Features
NOTE: For details about mounting the connectors to the PCB and the use of
fasteners, please refer to the applicable Sales Drawings.
22REVISION:
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ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
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TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
Figures 16 and 17 show orthogonal views of showing differences in the position and size of the openings in the cradle casing, and
the PCB location for the 45560 and 45593 connectors. Figure 18 shows a chamfer detail applicable to 45593.
Figure 16. Cradle Detail (45560)
(units: mm)
23REVISION:
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ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
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Figure 17. Cradle Detail (45593)
(units: mm)
Figure 18. Detail from Fig. 17.
(units: mm)
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
23 of 27
CREATED / REVISED BY:
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M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
Shelf Style
To achieve a ‘rocking’ disconnection for the end product from the cradle, a shelf style cradle design may be used under the
following conditions:
No supplemental guide posts may be used;
The end product may not have more than 1000 grams mass;
Side-to-side motion must be limited using end-walls or a guide rail;
The vibration conditions of the end application must be limited.
o
Disconnect
‘Rocking’
Direction
Connect
Direction
Shelf
(Bearing Surface)
Figure 19. Shelf-Style Cradle Features
NOTE: For details about mounting the connectors to the PCB and the use of
fasteners, please refer to the applicable Sales Drawings.
24REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
24 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
In addition to the differences in the position and size of the openings in the cradle casing, the PCB location for the 45560 and 45593
connectors, and the chamfer detail applicable to 45593 that is shown in Figures 16 thru 18. Figures 20 through 22 illustrate details
necessary to achieve a good ‘rocking’ design.
BACK SUPPORT
(REQUIRED)
Figure 20. Front View of Shelf-Style Cradle
25REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
Figure 21. Section View of Shelf-Style Cradle (units: mm)
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
25 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
Rocking Direction
NOTE: Orientation of the receptacle connector and
the plug or cradle connector must correspond to that
shown for good operation of a ‘rocking’ design.
Figure 22. Connector Orientation
26REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
26 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
HANDYLINK™
APPLICATION SPECIFICATION
7.0
Electrical Recommendations
7.1
Power Considerations
Please see the Product Specification, PS-44828-001, for the nominal electrical specifications. For applications where the sustained
electrical power usage requirements exceed the limits stated in the product specification, the use of multiple circuits is suggested.
When the end-application is likely to encounter salt spray conditions, potential differences exceeding 4VDC should be separated by
more than one terminal position (i.e. 1.6mm or more) to avoid galvanic corrosion between circuits.
7.2
High Speed Signal Transmission
Testing has shown that under the USB 2.0 Specification environment for connector components and cable assemblies (200 and
500 picosecond rise times), the HandyLink connectors perform within specification for both differential and common-mode impedance.
Full compliance testing on finished cable assemblies will have to be undertaken to verify the performance level of the finished
product.
Contact Molex for further assistance regarding high speed signal transmission applications.
27REVISION:
B
ECR/ECN INFORMATION:
EC No: UCP2009-1982
DATE: 2009/02/09
DOCUMENT NUMBER:
SD-45560-002
TITLE:
SHEET No.
APPLICATION SPECIFICATION
HANDYLINK™I/O CONNECTOR SYSTEM
27 of 27
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
M. Simmel/D. Morgan
M. Ibarra
S. Miller
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC