Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 CC1020 Low-Power RF Transceiver for Narrowband Systems 1 Device Overview 1.1 Features 1 • True Single Chip UHF RF Transceiver • Frequency Range 402 MHz to 470 MHz and 804 MHz to 960 MHz • High Sensitivity – Up to –118 dBm for a 12.5 kHz Channel • Programmable Output Power • Low Current Consumption – RX: 19.9 mA • Low Supply Voltage – 2.3 V to 3.6 V • No External IF Filter Needed • Low-IF Receiver • Very Few External Components Required • Small Size – QFN 32 Package 1.2 • • • • • • Pb-Free Package Digital RSSI and Carrier Sense Indicator Data Rate up to 153.6 kBaud OOK, FSK, and GFSK Data Modulation Integrated Bit Synchronizer Image Rejection Mixer Programmable Frequency and AFC Make Crystal Temperature Drift Compensation Possible Without TCXO Suitable for Frequency Hopping Systems Suited for Systems Targeting Compliance With EN 300 220, FCC CFR47 Part 15, ARIB STD-T67, and ARIB STD-T96 Development Kit Available Easy-to-Use Software for Generating the CC1020 Configuration Data Applications Narrowband Low-Power UHF Wireless Data Transmitters and Receivers With Channel Spacing as Low as 12.5 and 25 kHz 402-, 424-, 426-, 429-, 433-, 447-, 449-, 469-, 868-, 915-, 960-MHz ISM/SRD Band Systems 1.3 • • • • • • • • • • • AMR – Automatic Meter Reading Wireless Alarm and Security Systems Home Automation Low Power Telemetry Description CC1020 is a true single-chip UHF transceiver designed for very low-power and very low-voltage wireless applications. The circuit is mainly intended for the ISM (Industrial, Scientific, and Medical) and SRD (Short Range Device) frequency bands at 402-, 424-, 426-, 429-, 433-, 447-, 449-, 469-, 868-, 915-, and 960MHz, but can easily be programmed for multichannel operation at other frequencies in the 402- to 470MHz and 804- to 960-MHz range. The CC1020 device is especially suited for narrow-band systems with channel spacing of 12.5 or 25 kHz complying with ARIB STD-T67 and EN 300 220. The main operating parameters of the CC1020 device can be programmed with a serial bus, thus making CC1020 a very flexible and easy-to-use transceiver. In a typical system, the CC1020 device will be used together with a microcontroller and a few external passive components. TI recommends using the latest RF performance line device CC1120 as successor of CC1020: www.ti.com/rfperformanceline Table 1-1. Device Information (1) (1) PART NUMBER PACKAGE BODY SIZE (NOM) CC1020 VQFNP (32) 7.00 mm × 7.00 mm For more information, see Section 8, Mechanical Packaging and Orderable Information. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 1.4 www.ti.com Functional Block Diagram Figure 1-1 shows the system block diagram of the CC1020 device. ADC LNA LNA 2 ADC Multiplexer 0 90 - Digital RSSI - Gain Control - Image Suppression - Channel Filtering - Demodulation :2 0 90 :2 FREQ SYNTH CONTROL LOGIC RF_IN DIGITAL DEMODULATOR DIGITAL INTERFACE TO mC PDO PDI PCLK Power Control PSEL DIGITAL MODULATOR Multiplexer RF_OUT - Modulation - Data shaping - Power Control PA BIAS PA_EN LNA_EN R_BIAS XOSC XOSC_Q1 XOSC_Q2 VC CHP_OUT Figure 1-1. Functional Block Diagram 2 Device Overview Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table of Contents 1 2 3 Device Overview ......................................... 1 5.7 Data Rate Programming ............................ 24 1.1 Features .............................................. 1 5.8 Frequency Programming ............................ 26 1.2 Applications ........................................... 1 5.9 Receiver ............................................. 27 1.3 Description ............................................ 1 5.10 Transmitter .......................................... 39 1.4 Functional Block Diagram ............................ 2 5.11 Input and Output Matching and Filtering ............ 42 Revision History ......................................... 4 Terminal Configuration and Functions .............. 5 5.12 Frequency Synthesizer .............................. 45 5.13 VCO and LNA Current Control ...................... 51 .......................................... 5 3.2 Pin Configuration ..................................... 5 Specifications ............................................ 7 4.1 Absolute Maximum Ratings .......................... 7 4.2 ESD Ratings .......................................... 7 4.3 Recommended Operating Conditions ................ 7 4.4 RF Transmit .......................................... 8 4.5 RF Receive ........................................... 9 4.6 RSSI / Carrier Sense ................................ 12 4.7 Intermediate Frequency (IF) ........................ 12 4.8 Crystal Oscillator .................................... 13 4.9 Frequency Synthesizer .............................. 14 4.10 Digital Inputs and Outputs .......................... 15 4.11 Current Consumption ............................... 16 5.14 Power Management ................................. 51 5.15 On-Off Keying (OOK) 5.16 Crystal Oscillator .................................... 55 5.17 Built-in Test Pattern Generator 5.18 Interrupt on Pin DCLK ............................... 56 5.19 PA_EN and LNA_EN Digital Output Pins ........... 57 5.20 System Considerations and Guidelines ............. 58 5.21 Antenna Considerations............................. 61 5.22 Configuration Registers 3.1 4 4.12 5 Pin Diagram 6 7 5.2 5.3 5.4 5.5 5.6 ............................................ Functional Block Diagram ........................... Configuration Overview ............................. Microcontroller Interface............................. 4-wire Serial Configuration Interface ................ Signal Interface ...................................... Overview ..................... ............................. 53 56 62 Applications, Implementation, and Layout........ 83 6.1 Application Information .............................. 83 6.2 Design Requirements 6.3 PCB Layout Recommendations ..................... 86 ............................... 85 Device and Documentation Support ............... 87 7.1 Device Support ...................................... 87 7.2 Documentation Support ............................. 87 7.3 Trademarks.......................................... 88 17 7.4 Electrostatic Discharge Caution ..................... 88 17 7.5 Export Control Notice 18 7.6 Glossary ............................................. 88 Thermal Resistance Characteristics for VQFNP Package ............................................. 16 Detailed Description ................................... 17 5.1 ............................... 19 8 ............................... 88 20 Mechanical Packaging and Orderable Information .............................................. 88 21 8.1 Packaging Information .............................. Table of Contents Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 88 3 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com 2 Revision History This data manual revision history highlights the changes made to the SWRS046F device-specific data manual to make it an SWRS046G revision. Changes from Revision F (January 2006) to Revision G • • • Converted document to new TI standards. ........................................................................................ 1 Added Thermal Resistance Characteristics for VQFNP Package. ........................................................... 16 Changed Register table format to new TI standards. .......................................................................... 62 Changes from January 19, 2015 to February 19, 2015 • 4 Page Page Updated RUZ package to RSS. ................................................................................................... 87 Revision History Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 3 Terminal Configuration and Functions 3.1 Pin Diagram Figure 3-1 shows pin names and locations for the CC1020 device. The CC1020 comes in a QFN 32-type package. AGND AD_REF AVDD AVDD CHP_OUT DGND PSEL DVDD 32 31 30 29 28 27 26 25 PCLK 1 24 VC PDI 2 23 AVDD PDO 3 22 AVDD DGND 4 21 RF_OUT DVDD 5 20 AVDD DGND 6 19 RF_IN DCLK 7 18 AVDD DIO 8 17 R_BIAS 9 10 11 12 13 14 15 16 AVDD PA_EN AVDD LNA_EN AVDD XOSC_Q1 XOSC_Q2 LOCK AGND Exposed die attached pad Figure 3-1. Package 7-mm × 7-mm VQFNP (Top View) 3.2 Pin Configuration Table 3-1 provides an overview of the CC1020 pinout. Table 3-1. Pin Attributes (1) (2) PIN NO. (1) (2) PIN NAME TYPE DESCRIPTION Exposed die attached pad. Must be soldered to a solid ground plane as this is the ground connection for all analog modules. See Section 6.3 for more details. — AGND Ground (analog) 1 PCLK Digital input Programming clock for SPI configuration interface Programming data input for SPI configuration interface 2 PDI Digital input 3 PDO Digital output 4 DGND Ground (digital) Ground connection (0 V) for digital modules and digital I/O 5 DVDD Power (digital) Power supply (3 V typical) for digital modules and digital I/O 6 DGND Ground (digital) Ground connection (0 V) for digital modules (substrate) 7 DCLK Digital output 8 DIO Digital input/output 9 LOCK Digital output PLL Lock indicator, active low. Output is asserted (low) when PLL is in lock. The pin can also be used as a general digital output, or as receive data output in synchronous NRZ/Manchester mode 10 XOSC_Q1 Analog input Crystal oscillator or external clock input 11 XOSC_Q2 Analog output 12 AVDD Power (analog) Power supply (3 V typical) for crystal oscillator 13 AVDD Power (analog) Power supply (3 V typical) for the IF VGA 14 LNA_EN Digital output Programming data output for SPI configuration interface Clock for data in both receive and transmit mode. Can be used as receive data output in asynchronous mode Data input in transmit mode; data output in receive mode. Can also be used to start power-up sequencing in receive Crystal oscillator General digital output. Can be used for controlling an external LNA if higher sensitivity is needed. DCLK, DIO and LOCK are high-impedance (3-state) in power down (BIAS_PD = 1 in the MAIN register). The exposed die attached pad must be soldered to a solid ground plane as this is the main ground connection for the chip. Terminal Configuration and Functions Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 5 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 3-1. Pin Attributes(1)(2) (continued) PIN NO. TYPE DESCRIPTION PA_EN Digital output General digital output. Can be used for controlling an external PA if higher output power is needed. 16 AVDD Power (analog) Power supply (3 V typical) for global bias generator and IF anti-alias filter 17 R_BIAS Analog output 18 AVDD Power (analog) 19 RF_IN RF Input 20 AVDD Power (analog) 21 RF_OUT RF output 22 AVDD Power (analog) Power supply (3 V typical) for LO buffers, mixers, prescaler, and first PA stage 23 AVDD Power (analog) Power supply (3 V typical) for VCO 15 6 PIN NAME Connection for external precision bias resistor (82 kΩ, ±1%) Power supply (3 V typical) for LNA input stage RF signal input from antenna (external AC-coupling) Power supply (3 V typical) for LNA RF signal output to antenna 24 VC Analog input 25 AGND Ground (analog) VCO control voltage input from external loop filter Ground connection (0 V) for analog modules (guard) 26 AD_REF Power (analog) 3 V reference input for ADC 27 AVDD Power (analog) Power supply (3 V typical) for charge pump and phase detector 28 CHP_OUT Analog output 29 AVDD Power (analog) Power supply (3 V typical) for ADC 30 DGND Ground (digital) Ground connection (0 V) for digital modules (guard) 31 DVDD Power (digital) Power supply connection (3 V typical) for digital modules 32 PSEL Digital input PLL charge pump output to external loop filter Programming chip select, active low, for configuration interface. Internal pullup resistor. Terminal Configuration and Functions Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 4 Specifications Absolute Maximum Ratings (1) 4.1 PARAMETER MIN MAX UNIT Supply voltage, VDD –0.3 5.0 V Voltage on any pin –0.3 VDD + 0.3, max 5.0 V Input RF level 10 dBm Package body temperature 260 °C Humidity non-condensing 5% 85% Storage temperature range, Tstg –50 150 (1) (2) CONDITION All supply pins must have the same voltage Norm: IPC/JEDEC J-STD-020 (2) °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under general characteristics is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD_020 “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices”. 4.2 ESD Ratings VESD Electrostatic discharge (ESD) performance: VALUE UNIT All pads except RF Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001 (1) (2) RF Pads Charged-device Model (CDM) (1) (2) 4.3 ±1 kV ±0.4 kV 250 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. According to JEDEC STD 22, method A114, Human Body Model Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN RF Frequency Range Operating ambient temperature range Supply voltage MAX UNIT CONDITION 402 470 MHz Programmable in < 300 Hz steps 804 960 MHz Programmable in < 600 Hz steps –40 85 °C 2.3 TYP 3.0 3.6 V The same supply voltage should be used for digital (DVDD) and analog (AVDD) power. A 3.0 ±0.1 V supply is recommended to meet the ARIB STD-T67 selectivity and output power tolerance requirements. Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 7 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 4.4 www.ti.com RF Transmit All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. PARAMETER Transmit data rate Binary FSK frequency separation Output power Output power tolerance Harmonics, radiated CW Adjacent channel power (GFSK) Occupied bandwidth (99.5%,GFSK) Modulation bandwidth, 868 MHz 8 MIN TYP MAX UNIT CONDITION The data rate is programmable. See Section 5.7 for details. NRZ or Manchester encoding can be used. 153.6 kBaud equals 153.6 kbps using NRZ coding and 76.8 kbps using Manchester coding. See Section 5.4.2 for details. Minimum data rate for OOK is 2.4 kBaud 0.45 153.6 kBaud in 402 to 470 MHz range 0 108 kHz in 804 to 960 MHz range 0 216 kHz 433 MHz –20 to +10 dBm 868 MHz –20 to +5 dBm At 2.3 V, +85°C –4 dB At 3.6 V, –40°C 3 dB 2nd harmonic, 433 MHz, +10 dBm –50 dBc 3rd harmonic, 433 MHz, +10 dBm –50 dBc 2nd harmonic, 868 MHz, +5 dBm –50 dBc 3rd harmonic, 868 MHz, +5 dBm –50 dBc 12.5 kHz channel spacing, 433 MHz –46 dBc 25 kHz channel spacing, 433 MHz –52 dBc 25 kHz channel spacing, 868 MHz –49 dBc 12.5 kHz channel spacing, 433 MHz 7.5 kHz 25 kHz channel spacing, 433 MHz 9.6 kHz 25 kHz channel spacing, 868 MHz 9.6 kHz 19.2 kBaud, ±9.9 kHz frequency deviation 48 kHz 38.4 kBaud, ±19.8 kHz frequency deviation 106 kHz Specifications 108/216 kHz is the maximum specified separation at 1.84 MHz reference frequency. Larger separations can be achieved at higher reference frequencies. Delivered to 50 Ω single-ended load. The output power is programmable and should not be programmed to exceed +10/+5 dBm at 433/868 MHz under any operating conditions (refer to CC1020 Errata Note 003 in the CC1020 product folder). See Section 5.11 for details. At maximum output power Harmonics are measured as EIRP values according to EN 300 220. The antenna (SMAFF-433 and SMAFF-868 from R.W. Badland) plays a part in attenuating the harmonics. For 12.5 kHz channel spacing ACP is measured in a ±4.25 kHz bandwidth at ±12.5 kHz offset. Modulation: 2.4 kBaud NRZ PN9 sequence, ±2.025 kHz frequency deviation. For 25 kHz channel spacing ACP is measured in a ±8.5 kHz bandwidth at ±25 kHz offset. Modulation: 4.8 kBaud NRZ PN9 sequence, ±2.475 kHz frequency deviation. Bandwidth for 99.5% of total average power. Modulation for 12.5 channel spacing: 2.4 kBaud NRZ PN9 sequence, ±2.025 kHz frequency deviation. Modulation for 25 kHz channel spacing: 4.8 kBaud NRZ PN9 sequence, ±2.475 kHz frequency deviation. Bandwidth where the power envelope of modulation equals –36 dBm. Spectrum analyzer RBW = 1 kHz. Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 RF Transmit (continued) All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. PARAMETER MIN TYP MAX UNIT 47 to 74, 87.5 to 118, 174 to 230, 470 to 862 MHz –54 dBm 9 kHz to 1 GHz –36 dBm 1 to 4 GHz –30 dBm Spurious emission, radiated CW Optimum load impedance 4.5 433 MHz 54 + j44 Ω 868 MHz 15 + j24 Ω 915 MHz 20 + j35 Ω CONDITION At maximum output power, +10/+5 dBm at 433/868 MHz. To comply with EN 300 220, FCC CFR47 part 15 and ARIB STD-T96 an external (antenna) filter, as implemented in the application circuit in Section 5.11, must be used and tailored to each individual design to reduce out-of-band spurious emission levels. Spurious emissions can be measured as EIRP values according to EN 300 220. The antenna (SMAFF-433 and SMAFF868 from R.W. Badland) plays a part in attenuating the spurious emissions. If the output power is increased using an external PA, a filter must be used to attenuate spurs below 862 MHz when operating in the 868 MHz frequency band in Europe. Application Note AN036 CC1020/1021 Reducing Spurious Emission (SWRA057) presents and discusses a solution that reduces the TX mode spurious emission close to 862 MHz by increasing the REF_DIV from 1 to 7. Transmit mode. For matching details see Section 5.11. RF Receive All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. PARAMETER MIN TYP MAX UNIT CONDITION 12.5 kHz channel spacing, optimized selectivity, ±2.025 kHz freq. deviation –114 dBm 12.5 kHz channel spacing, optimized sensitivity, ±2.025 kHz freq. deviation –118 dBm 25 kHz channel spacing –112 dBm 500 kHz channel spacing –96 dBm 12.5 kHz channel spacing, ±2.475 kHz freq. deviation –116 dBm 25 kHz channel spacing –111 dBm 500 kHz channel spacing –94 dBm Receiver sensitivity, 433 MHz, OOK 2.4 kBaud –116 153.6 kBaud –81 Receiver sensitivity, 868 MHz, OOK 4.8 kBaud –107 153.6 kBaud –87 dBm Sensitivity is measured with PN9 −3 dBm sequence at BER = 10 Manchester coded data. dBm See Table 5-14 for typical sensitivity dBm figures at other data rates. FSK and OOK 10 Receiver sensitivity, 433 MHz, FSK Receiver sensitivity, 868 MHz, FSK Saturation (maximum input level) System noise bandwidth 9.6 to 307.2 Sensitivity is measured with PN9 sequence at BER = 10−3 12.5 kHz channel spacing: 2.4 kBaud, Manchester coded data. 25 kHz channel spacing: 4.8 kBaud, NRZ coded data, ±2.475 kHz frequency deviation. 500 kHz channel spacing: 153.6 kBaud, NRZ coded data, ±72 kHz frequency deviation. See Table 5-6 and Table 5-7 for typical sensitivity figures at other data rates. FSK: Manchester/NRZ coded data dBm OOK: Manchester coded data BER = 10−3 kHz The receiver channel filter 6 dB bandwidth is programmable from 9.6 kHz to 307.2 kHz. See Section 5.9.2. Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 9 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com RF Receive (continued) All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. PARAMETER Noise figure, cascaded MIN 433 and 868 MHz 7 433 MHz, 102.4 kHz channel filter BW Input IP3 (1) 868 MHz, 102.4 kHz channel filter BW Co-channel rejection, FSK and OOK Adjacent channel rejection (ACR) Image channel rejection TYP MAX UNIT dB dBm LNA2 maximum gain –18 dBm LNA2 medium gain –16 dBm LNA2 minimum gain –18 dBm LNA2 maximum gain –15 dBm LNA2 medium gain –13 dBm LNA2 minimum gain –11 dB 25 kHz channel spacing, 433 MHz –11 dB 25 kHz channel spacing, 868 MHz –11 dB 12.5 kHz channel spacing, 433 MHz 32 dB 25 kHz channel spacing, 433 MHz 37 dB 25 kHz channel spacing, 868 MHz 32 dB No I/Q gain and phase calibration 26/31 dB I/Q gain and phase calibrated 49/52 dB 12.5 kHz channel spacing, 433 MHz 41 dB 25 kHz channel spacing, 433 MHz 41 dB 25 kHz channel spacing, 868 MHz 39 dB ±1 MHz 50/57 dB ±2 MHz 64/71 dB ±5 MHz 64/71 dB ±10 MHz 75/78 dB No I/Q gain and phase calibration 36/41 dB I/Q gain and phase calibrated 59/62 dB Selectivity (2) Blocking / Desensitization (3) Image frequency suppression 433/868 MHz 433/868 MHz Spurious rejection (1) (2) (3) 10 NRZ coded data –23 12.5 kHz channel spacing, 433 MHz 433/868 MHz CONDITION 40 dB Wanted signal 3 dB above the sensitivity level, FM jammer (1 kHz sine, ±2.5 kHz deviation) at operating frequency, BER = 10–3. Wanted signal 3 dB above the sensitivity level, FM jammer (1 kHz sine, ±2.5 kHz deviation) at adjacent channel. BER = 10–3. Wanted signal 3 dB above the sensitivity level, CW jammer at image frequency, BER = 10−3. Image rejection after calibration will depend on temperature and supply voltage. Refer to Section 5.9.6. Wanted signal 3 dB above the sensitivity level. CW jammer is swept in 12.5 kHz/25 kHz steps to within ±1 MHz from wanted channel. BER = 10–3. Adjacent channel and image channel are excluded. Wanted signal 3 dB above the sensitivity level, CW jammer at ±1, 2, 5 and 10 MHz offset. BER = 10–3. 