TI1 CD74HC4511MG4 Bcd-to-7 segment Datasheet

SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
D 2-V to 6-V VCC Operation (’HC4511)
D 4.5-V to 5.5-V VCC Operation
CD54HC4511 . . . F PACKAGE
CD74HC4511 . . . E, M, OR PW PACKAGE
CD74HCT4511 . . . E PACKAGE
(TOP VIEW)
(CD74HCT4511)
D High-Output Sourcing Capability
D
D
D
D
D
D
− 7.5 mA at 4.5 V (CD74HCT4511)
− 10 mA at 6 V (’HC4511)
Input Latches for BCD Code Storage
Lamp Test and Blanking Capability
Balanced Propagation Delays and
Transition Times
Significant Power Reduction Compared to
LSTTL Logic ICs
’HC4511
− High Noise Immunity,
NIL or NIH = 30% of VCC at VCC = 5 V
CD74HCT4511
− Direct LSTTL Input Logic Compatibility,
VIL = 0.8 V Maximum, VIH = 2 V Minimum
− CMOS Input Compatibility, II ≤ 1 µA
at VOL, VOH
D1
D2
LT
BL
LE
D3
D0
GND
BCD
Inputs
BCD
Inputs
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
f
g
a
7-Segment
b
Outputs
c
d
e
DISPLAY
0
1
2
3
4
5
6
7
8
9
a
f
g
b
c
e
d
description/ordering information
The CD54HC4511, CD74HC4511, and CD74HCT4511 are BCD-to-7 segment latch/decoder/drivers with four
address inputs (D0−D3), an active-low blanking (BL) input, lamp-test (LT) input, and a latch-enable (LE) input
that, when high, enables the latches to store the BCD inputs. When LE is low, the latches are disabled, making
the outputs transparent to the BCD inputs.
These devices have standard-size output transistors, but are capable of sourcing (at standard VOH levels) up
to 7.5 mA at 4.5 V. The HC types can supply up to 10 mA at 6 V.
ORDERING INFORMATION
PDIP − E
−55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC − M
TSSOP − PW
CDIP − F
Tube of 25
TOP-SIDE
MARKING
CD74HC4511E
CD74HC4511E
CD74HCT4511E
CD74HCT4511E
Tube of 40
CD74HC4511M
Reel of 2500
CD74HC4511M96
Reel of 250
CD74HC4511MT
Reel of 2000
CD74HC4511PWR
Reel of 250
CD74HC4511PWT
Tube of 25
CD54HC4511F3A
HC4511M
HJ4511
CD54HC4511F3A
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
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1
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
FUNCTION TABLE
OUTPUTS
INPUTS
LE
BL
X
X
X
L
L
H
L
H
L
LT
D3
D2
D1
D0
a
b
c
d
e
f
g
DISPLAY
L
X
X
X
X
H
H
H
H
H
H
H
8
H
X
X
X
X
L
L
L
L
L
L
L
Blank
H
L
L
L
L
H
H
H
H
H
H
L
0
H
L
L
L
H
L
H
H
L
L
L
L
1
H
H
L
L
H
L
H
H
L
H
H
L
H
2
L
H
H
L
L
H
H
H
H
H
H
L
L
H
3
L
H
H
L
H
L
L
L
H
H
L
L
H
H
4
L
H
H
L
H
L
H
H
L
H
H
L
H
H
5
L
H
H
L
H
H
L
L
L
H
H
H
H
H
6
L
H
H
L
H
H
H
H
H
H
L
L
L
L
7
L
H
H
H
L
L
L
H
H
H
H
H
H
H
8
L
H
H
H
L
L
H
H
H
H
L
L
H
H
9
L
H
H
H
L
H
L
L
L
L
L
L
L
L
Blank
L
H
H
H
L
H
H
L
L
L
L
L
L
L
Blank
L
H
H
H
H
L
L
L
L
L
L
L
L
L
Blank
L
H
H
H
H
L
H
L
L
L
L
L
L
L
Blank
L
H
H
H
H
H
L
L
L
L
L
L
L
L
Blank
L
H
H
H
H
H
H
H
H
H
X
X
X
X
L
†
L
†
L
†
L
†
L
†
L
†
L
†
Blank
†
X = Don’t care
† Depends on BCD code previously applied when LE = L
NOTE: Display is blank for all illegal input codes (BCD > HLLH).
