Diodes DMN2501UFB4 Low on-resistance Datasheet

DMN2501UFB4
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
ADVANCE INFORMATION
20V
Features and Benefits
RDS(on) max
ID
TA = +25°C
0.4Ω @ VGS = 4.5V
1.5A
0.5 Ω @ VGS = 2.5V
1.3A
0.7 Ω @ VGS = 1.8V
1.1A


Low On-Resistance
Very Low Gate Threshold Voltage VGS(TH), 1.0V Max.








Low Input Capacitance
Fast Switching Speed
Ultra-Small Surfaced Mount Package
Ultra-Low Package Profile, 0.4mm Maximum Package Height
ESD Protected Gate
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description and Applications
Mechanical Data
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(on)) and yet maintain superior switching performance,


making it ideal for high efficiency power management applications.





DC-DC Converters
Power Management Functions

Case: X2-DFN1006-3
Case Material: Molded Plastic, “Green” Molding Compound;
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu over Copper Leadframe; Solderable
per MIL-STD-202, Method 208 e4
Weight: 0.001 grams (Approximate)
Drain
X2-DFN1006-3
Body
Diode
S
Gate
D
G
ESD PROTECTED
Bottom View
Top View
Internal Schematic
Gate
Protection
Diode
Source
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN2501UFB4-7
DMN2501UFB4-7B
Notes:
Case
X2-DFN1006-3
X2-DFN1006-3
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green"
and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
DMN2501UFB4
Document number: DS35824 Rev. 5 - 2
1 of 7
www.diodes.com
May 2015
© Diodes Incorporated
DMN2501UFB4
Marking Information
From date code 1527 (YYWW),
this changes to:
TN
Top View
Bar Denotes Gate and Source Side
Top View
Dot Denotes Drain Side
TN
TN
TN
TN
TN
DMN2501UFB4-7
TN
TN
Top View
Bar Denotes Gate and Source Side
TN = Part Marking Code
TN
TN
DMN2501UFB4-7B
TN
ADVANCE INFORMATION
TN
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 4.5V
Steady
State
t<10s
Continuous Drain Current (Note 6) VGS = 4.5V
Steady
State
t<10s
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
TA = 25°C
TA = 70°C
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Body Diode continuous Current
ID
Value
20
±8
1.0
0.8
ID
1.2
0.9
A
ID
1.5
1.2
A
1.8
1.4
6
1
ID
IDM
IS
Units
V
V
A
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Symbol
TA = +25°C
TA = +70°C
Steady State
t<10s
TA = +25°C
TA = +70°C
Steady State
t<10s
Operating and Storage Temperature Range
Notes:
PD
RJA
PD
RJA
TJ, TSTG
Value
0.5
0.3
251
188
1.2
0.7
110
82
-55 to +150
Units
W
°C/W
W
°C/W
°C
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
DMN2501UFB4
Document number: DS35824 Rev. 5 - 2
2 of 7
www.diodes.com
May 2015
© Diodes Incorporated
DMN2501UFB4
ADVANCE INFORMATION
Electrical Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
20
-
-
100
±1
V
nA
A
VGS = 0V, ID = 250μA
VDS = 20V, VGS = 0V
VGS = ±6V, VDS = 0V
VGS(th)
0.5
RDS (ON)
-
|Yfs|
VSD
-
1.0
400
500
700
1.2
V
Static Drain-Source On-Resistance
0.76
170
200
260
1.4
0.7
VDS = VGS, ID = 250μA
VGS = 4.5V, ID = 600mA
VGS = 2.5V, ID = 500mA
VGS = 1.8V, ID = 350mA
VDS = 10V, ID = 400mA
VGS = 0V, IS = 150mA
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
-
82
12
10
83
1.1
2.0
0.14
0.19
6.6
6.4
40.4
17.3
-
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
mΩ
S
V
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
Test Condition
VDS =16V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
VDS = 10V, ID = 250mA
VDD = 10V, VGS = 4.5V,
RL = 47Ω, RG = 10Ω,
ID = 200mA
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMN2501UFB4
Document number: DS35824 Rev. 5 - 2
3 of 7
www.diodes.com
May 2015
© Diodes Incorporated
DMN2501UFB4
20
2.0
1.8
VGS = 8.0V
16
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
1.6
VGS = 2.5V
1.4
VGS = 2.0V
1.2
VGS = 1.5V