12.5 kHz/25 kHz channel spacing at 433/868 MHz. Complying with EN 300 220, class 2 receiver requirements. Ratio between sensitivity for a signal at the image frequency to the sensitivity in the wanted channel. Image frequency is RF- 2 IF. The signal source is a 2.4 kBaud, Manchester coded data, ±2.025 kHz frequency deviation, signal level for BER = 10–3. Ratio between sensitivity for an unwanted frequency to the sensitivity in the wanted channel. The signal source is swept over all frequencies 100 MHz to 2 GHz. Signal level for BER = 10−3. 102.4 kHz channel filter bandwidth. Two tone test (+10 MHz and +20 MHz) Close-in spurious response rejection. Out-of-band spurious response rejection. Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 RF Receive (continued) All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. PARAMETER Intermodulation rejection (1) MIN TYP MAX UNIT 12.5 kHz channel spacing, 433 MHz 30 dB 25 kHz channel spacing, 868 MHz 30 dB 12.5 kHz channel spacing, 433 MHz 56 dB Intermodulation rejection (2) 25 kHz channel spacing, 868 MHz 55 dB LO leakage 433/868 MHz < –80/–66 dBm –64 dBm VCO leakage Spurious emission, radiated CW Input impedance Matched input impedance, S11 Matched input impedance 9 kHz to 1 GHz < –60 1 to 4 GHz < –60 Data latency 58 – j10 Ω 868 MHz 54 – j22 Ω 433 MHz –14 dB 868 MHz –12 dB 433 MHz 39 – j14 Ω 868 MHz 32 – j10 Ω 8000 NRZ mode 4 Manchester mode 8 Wanted signal 3 dB above the sensitivity level, two CW jammers at +2Ch and +4Ch where Ch is channel spacing 12.5 kHz or 25 kHz. BER = 10–2. Wanted signal 3 dB above the sensitivity level, two CW jammers at +10 MHz and +20 MHz offset. BER = 10–2. VCO frequency resides between 1608 and 1880 MHz. dBm Complying with EN 300 220, FCC CFR47 part 15 and ARIB STD-T96. Spurious emissions can be dBm measured as EIRP values according to EN 300 220. 433 MHz Bit synchronization offset CONDITION Receive mode. See Section 5.11 for details. Using application circuit matching network. See Section 5.11 for details. Using application circuit matching network. See Section 5.11 for details. The maximum bit rate offset tolerated by the bit synchronization ppm circuit for 6 dB degradation (synchronous modes only). Baud Time from clocking the data on the transmitter DIO pin until data is Baud available on receiver DIO pin. Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 11 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 4.6 www.ti.com RSSI / Carrier Sense All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. TYP UNIT RSSI dynamic range PARAMETER 55 dB 12.5 and 25 kHz channel spacing RSSI accuracy ±3 dB See Section 5.9.5 for details. RSSI linearity ±1 dB 2.4 kBaud, 12.5 kHz channel spacing 3.8 ms 4.8 kBaud, 25 kHz channel spacing 1.9 ms 153.6 kBaud, 500 kHz channel spacing 140 µs RSSI attach time Carrier sense programmable range Adjacent channel carrier sense 40 dB 12.5 kHz channel spacing –72 dBm 25 kHz channel spacing –72 dBm –70 dBm Spurious carrier sense 4.7 CONDITION Shorter RSSI attach times can be traded for lower RSSI accuracy. See Section 5.9.5 for details. Shorter RSSI attach times can also be traded for reduced sensitivity and selectivity by increasing the receiver channel filter bandwidth. Accuracy is as for RSSI At carrier sense level –110 dBm, FM jammer (1 kHz sine, ±2.5 kHz deviation) at adjacent channel. Adjacent channel carrier sense is measured by applying a signal on the adjacent channel and observe at which level carrier sense is indicated. At carrier sense level –110 dBm, 100 MHz to 2 GHz. Adjacent channel and image channel are excluded. Intermediate Frequency (IF) All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. PARAMETER Intermediate frequency (IF) Digital channel filter bandwidth AFC resolution 12 TYP UNIT 307.2 kHz See Section 5.9.1 for details. 9.6 to 307.2 kHz The channel filter 6 dB bandwidth is programmable from 9.6 kHz to 307.2 kHz. See Section 5.9.2 for details. 150 Hz At 2.4 kBaud Given as Baud rate / 16. See Section 5.9.3 for details. Specifications CONDITION Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com 4.8 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Crystal Oscillator All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. PARAMETER Crystal Oscillator Frequency MIN 4.9152 Reference frequency accuracy requirement (1) (2) Crystal operation Crystal load capacitance Crystal oscillator start-up time UNIT CONDITION MHz Recommended frequency is 14.7456 MHz. See Section 5.16 for details. ±5.7 ppm 433 MHz (EN 300 220) ±2.8 ppm 868 MHz (EN 300 220) Must be less than ±5.7 / ±2.8 ppm to comply with EN 300 220 25 kHz channel spacing at 433/868 MHz. ±4 ppm Must be less than ±4 ppm to comply with Japanese 12.5 kHz channel spacing regulations (ARIB STD-T67). 14.7456 19.6608 C4 and C5 are loading capacitors. See Section 5.16 for details. 4.9 to 6 MHz, 22 pF recommended 12 22 30 pF 6 to 8 MHz, 16 pF recommended 12 16 30 pF 8 to 19.6 MHz, 16 pF recommended 12 16 16 pF 4.9152 MHz, 12 pF load 1.55 ms 7.3728 MHz, 12 pF load 1.0 ms 9.8304 MHz, 12 pF load 0.90 ms 14.7456 MHz, 16 pF load 0.95 ms 17.2032 MHz, 12 pF load 0.60 ms 19.6608 MHz, 12 pF load 0.63 ms External clock signal drive, full-swing digital external clock (2) MAX Parallel External clock signal drive, sine wave (1) TYP 300 0 – VDD mVpp The external clock signal must be connected to XOSC_Q1 using a DC block (10 nF). Set XOSC_BYPASS = 0 in the INTERFACE register when using an external clock signal with low amplitude or a crystal. V The external clock signal must be connected to XOSC_Q1. No DC block shall be used. Set XOSC_BYPASS = 1 in the INTERFACE register when using a full-swing digital external clock. The reference frequency accuracy (initial tolerance) and drift (aging and temperature dependency) will determine the frequency accuracy of the transmitted signal. Crystal oscillator temperature compensation can be done using the fine step PLL frequency programmability and the AFC feature. See Section 5.9.13 for details. Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 13 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 4.9 www.ti.com Frequency Synthesizer All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. Phase noise, 402 to 470 MHz 12.5 kHz channel spacing Phase noise, 804 to 960 MHz 25 kHz channel spacing PLL loop bandwidth PLL lock time (RX / TX turn time) PLL turn-on time. From power down mode with crystal oscillator running. 14 PARAMETER TYP UNIT At 12.5 kHz offset from carrier –90 dBc/Hz At 25 kHz offset from carrier –100 dBc/Hz At 50 kHz offset from carrier –105 dBc/Hz At 100 kHz offset from carrier –110 dBc/Hz At 1 MHz offset from carrier –114 dBc/Hz At 12.5 kHz offset from carrier –85 dBc/Hz At 25 kHz offset from carrier –95 dBc/Hz At 50 kHz offset from carrier –101 dBc/Hz At 100 kHz offset from carrier –109 dBc/Hz At 1 MHz offset from carrier –118 dBc/Hz 12.5 kHz channel spacing, 433 MHz 2.7 kHz 25 kHz channel spacing, 868 MHz 8.3 kHz 12.5 kHz channel spacing, 433 MHz 900 µs 25 kHz channel spacing, 868 MHz 640 µs 500 kHz channel spacing 14 µs 12.5 kHz channel spacing, 433 MHz 3.2 ms 25 kHz channel spacing, 868 MHz 2.5 ms 500 kHz channel spacing 700 µs Specifications CONDITION Unmodulated carrier. Measured using loop filter components given in Table 6-2. The phase noise will be higher for larger PLL loop filter bandwidth. Unmodulated carrier. Measured using loop filter components given in Table 6-2. The phase noise will be higher for larger PLL loop filter bandwidth. After PLL and VCO calibration. The PLL loop bandwidth is programmable. 307.2 kHz frequency step to RF frequency within ±10% of channel spacing. Depends on loop filter component values and PLL_BW register setting. See Table 5-13 for more details. Time from writing to registers to RF frequency within ±10% of channel spacing. Depends on loop filter component values and PLL_BW register setting. See Table 5-12 for more details. Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 4.10 Digital Inputs and Outputs All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. MAX UNIT Logic "0" input voltage PARAMETER MIN 0 TYP 0.3 × VDD V CONDITION Logic "1" input voltage 0.7 × VDD VDD V Logic "0" output voltage 0 0.4 V Output current –2.0 mA, 3.0-V supply voltage Logic "1" output voltage 2.5 VDD V Output current 2.0 mA, 3.0-V supply voltage Input signal equals GND. PSEL has an internal pullup resistor and during configuration the current will be –350 µA. Logic “0” input current N/A –1 µA Logic “1” input current N/A 1 µA Input signal equals VDD ns TX mode, minimum time DIO must be ready before the positive edge of DCLK. Data should be set up on the negative edge of DCLK. ns TX mode, minimum time DIO must be held after the positive edge of DCLK. Data should be set up on the negative edge of DCLK. DIO setup time 20 DIO hold time 10 Serial interface (PCLK, PDI, PDO and PSEL) timing specification Source current Pin drive, LNA_EN, PA_EN Sink current See Table 5-1 for more details 0 V on LNA_EN, PA_EN pins 0.90 mA 0.5 V on LNA_EN, PA_EN pins 0.87 mA 1.0 V on LNA_EN, PA_EN pins 0.81 mA 1.5 V on LNA_EN, PA_EN pins 0.69 mA 3.0 V on LNA_EN, PA_EN pins 0.93 mA 2.5 V on LNA_EN, PA_EN pins 0.92 mA 2.0 V on LNA_EN, PA_EN pins 0.89 mA 1.5 V on LNA_EN, PA_EN pins 0.79 mA See Figure 5-32 for more details. Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 15 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com 4.11 Current Consumption All measurements were performed using the two-layer PCB CC1020EMX reference design. See Figure 6-1. The electrical specifications given for 868 MHz are also applicable for 902 to 928 MHz. TA = 25°C, AVDD = DVDD = 3.0 V, fC = 14.7456 MHz if nothing else stated. TYP MAX UNIT Power Down mode PARAMETER 0.2 1.8 µA Current Consumption, receive mode 433 and 868 MHz 19.9 mA P = –20 dBm 12.3/14.5 mA P = –5 dBm 14.4/17.0 mA P = 0 dBm 16.2/20.5 mA P = +5 dBm 20.5/25.1 mA 27.1 mA Current Consumption, crystal oscillator 77 µA 14.7456 MHz, 16 pF load crystal Current Consumption, crystal oscillator and bias 500 µA 14.7456 MHz, 16 pF load crystal Current Consumption, crystal oscillator, bias and synthesizer 7.5 mA 14.7456 MHz, 16 pF load crystal Current Consumption, transmit mode 433/868 MHz: MIN P = +10 dBm (433 MHz only) CONDITION Oscillator core off The output power is delivered to a 50 Ω singleended load. See Section 5.10.2 for more details. 4.12 Thermal Resistance Characteristics for VQFNP Package °C/W (1) NAME DESCRIPTION RθJC(top) Junction-to-case (top) RθJB Junction-to-board 6.9 RθJA Junction-to-free air 30.7 PsiJT Junction-to-package top 0.2 PsiJB Junction-to-board 6.9 RθJC(bottom) Junction-to-case (bottom) 1.0 (1) (2) 16 (2) 16.2 °C/W = degrees Celsius per watt. These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. Specifications Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5 Detailed Description 5.1 Overview A simplified block diagram of CC1020 is shown in Figure 5-1. Only signal pins are shown. CC1020 features a low-IF receiver. The received RF signal is amplified by the low-noise amplifier (LNA and LNA2) and down-converted in quadrature (I and Q) to the intermediate frequency (IF). At IF, the I/Q signal is complex filtered and amplified, and then digitized by the ADCs. Automatic gain control, fine channel filtering, demodulation and bit synchronization is performed digitally. CC1020 outputs the digital demodulated data on the DIO pin. A synchronized data clock is available at the DCLK pin. RSSI is available in digital format and can be read via the serial interface. The RSSI also features a programmable carrier sense indicator. In transmit mode, the synthesized RF frequency is fed directly to the power amplifier (PA). The RF output is frequency shift keyed (FSK) by the digital bit stream that is fed to the DIO pin. Optionally, a Gaussian filter can be used to obtain Gaussian FSK (GFSK). The frequency synthesizer includes a completely on-chip LC VCO and a 90 degrees phase splitter for generating the LO_I and LO_Q signals to the down-conversion mixers in receive mode. The VCO operates in the frequency range 1.608 to 1.880 GHz. The CHP_OUT pin is the charge pump output and VC is the control node of the on-chip VCO. The external loop filter is placed between these pins. A crystal is to be connected between XOSC_Q1 and XOSC_Q2. A lock signal is available from the PLL. The 4-wire SPI serial interface is used for configuration. Functional Block Diagram ADC RF_IN LNA LNA 2 ADC Multiplexer 0 90 DIGITAL DEMODULATOR - Digital RSSI - Gain Control - Image Suppression - Channel Filtering - Demodulation :2 0 90 :2 FREQ SYNTH CONTROL LOGIC 5.2 DIGITAL INTERFACE TO mC PDO PDI PCLK Power Control PSEL DIGITAL MODULATOR Multiplexer RF_OUT - Modulation - Data shaping - Power Control PA BIAS PA_EN LNA_EN R_BIAS XOSC XOSC_Q1 XOSC_Q2 VC CHP_OUT Figure 5-1. CC1020 Simplified Block Diagram Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 17 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.3 www.ti.com Configuration Overview CC1020 can be configured to achieve optimum performance for different applications. Through the programmable configuration registers the following key parameters can be programmed: • Receive and transmit mode • RF output power • Frequency synthesizer key parameters: – RF output frequency – FSK frequency separation – Crystal oscillator reference frequency • Power-down and power-up mode • Power-down and power-up mode • Data rate and data format (NRZ, Manchester coded or UART interface) • Synthesizer lock indicator mode • Digital RSSI and carrier sense • FSK, GFSK, and OOK modulation 5.3.1 Configuration Software TI provides users of CC1020 with a software program, SmartRF Studio (Windows interface) that generates all necessary CC1020 configuration data based on the user’s selections of various parameters. These hexadecimal numbers will then be the necessary input to the microcontroller for the configuration of CC1020. In addition, the program will provide the user with the component values needed for the input/output matching circuit, the PLL loop filter and the LC filter. Figure 5-2 shows the user interface of the CC1020 configuration software. Figure 5-2. SmartRF™ Studio user interface 18 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com 5.4 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Microcontroller Interface Used in a typical system, CC1020 will interface to a microcontroller. This microcontroller must be able to: • Program CC1020 into different modes via the 4-wire serial configuration interface (PDI, PDO, PCLK and PSEL). • Interface to the bi-directional synchronous data signal interface (DIO and DCLK). • Optionally, the microcontroller can do data encoding and decoding. • Optionally, the microcontroller can monitor the LOCK pin for frequency lock status, carrier sense status or other status information. • Optionally, the microcontroller can read back the digital RSSI value and other status information via the 4-wire serial interface. 5.4.1 Configuration Interface The microcontroller interface is shown in Figure 5-3. The microcontroller uses 3 or 4 I/O pins for the configuration interface (PDI, PDO, PCLK and PSEL). PDO should be connected to a microcontroller input. PDI, PCLK and PSEL must be microcontroller outputs. One I/O pin can be saved if PDI and PDO are connected together and a bi-directional pin is used at the microcontroller. The microcontroller pins connected to PDI, PDO and PCLK can be used for other purposes when the configuration interface is not used. PDI, PDO and PCLK are high impedance inputs as long as PSEL is not activated (active low). PSEL has an internal pullup resistor and should be left open (tri-stated by the microcontroller) or set to a high level during power down mode in order to prevent a trickle current flowing in the pullup. 5.4.2 Signal Interface A bi-directional pin is usually used for data (DIO) to be transmitted and data received. DCLK providing the data timing should As an option, the data output in receive mode can be made available on a separate pin. See Section 5.6 for further details. 5.4.3 PLL Lock Signal Optionally, one microcontroller pin can be used to monitor the LOCK signal. This signal is at low logic level when the PLL is in lock. It can also be used for carrier sense and to monitor other internal test signals. Figure 5-3. Microcontroller Interface Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 19 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.5 www.ti.com 4-wire Serial Configuration Interface CC1020 is configured via a simple 4-wire SPI-compatible interface (PDI, PDO, PCLK and PSEL) where CC1020 is the slave. There are 8-bit configuration registers, each addressed by a 7-bit address. A Read/Write bit initiates a read or write operation. A full configuration of CC1020 requires sending 33 data frames of 16 bits each (7 address bits, R/W bit and 8 data bits). The time needed for a full configuration depends on the PCLK frequency. With a PCLK frequency of 10 MHz the full configuration is done in less than 53 ms. Setting the device in power down mode requires sending one frame only and will in this case take less than 2 ms. All registers are also readable. During each write-cycle, 16 bits are sent on the PDI-line. The seven most significant bits of each data frame (A6:0) are the address-bits. A6 is the MSB (Most Significant Bit) of the address and is sent as the first bit. The next bit is the R/W bit (high for write, low for read). The 8 data-bits are then transferred (D7:0). During address and data transfer the PSEL (Program Select) must be kept low. See Figure 5-4. The timing for the programming is also shown in Figure 5-4 with reference to Table 5-1. The clocking of the data on PDI is done on the positive edge of PCLK. Data should be set up on the negative edge of PCLK by the microcontroller. When the last bit, D0, of the 8 data-bits has been loaded, the data word is loaded into the internal configuration register. The configuration data will be retained during a programmed power down mode, but not when the power supply is turned off. The registers can be programmed in any order. The configuration registers can also be read by the microcontroller via the same configuration interface. The seven address bits are sent first, then the R/W bit set low to initiate the data read-back. CC1020 then returns the data from the addressed register. PDO is used as the data output and must be configured as an input by the microcontroller. The PDO is set at the negative edge of PCLK and should be sampled at the positive edge. The read operation is illustrated in Figure 5-5. PSEL must be set high between each read/write operation. THS TSS TCL,min TCH,min TSD THD PCLK Address PDI 6 5 4 Data byte Write mode 3 2 1 0 W 7 6 5 4 3 2 1 0 PDO PSEL Figure 5-4. Configuration Registers Write Operation 20 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 THS TSS TCH,min TCL,min PCLK Address PDI 6 5 4 Read mode 3 2 1 0 R Data byte PDO 7 PSEL 5 6 4 3 2 1 0 TSH Figure 5-5. Configuration Registers Read Operation Table 5-1. Serial Interface, Timing Specification (1) PARAMETER (1) 5.6 MIN MAX UNIT 10 MHz CONDITION FPCLK PCLK, clock frequency TCL,min PCLK low pulse duration 50 ns The minimum time PCLK must be low. TCH,min PCLK high pulse duration 50 ns The minimum time PCLK must be high. TSS PSEL setup time 25 ns The minimum time PSEL must be low before positive edge of PCLK. THS PSEL hold time 25 ns The minimum time PSEL must be held low after the negative edge of PCLK. TSH PSEL high time 50 ns The minimum time PSEL must be high. TSD PDI setup time 25 ns The minimum time data on PDI must be ready before the positive edge of PCLK. THD PDI hold time 25 ns The minimum time data must be held at PDI, after the positive edge of PCLK. Trise Rise time 100 ns The maximum rise time for PCLK and PSEL Tfall Fall time 100 ns The maximum fall time for PCLK and PSEL The setup and hold times refer to 50% of VDD. The rise and fall times refer to 10% / 90% of VDD. The maximum load that this table is valid for is 20 pF. Signal Interface The CC1020 can be used with NRZ (Non-Return-to-Zero) data or Manchester (also known as bi-phaselevel) encoded data. CC1020 can also synchronize the data from the demodulator and provide the data clock at DCLK. The data format is controlled by the DATA_FORMAT[1:0] bits in the MODEM register. CC1020 can be configured for three different data formats: Synchronous NRZ mode, Transparent Asynchronous UART mode, and Synchronous Manchester encoded mode. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 21 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.6.1 www.ti.com Synchronous NRZ Mode In transmit mode CC1020 provides the data clock at DCLK and DIO is used as data input. Data is clocked into CC1020 at the rising edge of DCLK. The data is modulated at RF without encoding. In receive mode CC1020 performs the synchronization and provides received data clock at DCLK and data at DIO. The data should be clocked into the interfacing circuit at the rising edge of DCLK. See Figure 5-6. 5.6.2 Transparent Asynchronous UART Mode In transmit mode DIO is used as data input. The data is modulated at RF without synchronization or encoding. In receive mode the raw data signal from the demodulator is sent to the output (DIO). No synchronization or decoding of the signal is done in CC1020 and should be done by the interfacing circuit. If SEP_DI_DO = 0 in the INTERFACE register, the DIO pin is the data output in receive mode and data input in transmit mode. The DCLK pin is not active and can be set to a high or low level by DATA_FORMAT[0]. If SEP_DI_DO = 1 in the INTERFACE register, the DCLK pin is the data output in receive mode and the DIO pin is the data input in transmit mode. In TX mode the DCLK pin is not active and can be set to a high or low level by DATA_FORMAT[0]. See Figure 5-7. 5.6.3 Synchronous Manchester Encoded Mode In transmit mode CC1020 provides the data clock at DCLK and DIO is used as data input. Data is clocked into CC1020 at the rising edge of DCLK and should be in NRZ format. The data is modulated at RF with Manchester code. The encoding is done by CC1020. In this mode the effective bit rate is half the baud rate due to the coding. As an example, 4.8 kBaud Manchester encoded data corresponds to 2.4 kbps. In receive mode CC1020 performs the synchronization and provides received data clock at DCLK and data at DIO. CC1020 performs the decoding and NRZ data is presented at DIO. The data should be clocked into the interfacing circuit at the rising edge of DCLK. See Figure 5-7. In synchronous NRZ or Manchester mode the DCLK signal runs continuously both in RX and TX unless the DCLK signal is gated with the carrier sense signal or the PLL lock signal. Refer to Section 5.18 and Section 5.18.2 for more details. If SEP_DI_DO = 0 in the INTERFACE register, the DIO pin is the data output in receive mode and data input in transmit mode. As an option, the data output can be made available at a separate pin. This is done by setting SEP_DI_DO = 1 in the INTERFACE register. Then, the LOCK pin will be used as data output in synchronous mode, overriding other use of the LOCK pin. 5.6.3.1 Manchester Encoding and Decoding In the Synchronous Manchester encoded mode CC1020 uses Manchester coding when modulating the data. The CC1020 also performs the data decoding and synchronization. The Manchester code is based on transitions; a “0” is encoded as a low-to-high transition, a “1” is encoded as a high-to-low transition. See Figure 5-9. The Manchester code ensures that the signal has a constant DC component, which is necessary in some FSK demodulators. Using this mode also ensures compatibility with CC400/CC900 designs. 22 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Transmitter side: DCLK Clock provided by CC1020 DIO Data provided by microcontroller “RF” FSK modulating signal (NRZ), internal in CC1020 Receiver side: “RF” Demodulated signal (NRZ), internal in CC1020 DCLK Clock provided by CC1020 DIO Data provided by CC1020 Figure 5-6. Synchronous NRZ Mode (SEP_DI_DO = 0) Transmitter side: DCLK Clock provided by CC1020 DIO Data provided by microcontroller “RF” FSK modulating signal (Manchester encoded), internal in CC1020 Receiver side: “RF” Demodulated signal (Manchester encoded), internal in CC1020 DCLK Clock provided by CC1020 DIO Data provided by CC1020 Figure 5-7. Synchronous Manchester Encoded Mode (SEP_DI_DO = 0) Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 23 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Transmitter side: DCLK is not used in transmit mode, and is used as data output in receive mode. It can be set to default high or low in transmit mode. DCLK DIO Data provided by UART (TXD) “RF” FSK modulating signal, internal in CC1020 Receiver side: “RF” Demodulated signal (NRZ), internal in CC1020 DCLK DCLK is used as data output provided by CC1020. Connect to UART (RXD) DIO is not used in receive mode. Used only as data input in transmit mode DIO Figure 5-8. Transparent Asynchronous UART Mode (SEP_DI_DO = 1) 1 0 1 1 0 0 0 1 1 0 1 Tx data Time Figure 5-9. Manchester Encoding 5.7 Data Rate Programming The data rate (baud rate) is programmable and depends on the crystal frequency and the programming of the CLOCK (CLOCK_A and CLOCK_B) registers. The baud rate (B.R.) is given by Equation 1. fxosc B.R. = 8 ´ (REF _ DIV + 1) ´ DIV1 ´ DIV2 (1) Where: DIV1 and DIV2 are given by the value of MCLK_DIV1 and MCLK_DIV2. Table 5-4 shows some possible data rates as a function of crystal frequency in synchronous mode. In asynchronous transparent UART mode any data rate up to 153.6 kBaud can be used. Table 5-2. DIV2 for Different Settings of MCLK_DIV2 24 MCLK_DIV2[1:0] DIV2 00 1 01 2 10 4 11 8 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-3. DIV1 for Different Settings of MCLK_DIV1 MCLK_DIV1[2:0] DIV1 000 2.5 001 3 010 4 011 7.5 100 12.5 101 40 110 48 111 64 Table 5-4. Some Possible Data Rates Versus Crystal Frequency DATA RATE [kBaud] CRYSTAL FREQUENCY [MHz] 4.9152 0.45 7.3728 9.8304 X X X X X X X X X X X X X X X X X X X X 4 X 4.096 X X 7.2 X X X X X X X X X X 14.4 X X X X X X X X 16.384 X X 28.8 X X X X X X X X 32.768 X X 57.6 X X X X X X X X X 64 X 65.536 X X X X X X 128 153.6 X X 32 115.2 X X 16 76.8 X X 8 8.192 38.4 X X 3.6 19.2 X X 2 9.6 19.6608 X X 1.8 4.8 X X 1 2.4 17.2032 X X 0.9 1.2 14.7456 X 0.5 0.6 12.288 X X X X X X X X X X X Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 25 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.8 www.ti.com Frequency Programming Programming the frequency word in the configuration registers sets the operation frequency. There are two frequency words registers, termed FREQ_A and FREQ_B, which can be programmed to two different frequencies. One of the frequency words can be used for RX (local oscillator frequency) and the other for TX (transmitting carrier frequency) in order to be able to switch very fast between RX mode and TX mode. They can also be used for RX (or TX) at two different channels. The F_REG bit in the MAIN register selects frequency word A or B. The frequency word is located in FREQ_2A:FREQ_1A:FREQ_0A and FREQ_2B:FREQ_1B:FREQ_0B for the FREQ_A and FREQ_B word respectively. The LSB of the FREQ_0 registers are used to enable dithering, see Section 5.8.1. The PLL output frequency is given by Equation 2 in the frequency band 402 to 470 MHz. æ 3 FREQ + 0.5 ´ DITHER ö fc = fref ´ ç + ÷ 32768 è4 ø (2) The PLL output frequency is given by Equation 3 in the frequency band 804 to 960 MHz. æ 3 FREQ + 0.5 ´ DITHER ö fc = fref ´ ç + ÷ 16384 è2 ø (3) The BANDSELECT bit in the ANALOG register controls the frequency band used. BANDSELECT = 0 gives 402 to 470 MHz, and BANDSELECT = 1 gives 804 to 960 MHz. The reference frequency is the crystal oscillator clock frequency divided by REF_DIV (3 bits in the CLOCK_A or CLOCK_B register), a number between 1 and 7, as shown in Equation 4. fxosc fref = REF _ DIV + 1 (4) FSK frequency deviation is programmed in the DEVIATION register. The deviation programming is divided into a mantissa (TXDEV_M[3:0]) and an exponent (TXDEV_X[2:0]). Generally REF_DIV should be as low as possible but the requirements (shown in Equation 5 and Equation 6) must be met. f 9.8304 ³ fref > c [MHz ] 256 (5) Equation 5 in the frequency band 402 to 470 MHz, and Equation 6 in the frequency band 804 to 960 MHz. f 9.8304 ³ fref > c [MHz ] 512 (6) The PLL output frequency Equation 2 and Equation 3 give the carrier frequency, fc , in transmit mode (centre frequency). The two FSK modulation frequencies are given by Equation 7 and Equation 7. f0 = fc – fdev f1 = fc + fdev (7) (8) Where: fdev is set by the DEVIATION register shown in Equation 9 in the frequency band 402 to 470 MHz and in Equation 10 in the frequency band 804 to 960 MHz. fdev = fref ´ TXDEV _ M ´ 2(TXDEV _ X -16) (9) (TXDEV _ X -15) fdev = fref ´ TXDEV _ M ´ 2 (10) OOK (On-Off Keying) is used if TXDEV_M[3:0] = 0000. The TX_SHAPING bit in the DEVIATION register controls Gaussian shaping of the modulation signal. 26 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 In receive mode the frequency must be programmed to be the LO frequency. Low side LO injection is used, hence Equation 8. fLO = fc – fIF (11) Where: fIF is the IF frequency (ideally 307.2 kHz). 5.8.1 Dithering Spurious signals will occur at certain frequencies depending on the division ratios in the PLL. To reduce the strength of these spurs, a common technique is to use a dithering signal in the control of the frequency dividers. Dithering is activated by setting the DITHER bit in the FREQ_0 registers. It is recommended to use the dithering in order to achieve the best possible performance. 5.9 5.9.1 Receiver IF Frequency The IF frequency is derived from the crystal frequency as shown in Equation 12. fxoscx f IF = 8 ´ (ADC _ DIV [2 : 0]+ 1) (12) Where: ADC_DIV[2:0] is set in the MODEM register. The analog filter succeeding the mixer is used for wideband and anti-alias filtering, which is important for the blocking performance at 1 MHz and larger offsets. This filter is fixed and centered on the nominal IF frequency of 307.2 kHz. The bandwidth of the analog filter is about 160 kHz. Using crystal frequencies which gives an IF frequency within 300 to 320 kHz means that the analog filter can be used (assuming low frequency deviations and low data rates). Large offsets, however, from the nominal IF frequency will give an un-symmetric filtering (variation in group delay and different attenuation) of the signal, resulting in decreased sensitivity and selectivity. See AN022 CC1020 Crystal Frequency Selection (SWRA070) for more details. For IF frequencies other than 300 to 320 kHz and for high frequency deviation and high data rates (typically ≥ 76.8 kBaud) the analog filter must be bypassed by setting FILTER_BYPASS = 1 in the FILTER register. In this case the blocking performance at 1 MHz and larger offsets will be degraded. The IF frequency is always the ADC clock frequency divided by 4. The ADC clock frequency should therefore be as close to 1.2288 MHz as possible. 5.9.2 Receiver Channel Filter Bandwidth In order to meet different channel spacing requirements, the receiver channel filter bandwidth is programmable. It can be programmed from 9.6 to 307.2 kHz. The minimum receiver channel filter bandwidth depends on baud rate, frequency separation and crystal tolerance. The signal bandwidth must be smaller than the available receiver channel filter bandwidth. The signal bandwidth (SBW) can be approximated by (Carson’s rule) shown in Equation 13. SBW = 2 × fm + 2 × frequency deviation (13) Where: fm is the modulating signal. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 27 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com In Manchester mode the maximum modulating signal occurs when transmitting a continuous sequence of 0s (or 1s). In NRZ mode the maximum modulating signal occurs when transmitting a 0-1-0 sequence. In both Manchester and NRZ mode 2 × fm is then equal to the programmed baud rate. The equation for SBW can then be rewritten as shown in Equation 14. SBW = Baud rate + frequency separation (14) Furthermore, the frequency offset of the transmitter and receiver must also be considered. Assuming equal frequency error in the transmitter and receiver (same type of crystal) the total frequency error is shown in Equation 15. f_error = ±2 × XTAL_ppm × f_RF (15) Where: XTAL_ppm is the total accuracy of the crystal including initial tolerance, temperature drift, loading and ageing. F_RF is the RF operating frequency. The minimum receiver channel filter bandwidth (ChBW) can then be estimated as shown in Equation 16. ChBW > SBW + 2 × f_error (16) The DEC_DIV[4:0] bits in the FILTER register control the receiver channel filter bandwidth. The 6 dB bandwidth is given by Equation 17. 307.2 ChBW = (DEC _ DIV + 1) [kHz ] (17) Where: the IF frequency is set to 307.2 kHz. In SmartRF Studio the user specifies the channel spacing and the channel filter bandwidth is set according to Table 5-5. For narrowband systems with channel spacings of 12.5 and 25 kHz the channel filter bandwidth is 12.288 kHz and 19.2 kHz respectively to comply with ARIB STD-T67 and EN 300 220. For wideband systems (channel spacing of 50 kHz and above) it is possible to use different channel filter bandwidths than given in Table 5-5. There is a trade-off between selectivity as well as sensitivity and accepted frequency tolerance. In applications where larger frequency drift is expected, the filter bandwidth can be increased, but with reduced adjacent channel rejection (ACR) and sensitivity. Table 5-5. Channel Filter Bandwidths Used for the Channel Spacings Defined in SmartRF Studio 28 CHANNEL SPACING [kHz] FILTER BANDWIDTH [kHz] FILTER.DEC_DIV [4:0] [decimal(binary)] 12.5 12.288 24 (11000b) 25 19.2 15 (01111b) 50 25.6 11 (01011b) 100 51.2 5 (00101b) 150 102.4 2 (00010b) 200 153.6 1 (00001b) 500 307.2 0 (00000b) Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com 5.9.3 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Demodulator, Bit Synchronizer, and Data Decision The block diagram for the demodulator, data slicer and bit synchronizer is shown in Figure 5-10. The builtin bit synchronizer synchronizes the internal clock to the incoming data and performs data decoding. The data decision is done using over-sampling and digital filtering of the incoming signal. This improves the reliability of the data transmission. Using the synchronous modes simplifies the data-decoding task substantially. The recommended preamble is a ‘010101…’ bit pattern. The same bit pattern should also be used in Manchester mode, giving a ‘011001100110…‘chip’ pattern. This is necessary for the bit synchronizer to synchronize to the coding correctly. The data slicer does the bit decision. Ideally the two received FSK frequencies are placed symmetrically around the IF frequency. However, if there is some frequency error between the transmitter and the receiver, the bit decision level should be adjusted accordingly. In CC1020, this is done automatically by measuring the two frequencies and use the average value as the decision level. The digital data slicer in CC1020 uses an average value of the minimum and maximum frequency deviation detected as the comparison level. The RXDEV_X[1:0] and RXDEV_M[3:0] in the AFC_CONTROL register are used to set the expected deviation of the incoming signal. Once a shift in the received frequency larger than the expected deviation is detected, a bit transition is recorded and the average value to be used by the data slicer is calculated. The minimum number of transitions required to calculate a slicing level is 3. That is, a 010 bit pattern (NRZ). The actual number of bits used for the averaging can be increased for better data decision accuracy. This is controlled by the SETTLING[1:0] bits in the AFC_CONTROL register. If RX data is present in the channel when the RX chain is turned on, then the data slicing estimate will usually give correct results after 3 bit transitions. The data slicing accuracy will increase after this, depending on the SETTLING[1:0] bits. If the start of transmission occurs after the RX chain has turned on, the minimum number of bit transitions (or preamble bits) before correct data slicing will depend on the SETTLING[1:0] bits. The automatic data slicer average value function can be disabled by setting SETTLING[1:0] = 00. In this case a symmetrical signal around the IF frequency is assumed. The internally calculated average FSK frequency value gives a measure for the frequency offset of the receiver compared to the transmitter. This information can also be used for an automatic frequency control (AFC) as described in Section 5.9.13. Average filter Digital filtering Frequency detector Decimator Data filter Data slicer comparator Bit synchronizer and data decoder Figure 5-10. Demodulator Block Diagram Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 29 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.9.4 www.ti.com Receiver Sensitivity Versus Data Rate and Frequency Separation The receiver sensitivity depends on the channel filter bandwidth, data rate, data format, FSK frequency separation and the RF frequency. Typical figures for the receiver sensitivity (BER = 10–3) are shown in Table 5-6 and Table 5-7 for FSK. For best performance, the frequency deviation should be at least half the baud rate in FSK mode. The sensitivity is measured using the matching network shown in the application circuit in Figure 6-1, which includes an external T/R switch. Refer to AN029 CC1020/1021 Automatic Frequency Control (AFC) (SWRA063) for plots of sensitivity versus frequency offset. Table 5-6. Typical Receiver Sensitivity as a Function of Data Rate at 433 MHz, FSK Modulation, BER = 10–3, Pseudo-random Data (PN9 Sequence) (1) SENSITIVITY [dBm] DATA RATE [kBaud] CHANNEL SPACING [kHz] DEVIATION [kHz] FILTER BW 2.4 optimized sensitivity (1) 12.5 ±2.025 2.4 optimized selectivity (1) 12.5 4.8 NRZ MODE MANCHESTER MODE UART MODE 9.6 –115 –118 –115 ±2.025 12.288 –112 –114 –112 25 ±2.475 19.2 –112 –112 –112 9.6 50 ±4.95 25.6 –110 –111 –110 19.2 100 ±9.9 51.2 –107 –108 –107 38.4 150 ±19.8 102.4 –104 –104 –104 76.8 200 ±36.0 153.6 –101 –101 –101 153.6 500 ±72.0 307.2 –96 –97 –96 Optimized selectivity is relevant for systems targeting compliance with ARIB STD-T67, 12.5 kHz channel spacing. Table 5-7. Typical Receiver Sensitivity as a Function of Data Rate at 868 MHz, FSK Modulation, BER = 10–3, Pseudo-random Data (PN9 Sequence) 30 SENSITIVITY [dBm] DATA RATE [kBaud] CHANNEL SPACING [kHz] DEVIATION [kHz] FILTER BW 2.4 12.5 ±2.025 4.8 25 ±2.475 9.6 50 ±4.95 19.2 100 38.4 150 76.8 200 153.6 500 NRZ MODE MANCHESTER MODE UART MODE 12.288 –112 –116 –112 19.2 –111 –112 –111 25.6 –109 –110 –109 ±9.9 51.2 –107 –107 –107 ±19.8 102.4 –103 –103 –103 ±36.0 153.6 –99 –100 –99 ±72.0 307.2 –94 –94 –94 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com 5.9.5 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 RSSI CC1020 has a built-in RSSI (Received Signal Strength Indicator) giving a digital value that can be read form the RSSI register. The RSSI reading must be offset and adjusted for VGA gain setting (VGA_SETTING[4:0] in the VGA3 register). The digital RSSI value is ranging from 0 to 106 (7 bits). The RSSI reading is a logarithmic measure of the average voltage amplitude after the digital filter in the digital part of the IF chain as shown in Equation 18. RSSI = 4 log2(signal amplitude) (18) The relative power is then given by RSSI × 1.5 dB in a logarithmic scale. The number of samples used to calculate the average signal amplitude is controlled by AGC_AVG[1:0] in the VGA2 register. The RSSI update rate is given by Equation 19. f filter _ clock f RSSI = AGC _ AVG[1:0] + 1 2 (19) Where: AGC_AVG[1:0] is set in the VGA2 register. ffilter_clock = 2 × ChBW. Maximum VGA gain is programmed by the VGA_SETTING[4:0] bits. The VGA gain is programmed in approximately 3 dB/LSB. The RSSI measurement can be referred to the power (absolute value) at the RF_IN pin by using the Equation 20. P = 1.5 × RSSI – 3 × VGA_SETTING – RSSI_Offset [dBm] (20) The RSSI_Offset depends on the channel filter bandwidth used due to different VGA settings. Figure 5-11 and Figure 5-12 show typical plots of RSSI reading as a function of input power for different channel spacings. See Section 5.9.5 for a list of channel filter bandwidths corresponding to the various channel spacings. Refer to AN030 CC1020/1021 Received Signal Strength Indicator (SWRA062) for further details. The method shown in Equation 21 can be used to calculate the power (P) in dBm from the RSSI readout values in Figure 5-11 and Figure 5-12. P = 1.5 × [RSSI – RSSI_ref] + P_ref (21) Where: P is the output power in dBm for the current RSSI readout value. RSSI_ref is the RSSI readout value taken from Figure 5-11 or Figure 5-12 for an input power level of P_ref. NOTE The RSSI reading in decimal value changes for different channel filter bandwidths. The analog filter has a finite dynamic range and is the reason why the RSSI reading is saturated at lower channel spacings. Higher channel spacing is typically used for high frequency deviation and data rates. The analog filter bandwidth is about 160 kHz and is bypassed for high frequency deviation and data rates and is the reason why the RSSI reading is not saturated for 200 kHz and 500 kHz channel spacing in Figure 5-11 and Figure 5-12. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 31 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Figure 5-11. Typical RSSI Value vs Input Power for Some Typical Channel Spacings, 433 MHz 5.9.6 Figure 5-12. Typical RSSI Value vs Input Power for Some Typical Channel Spacings, 868 MHz Image Rejection Calibration For perfect image rejection, the phase and gain of the “I” and “Q” parts of the analog RX chain must be perfectly matched. To improve the image rejection, the “I” and “Q” phase and gain difference can be finetuned by adjusting the PHASE_COMP and GAIN_COMP registers. This allows compensation for process variations and other nonidealities. The calibration is done by injecting a signal at the image frequency, and adjusting the phase and gain difference for minimum RSSI value. During image rejection calibration, an unmodulated carrier should be applied at the image frequency (614.4 kHz below the desired channel). No signal should be present in the desired channel. The signal level should be 50 to 60 dB above the sensitivity in the desired channel, but the optimum level will vary from application to application. Too large input level gives poor results due to limited linearity in the analog IF chain, while too low input level gives poor results due to the receiver noise floor. For best RSSI accuracy, use AGC_AVG[1:0] = 11 during image rejection calibration (RSSI value is averaged over 16 filter output samples). The RSSI register update rate then equals the receiver channel bandwidth (set in FILTER register) divided by 8, as the filter output rate is twice the receiver channel bandwidth. This gives the minimum waiting time between RSSI register reads (0.5 ms is used below). TI recommends the following image calibration procedure: 1. Define 3 variables: XP = 0, XG = 0 and DX = 64. Go to step 3. 2. Set DX = DX/2. 3. Write XG to GAIN_COMP register. 4. If XP + 2 × DX < 127, then write XP + 2 × DX to PHASE_COMP register else write 127 to PHASE_COMP register. 5. Wait at least 3 ms. Measure signal strength Y4 as filtered average of 8 reads from RSSI register with 0.5 ms of delay between each RSSI read. 6. Write XP+DX to PHASE_COMP register. 7. Wait at least 3 ms. Measure signal strength Y3 as filtered average of 8 reads from RSSI register with 0.5 ms of delay between each RSSI read. 8. Write XP to PHASE_COMP register. 9. Wait at least 3 ms. Measure signal strength Y2 as filtered average of 8 reads from RSSI register with 0.5 ms of delay between each RSSI read. 10. Write XP-DX to PHASE_COMP register. 11. Wait at least 3 ms. Measure signal strength Y1 as filtered average of 8 reads from RSSI register with 32 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 0.5 ms of delay between each RSSI read. 12. Write XP – 2 × DX to PHASE_COMP register. 13. Wait at least 3 ms. Measure signal strength Y0 as filtered average of 8 reads from RSSI register with 0.5 ms of delay between each RSSI read. 14. Set AP = 2 × (Y0 – Y2 + Y4) – (Y1 + Y3). 15. If AP > 0 then set DP = ROUND ( 7 × DX × (2 × (Y0 – Y4) + Y1 – Y3) / (10 × AP)) else if Y0 + Y1 > Y3 + Y4 then set DP = DX else set DP = –DX. 16. If DP > DX then set DP = DX else if DP < –DX then set DP = –DX. 17. Set XP = XP + DP. 18. Write XP to PHASE_COMP register. 19. If XG + 2 × DX < 127 then write XG + 2 × DX to GAIN_COMP register else write 127 to GAIN_COMP register. 20. Wait at least 3 ms. Measure signal strength Y4 as 0.5 ms of delay between each RSSI read. 21. Write XG + DX to GAIN_COMP register. 22. Wait at least 3 ms. Measure signal strength Y3 as 0.5 ms of delay between each RSSI read. 23. Write XG to GAIN_COMP register. 24. Wait at least 3 ms. Measure signal strength Y2 as 0.5 ms of delay between each RSSI read. 25. Write XG – DX to GAIN_COMP register. 26. Wait at least 3 ms. Measure signal strength Y1 as 0.5 ms of delay between each RSSI read. 27. Write XG – 2 × DX to GAIN_COMP register. 28. Wait at least 3 ms. Measure signal strength Y0 as 0.5 ms of delay between each RSSI read. 29. Set AG = 2 × (Y0 – Y2 + Y4) – (Y1 + Y3). 30. If AG > 0 then filtered average of 8 reads from RSSI register with filtered average of 8 reads from RSSI register with filtered average of 8 reads from RSSI register with filtered average of 8 reads from RSSI register with filtered average of 8 reads from RSSI register with set DG = ROUND (7 × DX × (2 × (Y0 – Y4) + Y1 – Y3) / (10 × AG) else if Y0 + Y1 > Y3 + Y4 then set DG = DX else set DG = –DX. 31. If DG > DX then set DG = DX else if DG < –DX then set DG = –DX 32. Set XG = XG + DG. 33. If DX > 1 then go to step 2. 34. Write XP to PHASE_COMP register and XG to GAIN_COMP register. If repeated calibration gives varying results, try to change the input level or increase the number of RSSI reads N. A good starting point is N = 8. As accuracy is more important in the last fine-calibration steps, it can be worthwhile to increase N for each loop iteration. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 33 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com For high frequency deviation and high data rates (typically ≥ 76.8 kBaud) the analog filter succeeding the mixer must be bypassed by setting FILTER_BYPASS = 1 in the FILTER register. In this case the image rejection is degraded. The image rejection is reduced for low supply voltages (typically < 2.5 V) when operating in the 402 to 470 MHz frequency range. 5.9.7 Blocking and Selectivity Figure 5-13 shows the blocking/selectivity at 433 MHz, 12.5 kHz channel spacing. Figure 5-14 shows the blocking/selectivity at 868 MHz, 25 kHz channel spacing. The blocking rejection is the ratio between a modulated blocker (interferer) and a wanted signal 3 dB above the sensitivity limit. Figure 5-13. Typical Blocker Rejection Carrier Frequency Set to 434.3072 MHz (12.5 kHz Channel Spacing, 12.288 kHz Receiver Channel Filter Bandwidth) 5.9.8 Figure 5-14. Typical Blocker Rejection Carrier Frequency Set to 868.3072 MHz (25 kHz Channel Spacing, 19.2 kHz Receiver Channel Filter Bandwidth) Linear IF Chain and AGC Settings CC1020 is based on a linear IF chain where the signal amplification is done in an analog VGA (Variable Gain Amplifier). The gain is controlled by the digital part of the IF chain after the ADC (Analog to Digital Converter). The AGC (Automatic Gain Control) loop ensures that the ADC operates inside its dynamic range by using an analog/digital feedback loop. The maximum VGA gain is programmed by the VGA_SETTING[4:0] in the VGA3 register. The VGA gain is programmed in approximately 3 dB/LSB. The VGA gain should be set so that the amplified thermal noise from the front-end balance the quantization noise from the ADC. Therefore the optimum maximum VGA gain setting will depend on the channel filter bandwidth. A digital RSSI is used to measure the signal strength after the ADC. The CS_LEVEL[4:0] in the VGA4 register is used to set the nominal operating point of the gain control (and also the carrier sense level). Further explanation can be found in Figure 5-15. The VGA gain will be changed according to a threshold set by the VGA_DOWN[2:0] in the VGA3 register and the VGA_UP[2:0] in the VGA4 register. Together, these two values specify the signal strength limits used by the AGC to adjust the VGA gain. To avoid unnecessary tripping of the VGA, an extra hysteresis and filtering of the RSSI samples can be added. The AGC_HYSTERESIS bit in the VGA2 register enables this. The time dynamics of the loop can be altered by the VGA_BLANKING bit in the ANALOG register, and VGA_FREEZE[1:0] and VGA_WAIT[2:0] bits in the VGA1 register. When VGA_BLANKING is activated, the VGA recovery time from DC offset spikes after a gain step is reduced. 34 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 VGA_FREEZE determines the time to hold bit synchronization, VGA and RSSI levels after one of these events occur: • RX power-up • The PLL has been out of lock • Frequency register setting is switched between A and B This feature is useful to avoid AGC operation during start-up transients and to ensure minimum dwell time using frequency hopping. This means that bit synchronization can be maintained from hop to hop. VGA_WAIT determines the time to hold the present bit synchronization and RSSI levels after changing VGA gain. This feature is useful to avoid AGC operation during the settling of transients after a VGA gain change. Some transients are expected due to DC offsets in the VGA. At the sensitivity limit, the VGA gain is set by VGA_SETTING. In order to optimize selectivity, this gain should not be set higher than necessary. The SmartRF Studio software gives the settings for VGA1 to VGA4 registers. For reference, the following method can be used to find the AGC settings: 1. Disable AGC and use maximum LNA2 gain by writing BFh to the VGA2 register. Set minimum VGA gain by writing to the VGA3 register with VGA_SETTING = 0. 2. Apply no RF input signal, and measure ADC noise floor by reading the RSSI register. 3. Apply no RF input signal, and write VGA3 register with increasing VGA_SETTING value until the RSSI register value is approximately 4 larger than the value read in step 2. This places the front-end noise floor around 6 dB above the ADC noise floor. 4. Apply an RF signal with strength equal the desired carrier sense threshold. The RF signal should preferably be modulated with correct Baud rate and deviation. Read the RSSI register value, subtract 8, and write to CS_LEVEL in the VGA4 register. Vary the RF signal level slightly and check that carrier sense indication (bit 3 in STATUS register) switches at the desired input level. 5. If desired, adjust the VGA_UP and VGA_DOWN settings according to the explanation in Figure 5-15. 6. Enable AGC and select LNA2 gain change level. Write 55h to VGA2 register if the resulting VGA_SETTING>10. Otherwise, write 45h to VGA2. Modify AGC_AVG in the above VGA2 value if faster carrier sense and AGC settling is desired. RSSI Level Note that the AGC works with "raw" filter output signal strength, while the RSSI readout value is compensated for VGA gain changes by the AGC. The AGC keeps the signal strength in this range. Minimize VGA_DOWN for best selectivity, but leave some margin to avoid frequent VGA gain changes during reception. The AGC keeps the signal strength above carrier sense level + VGA_UP. Minimize VGA_UP for best selectivity, but increase if first VGA gain reduction occurs too close to the noise floor. (signal strength, 1.5dB/step) AGC decreases gain if above this level (unless at minimum). VGA_DOWN+3 AGC increases gain if below this level (unless at maximum). VGA_UP Carrier sense is turned on here. To set CS_LEVEL, subtract 8 from RSSI readout with RF input signal at desired carrier sense level. CS_LEVEL+8 Zero level depends on front-end settings and VGA_SETTING value. 0 Figure 5-15. Relationship Between RSSI, Carrier Sense Level, and AGC Settings CS_LEVEL, VGA_UP and VGA_DOWN Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 35 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.9.9 www.ti.com AGC Settling After turning on the RX chain, the following occurs: A. The AGC waits 16 to 128 ADC_CLK (1.2288 MHz) periods, depending on the VGA_FREEZE setting in the VGA1 register, for settling in the analog parts. B. The AGC waits 16 to 48 FILTER_CLK periods, depending on the VGA_WAIT setting in the VGA1 register, for settling in the analog parts and the digital channel filter. C. The AGC calculates the RSSI value as the average magnitude over the next 2 to 16 FILTER_CLK periods, depending on the AGC_AVG setting in the VGA2 register. D. If the RSSI value is higher than CS_LEVEL+8, then the carrier sense indicator is set (if CS_SET = 0). If the RSSI value is too high according to the CS_LEVEL, VGA_UP and VGA_DOWN settings, and the VGA gain is not already at minimum, then the VGA gain is reduced and the AGC continues from B). E. If the RSSI value is too low according to the CS_LEVEL and VGA_UP settings, and the VGA gain is not already at maximum (given by VGA_SETTING), then the VGA gain is increased and the AGC continues from B). Two to three VGA gain changes should be expected before the AGC has settled. Increasing AGC_AVG increases the settling time, but may be worthwhile if there is the time in the protocol, and for reducing false wake-up events when setting the carrier sense close to the noise floor. The AGC settling time depends on the FILTER_CLK (= 2 × ChBW). Thus, there is a trade off between AGC settling time and receiver sensitivity because the AGC settling time can be reduced for data rates lower than 76.8 kBaud by using a wider receiver channel filter bandwidth (that is, larger ChBW). 5.9.10 Preamble Length and Sync Word The rules for choosing a good sync word are as follows: 1. The sync word should be significantly different from the preamble. 2. A large number of transitions is good for the bit synchronization or clock recovery. Equal bits reduce the number of transitions. The recommended sync word has at most 3 equal bits in a row. 3. Autocorrelation. The sync word should not repeat itself, as this will increase the likelihood for errors. 4. In general the first bit of sync should be opposite of last bit in preamble, to achieve one more transition. The recommended sync words for CC1020 are 2 bytes (0xD391), 3 bytes (0xD391DA) or 4 bytes (0xD391DA26) and are selected as the best compromise of the above criteria. Using the register settings provided by the SmartRFM Studio software, packet error rates (PER) less than 0.5% can be achieved when using 24 bits of preamble and a 16 bit sync word (0xD391). Using a preamble longer than 24 bits will improve the PER. When performing the PER measurements described above the packet format consisted of 10 bytes of random data, 2 bytes CRC and 1 dummy byte in addition to the sync word and preamble at the start of each package. For the test, 1000 packets were sent 10 times. The transmitter was put in power down between each packet. Any bit error in the packet, either in the sync word, in the data or in the CRC caused the packet to be counted as a failed packet. 36 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.9.11 Carrier Sense The carrier sense signal is based on the RSSI value and a programmable threshold. The carrier sense function can be used to simplify the implementation of a CSMA (Carrier Sense Multiple Access) medium access protocol. Carrier sense threshold level is programmed by CS_LEVEL[4:0] in the VGA4 register and VGA_SETTING[4:0] in the VGA3 register. VGA_SETTING[4:0] sets the maximum gain in the VGA. This value must be set so that the ADC works with optimum dynamic range for a certain channel filter bandwidth. The detected signal strength (after the ADC) will therefore depend on this setting. CS_LEVEL[4:0] sets the threshold for this specific VGA_SETTING[4:0] value. If the VGA_SETTING[4:0] is changed, the CS_LEVEL[4:0] must be changed accordingly to maintain the same absolute carrier sense threshold. See Figure 5-15 for an explanation of the relationship between RSSI, AGC and carrier sense settings. The carrier sense signal can be read as the CARRIER_SENSE bit in the STATUS register. The carrier sense signal can also be made available at the LOCK pin by setting LOCK_SELECT[3:0] = 0100 in the LOCK register. 5.9.12 Automatic Power-up Sequencing CC1020 has a built-in automatic power-up sequencing state machine. By setting the CC1020 into this mode, the receiver can be powered-up automatically by a wake-up signal and will then check for a carrier signal (carrier sense). If carrier sense is not detected, it returns to power-down mode. A flow chart for automatic power-up sequencing is shown in Figure 5-16. The automatic power-up sequencing mode is selected when PD_MODE[1:0] = 11 in the MAIN register. When the automatic power-up sequencing mode is selected, the functionality of the MAIN register is changed and used to control the sequencing. By setting SEQ_PD = 1 in the MAIN register, CC1020 is set in power down mode. If SEQ_PSEL = 1 in the SEQUENCING register the automatic power-up sequence is initiated by a negative transition on the PSEL pin. If SEQ_PSEL = 0 in the SEQUENCING register, then the automatic power-up sequence is initiated by a negative transition on the DIO pin (as long as SEP_DI_DO = 1 in the INTERFACE register). Sequence timing is controlled through RX_WAIT[2:0] AND CS_WAIT[3:0] in the SEQUENCING register. VCO and PLL calibration can also be done automatically as a part of the sequence. This is controlled through SEQ_CAL[1:0] in the MAIN register. Calibration can be done every time, every 16th sequence, every 256th sequence, or never. See Section 5.22.1 description for details. A description of when to do, and how the VCO and PLL self-calibration is done, is given in Section 5.12.2. See also Application Note AN070 CC1020 Automatic Power-Up Sequencing (SWRA279). Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 37 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Turn on crystal oscillator/bias Frequency synthesizer off Receive chain off Sequencing wake-up event (negative transition on PSEL pin or DIO pin) Power down Crystal oscillator and bias off Frequency synthesizer off Receive chain off Crystal oscillator and bias on Turn on frequency synthesizer Receive chain off Wait for PLL lock or timeout, 127 filter clocks PLL timeout Set SEQ_ERROR flag in STATUS register Optional calibration Programmable: each time, once in 16, or once in 256 Receive chain off PLL in lock Optional waiting time before turning on receive chain Programmable: 32-256 ADC clocks Crystal oscillator and bias on Frequency synthesizer on Turn on receive chain Wait for carrier sense or timeout Programmable: 20-72 filter clocks Carrier sense timeout Carrier sense Receive mode Sequencing power-down event Crystal oscillator and bias on Frequency synthesizer on (Positive transition on SEQ_PD in MAIN register) Receive chain on (1) Filter clock (FILTER_CLK): ffilter_clock = 2 × ChBW where ChBW is defined in Section 5.9.2. fADC = (2) ADC clock (ADC_CLK): fxoscx 2 ´ (ADC _ DIV [2 : 0]+ 1) where ADC_DIV[2:0] is set in the MODEM register. Figure 5-16. Automatic Power-up Sequencing Flow Chart 5.9.13 Automatic Frequency Control CC1020 has a built-in feature called AFC (Automatic Frequency Control) that can be used to compensate for frequency drift. The average frequency offset of the received signal (from the nominal IF frequency) can be read in the AFC register. The signed (2’s-complement) 8-bit value AFC[7:0] can be used to compensate for frequency offset between transmitter and receiver. The frequency offset is given by Equation 22. AFC ´ Baud rate DF = 16 (22) The receiver can be calibrated against the transmitter by changing the operating frequency according to the measured offset. The new frequency must be calculated and written to the FREQ register by the microcontroller. The AFC can be used for an FSK/GFSK signal, but not for OOK. Application Note AN029 CC1020/1021 Automatic Frequency Control (AFC) (SWRA063) provides the procedure and equations necessary to implement AFC. The AFC feature reduces the crystal accuracy requirement. 38 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.9.14 Digital FM It is possible to read back the instantaneous IF from the FM demodulator as a frequency offset from the nominal IF frequency. This digital value can be used to perform a pseudo analog FM demodulation. The frequency offset can be read from the GAUSS_FILTER register and is a signed 8-bit value coded as 2-complement. The instantaneous deviation is given by Equation 23. GAUSS _ FILTER ´ Baud rate F= 8 (23) The digital value should be read from the register and sent to a DAC and filtered in order to get an analog audio signal. The internal register value is updated at the MODEM_CLK rate. MODEM_CLK is available at the LOCK pin when LOCK_SELECT[3:0] = 1101 in the LOCK register, and can be used to synchronize the reading. For audio (300 to 4000 Hz) the sampling rate should be higher than or equal to 8 kHz (Nyquist) and is determined by the MODEM_CLK. The MODEM_CLK, which is the sampling rate, equals 8 times the baud rate. That is, the minimum baud rate, which can be programmed, is 1 kBaud. However, the incoming data will be filtered in the digital domain and the 3-dB cut-off frequency is 0.6 times the programmed Baud rate. Thus, for audio the minimum programmed Baud rate should be approximately 7.2 kBaud. The GAUSS_FILTER resolution decreases with increasing baud rate. A accumulate and dump filter can be implemented in the µC to improve the resolution. Note that each GAUSS_FILTER reading should be synchronized to the MODEM_CLK. As an example, accumulating 4 readings and dividing the total by 4 will improve the resolution by 2 bits. Furthermore, to fully utilize the GAUSS_FILTER dynamic range the frequency deviation must be 16 times the programmed baud rate. 5.10 Transmitter 5.10.1 FSK Modulation Formats The data modulator can modulate FSK, which is a two level FSK (Frequency Shift Keying), or GFSK, which is a Gaussian filtered FSK with BT = 0.5. The purpose of the GFSK is to make a more bandwidth efficient system as shown in Figure 5-17. The modulation and the Gaussian filtering are done internally in the chip. The TX_SHAPING bit in the DEVIATION register enables the GFSK. GFSK is recommended for narrowband operation. Figure 5-18 and Figure 5-19 show typical eye diagrams for 434 MHz and 868 MHz operation, respectively. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 39 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 2.4 kBaud, NRZ, www.ti.com ±2.025 kHz frequency deviation Figure 5-17. FSK vs GFSK Spectrum Plot 153.6 kBaud, 2.4 kBaud, NRZ, ±2.025 kHz frequency deviation Figure 5-18. FSK vs GFSK Eye Diagram NRZ, ±79.2 kHz frequency deviation Figure 5-19. GFSK Eye Diagram 5.10.2 Output Power Programming The RF output power from the device is programmable by the 8-bit PA_POWER register. Figure 5-20 and Figure 5-21 show the output power and total current consumption as a function of the PA_POWER register setting. It is more efficient in terms of current consumption to use either the lower or upper 4-bits in the register to control the power, as shown in Figure 5-20 and Figure 5-21. However, the output power can be controlled in finer steps using all the available bits in the PA_POWER register. 40 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 35.0 Current [mA] / Output power [dBm] 30.0 25.0 20.0 15.0 10.0 5.0 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 0 1 2 3 4 5 6 7 8 9 0A 0B 0C 0D 0E 0F 50 60 70 80 90 A0 B0 C0 D0 E0 F0 FF PA_POWER [hex] Current Consumption Output Power Figure 5-20. Typical Output Power and Current Consumption, 433 MHz 35.0 Current [mA] / Output power [dBm] 30.0 25.0 20.0 15.0 10.0 5.0 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 0 1 2 3 4 5 6 7 8 9 0A 0B 0C 0D 0E 0F 50 60 70 80 90 A0 B0 C0 D0 E0 F0 FF PA_POWER [hex] Current Consumption Output Power Figure 5-21. Typical Output Power and Current Consumption, 433 MHz 5.10.3 TX Data Latency The transmitter will add a delay due to the synchronization of the data with DCLK and further clocking into the modulator. The user should therefore add a delay equivalent to at least 2 bits after the data payload has been transmitted before switching off the PA (that is, before stopping the transmission). Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 41 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com 5.10.4 Reducing Spurious Emission and Modulation Bandwidth Modulation bandwidth and spurious emission are normally measured with the PA continuously on and a repeated test sequence. In cases where the modulation bandwidth and spurious emission are measured with the CC1020 switching from power down mode to TX mode, a PA ramping sequence could be used to minimize modulation bandwidth and spurious emission. PA ramping should then be used both when switching the PA on and off. A linear PA ramping sequence can be used where register PA_POWER is changed from 00h to 0Fh and then from 50h to the register setting that gives the desired output power (for example, F0h for +10 dBm output power at 433 MHz operation). The longer the time per PA ramping step the better, but setting the total PA ramping time equal to 2 bit periods is a good compromise between performance and PA ramping time. 5.11 Input and Output Matching and Filtering When designing the impedance matching network for the CC1020 the circuit must be matched correctly at the harmonic frequencies as well as at the fundamental tone. A recommended matching network is shown in Figure 5-22. Component values for various frequencies are given in Table 5-8. Component values for other frequencies can be found using the SmartRF Studio software. As can be seen from Figure 5-22 and Table 5-8, the 433 MHz network utilizes a T-type filter, while the 868/915 MHz network has a π-type filter topology. It is important to remember that the physical layout and the components used contribute significantly to the reflection coefficient, especially at the higher harmonics. For this reason, the frequency response of the matching network should be measured and compared to the response of the TI reference design. Refer to Figure 5-24 and Table 5-9 as well as Figure 5-25 and Table 5-10. The use of an external T/R switch reduces current consumption in TX for high output power levels and improves the sensitivity in RX. A recommended application circuit is available from the TI web site (CC1020EMX). The external T/R switch can be omitted in certain applications, but performance will then be degraded. The match can also be tuned by a shunt capacitor array at the PA output (RF_OUT). The capacitance can be set in 0.4-pF steps and used either in RX mode or TX mode. The RX_MATCH[3:0] and TX_MATCH[3:0] bits in the MATCH register control the capacitor array. AVDD = 3 V R10 CC1021 C60 ANTENNA L2 L70 C3 RF_OUT C71 RF_IN L71 C72 C1 T/R SWITCH L1 Figure 5-22. Input and Output Matching Network 42 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-8. Component Values for the Matching Network Described in Figure 5-22 (1) ITEM 433 MHz 868 MHz 915 MHz C1 10 pF, 5%, NP0, 0402 47 pF, 5%, NP0, 0402 47 pF, 5%, NP0, 0402 C3 5.6 pF, 5%, NP0, 0402 10 pF, 5%, NP0, 0402 10 pF, 5%, NP0, 0402 C60 220 pF, 5%, NP0, 0402 220 pF, 5%, NP0, 0402 220 pF, 5%, NP0, 0402 C71 DNM (1) 8.2 pF 5%, NP0, 0402 8.2 pF 5%, NP0, 0402 C72 4.7 pF, 5%, NP0, 0402 8.2 pF 5%, NP0, 0402 8.2 pF 5%, NP0, 0402 L1 33 nH, 5%, 0402 82 nH, 5%, 0402 82 nH, 5%, 0402 3.6 nH, 5%, 0402 L2 22 nH, 5%, 0402 3.6 nH, 5%, 0402 L70 47 nH, 5%, 0402 5.1 nH, 5%, 0402 5.1 nH, 5%, 0402 L71 39 nH, 5%, 0402 0 Ω resistor, 0402 0 Ω resistor, 0402 R10 82 Ω, 5%, 0402 82 Ω, 5%, 0402 82 Ω, 5%, 0402 DNM = Do Not Mount Figure 5-23. Typical LNA Input Impedance, 200 to 1000 MHz Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 43 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com The frequency is swept from 300 MHz to 2500 MHz. Values are listed in . Figure 5-24. Typical Optimum PA Load Impedance, 433 MHz Table 5-9. Impedances at the First 5 Harmonics (433 MHz Matching Network) 44 FREQUENCY (MHz) REAL (Ohms) IMAGINARY (Ohms) 433 54 44 866 20 173 1299 288 –563 1732 14 –123 2165 5 –66 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 The frequency is swept from 300 MHz to 2800 MHz. Values are listed in Table 5-10. Figure 5-25. Typical optimum PA load impedance, 868/915 MHz Table 5-10. Impedances at the First Three Harmonics (868/915 MHz Matching Network) FREQUENCY (MHz) REAL (Ohms) IMAGINARY (Ohms) 868 15 24 915 20 35 1736 1.5 18 1830 1.7 22 2604 3.2 44 2745 3.6 45 5.12 Frequency Synthesizer 5.12.1 VCO, Charge Pump and PLL Loop Filter The VCO is completely integrated and operates in the 1608 to 1920 MHz range. A frequency divider is used to get a frequency in the UHF range (402 to 470 and 804 to 960 MHz). The BANDSELECT bit in the ANALOG register selects the frequency band. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 45 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com The VCO frequency is given by Equation 24. FREQ + 0.5 ´ DITHER ö æ fVCO = fref ´ ç 3 + ÷ 8192 è ø (24) The VCO frequency is divided by 2 and by 4 to generate frequencies in the two bands, respectively. The VCO sensitivity (sometimes referred to as VCO gain) varies over frequency and operating conditions. Typically the VCO sensitivity varies between 12 and 36 MHz/V. For calculations the geometrical mean at 21 MHz/V can be used. The PLL calibration (explained below) measures the actual VCO sensitivity and adjusts the charge pump current accordingly to achieve correct PLL loop gain and bandwidth (higher charge pump current when VCO sensitivity is lower). Equation 25 through Equation 29 can be used for calculating PLL loop filter component values, see Figure 6-1, for a desired PLL loop bandwidth, BW. æ f ö C7 = 3037 ç ref 2 ÷ - 7 [pF] BW è ø (25) æ BW ö R2 = 7126 ç ÷ [kW ] è fref ø (26) æ f ö C6 = 80.75 ç ref 2 ÷ [nF] è BW ø (27) æ BW ö R3 = 21823 ç ÷ [kW ] è fref ø (28) æ f ö C8 = 839 ç ref 2 ÷ - 6 [pF] BW è ø (29) Define a minimum PLL loop bandwidth as shown in Equation 30. BWmin = 80.75 ´ fref 220 (30) If BWmin > Baud rate/3 then set BW = BWmin and if BWmin < Baud rate/3 then set BW = Baud rate/3 in Equation 25 through Equation 29. There are two special cases when using the recommended 14.7456 MHz crystal: 1. If the data rate is 4.8 kBaud or below and the channel spacing is 12.5 kHz the following loop filter components are recommended: C6 = 220 nF C7 = 8200 pF C8 = 2200 pF R2 = 1.5 kΩ R3 = 4.7 kΩ 2. If the data rate is 4.8 kBaud or below and the channel spacing is different from 12.5 kHz the following loop filter components are recommended: C6 C7 C8 R2 R3 46 = = = = = 100 nF 3900 pF 1000 pF 2.2 kΩ 6.8 kΩ Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 After calibration the PLL bandwidth is set by the PLL_BW register in combination with the external loop filter components calculated above. The PLL_BW can be found from Equation 31. æ f ö PLL _ BW = 174 + 16 log2 ç ref ÷ è 7.126 ø (31) Where: fref is the reference frequency (in MHz). The PLL loop filter bandwidth increases with increasing PLL_BW setting. Note that in SmartRF Studio PLL_BW is fixed to 9E hex when the channel spacing is set up for 12.5 kHz, optimized selectivity. After calibration the applied charge pump current (CHP_CURRENT[3:0]) can be read in the STATUS1 register. The charge pump current is approximately given by Equation 32. I CHP = 16 ´ 2CHP _ CURRENT / 4 [mA ] (32) The combined charge pump and phase detector gain (in A/rad) is given by the charge pump current divided by 2π. The PLL bandwidth will limit the maximum modulation frequency and hence, data rate. 5.12.2 VCO and PLL Self-Calibration To compensate for supply voltage, temperature and process variations, the VCO and PLL must be calibrated. The calibration is performed automatically and sets the maximum VCO tuning range and optimum charge pump current for PLL stability. After setting up the device at the operating frequency, the self-calibration can be initiated by setting the CAL_START bit in the CALIBRATE register. The calibration result is stored internally in the chip, and is valid as long as power is not turned off. If large supply voltage drops (typically more than 0.25 V) or temperature variations (typically more than 40°C) occur after calibration, a new calibration should be performed. The nominal VCO control voltage is set by the CAL_ITERATE[2:0] bits in the CALIBRATE register. The CAL_COMPLETE bit in the STATUS register indicates that calibration has finished. The calibration wait time (CAL_WAIT) is programmable and is inverse proportional to the internal PLL reference frequency. The highest possible reference frequency should be used to get the minimum calibration time. It is recommended to use CAL_WAIT[1:0] = 11 in order to get the most accurate loop bandwidth. Table 5-11. Typical Calibration Times CALIBRATION TIME [ms] REFERENCE FREQUENCY [MHz] CAL_WAIT 1.8432 7.3728 9.8304 00 49 ms 12 ms 10 ms 01 60 ms 15 ms 11 ms 10 71 ms 18 ms 13 ms 11 109 ms 27 ms 20 ms The CAL_COMPLETE bit can also be monitored at the LOCK pin, configured by LOCK_SELECT[3:0] = 0101, and used as an interrupt input to the microcontroller. To check that the PLL is in lock the user should monitor the LOCK_CONTINUOUS bit in the STATUS register. The LOCK_CONTINUOUS bit can also be monitored at the LOCK pin, configured by LOCK_SELECT[3:0] = 0010. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 47 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com There are separate calibration values for the two frequency registers. However, dual calibration is possible if all of the below conditions apply: • The two frequencies A and B differ by less than 1 MHz. • Reference frequencies are equal (REF_DIV_A[2:0] = REF_DIV_B[2:0] in the CLOCK_A/CLOCK_B registers). • VCO currents are equal (VCO_CURRENT_A[3:0] = VCO_CURRENT_B[3:0] in the VCO register). The CAL_DUAL bit in the CALIBRATE register controls dual or separate calibration. The single calibration algorithm (CAL_DUAL=0) using separate calibration for RX and TX frequency is illustrated in Figure 5-26. The same algorithm is applicable for dual calibration if CAL_DUAL=1. Refer to Application Note AN023 CC1020 MCU Interfacing (SWRA069), which includes example source code for single calibration. TI recommends that single calibration be used for more robust operation. There is a small, but finite, possibility that the PLL self-calibration will fail. The calibration routine in the source code should include a loop so that the PLL is re-calibrated until PLL lock is achieved if the PLL does not lock the first time. Refer to CC1020 Errata Note 004, available in the CC1020 product folder. 48 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Start single calibration fref is the reference frequency (in MHz) Write FREQ_A, FREQ_B, VCO, CLOCK_A and CLOCK_B registers. PLL_BW = 174 + 16log2(fref/7.126) Calibrate RX frequency register A (to calibrate TX frequency register B write MAIN register = D1h). Register CALIBRATE = 34h Write MAIN register = 11h: RXTX=0, F_REG=0, PD_MODE=1, FS_PD=0, CORE_PD=0, BIAS_PD=0, RESET_N=1 Write CALIBRATE register = B4h Start calibration Wait for T≥100 us Read STATUS register and wait until CAL_COMPLETE=1 Read STATUS register and wait until LOCK_CONTINUOUS=1 Calibration OK? No Yes End of calibration Figure 5-26. Single Calibration Algorithm for RX and TX 5.12.3 PLL Turn-on Time Versus Loop Filter Bandwidth If calibration has been performed the PLL turn-on time is the time needed for the PLL to lock to the desired frequency when going from power down mode (with the crystal oscillator running) to TX or RX mode. The PLL turn-on time depends on the PLL loop filter bandwidth. Table 5-12 gives the PLL turn-on time for different PLL loop filter bandwidths. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 49 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-12. Typical PLL Turn-on Time to Within ±10% of Channel Spacing for Different Loop Filter Bandwidths C6 [nF] C7 [pF] C8 [pF] R2 [kΩ] R3 [kΩ] PLL TURN-ON TIME [µs] 220 8200 2200 1.5 4.7 3200 Up to 4.8 kBaud data rate, 12.5 kHz channel spacing 100 3900 1000 2.2 6.8 2500 Up to 4.8 kBaud data rate, 25 kHz channel spacing 56 2200 560 3.3 10 1400 Up to 9.6 kBaud data rate, 50 kHz channel spacing 15 560 150 5.6 18 1300 Up to 19.2 kBaud data rate, 100 kHz channel spacing 3.9 120 33 12 39 1080 Up to 38.4 kBaud data rate, 150 kHz channel spacing 1.0 27 3.3 27 82 950 Up to 76.8 kBaud data rate, 200 kHz channel spacing 0.2 1.5 — 47 150 700 Up to 153.6 kBaud data rate, 500 kHz channel spacing COMMENT 5.12.4 PLL Lock Time Versus Loop Filter Bandwidth If calibration has been performed the PLL lock time is the time needed for the PLL to lock to the desired frequency when going from RX to TX mode or vice versa. The PLL lock time depends on the PLL loop filter bandwidth. Table 5-13 gives the PLL lock time for different PLL loop filter bandwidths. Table 5-13. Typical PLL Lock Time to Within ±10% of Channel Spacing for Different Loop Filter Bandwidths (1) (1) 50 PLL LOCK TIME [µs] C6 [nF] C7 [pF] C8 [pF] R2 [kΩ] R3 [kΩ] 1 2 3 220 8200 2200 1.5 4.7 900 180 1300 Up to 4.8 kBaud data rate, 12.5 kHz channel spacing 100 3900 1000 2.2 6.8 640 270 830 Up to 4.8 kBaud data rate, 25 kHz channel spacing 56 2200 560 3.3 10 400 140 490 Up to 9.6 kBaud data rate, 50 kHz channel spacing 15 560 150 5.6 18 140 70 230 Up to 19.2 kBaud data rate, 100 kHz channel spacing 3.9 120 33 12 39 75 50 180 Up to 38.4 kBaud data rate, 150 kHz channel spacing 1.0 27 3.3 27 82 30 15 55 Up to 76.8 kBaud data rate, 200 kHz channel spacing 0.2 1.5 — 47 150 14 14 28 Up to 153.6 kBaud data rate, 500 kHz channel spacing Comment 1) 307.2 kHz step, 2) 1 channel step, 3) 1 MHz step Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.13 VCO and LNA Current Control The VCO current is programmable and should be set according to operating frequency, RX/TX mode and output power. Recommended settings for the VCO_CURRENT bits in the VCO register are shown in Table 5-16 and are also given by SmartRF Studio. The VCO current for frequency FREQ_A and FREQ_B can be programmed independently. The bias currents for the LNA, mixer and the LO and PA buffers are also programmable. The FRONTEND and the BUFF_CURRENT registers control these currents. 