function diagram
D1 1
BCD
Inputs
D2 2
D3
LE
BL
6
Driver
7
Decoder
D0
3
Latch
LT
13
12
11
10
9
15
14
5
4
VSS = 8
VDD = 16
2
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a
b
c
d
e
f
g
7-Segment
Outputs
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
logic diagram
BL
D3
4
13 a
6
D
Q
12 b
Latch
LE
LE
LE
LE
Q
11 c
D2
2
D
Q
Latch
D1
LE
LE
LE
LE
1
D
10 d
Q
Q
Latch
D0
LE
LE
LE
LE
7
D
Q
9 e
Q
Latch
LE
LE
LE
LE
15
f
Q
14 g
LE
5
LE
LT
3
LE
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3
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input diode current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output diode current, IOK (VO < −0.5 V or VO > VCC + 0.5V) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output source or sink current per output, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Lead temperature (during soldering):
At distance 1/16 ± 1/32 in (1.59 ± 0.79 mm) from case for 10 s maximum . . . . . . . . . . . . . . . . . . . . . 265°C
Unit inserted into a PC board (minimum thickness 1/16 in, 1.59 mm),
with solder contacting lead tips only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65 to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions for ’HC4511 (see Note 3)
VCC
VIH
Supply voltage
High-level input voltage
VCC = 2 V
VCC = 4.5 V
VCC = 6 V
VCC = 2 V
VIL
VI
VO
tt
Low-level input voltage
TA = −55°C
TO 125°C
TA = −40°C
TO 85°C
MIN
MAX
MIN
MAX
MIN
MAX
2
6
2
6
2
6
1.5
1.5
1.5
3.15
3.15
3.15
4.2
4.2
4.2
VCC = 4.5 V
VCC = 6 V
Input voltage
0
Output voltage
Input transition (rise and fall) time
TA = 25°C
0
VCC = 2 V
VCC = 4.5 V
UNIT
V
0.5
0.5
0.5
1.35
1.35
1.35
1.8
1.8
1.8
VCC
VCC
0
0
VCC
VCC
0
0
V
VCC
VCC
1000
1000
1000
500
500
500
V
V
V
ns
VCC = 6 V
400
400
400
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
recommended operating conditions for CD74HCT4511 (see Note 4)
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
VO
tt
Output voltage
High-level input voltage
TA = 25°C
TA = −55°C
TO 125°C
TA = −40°C
TO 85°C
MIN
MAX
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
4.5
5.5
2
2
Input voltage
Input transition (rise and fall) time
2
UNIT
V
V
0.8
0.8
0.8
V
VCC
VCC
VCC
VCC
VCC
VCC
V
500
500
500
ns
V
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
’HC4511
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −20 µA
VOH
VI = VIH or VIL
IOH = −7.5 mA
IOH = −10 mA
IOL = 20 µA
VOL
VI = VIH or VIL
IOL = 4 mA
IOL = 5.2 mA
II
ICC
VI = VCC or 0
VI = VCC or 0,
IO = 0
VCC
TA = 25°C
TA = −55°C
TO 125°C
TA = −40°C
TO 85°C
MIN
MIN
MIN
MAX
2V
1.9
1.9
1.9
4.5 V
4.4
4.4
4.4
6V
5.9
5.9
5.9
4.5 V
3.98
3.7
3.84
6V
5.48
5.2
UNIT
MAX
V
5.34
2V
0.1
0.1
0.1
4.5 V
0.1
0.1
0.1
6V
0.1
0.1
0.1
4.5 V
0.26
0.4
0.33
6V
0.26
0.4
0.33
6V
±0.1
±1
±1
µA
6V
8
160
80
µA
10
10
10
pF
Ci
POST OFFICE BOX 655303
MAX
• DALLAS, TEXAS 75265
V
5
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
CD74HCT4511
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25°C
VCC
MIN
VOH
VI = VIH or VIL
IOH = −20 µA
IOH = −4 mA
4.5 V
VOL
VI = VIH or VIL
IOL = 20 µA
IOL = 4 mA
4.5 V
II
ICC
VI = VCC to GND
VI = VCC or 0,
∆ICC†
IO = 0
One input at VCC − 2.1 V,
Other inputs at 0 or VCC
TYP
MAX
TA = −55°C
TO 125°C
TA = −40°C
TO 85°C
MIN
MIN
MAX
4.4
4.4
4.4
3.98
3.7
3.84
UNIT
MAX
V
0.1
0.1
0.1
0.26
0.4
0.33
5.5 V
±0.1
±1
±1
µA
5.5 V
8
160
80
µA
360
490
450
µA
4.5 V to 5.5 V
100
V
Ci
10
10
10
pF
† Additional quiescent supply current per input pin, TTL inputs high, 1 unit load. For dual-supply systems, theoretical worst-case
(VI = 2.4 V, VCC = 5.5 V) specification is 1.8 mA.