1.0
0.8
0.6
12
TA = 150°C
8
T A = 125°C
TA = 85°C
4
0.4
T A = 25°C
0.2
TA = -55°C
VGS = 1.2V
0
0
0.5
1.0
1.5
2.0
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristic
3.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.50
0.45
0.40
0.35
0.30
0.25
VGS = 1.8V
0.20
VGS = 2.5V
0.15
0.10
VGS = 8.0V
VGS = 4.5V
0.05
0
0
0.4
0.8
1.2
1.6
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
2.0
0.4
0.8
1.2
1.6
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
2.0
1.0
0.9
0.8
ID = 350mA
0.7
ID = 500mA
ID = 600mA
0.6
0.5
0.4
0.3
0.2
0.1
0
1
2
3
4
5
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 4 Typical Drain-Source On-Resistance
vs. Gate-Source Voltage
6
1.8
0.30
0.25
0
0
VGS = 4.5V
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ( )
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
ADVANCE INFORMATION
VDS = 5.0V
VGS = 4.5V
TA = 150°C
0.20
TA = 125°C
TA = 85°C
0.15
TA = 25°C
0.10
TA = -55°C
0.05
0
0
4
8
12
16
ID, DRAIN CURRENT (A)
Fig. 5 Typical On-Resistance vs.
Drain Current and Temperature
DMN2501UFB4
Document number: DS35824 Rev. 5 - 2
20
4 of 7
www.diodes.com
1.6
VGS = 4.5V
ID = 1.0A
1.4
1.2
VGS = 8.0V
ID = 1A
1.0
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Fig. 6 On-Resistance Variation with Temperature
May 2015
© Diodes Incorporated
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
1.2
0.25
VGS = 4.5V
ID = 1.0A
0.20
0.15
VGS = 8.0V
ID = 1A
0.10
0.05
1.0
ID = 1mA
0.8
ID = 250µA
0.6
0.4
0.2
0
-50
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE ( C)
Fig. 7 On-Resistance Variation with Temperature
-25
0
25
50 75 100 125 150
TJ, JUNCTION TEMPERATURE ( C)
Fig. 8 Gate Threshold Variation vs. Ambient Temperature
1,000
2.0
CT, JUNCTION CAPACITANCE (pF)
1.8
IS, SOURCE CURRENT (A)
1.6
1.4
1.2
TA = 150°C
1.0
TA = 125°C
0.8
TA = 85°C
0.6
TA = 25°C
0.4
TA = -55°C
100
Ciss
Coss
10
Crss
0.2
0
f = 1MHz
0
1
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 9 Diode Forward Voltage vs. Current
0
2
4
6
8 10 12 14 16 18 20
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Junction Capacitance
100
8
7
VDS = 10V
ID = 250mA
6
ID, DRAIN CURRENT (A)
VGS GATE THRESHOLD VOLTAGE (V)
ADVANCE INFORMATION
DMN2501UFB4
5
4
3
2
PW = 10µs
RDS(on)
Limited
1
DC
PW = 10s
PW = 1s
0.1 T
J(max) = 150°C
PW = 100ms
TA = 25°C
VGS = 8V
Single Pulse
DUT on 1 * MRP Board
1
0
0
10
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Qg, TOTAL GATE CHARGE (nC)
Fig. 11 Gate Charge
DMN2501UFB4
Document number: DS35824 Rev. 5 - 2
0.01
0.01
5 of 7
www.diodes.com
PW = 10ms
PW = 1ms
PW = 100µs
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 12 SOA, Safe Operation Area
100
May 2015
© Diodes Incorporated
DMN2501UFB4
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RJA(t) = r(t) * RJA
RJA = 251°C/W
Duty Cycle, D = t1/ t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (sec)
Fig. 13 Transient Thermal Resistance
10
100
1,000
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
A1
Seating Plane
D
b
Pin #1 ID
e
E b2
X2-DFN1006-3
Dim Min Max Typ
A
 0.40 
A1 0.00 0.05 0.03
b
0.10 0.20 0.15
b2 0.45 0.55 0.50
D 0.95 1.05 1.00
E 0.55 0.65 0.60
e
0.35
L1 0.20 0.30 0.25
L2 0.20 0.30 0.25
L3
0.40
z
0.02 0.08 0.05
All Dimensions in mm
z
L3
L2
L1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C
Y
Dimensions
C
G1
G2
X
X1
Y
Y1
Y1
G2
X
G1
Value (in mm)
0.70
0.30
0.20
0.40
1.10
0.25
0.70
X1
DMN2501UFB4
Document number: DS35824 Rev. 5 - 2
6 of 7
www.diodes.com
May 2015
© Diodes Incorporated
DMN2501UFB4
ADVANCE INFORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for
use provided in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
DMN2501UFB4
Document number: DS35824 Rev. 5 - 2
7 of 7
www.diodes.com
May 2015
© Diodes Incorporated
Similar pages