5.14 Power Management CC1020 offers great flexibility for power management in order to meet strict power consumption requirements in battery-operated applications. Power down mode is controlled through the MAIN register. There are separate bits to control the RX part, the TX part, the frequency synthesizer and the crystal oscillator in the MAIN register. This individual control can be used to optimize for lowest possible current consumption in each application. Figure 5-27 shows a typical power-on and initializing sequence for minimum power consumption. Figure 5-28 shows a typical sequence for activating RX and TX mode from power down mode for minimum power consumption. NOTE PSEL should be tri-stated or set to a high level during power down mode in order to prevent a trickle current from flowing in the internal pullup resistor. Application Note AN023 CC1020 MCU Interfacing (SWRA069) includes example source code. TI recommends resetting the CC1020 (by clearing the RESET_N bit in the MAIN register) when the chip is powered up initially. All registers that need to be configured should then be programmed (those which differ from their default values). Registers can be programmed freely in any order. The CC1020 should then be calibrated in both RX and TX mode. After this is completed, the CC1020 is ready for use. See the detailed procedure flowcharts in Figure 5-26 through Figure 5-28. With reference to Application Note AN023 CC1020 MCU Interfacing (SWRA069), TI recommends the following sequence: After power up: 1. ResetCC1020 2. Initialize 3. WakeUpCC1020ToRX 4. Calibrate 5. WakeUpCC1020ToTX 6. Calibrate After calibration is completed, enter TX mode (SetupCC1020TX), RX mode (SetupCC1020RX) or power down mode (SetupCC1020PD). From power-down mode to RX: 1. WakeUpCC1020ToRX 2. SetupCC1020RX Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 51 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com From power-down mode to TX: 1. WakeUpCC1020ToTX 2. SetupCC1020TX Switching from RX to TX mode: 1. SetupCC1020TX Switching from TX to RX mode: 1. SetupCC1020RX Power Off ResetCC1020 Turn on power Reset CC1020 MAIN: RX_TX=0, F_REG=0, PD_MODE=1, FS_PD=1, XOSC_PD=1, BIAS_PD=1 RESET_N=0 RESET_N=1 WakeupCC1020ToRx/ WakeupCC1020ToTx Program all necessary registers except MAIN and RESET Turn on crystal oscillator, bias generator and synthesizer successively SetupCC1020PD Calibrate VCO and PLL MAIN: PD_MODE=1, FS_PD=1, XOSC_PD=1, BIAS_PD=1 PA_POWER=00h Power Down mode Figure 5-27. Initializing Sequence 52 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Power Down mode WakeupCC1020ToTx Turn on bias generator. MAIN: BIAS_PD=0 Wait 150 us RX or TX? TX Turn on frequency synthesizer MAIN: RXTX=1, F_REG=1, FS_PD=0 Wait until lock detected from LOCK pin or STATUS register Turn on RX: MAIN: PD_MODE = 0 Wait until lock detected from LOCK pin or STATUS register Turn on TX: MAIN: PD_MODE = 0 Set PA_POWER RX mode TX mode SetupCC1020PD Turn off RX/TX: MAIN: PD_MODE = 1, FS_PD=1, XOSC_PD=1, BIAS_PD=1 PA_POWER=00h SetupCC1020PD Turn on frequency synthesizer MAIN: RXTX=0, F_REG=0, FS_PD=0 SetupCC1020Tx WakeupCC1020ToRx Turn on crystal oscillator core MAIN: PD_MODE=1, FS_PD=1, XOSC_PD=0, BIAS_PD=1 Wait 1.2 ms* RX SetupCC1020Rx *Time to wait depends on the crystal frequency and the load capacitance Power Down mode Figure 5-28. Sequence for Activating RX or TX Mode 5.15 On-Off Keying (OOK) The data modulator can also provide OOK (On-Off Keying) modulation. OOK is an ASK (Amplitude Shift Keying) modulation using 100% modulation depth. OOK modulation is enabled in RX and in TX by setting TXDEV_M[3:0] = 0000 in the DEVIATION register. An OOK eye diagram is shown in Figure 5-29. The data demodulator can also perform OOK demodulation. The demodulation is done by comparing the signal level with the “carrier sense” level (programmed as CS_LEVEL in the VGA4 register). The signal is then decimated and filtered in the data filter. Data decision and bit synchronization are as for FSK reception. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 53 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com In this mode, AGC_AVG in the VGA2 register must be set to 3. The channel bandwidth must be 4 times the Baud rate for data rates up to 9.6 kBaud. For the highest data rates the channel bandwidth must be 2 times the Baud rate (see Table 5-14). Manchester coding must always be used for OOK. NOTE The automatic frequency control (AFC) cannot be used when receiving OOK, as it requires a frequency shift. The AGC has a certain time-constant determined by FILTER_CLK, which depends on the IF filter bandwidth. There is a lower limit on FILTER_CLK and hence the AGC time constant. For very low data rates the minimum time constant is too fast and the AGC will increase the gain when a “0” is received and decrease the gain when a “1” is received. For this reason the minimum data rate in OOK is 2.4 kBaud. Typical figures for the receiver sensitivity (BER = 10–3) are shown in Table 5-14 for OOK. 9.6 kBaud Figure 5-29. OOK Eye Diagram Table 5-14. Typical Receiver Sensitivity as a Function of Data Rate at 433 and 868 MHz, OOK Modulation, BER = 10–3, Pseudo-random Data (PN9 Sequence) DATA RATE [kBaud] 54 FILTER BW [kHz] SENSITIVITY [dBm] 433 MHz MANCHESTER MODE 868 MHz MANCHESTER MODE 2.4 9.6 –116 — 4.8 19.2 –113 –107 9.6 38.4 –103 –104 19.2 51.2 –102 –101 38.4 102.4 –95 –97 76.8 153.6 –92 –94 153.6 307.2 –81 –87 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.16 Crystal Oscillator The recommended crystal frequency is 14.7456 MHz, but any crystal frequency in the range 4 to 20 MHz can be used. Using a crystal frequency different from 14.7456 MHz might in some applications give degraded performance. Refer to AN022 Crystal Frequency Selection (SWRA070) for more details on the use of other crystal frequencies than 14.7456 MHz. The crystal frequency is used as reference for the data rate (as well as other internal functions) and in the 4 to 20 MHz range the frequencies 4.9152, 7.3728, 9.8304, 12.2880, 14.7456, 17.2032, 19.6608 MHz will give accurate data rates (as shown in Table 5-4) and an IF frequency of 307.2 kHz. The crystal frequency will influence the programming of the CLOCK_A, CLOCK_B and MODEM registers. An external clock signal or the internal crystal oscillator can be used as main frequency reference. An external clock signal should be connected to XOSC_Q1, while XOSC_Q2 should be left open. The XOSC_BYPASS bit in the INTERFACE register should be set to ‘1’ when an external digital rail-to-rail clock signal is used. No DC block should be used then. A sine with smaller amplitude can also be used. A DC blocking capacitor must then be used (10 nF) and the XOSC_BYPASS bit in the INTERFACE register should be set to ‘0’. For input signal amplitude, see Section 4.8. Using the internal crystal oscillator, the crystal must be connected between the XOSC_Q1 and XOSC_Q2 pins. The oscillator is designed for parallel mode operation of the crystal. In addition, loading capacitors (C4 and C5) for the crystal are required. The loading capacitor values depend on the total load capacitance, CL, specified for the crystal. The total load capacitance seen between the crystal terminals should equal CL for the crystal to oscillate at the specified frequency. 1 CL = + Cparasitic 1 1 + C4 C 5 (33) The parasitic capacitance is constituted by pin input capacitance and PCB stray capacitance. Total parasitic capacitance is typically 8 pF. A trimming capacitor may be placed across C5 for initial tuning if necessary. The crystal oscillator circuit is shown in Figure 5-30. Typical component values for different values of CL are given in Table 5-15. The crystal oscillator is amplitude regulated. This means that a high current is required to initiate the oscillations. When the amplitude builds up, the current is reduced to what is necessary to maintain approximately 600 mVpp amplitude. This ensures a fast start-up, keeps the drive level to a minimum and makes the oscillator insensitive to ESR variations. As long as the recommended load capacitance values are used, the ESR is not critical. The initial tolerance, temperature drift, aging and load pulling should be carefully specified in order to meet the required frequency accuracy in a certain application. By specifying the total expected frequency accuracy in SmartRF Studio together with data rate and frequency separation, the software will estimate the total bandwidth and compare to the available receiver channel filter bandwidth. The software will report any contradictions and a more accurate crystal will be recommended if required. XOSC_Q2 XOSC_Q1 XTAL C4 C5 Figure 5-30. Crystal Oscillator Circuit Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 55 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-15. Crystal Oscillator Component Values ITEM CL = 12 pF CL = 16 pF CL = 22 pF C4 6.8 pF 15 pF 27 pF C5 6.8 pF 15 pF 27 pF 5.17 Built-in Test Pattern Generator The CC1020 has a built-in test pattern generator that generates a PN9 pseudo random sequence. The PN9_ENABLE bit in the MODEM register enables the PN9 generator. A transition on the DIO pin is required after enabling the PN9 pseudo random sequence. The PN9 pseudo random sequence is defined by the polynomial x9 + x5 + 1. The PN9 sequence is ‘XOR’ed with the DIO signal in both TX and RX mode as shown in Figure 5-31. Hence, by transmitting only zeros (DIO = 0), the BER (Bit Error Rate) can be tested by counting the number of received ones. Note that the 9 first received bits should be discarded in this case. Also note that one bit error will generate 3 received ones. Transmitting only ones (DIO = 1), the BER can be tested by counting the number of received zeroes. The PN9 generator can also be used for transmission of ‘real-life’ data when measuring narrowband ACP (Adjacent Channel Power), modulation bandwidth or occupied bandwidth. Tx pseudo random sequence Tx out (modulating signal) Tx data (DIO pin) XOR 8 7 6 5 4 3 2 1 0 5 4 3 2 1 0 XOR Rx pseudo random sequence Rx in (Demodulated Rx data) 8 7 6 XOR XOR Rx out (DIO pin) Figure 5-31. PN9 Pseudo-random Sequence Generator in TX and RX Mode 5.18 Interrupt on Pin DCLK 5.18.1 Interrupt Upon PLL Lock In synchronous mode the DCLK pin on CC1020 can be used to give an interrupt signal to wake the microcontroller when the PLL is locked. 56 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 PD_MODE[1:0] in the MAIN register should be set to 01. If DCLK_LOCK in the INTERFACE register is set to 1 the DCLK signal is always logic high if the PLL is not in lock. When the PLL locks to the desired frequency the DCLK signal changes to logic 0. When this interrupt has been detected write PD_MODE[1:0] = 00. This will enable the DCLK signal. This function can be used to wait for the PLL to be locked before the PA is ramped up in transmit mode. In receive mode, it can be used to wait until the PLL is locked before searching for preamble. 5.18.2 Interrupt Upon Received Signal Carrier Sense In synchronous mode the DCLK pin on CC1020 can also be used to give an interrupt signal to the microcontroller when the RSSI level exceeds a certain threshold (carrier sense threshold). This function can be used to wake or interrupt the microcontroller when a strong signal is received. Gating the DCLK signal with the carrier sense signal makes the interrupt signal. This function should only be used in receive mode and is enabled by setting DCLK_CS = 1 in the INTERFACE register. The DCLK signal is always logic high unless carrier sense is indicated. When carrier sense is indicated the DCLK starts running. When gating the DCLK signal with the carrier sense signal at least 2 dummy bits should be added after the data payload in TX mode. The reason being that the carrier sense signal is generated earlier in the receive chain (that is, before the demodulator), causing it to be updated 2 bits before the corresponding data is available on the DIO pin. In transmit mode DCLK_CS must be set to 0. Refer to CC1020 Errata Note 002, available in the CC1020 product folder. 5.19 PA_EN and LNA_EN Digital Output Pins 5.19.1 Interfacing an External LNA or PA CC1020 has two digital output pins, PA_EN and LNA_EN, which can be used to control an external LNA or PA. The functionality of these pins are controlled through the INTERFACE register. The outputs can also be used as general digital output control signals. EXT_PA_POL and EXT_LNA_POL control the active polarity of the signals. EXT_PA and EXT_LNA control the function of the pins. If EXT_PA = 1, then the PA_EN pin will be activated when the internal PA is turned on. Otherwise, the EXT_PA_POL bit controls the PA_EN pin directly. If EXT_LNA = 1, then the LNA_EN pin will be activated when the internal LNA is turned on. Otherwise, the EXT_LNA_POL bit controls the LNA_EN pin directly. These two pins can therefore also be used as two general control signals, see Section 5.19.2. In the TI reference design LNA_EN and PA_EN are used to control the external T/R switch. 5.19.2 General Purpose Output Control Pins The two digital output pins, PA_EN and LNA_EN, can be used as two general control signals by setting EXT_PA = 0 and EXT_LNA = 0. The output value is then set directly by the value written to EXT_PA_POL and EXT_LNA_POL. The LOCK pin can also be used as a general-purpose output pin. The LOCK pin is controlled by LOCK_SELECT[3:0] in the LOCK register. The LOCK pin is low when LOCK_SELECT[3:0] = 0000, and high when LOCK_SELECT[3:0] = 0001. These features can be used to save I/O pins on the microcontroller when the other functions associated with these pins are not used. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 57 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com 5.19.3 PA_EN and LNA_EN Pin Drive Figure 5-32 shows the PA_EN and LNA_EN pin drive currents. The sink and source currents have opposite signs but absolute values are used in Figure 5-32. 1400 1200 Current [uA] 1000 800 600 400 200 3.6 3.4 3.2 3 2.8 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 Voltage on PA_EN/LNA_EN pin [V] source current, 3 V sink current, 3 V source current, 2.3 V sink current, 2.3 V source current, 3.6 V sink current, 3.6 V Figure 5-32. Typical PA_EN and LNA_EN Pin Drive 5.20 System Considerations and Guidelines 5.20.1 SRD Regulations International regulations and national laws regulate the use of radio receivers and transmitters. SRDs (Short Range Devices) for license free operation are allowed to operate in the 433 and 868 to 870 MHz bands in most European countries. In the United States, such devices operate in the 260 to 470 and 902 to 928 MHz bands. CC1020 is also applicable for use in the 950 to 960 MHz frequency band in Japan. A summary of the most important aspects of these regulations can be found in AN001 SRD Regulations For License Free Transceiver Operation (SWRA090). 5.20.2 Narrowband Systems CC1020 is specifically designed for narrowband systems complying with ARIB STD-T67 and EN 300 220. The CC1020 meets the strict requirements to ACP (Adjacent Channel Power) and occupied bandwidth for a narrowband transmitter. To meet the ARIB STD-T67 requirements, a 3.0 V regulated voltage supply should be used. For the receiver side, CC1020 gives very good ACR (Adjacent Channel Rejection), image frequency suppression and blocking properties for channel spacings down to 12.5 kHz. Such narrowband performance normally requires the use of external ceramic filters. The CC1020 provides this performance as a true single-chip solution with integrated IF filters. Japan and Korea have allocated several frequency bands at 424, 426, 429, 447, 449 and 469 MHz for narrowband license free operation. CC1020 is designed to meet the requirements for operation in all these bands, including the strict requirements for narrowband operation down to 12.5 kHz channel spacing. Due to on-chip complex filtering, the image frequency is removed. An on-chip calibration circuit is used to get the best possible image rejection. A narrowband preselector filter is not necessary to achieve image rejection. 58 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 A unique feature in CC1020 is the very fine frequency resolution. This can be used for temperature compensation of the crystal if the temperature drift curve is known and a temperature sensor is included in the system. Even initial adjustment can be performed using the frequency programmability. This eliminates the need for an expensive TCXO and trimming in some applications. For more details refer to AN027 Temperature Compensation by Indirect Method (SWRA065). In less demanding applications, a crystal with low temperature drift and low aging could be used without further compensation. A trimmer capacitor in the crystal oscillator circuit (in parallel with C5) could be used to set the initial frequency accurately. The frequency offset between a transmitter and receiver is measured in the CC1020 and can be read back from the AFC register. The measured frequency offset can be used to calibrate the receiver frequency using the transmitter as the reference. For more details refer to AN029 CC1020/1021 Automatic Frequency Control (AFC) (SWRA063). CC1020 also has the possibility to use Gaussian shaped FSK (GFSK). This spectrum-shaping feature improves adjacent channel power (ACP) and occupied bandwidth. In ‘true’ FSK systems with abrupt frequency shifting, the spectrum is inherently broad. By making the frequency shift ‘softer’, the spectrum can be made significantly narrower. Thus, higher data rates can be transmitted in the same bandwidth using GFSK. 5.20.3 Low Cost Systems As the CC1020 provides true narrowband multi-channel performance without any external filters, a very low cost high performance system can be achieved. The oscillator crystal can then be a low cost crystal with 50 ppm frequency tolerance using the on-chip frequency tuning possibilities. 5.20.4 Battery Operated Systems In low power applications, the power down mode should be used when CC1020 is not being active. Depending on the start-up time requirement, the oscillator core can be powered during power down. See Section 5.14 for information on how effective power management can be implemented. 5.20.5 High Reliability Systems Using a SAW filter as a preselector will improve the communication reliability in harsh environments by reducing the probability of blocking. The receiver sensitivity and the output power will be reduced due to the filter insertion loss. By inserting the filter in the RX path only, together with an external RX/TX switch, only the receiver sensitivity is reduced and output power is remained. The PA_EN and LNA_EN pin can be configured to control an external LNA, RX/TX switch or power amplifier. This is controlled by the INTERFACE register. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 59 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com 5.20.6 Frequency Hopping Spread Spectrum Systems (FHSS) Due to the very fast locking properties of the PLL, the CC1020 is also very suitable for frequency hopping systems. Hop rates of 1to100 hops/s are commonly used depending on the bit rate and the amount of data to be sent during each transmission. The two frequency registers (FREQ_A and FREQ_B) are designed such that the ‘next’ frequency can be programmed while the ‘present’ frequency is used. The switching between the two frequencies is done through the MAIN register. Several features have been included to do the hopping without a need to re-synchronize the receiver. For more details, refer to Application Note AN014 Frequency Hopping Systems (SWRA077). In order to implement a frequency hopping system with CC1020 do the following: Set the desired frequency, calibrate and store the following register settings in non-volatile memory: STATUS1[3:0]: CHP_CURRENT[3:0] STATUS2[4:0]: VCO_ARRAY[4:0] TEST1[3:0]: CHP_CO[3:0] STATUS3[5:0]:VCO_CAL_CURRENT[5:0] Repeat the calibration for each desired frequency. VCO_CAL_CURRENT[5:0] is not dependent on the RF frequency and the same value can be used for all frequencies. When performing frequency hopping, write the stored values to the corresponding TEST1, TEST2 and TEST3 registers, and enable override: TEST2[4:0]: VCO_AO[4:0] TEST2[5]: VCO_OVERRIDE TEST2[6]: CHP_OVERRIDE TEST3[5:0]: VCO_CO[5:0] TEST3[6]: VCO_CAL_OVERRIDE CHP_CO[3:0] is the register setting read from CHP_CURRENT[3:0], VCO_AO[4:0] is the register setting read from VCO_ARRAY[4:0] and VCO_CO[5:0] is the register setting read from VCO_CAL_CURRENT[5:0]. Assume channel 1 defined by register FREQ_A is currently being used and that CC1020 should operate on channel 2 next (to change channel simply write to register MAIN[6]). The channel 2 frequency can be set by register FREQ_B which can be written to while operating on channel 1. The calibration data must be written to the TEST1-3 registers after switching to the next frequency. That is, when hopping to a new channel write to register MAIN[6] first and the test registers next. The PA should be switched off between each hop and the PLL should be checked for lock before switching the PA back on after a hop has been performed. NOTE The override bits VCO_OVERRIDE, CHP_OVERRIDE and VCO_CAL_OVERRIDE must be disabled when performing a re-calibration. 60 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 5.21 Antenna Considerations CC1020 can be used together with various types of antennas. The most common antennas for shortrange communication are monopole, helical and loop antennas. Monopole antennas are resonant antennas with a length corresponding to one quarter of the electrical l wavelength ( 4 ). They are very easy to design and can be implemented simply as a “piece of wire” or even integrated onto the PCB. l Non-resonant monopole antennas shorter than 4 can also be used, but at the expense of range. In size and cost critical applications such an antenna may very well be integrated onto the PCB. Helical antennas can be thought of as a combination of a monopole and a loop antenna. They are a good compromise in size critical applications. But helical antennas tend to be more difficult to optimize than the simple monopole. Loop antennas are easy to integrate into the PCB, but are less effective due to difficult impedance matching because of their very low radiation resistance. l For low power applications the 4 monopole antenna is recommended due to its simplicity as well as providing the best range. l The length of the 4 monopole antenna is given by Equation 34. 7125 L= f (34) Where: f is in MHz, giving the length in cm. An antenna for 868 MHz should be 8.2 cm, and 16.4 cm for 433 MHz. The antenna should be connected as close as possible to the IC. If the antenna is located away from the input pin the antenna should be matched to the feeding transmission line (50 Ω). For a more thorough background on antennas, please refer to AN003 SRD Antennas (SWRA088). Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 61 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com 5.22 Configuration Registers The configuration of CC1020 is done by programming the 8-bit configuration registers. The configuration data based on selected system parameters are most easily found by using the SmartRF Studio software. Complete descriptions of the registers are given in Section 5.22.1. After a RESET is programmed, all the registers have default values. The TEST registers also get default values after a RESET, and should not be altered by the user. TI recommends using the register settings found using the SmartRF Studio software. These are the register settings that TI specifies across temperature, voltage, and process. Check the TI web site for regularly updates to the SmartRF Studio software. Table 5-16. CC1020 Register Overview ADDRESS 62 ACRONYM REGISTER NAME 00h MAIN 01h INTERFACE Main control register 02h RESET 03h SEQUENCING 04h FREQ_2A Frequency register 2A 05h FREQ_1A Frequency register 1A 06h FREQ_0A Frequency register 0A 07h CLOCK_A Clock generation register A 08h FREQ_2B Frequency register 2B 09h FREQ_1B Frequency register 1B 0Ah FREQ_0B Frequency register 0B 0Bh CLOCK_B Clock generation register B 0Ch VCO VCO current control register 0Dh MODEM Interface control register Digital module reset register Automatic power-up sequencing control register Modem control register 0Eh DEVIATION 0Fh AFC_CONTROL TX frequency deviation register 10h FILTER 11h VGA1 VGA control register 1 12h VGA2 VGA control register 2 13h VGA3 VGA control register 3 14h VGA4 VGA control register 4 15h LOCK Lock control register 16h FRONTEND 17h ANALOG RX AFC control register Channel filter / RSSI control register 18h BUFF_SWING 19h BUFF_CURRENT 1Ah PLL_BW Front end bias current control register Analog modules control register LO buffer and prescaler swing control register LO buffer and prescaler bias current control register PLL loop bandwidth / charge pump current control register 1Bh CALIBRATE PLL calibration control register 1Ch PA_POWER Power amplifier output power register 1Dh MATCH 1Eh PHASE_COMP Phase error compensation control register for LO I/Q 1Fh GAIN_COMP Gain error compensation control register for mixer I/Q 20h POWERDOWN 21h TEST1 Test register for overriding PLL calibration 22h TEST2 Test register for overriding PLL calibration 23h TEST3 Test register for overriding PLL calibration 24h TEST4 Test register for charge pump and IF chain testing Match capacitor array control register, for RX and TX impedance matching Power-down control register Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-16. CC1020 Register Overview (continued) ADDRESS ACRONYM 25h TEST5 Test register for ADC testing REGISTER NAME 26h TEST6 Test register for VGA testing 27h TEST7 Test register for VGA testing 40h STATUS 41h RESET_DONE 42h RSSI Received signal strength register 43h AFC Average received frequency deviation from IF (can be used for AFC) 44h GAUSS_FILTER 45h STATUS1 Status of PLL calibration results and so on (test only) 46h STATUS2 Status of PLL calibration results and so on (test only) 47h STATUS3 Status of PLL calibration results and so on (test only) 48h STATUS4 Status of ADC signals (test only) Status information register (PLL lock, RSSI, calibration ready, and so on) Status register for digital module reset Digital FM demodulator register 49h STATUS5 Status of channel filter “I” signal (test only) 4Ah STATUS6 Status of channel filter “Q” signal (test only) 4Bh STATUS7 Status of AGC (test only) 5.22.1 Memory Table 5-17. MAIN Register (00h) REGISTER NAME DEFAULT VALUE ACTIVE MAIN[7] RXTX — — RX/TX switch, 0: RX , 1: TX MAIN[6] F_REG — — Selection of Frequency Register, 0: Register A, 1: Register B MAIN[5:4] PD_MODE[1:0] — — Power down mode DESCRIPTION 0 (00): Receive Chain in power-down in TX, PA in power-down in RX 1 (01): Receive Chain and PA in power down in both TX and RX 2 (10): Individual modules can be put in power down by programming the POWERDOWN register 3 (11): Automatic power-up sequencing is activated (see Table 5-18) MAIN[3] FS_PD — H Power Down of Frequency Synthesizer MAIN[2] XOSC_PD — H Power Down of Crystal Oscillator Core MAIN[1] BIAS_PD — H Power Down of BIAS (Global Current Generator) and Crystal Oscillator Buffer MAIN[0] RESET_N — L Reset, active low. Writing RESET_N low will write default values to all other registers than MAIN. Bits in MAIN do not have a default value and will be written directly through the configuration interface. Must be set high to complete reset. Table 5-18. MAIN Register (00h) When Using Automatic Power-up Sequencing (RXTX = 0, PD_MODE[1:0] =11) REGISTER NAME DEFAULT VALUE ACTIVE MAIN[7] RXTX — — Automatic power-up sequencing only works in RX (RXTX=0) MAIN[6] F_REG — — Selection of Frequency Register, 0: Register A, 1: Register B MAIN[5:4] PD_MODE[1:0] — H Set PD_MODE[1:0]=3 (11) to enable sequencing DESCRIPTION Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 63 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-18. MAIN Register (00h) When Using Automatic Power-up Sequencing (RXTX = 0, PD_MODE[1:0] =11) (continued) REGISTER NAME DEFAULT VALUE ACTIVE MAIN[3:2] SEQ_CAL[1:0] — — DESCRIPTION Controls PLL calibration before re-entering power down 0: Never perform PLL calibration as part of sequence 1: Always perform PLL calibration at end of sequence 2: Perform PLL calibration at end of every 16th sequence 3: Perform PLL calibration at end of every 256th sequence MAIN[1] SEQ_PD — ↑ ↑1: Put the chip in power down and wait for start of new power-up sequence MAIN[0] RESET_N — L Reset, active low. Writing RESET_N low will write default values to all other registers than MAIN. Bits in MAIN do not have a default value and will be written directly through the configuration interface. Must be set high to complete reset. Table 5-19. INTERFACE Register (01h) (1) REGISTER NAME DEFAULT VALUE ACTIVE INTERFACE[7] XOSC_BYPASS 0 H DESCRIPTION Bypass internal crystal oscillator, use external clock 0: Internal crystal oscillator is used, or external sine wave fed through a coupling capacitor 1: Internal crystal oscillator in power down, external clock with railto-rail swing is used INTERFACE[6] SEP_DI_DO 0 H Use separate pin for RX data output 0: DIO is data output in RX and data input in TX. LOCK pin is available (Normal operation). 1: DIO is always input, and a separate pin is used for RX data output (synchronous mode: LOCK pin, asynchronous mode: DCLK pin). If SEP_DI_DO=1 and SEQ_PSEL=0 in SEQUENCING register then negative transitions on DIO is used to start power-up sequencing when PD_MODE=3 (power-up sequencing is enabled). INTERFACE[5] DCLK_LOCK 0 H Gate DCLK signal with PLL lock signal in synchronous mode Only applies when PD_MODE = "01" 0: DCLK is always 1 1: DCLK is always 1 unless PLL is in lock INTERFACE[4] DCLK_CS 0 H Gate DCLK signal with carrier sense indicator in synchronous mode Use when receive chain is active (in power up) Always set to 0 in TX mode. 0: DCLK is independent of carrier sense indicator. 1: DCLK is always 1 unless carrier sense is indicated INTERFACE[3] EXT_PA 0 H Use PA_EN pin to control external PA 0: PA_EN pin always equals EXT_PA_POL bit 1: PA_EN pin is asserted when internal PA is turned on INTERFACE[2] EXT_LNA 0 H Use LNA_EN pin to control external LNA 0: LNA_EN pin always equals EXT_LNA_POL bit 1: LNA_EN pin is asserted when internal LNA is turned on INTERFACE[1] EXT_PA_POL 0 H Polarity of external PA control 0: PA_EN pin is "0" when activating external PA 1: PA_EN pin is “1” when activating external PA INTERFACE[0] EXT_LNA_POL 0 H Polarity of external LNA control 0: LNA_EN pin is “0” when activating external LNA 1: LNA_EN pin is “1” when activating external LNA (1) 64 If TF_ENABLE=1 or TA_ENABLE=1 in TEST4 register, then INTERFACE[3:0] controls analog test module: INTERFACE[3] = TEST_PD, INTERFACE[2:0] = TEST_MODE[2:0]. Otherwise, TEST_PD=1 and TEST_MODE[2:0]=001. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-20. RESET Register (02h) (1) (2) NAME DEFAULT VALUE ACTIVE RESET[7] ADC_RESET_N 0 L Reset ADC control logic RESET[6] AGC_RESET_N 0 L Reset AGC (VGA control) logic RESET[5] GAUSS_RESET_N 0 L Reset Gaussian data filter RESET[4] AFC_RESET_N 0 L Reset AFC / FSK decision level logic RESET[3] BITSYNC_RESET_N 0 L Reset modulator, bit synchronization logic and PN9 PRBS generator RESET[2] SYNTH_RESET_N 0 L Reset digital part of frequency synthesizer RESET[1] SEQ_RESET_N 0 L Reset power-up sequencing logic RESET[0] CAL_LOCK_RESET_N 0 L Reset calibration logic and lock detector REGISTER (1) (2) DESCRIPTION For reset of CC1020 write RESET_N=0 in the MAIN register. The reset register should not be used during normal operation. Bits in the RESET register are self-clearing (will be set to 1 when the reset operation starts). Relevant digital clocks must be running for the resetting to complete. After writing to the RESET register, the user should verify that all reset operations have been completed, by reading the RESET_DONE status register (41h) until all bits equal 1. Table 5-21. SEQUENCING Register (03h) REGISTER NAME DEFAULT VALUE ACTIVE SEQUENCING[7] SEQ_PSEL 1 H DESCRIPTION Use PSEL pin to start sequencing 0: PSEL pin does not start sequencing. Negative transitions on DIO starts power-up sequencing if SEP_DI_DO=1. 1: Negative transitions on the PSEL pin will start power-up sequencing SEQUENCING[6:4] RX_WAIT[2:0] 0 — Waiting time from PLL enters lock until RX power up 0: Wait for approx. 32 ADC_CLK periods (26 μs) 1: Wait for approx. 44 ADC_CLK periods (36 μs) 2: Wait for approx. 64 ADC_CLK periods (52 μs) 3: Wait for approx. 88 ADC_CLK periods (72 μs) 4: Wait for approx. 128 ADC_CLK periods (104 μs) 5: Wait for approx. 176 ADC_CLK periods (143 μs) 6: Wait for approx. 256 ADC_CLK periods (208 μs) 7: No additional waiting time before RX power up SEQUENCING[3:0] CS_WAIT[3:0] 10 — Waiting time for carrier sense from RX power up 0: Wait 20 FILTER_CLK periods before power down 1: Wait 22 FILTER_CLK periods before power down 2: Wait 24 FILTER_CLK periods before power down 3: Wait 26 FILTER_CLK periods before power down 4: Wait 28 FILTER_CLK periods before power down 5: Wait 30 FILTER_CLK periods before power down 6: Wait 32 FILTER_CLK periods before power down 7: Wait 36 FILTER_CLK periods before power down 8: Wait 40 FILTER_CLK periods before power down 9: Wait 44 FILTER_CLK periods before power down 10: Wait 48 FILTER_CLK periods before power down 11: Wait 52 FILTER_CLK periods before power down 12: Wait 56 FILTER_CLK periods before power down 13: Wait 60 FILTER_CLK periods before power down 14: Wait 64 FILTER_CLK periods before power down 15: Wait 72 FILTER_CLK periods before power down Table 5-22. FREQ_2A Register (04h) REGISTER NAME DEFAULT VALUE ACTIVE FREQ_2A[7:0] FREQ_A[22:15] 131 — DESCRIPTION 8 MSB of frequency control word A Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 65 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-23. FREQ_1A Register (05h) REGISTER NAME DEFAULT VALUE ACTIVE FREQ_1A[7:0] FREQ_1A[7:0] 177 — DESCRIPTION Bit 15 to 8 of frequency control word A Table 5-24. FREQ_0A Register (06h) REGISTER NAME DEFAULT VALUE ACTIVE FREQ_0A[7:1] FREQ_A[6:0] 124 — 7 LSB of frequency control word A FREQ_0A[0] DITHER_A 1 H Enable dithering for frequency A DESCRIPTION Table 5-25. CLOCK_A Register (07h) REGISTER NAME DEFAULT VALUE ACTIVE CLOCK_A[7:5] REF_DIV_A[2:0] 2 — DESCRIPTION Reference frequency divisor (A): 0: Not supported 1: REF_CLK frequency = Crystal frequency / 2 … 7: REF_CLK frequency = Crystal frequency / 8 It is recommended to use the highest possible reference clock frequency that allows the desired Baud rate. CLOCK_A[4:2] MCLK_DIV1_A[2:0] 4 — Modem clock divider 1 (A): 0: Divide by 1: Divide by 2: Divide by 3: Divide by 4: Divide by 5: Divide by 6: Divide by 7: Divide by CLOCK_A[1:0] MCLK_DIV2_A[1:0] 0 — 2.5 3 4 7.5 (2.5 × 3) 12.5 (2.5 × 5) 40 (2.5 × 16) 48 (3 × 16) 64 (4 × 16) Modem clock divider 2 (A): 0: Divide by 1: Divide by 2: Divide by 3: Divide by 1 2 4 8 MODEM_CLK frequency is FREF frequency divided by the product of divider 1 and divider 2. Baud rate is MODEM_CLK frequency divided by 8. Table 5-26. FREQ_2B Register (08h) REGISTER NAME DEFAULT VALUE ACTIVE FREQ_2B[7:0] FREQ_B[22:15] 131 — DESCRIPTION 8 MSB of frequency control word B Table 5-27. FREQ_1B Register (09h) REGISTER NAME DEFAULT VALUE ACTIVE FREQ_1B[7:0] FREQ_B[14:7] 189 — 66 DESCRIPTION 8 MSB of frequency control word B Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-28. FREQ_0B Register (0Ah) REGISTER NAME DEFAULT VALUE ACTIVE FREQ_0B[7:1] FREQ_B[6:0] 124 — 7 LSB of frequency control word B FREQ_0B[0] DITHER_B 1 H Enable dithering for frequency B DESCRIPTION Table 5-29. CLOCK_B Register (0Bh) REGISTER NAME DEFAULT VALUE ACTIVE CLOCK_B[7:5] REF_DIV_B[2:0] 2 — DESCRIPTION Reference frequency divisor (B): 0: Not supported 1: REF_CLK frequency = Crystal frequency / 2 … 7: REF_CLK frequency = Crystal frequency / 8 CLOCK_B[4:2] MCLK_DIV1_B[2:0] 4 — Modem clock divider 1 (B): 0: Divide by 1: Divide by 2: Divide by 3: Divide by 4: Divide by 5: Divide by 6: Divide by 7: Divide by CLOCK_B[1:0] MCLK_DIV2_B[1:0] 0 — 2.5 3 4 7.5 (2.5 × 3) 12.5 (2.5 × 5) 40 (2.5 × 16) 48 (3 × 16) 64 (4 × 16) Modem clock divider 2 (B): 0: Divide by 1: Divide by 2: Divide by 3: Divide by 1 2 4 8 MODEM_CLK frequency is FREF frequency divided by the product of divider 1 and divider 2. Baud rate is MODEM_CLK frequency divided by 8. Table 5-30. VCO Register (0Ch) REGISTER NAME DEFAULT VALUE ACTIVE VCO[7:4] VCO_CURRENT_A[3:0] 8 — DESCRIPTION Control of current in VCO core for frequency A 0 : 1.4 mA current in VCO core 1 : 1.8 mA current in VCO core 2 : 2.1 mA current in VCO core 3 : 2.5 mA current in VCO core 4 : 2.8 mA current in VCO core 5 : 3.2 mA current in VCO core 6 : 3.5 mA current in VCO core 7 : 3.9 mA current in VCO core 8 : 4.2 mA current in VCO core 9 : 4.6 mA current in VCO core 10 : 4.9 mA current in VCO core 11 : 5.3 mA current in VCO core 12 : 5.6 mA current in VCO core 13 : 6.0 mA current in VCO core 14 : 6.4 mA current in VCO core 15 : 6.7 mA current in VCO core Recommended setting: VCO_CURRENT_A=4 VCO[3:0] VCO_CURRENT_B[3:0] 8 — Control of current in VCO core for frequency B The current steps are the same as for VCO_CURRENT_A Recommended setting: VCO_CURRENT_B=4 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 67 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-31. MODEM Register (0Dh) NAME DEFAULT VALUE ACTIVE MODEM[7] — 0 — Reserved, write 0 MODEM[6:4] ADC_DIV[2:0] 3 — ADC clock divisor (1) REGISTER DESCRIPTION 0: Not supported 1: ADC frequency 2: ADC frequency 3: ADC frequency 4: ADC frequency 5: ADC frequency 6: ADC frequency 7: ADC frequency = XOSC = XOSC = XOSC = XOSC = XOSC = XOSC = XOSC frequency frequency frequency frequency frequency frequency frequency / / / / / / / 4 6 8 10 12 14 16 MODEM[3] — 0 — Reserved, write 0 MODEM[2] PN9_ENABLE 0 H Enable scrambling of TX and RX with PN9 pseudo-random bit sequence 0: PN9 scrambling is disabled 1: PN9 scrambling is enabled (x9 + x5 + 1) The PN9 pseudo-random bit sequence can be used for BER testing by only transmitting zeros, and then counting the number of received ones. MODEM[1:0] DATA_FORMAT[1:0] 0 — Modem data format 0 1 2 3 (1) (00): (01): (10): (11): NRZ operation Manchester operation Transparent asynchronous UART operation, set DCLK=0 Transparent asynchronous UART operation, set DCLK=1 The intermediate frequency should be as close to 307.2 kHz as possible. ADC clock frequency is always 4 times the intermediate frequency and should therefore be as close to 1.2288 MHz as possible. Table 5-32. DEVIATION Register (0Eh) REGISTER NAME DEFAULT VALUE ACTIVE DEVIATION[7] TX_SHAPING 1 H DEVIATION[6:4] TXDEV_X[2:0] 6 — Transmit frequency deviation exponent DEVIATION [3:0] TXDEV_M[3:0] 8 — Transmit frequency deviation mantissa DESCRIPTION Enable Gaussian shaping of transmitted data Recommended setting: TX_SHAPING=1 Deviation in 402 to 470 MHz band: FREF × XDEV_M × 2(TXDEV_X−16) Deviation in 804 to 960 MHz band: FREF × TXDEV_M × 2(TXDEV_X−15) On-off-keying (OOK) is used in RX/TX if TXDEV_M[3:0]=0 To find TXDEV_M given the deviation and TXDEV_X: TXDEV_M = deviation × 2(16−TXDEV_X) / FREF in 402 to 470 MHz band, TXDEV_M = deviation × 2(15−TXDEV_X) / FREF in 804 to 960 MHz band, Decrease TXDEV_X and try again if TXDEV_M < 8. Increase TXDEV_X and try again if TXDEV_M ≥ 16. 