HCT INPUT LOADING TABLE
INPUT
UNIT LOADS‡
LT, LE
1.5
BL, Dn
0.3
‡ Unit load is ∆ICC limit specified in electrical
characteristics table, e.g., 360 µA maximum at
25°C.
’HC4511 timing requirements over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
VCC
tw
tsu
th
6
Pulse duration, LE low
Setup time, BCD inputs before LE↑
Hold time, BCD inputs before LE↑
POST OFFICE BOX 655303
TA = 25°C
TA = −55°C
TO 125°C
TA = −40°C
TO 85°C
MIN
MIN
MIN
MAX
MAX
2V
80
120
100
4.5 V
16
24
20
6V
14
20
17
2V
60
90
75
4.5 V
12
18
15
6V
10
15
13
2V
3
3
3
4.5 V
3
3
3
6V
3
3
3
• DALLAS, TEXAS 75265
UNIT
MAX
ns
ns
ns
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
’HC4511
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
Dn
TO
(OUTPUT)
Output
Output
BL
Output
tt
Output
Any
MIN
MIN
2V
300
450
375
CL = 50 pF
60
90
75
51
77
64
2V
270
405
340
4.5 V
54
81
68
6V
46
69
58
2V
220
330
275
4.5 V
44
66
55
37
56
47
2V
160
240
200
4.5 V
32
48
40
6V
27
41
34
MIN
TYP
MAX
6V
CL = 50 pF
CL = 50 pF
5V
5V
CL = 50 pF
5V
MAX
23
ns
18
CL = 15 pF
5V
2V
75
110
95
CL = 50 pF
4.5 V
15
22
19
6V
13
19
16
POST OFFICE BOX 655303
UNIT
MAX
25
6V
CL = 15 pF
LT
TA = −40°C
TO 85°C
4.5 V
CL = 15 pF
tpd
TA = −55°C
TO 125°C
VCC
CL = 15 pF
LE
TA = 25°C
LOAD
CAPACITANCE
13
• DALLAS, TEXAS 75265
ns
7
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
CD74HCT4511
timing requirements over recommended operating free-air temperature range VCC = 4.5 V (unless
otherwise noted) (see Figure 2)
TA = 25°C
TA = −55°C
TO 125°C
TA = −40°C
TO 85°C
MIN
MIN
MIN
MAX
MAX
UNIT
MAX
tw
tsu
Pulse duration, LE low
16
24
20
ns
Setup time, BCD inputs before LE↑
16
24
20
ns
th
Hold time, BCD inputs before LE↑
5
5
5
ns
CD74HCT4511
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
Dn
Output
LE
Output
tpd
BL
LT
tt
Output
Output
Any
LOAD
CAPACITANCE
VCC
CL = 50 pF
4.5 V
CL = 15 pF
5V
CL = 50 pF
4.5 V
TA = 25°C
MIN
TYP
MAX
TA = −55°C
TO 125°C
TA = −40°C
TO 85°C
MIN
MIN
MAX
UNIT
MAX
60
90
75
54
81
68
44
66
55
33
50
41
15
22
19
25
CL = 15 pF
5V
CL = 50 pF
4.5 V
23
CL = 15 pF
5V
CL = 50 pF
4.5 V
CL = 15 pF
5V
CL = 50 pF
4.5 V
ns
18
13
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd†
TYP
Power dissipation capacitance
† Cpd is used to determine the dynamic power consumption, per package.
PD = Cpd VCC2 fi + ∑ CL VCC2 fo
where: fi = input frequency
fo = output frequency
CL = output load capacitance
VCC = supply voltage
8
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’HC4511
114
CD74HCT4511
110
UNIT
pF
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION − ’HC4511
VCC
Test
Point
From Output
Under Test
PARAMETER
S1
ten
RL = 1 kΩ
tdis
CL
(see Note A)
S2
S1
S2
tPZH
Open
Closed
tPZL
Closed
Open
tPHZ
Open
Closed
tPLZ
Closed
Open
Open
Open
tpd or tt
tw
LOAD CIRCUIT
VCC
Input
50% VCC
50% VCC
0V
VOLTAGE WAVEFORMS
PULSE DURATION
CLR
Input
VCC
Reference
Input
VCC
50% VCC
50% VCC
0V
0V
tsu
trec
Data
50%
Input 10%
VCC
50% VCC
CLK
90%
VOLTAGE WAVEFORMS
RECOVERY TIME
50% VCC
50% VCC
tPLH
tPHL
50%
10%
90%
90%
tr
tPHL
Out-of-Phase
Output
90%
tf
tf
VCC
VOH
50% VCC
10%
VOL
tf
50%
10%
90%
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50% VCC
50% VCC
0V
tPLZ
tPZL
≈VCC
Output
Waveform 1
(see Note B)
50% VCC
Output
Waveform 2
(see Note B)
10%
VOL
tPHZ
tPZH
VOH
VOL
VCC
Output
Control
tPLH
50% VCC
10%
VCC
50% VCC
10% 0 V
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
0V
In-Phase
Output
90%
tr
0V
Input
th
50% VCC
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. For clock inputs, fmax is measured with the input duty cycle at 50%.
E. The outputs are measured one at a time with one input transition per measurement.
F. tPLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
H. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
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9
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION − CD74HCT4511
VCC
Test
Point
From Output
Under Test
PARAMETER
S1
ten
RL = 1 kΩ
tdis
CL
(see Note A)
S2
S1
S2
tPZH
Open
Closed
tPZL
Closed
Open
tPHZ
Open
Closed
tPLZ
Closed
Open
Open
Open
tpd or tt
tw
LOAD CIRCUIT
VCC
Input
50% VCC
50% VCC
0V
VOLTAGE WAVEFORMS
PULSE DURATION
CLR
Input
VCC
Reference
Input
VCC
50% VCC
50% VCC
0V
0V
tsu
trec
Data
50%
Input 10%
VCC
50% VCC
CLK
90%
VOLTAGE WAVEFORMS
RECOVERY TIME
50% VCC
50% VCC
tPLH
tPHL
50%
10%
90%
90%
tr
tPHL
Out-of-Phase
Output
90%
tf
tf
VCC
VOH
50% VCC
10%
VOL
tf
50%
10%
90%
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50% VCC
50% VCC
0V
tPLZ
tPZL
≈VCC
Output
Waveform 1
(see Note B)
50% VCC
Output
Waveform 2
(see Note B)
10%
VOL
tPHZ
tPZH
VOH
VOL
VCC
Output
Control
tPLH
50% VCC
10%
VCC
50% VCC
10% 0 V
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
0V
In-Phase
Output
90%
tr
0V
Input
th
50% VCC
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. For clock inputs, fmax is measured with the input duty cycle at 50%.
E. The outputs are measured one at a time with one input transition per measurement.
F. tPLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
H. tPLH and tPHL are the same as tpd.
Figure 2. Load Circuit and Voltage Waveforms
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-8773301EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8773301EA
CD54HC4511F3A
CD54HC4511F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8773301EA
CD54HC4511F3A
CD74HC4511E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74HC4511E
CD74HC4511EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74HC4511E
CD74HC4511M
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4511M
CD74HC4511M96
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4511M
CD74HC4511M96E4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4511M
CD74HC4511ME4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4511M
CD74HC4511MG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4511M
CD74HC4511MT
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HC4511M
CD74HC4511PWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ4511
CD74HC4511PWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ4511
CD74HC4511PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ4511
CD74HC4511PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ4511
CD74HC4511PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ4511
CD74HC4511PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
HJ4511
CD74HCT4511E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74HCT4511E
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
10-Jun-2014
Status
(1)
CD74HCT4511EE4
ACTIVE
Package Type Package Pins Package
Drawing
Qty
PDIP
N
16
25
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Op Temp (°C)
Device Marking
(4/5)
-55 to 125
CD74HCT4511E
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54HC4511, CD74HC4511 :
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
• Catalog: CD74HC4511
• Military: CD54HC4511
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC4511M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HC4511PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
CD74HC4511PWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC4511M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HC4511PWR
TSSOP
PW
16
2000
367.0
367.0
35.0
CD74HC4511PWT
TSSOP
PW
16
250
367.0
367.0
35.0
Pack Materials-Page 2
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