68 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-33. AFC_CONTROL Register (0Fh) (1) REGISTER NAME DEFAULT VALUE ACTIVE AFC_CONTROL[7:6] SETTLING[1:0] 2 — DESCRIPTION Controls AFC settling time versus accuracy 0: AFC off; zero average frequency is used in demodulator 1: Fastest settling; frequency averaged over 1 0/1 bit pair 2: Medium settling; frequency averaged over 2 0/1 bit pairs 3: Slowest settling; frequency averaged over 4 0/1 bit pairs Recommended setting: AFC_CONTROL=3 for higher accuracy unless it is essential to have the fastest settling time when transmission starts after RX is activated. AFC_CONTROL[5:4] RXDEV_X[1:0] 1 — RX frequency deviation exponent AFC_CONTROL[3:0] RXDEV_M[3:0] 12 — RX frequency deviation mantissa Expected RX deviation should be: Baud rate × RXDEV_M × 2(RXDEV_X−3) / 3 To find RXDEV_M given the deviation and RXDEV_X: RXDEV_M = 3 × deviation × 2(3−RXDEV_X) / Baud rate Decrease RXDEV_X and try again if RXDEV_M < 8. Increase RXDEV_X and try again if RXDEV_M ≥ 16. (1) The RX frequency deviation should be close to half the TX frequency deviation for GFSK at 100 kBaud data rate and below. The RX frequency deviation should be close to the TX frequency deviation for FSK and for GFSK at 100 kBaud data rate and above. Table 5-34. FILTER Register (10h) REGISTER NAME DEFAULT VALUE ACTIVE FILTER[7] FILTER_BYPASS 0 H DESCRIPTION Bypass analog image rejection / anti-alias filter. Set to 1 for increased dynamic range at high Baud rates. Recommended setting: FILTER_BYPASS=0 below 76.8 kBaud, FILTER_BYPASS=1 for 76.8 kBaud and up. FILTER[6:5] DEC_SHIFT[1:0] 0 — Number of extra bits to shift decimator input (may improve filter accuracy and lower power consumption). Recommended settings: DEC_SHIFT=0 when DEC_DIV ≤1 (receiver channel bandwidth ≥ 153.6 kHz), DEC_SHIFT=1 when optimized sensitivity and 1< DEC_DIV < 24 (12.29 kHz < receiver channel bandwidth < 153.6 kHz), DEC_SHIFT=2 when optimized selectivity and DEC_DIV ≥ 24 (receiver channel bandwidth ≤12.29 kHz) FILTER[4:0] DEC_DIV[4:0] 0 — Decimation clock divisor 0: Decimation clock divisor = 1, 307.2 kHz channel filter BW. 1: Decimation clock divisor = 2, 153.6 kHz channel filter BW. … 30: Decimation clock divisor = 31, 9.91 kHz channel filter BW. 31: Decimation clock divisor = 32, 9.6 kHz channel filter BW. Channel filter bandwidth is 307.2 kHz divided by the decimation clock divisor. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 69 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-35. VGA1 Register (11h) REGISTER NAME DEFAULT VALUE ACTIVE VGA1[7:6] CS_SET[1:0] 1 — DESCRIPTION Sets the number of consecutive samples at or above carrier sense level before carrier sense is indicated (for example, on LOCK pin) 0: Set carrier sense after first sample at or above carrier sense level 1: Set carrier sense after second sample at or above carrier sense level 2: Set carrier sense after third sample at or above carrier sense level 3: Set carrier sense after fourth sample at or above carrier sense level Increasing CS_SET reduces the number of “false” carrier sense events due to noise at the expense of increased carrier sense response time. VGA1[5] CS_RESET 1 — Sets the number of consecutive samples below carrier sense level before carrier sense indication (for example, on lock pin) is reset 0: Carrier sense is reset after first sample below carrier sense level 1: Carrier sense is reset after second sample below carrier sense level Recommended setting: CS_RESET=1 in order to reduce the chance of losing carrier sense due to noise. VGA1[4:2] VGA_WAIT[2:0] 1 — Controls how long AGC, bit synchronization, AFC and RSSI levels are frozen after VGA gain is changed when frequency is changed between A and B or PLL has been out of lock or after RX power up 0: Freeze 1: Freeze 2: Freeze 3: Freeze 4: Freeze 5: Freeze 6: Freeze 7: Freeze VGA1[1:0] VGA_FREEZE[1:0] 1 — Controls the additional time AGC, bit synchronization, AFC and RSSI levels are frozen when frequency is changed between A and B or PLL has been out of lock or after RX power up 0: Freeze 1: Freeze 2: Freeze 3: Freeze 70 operation for 16 filter clocks, 8/(filter BW) seconds operation for 20 filter clocks, 10/(filter BW) seconds operation for 24 filter clocks, 12/(filter BW) seconds operation for 28 filter clocks, 14/(filter BW) seconds operation for 32 filter clocks, 16/(filter BW) seconds operation for 40 filter clocks, 20/(filter BW) seconds operation for 48 filter clocks, 24/(filter BW) seconds present levels unconditionally levels levels levels levels Detailed Description for for for for approx. 16 ADC_CLK periods (13 µs) approx. 32 ADC_CLK periods (26 µs) approx. 64 ADC_CLK periods (52 µs) approx. 128 ADC_CLK periods (104 µs) Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-36. VGA2 Register (12h) REGISTER NAME DEFAULT VALUE ACTIVE VGA2[7] LNA2_MIN 0 — DESCRIPTION Minimum LNA2 setting used in VGA 0: Minimum LNA2 gain 1: Medium LNA2 gain Recommended setting: LNA2_MIN=0 for best selectivity. VGA2[6] LNA2_MAX 1 — Maximum LNA2 setting used in VGA 0: Medium LNA2 gain 1: Maximum LNA2 gain Recommended setting: LNA2_MAX=1 for best sensitivity. VGA2[5:4] LNA2_SETTING[1:0] 3 — Selects at what VGA setting the LNA gain should be changed 0: Apply LNA2 change below min. VGA setting. 1: Apply LNA2 change at approx. 1/3 VGA setting (around VGA setting 10). 2: Apply LNA2 change at approx. 2/3 VGA setting (around VGA setting 19). 3: Apply LNA2 change above max. VGA setting. Recommended setting: LNA2_SETTING=0 if VGA_SETTING<10, LNA2_SETTING=1 otherwise. If LNA2_MIN=1 and LNA2_MAX=0, then the LNA2 setting is controlled by LNA2_SETTING: 0: Between medium and maximum LNA2 gain 1: Minimum LNA2 gain 2: Medium LNA2 gain 3: Maximum LNA2 gain VGA2[3] AGC_DISABLE 0 H Disable AGC 0: AGC is enabled 1: AGC is disabled (VGA_SETTING determines VGA gain) Recommended setting: AGC_DISABLE=0 for good dynamic range. VGA2[2] AGC_HYSTERESIS 1 H Enable AGC hysteresis 0: No hysteresis. Immediate gain change for smallest up/down step 1: Hysteresis enabled. Two samples in a row must indicate gain change for smallest up or down step Recommended setting: AGC_HYSTERESIS=1. VGA2[1:0] AGC_AVG[1:0] 1 — Sets how many samples that are used to calculate average output magnitude for AGC/RSSI. 0: Magnitude is 1: Magnitude is 2: Magnitude is 3: Magnitude is averaged over averaged over averaged over averaged over 2 filter output samples 4 filter output samples 8 filter output samples 16 filter output samples Recommended setting: AGC_AVG=1. For best AGC/RSSI accuracy AGC_AVG=3. For automatic power-up sequencing, the AGC_AVG and CS_SET values must be chosen so that carrier sense is available in time to be detected before the chip re-enters power down. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 71 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-37. VGA3 Register (13h) REGISTER NAME DEFAULT VALUE ACTIVE VGA3[7:5] VGA_DOWN[2:0] 1 — DESCRIPTION Decides how much the signal strength must be above CS_LEVEL+VGA_UP before VGA gain is decreased. Based on the calculated internal strength level, which has an LSB resolution of 1.5 dB. 0: Gain is decreased VGA_UP + 3 1: Gain is decreased VGA_UP + 4 … 6: Gain is decreased VGA_UP + 9 7: Gain is decreased VGA_UP + 10 when level is above CS_LEVEL+ 8 + when level is above CS_LEVEL+ 8 + when level is above CS_LEVEL+ 8 + when level is above CS_LEVEL+ 8 + See Figure 5-15 for an explanation of the relationship between RSSI, AGC and carrier sense settings. VGA3[4:0] VGA_SETTING[4:0] 24 H VGA setting to be used when receive chain is turned on This is also the maximum gain that the AGC is allowed to use. See Figure 5-15 for an explanation of the relationship between RSSI, AGC and carrier sense settings. Table 5-38. VGA4 Register (14h) REGISTER NAME DEFAULT VALUE ACTIVE DESCRIPTION VGA4[7:5] VGA_UP[2:0] 1 — Decides the level where VGA gain is increased if it is not already at the maximum set by VGA_SETTING. Based on the calculated internal strength level, which has an LSB resolution of 1.5 dB. 0: Gain 1: Gain … 6: Gain 7: Gain is increased when signal is below CS_LEVEL + 8 is increased when signal is below CS_LEVEL+ 8 + 1 is increased when signal is below CS_LEVEL+ 8 + 6 is increased when signal below CS_LEVEL+ 8 + 7 See Figure 5-15 for an explanation of the relationship between RSSI, AGC and carrier sense settings. VGA4[4:0] CS_LEVEL[4:0] 24 H Reference level for Received Signal Strength Indication (carrier sense level) and AGC. See Figure 5-15 for an explanation of the relationship between RSSI, AGC and carrier sense settings. 72 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-39. LOCK Register (15h) (1) REGISTER NAME DEFAULT VALUE ACTIVE LOCK[7:4] LOCK_SELECT[3:0] 0 — DESCRIPTION Selection of signals to LOCK pin 0: Set to 0 1: Set to 1 2: LOCK_CONTINUOUS (active low) 3: LOCK_INSTANT (active low) 4: CARRIER_SENSE (RSSI above threshold, active low) 5: CAL_COMPLETE (active low) 6: SEQ_ERROR (active low) 7: FXOSC 8: REF_CLK 9: FILTER_CLK 10: DEC_CLK 11: PRE_CLK 12: DS_CLK 13: MODEM_CLK 14: VCO_CAL_COMP 15: F_COMP LOCK[3] WINDOW_WIDTH 0 — Selects lock window width 0: Lock window is 2 prescaler clock cycles wide 1: Lock window is 4 prescaler clock cycles wide Recommended setting: WINDOW_WIDTH=0. LOCK[2] LOCK_MODE 0 — Selects lock detector mode 0: Counter restart mode 1: Up/Down counter mode Recommended setting: LOCK_MODE=0. LOCK[1:0] LOCK_ACCURACY[1:0] 0 — Selects lock accuracy (counter threshold values) 0: Declare 1: Declare 2: Declare 3: Declare (1) lock at counter value lock at counter value lock at counter value lock at counter value 127, out of lock at value 111 255, out of lock at value 239 511, out of lock at value 495 1023, out of lock at value 1007 Set LOCK_SELECT=2 to use the LOCK pin as a lock indicator. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 73 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-40. FRONTEND Register (16h) REGISTER NAME DEFAULT VALUE ACTIVE FRONTEND[7:6] LNAMIX_CURRENT[1:0] 2 — FRONTEND[5:4] LNA_CURRENT[1:0] 1 — DESCRIPTION Controls current in LNA, LNA2 and mixer Recommended setting: LNAMIX_CURRENT=1 Controls current in the LNA Recommended setting: LNA_CURRENT=3. Can be lowered to save power at the expense of reduced sensitivity. FRONTEND[3] MIX_CURRENT 0 — Controls current in the mixer Recommended setting: MIX_CURRENT=1 at 426 to 464 MHz, MIX_CURRENT=0 at 852 to 928 MHz. FRONTEND[2] LNA2_CURRENT 0 — Controls current in LNA 2 Recommended settings: LNA2_CURRENT=0 at 426 to 464 MHz, LNA2_CURRENT=1 at 852 to 928 MHz. FRONTEND[1] SDC_CURRENT 0 — Controls current in the single-to-diff. Converter Recommended settings: SDC_CURRENT=0 at 426 to 464 MHz, SDC_CURRENT=1 at 852 to 928 MHz. FRONTEND[0] LNAMIX_BIAS 1 — Controls how front-end bias currents are generated 0: Constant current biasing 1: Constant Gm × R biasing (reduces gain variation) Recommended setting: LNAMIX_BIAS=0. 74 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-41. ANALOG Register (17h) REGISTER NAME DEFAULT VALUE ACTIVE ANALOG[7] BANDSELECT 1 — DESCRIPTION Frequency band selection 0: 402 to 470 MHz band 1: 804 to 960 MHz band ANALOG[6] LO_DC 1 — Lower LO DC level to mixers 0: High LO DC level to mixers 1: Low LO DC level to mixers Recommended settings: LO_DC=1 for 402 to 470 MHz, LO_DC=0 for 804 to 960 MHz. ANALOG[5] VGA_BLANKING 1 H Enable analog blanking switches in VGA when changing VGA gain. 0: Blanking switches are disabled 1: Blanking switches are turned on for approx. 0.8 μs when gain is changed (always on if AGC_DISABLE=1) Recommended setting: VGA_BLANKING=0. ANALOG[4] PD_LONG 0 H Selects short or long reset delay in phase detector 0: Short reset delay 1: Long reset delay Recommended setting: PD_LONG=0. ANALOG[3] — 0 — Reserved, write 0 ANALOG[2] PA_BOOST 0 H Boost PA bias current for higher output power ANALOG[1:0] DIV_BUFF_CURRENT[1:0] 3 — Recommended setting: PA_BOOST=1. Overall bias current adjustment for VCO divider and buffers 0: 4/6 of nominal VCO divider and buffer current 1: 4/5 of nominal VCO divider and buffer current 2: Nominal VCO divider and buffer current 3: 4/3 of nominal VCO divider and buffer current Recommended setting: DIV_BUFF_CURRENT=3 Table 5-42. BUFF_SWING Register (18h) REGISTER NAME DEFAULT VALUE ACTIVE BUFF_SWING[7:6] PRE_SWING[1:0] 3 — DESCRIPTION Prescaler swing. 0: 2/3 of nominal swing 1: 1/2 of nominal swing 2: 4/3 of nominal swing 3: Nominal swing Recommended setting: PRE_SWING=0. BUFF_SWING[5:3] RX_SWING[2:0] 4 — LO buffer swing, in RX (to mixers) 0: Smallest load resistance (smallest swing) … 7: Largest load resistance (largest swing) Recommended setting: RX_SWING=2. BUFF_SWING[2:0] TX_SWING[2:0] 1 — LO buffer swing, in TX (to power amplifier driver) 0: Smallest load resistance (smallest swing) … 7: Largest load resistance (largest swing) Recommended settings: TX_SWING=4 for 402 to 470 MHz, TX_SWING=0 for 804 to 960 MHz. Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 75 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-43. BUFF_CURRENT Register (19h) REGISTER NAME DEFAULT VALUE ACTIVE BUFF_CURRENT[7:6] PRE_CURRENT[1:0] 1 — DESCRIPTION Prescaler current scaling 0: Nominal current 1: 2/3 of nominal current 2: 1/2 of nominal current 3: 2/5 of nominal current Recommended setting: PRE_CURRENT=0. BUFF_CURRENT[5:3] RX_CURRENT[2:0] 4 — LO buffer current, in RX (to mixers) 0: Minimum buffer current … 7: Maximum buffer current Recommended setting: RX_CURRENT=4. BUFF_CURRENT[2:0] TX_CURRENT[2:0] 5 — LO buffer current, in TX (to PA driver) 0: Minimum buffer current … 7: Maximum buffer current Recommended settings: TX_CURRENT=2 for 402 to 470 MHz, TX_CURRENT=5 for 804 to 960 MHz. Table 5-44. PLL_BW Register (1Ah) REGISTER NAME DEFAULT VALUE ACTIVE DESCRIPTION PLL_BW[7:0] PLL_BW[7:0] 134 — Charge pump current scaling/rounding factor. Used to calibrate charge pump current for the desired PLL loop bandwidth. The value is given by: PLL_BW = 174 + 16 log2(fref / 7.126) where fref is the reference frequency in MHz. Table 5-45. CALIBRATE Register (1Bh) REGISTER NAME DEFAULT VALUE ACTIVE CALIBRATE[7] CAL_START 0 ↑ ↑ 1: Calibration started CALIBRATE[6] CAL_DUAL 0 H Use calibration results for both frequency A and B DESCRIPTION 0: Calibration inactive 0: Store results in A or B defined by F_REG (MAIN[6]) 1: Store calibration results in both A and B CALIBRATE[5:4] CAL_WAIT[1:0] 0 — Selects calibration wait time (affects accuracy) 0 1 2 3 (00): (01): (10): (11): Calibration time is Calibration time is Calibration time is Calibration time is approx. 90000 F_REF periods approx. 110000 F_REF periods approx. 130000 F_REF periods approx. 200000 F_REF periods Recommended setting: CAL_WAIT=3 for best accuracy in calibrated PLL loop filter bandwidth. CALIBRATE[3] 76 — 0 — Reserved, write 0 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-45. CALIBRATE Register (1Bh) (continued) REGISTER NAME DEFAULT VALUE ACTIVE CALIBRATE[2:0] CAL_ITERATE[2:0] 5 — DESCRIPTION Iteration start value for calibration DAC 0 1 2 3 4 5 6 7 (000): (001): (010): (011): (100): (101): (110): (111): DAC DAC DAC DAC DAC DAC DAC DAC start value start value start value start value start value start value start value start value 1, VC < 2, VC < 3, VC < 4, VC < 5, VC < 6, VC < 7, VC < 8, VC < 0.49 0.66 0.82 0.99 1.15 1.32 1.48 1.65 V V V V V V V V after calibration after calibration after calibration after calibration after calibration after calibration after calibration after calibration Recommended setting: CAL_ITERATE=4. Table 5-46. PA_POWER Register (1Ch) REGISTER NAME DEFAULT VALUE ACTIVE PA_POWER[7:4] PA_HIGH [3:0] 0 — DESCRIPTION Controls output power in high-power array 0: High-power array is off 1: Minimum high-power array output power … 15: Maximum high-power array output power PA_POWER[3:0] PA_LOW[3:0] 15 — Controls output power in low-power array 0: Low-power array is off 1: Minimum low-power array output power … 15: Maximum low-power array output power It is more efficient in terms of current consumption to use either the lower or upper 4-bits in the PA_POWER register to control the power. Table 5-47. MATCH Register (1Dh) REGISTER NAME DEFAULT VALUE ACTIVE MATCH[7:4] RX_MATCH[3:0] 0 — Selects matching capacitor array value for RX. Each step is approximately 0.4 pF. MATCH[3:0] TX_MATCH[3:0] 0 — Selects matching capacitor array value for TX. DESCRIPTION Each step is approximately 0.4 pF. Table 5-48. PHASE_COMP Register (1Eh) REGISTER NAME DEFAULT VALUE ACTIVE DESCRIPTION PHASE_COMP[7:0] PHASE_COMP[7:0] 0 — Signed compensation value for LO I/Q phase error. Used for image rejection calibration. –128: approx. –6.2° adjustment between I and Q phase –1: approx. –0.02° adjustment between I and Q phase 0: approx. +0.02° adjustment between I and Q phase 127: approx. +6.2° adjustment between I and Q phase Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 77 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-49. GAIN_COMP Register (1Fh) REGISTER NAME DEFAULT VALUE ACTIVE DESCRIPTION GAIN_COMP[7:0] GAIN_COMP[7:0] 0 — Signed compensation value for mixer I/Q gain error. Used for image rejection calibration. –128: approx. –1.16 dB adjustment between I and Q gain –1: approx. –0.004 dB adjustment between I and Q gain 0: approx. +0.004 dB adjustment between I and Q gain 127: approx. +1.16 dB adjustment between I and Q gain Table 5-50. POWERDOWN Register (20h) REGISTER NAME DEFAULT VALUE ACTIVE POWERDOWN[7] PA_PD 0 H Sets PA in power down when PD_MODE[1:0]=2 POWERDOWN[6] VCO_PD 0 H Sets VCO in power down when PD_MODE[1:0]=2 POWERDOWN[5] BUFF_PD 0 H Sets VCO divider, LO buffers and prescaler in power-down when PD_MODE[1:0]=2 POWERDOWN[4] CHP_PD 0 H Sets charge pump in power down when PD_MODE[1:0]=2 POWERDOWN[3] LNAMIX_PD 0 H Sets LNA/mixer in power down when PD_MODE[1:0]=2 POWERDOWN[2] VGA_PD 0 H Sets VGA in power down when PD_MODE[1:0]=2 POWERDOWN[1] FILTER_PD 0 H Sets image filter in power down when PD_MODE[1:0]=2 POWERDOWN[0] ADC_PD 0 H Sets ADC in power down when PD_MODE[1:0]=2 DESCRIPTION Table 5-51. TEST1 Register (21h, for Test Only) DEFAULT VALUE ACTIVE CAL_DAC_OPEN[3:0] 4 — Calibration DAC override value, active when BREAK_LOOP=1 CHP_CO[3:0] 13 — Charge pump current override value REGISTER NAME TEST1[7:4] TEST1[3:0] DESCRIPTION Table 5-52. TEST2 Register (22h, for Test Only) REGISTER NAME DEFAULT VALUE ACTIVE TEST2[7] BREAK_LOOP 0 H 0: PLL loop closed 1: PLL loop open TEST2[6] CHP_OVERRIDE 0 H 0: use calibrated value 1: use CHP_CO[3:0] value TEST2[5] VCO_OVERRIDE 0 H 0: use calibrated value 1: use VCO_AO[4:0] value TEST2[4:0] VCO_AO[4:0] 16 — VCO_ARRAY override value DESCRIPTION Table 5-53. TEST3 Register (23h, for Test Only) NAME DEFAULT VALUE ACTIVE TEST3[7] VCO_CAL_MANUAL 0 H Enables “manual” VCO calibration (test only) TEST3[6] VCO_CAL_OVERRIDE 0 H Override VCO current calibration REGISTER DESCRIPTION 0: Use calibrated value 1: Use VCO_CO[5:0] value VCO_CAL_OVERRIDE controls VCO_CAL_CLK if VCO_CAL_MANUAL=1. Negative transitions are then used to sample VCO_CAL_COMP. TEST3[5:0] 78 VCO_CO[5:0] 6 — VCO_CAL_CURRENT override value Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-54. TEST4 Register (24h, for Test Only) (1) NAME DEFAULT VALUE ACTIVE TEST4[7] CHP_DISABLE 0 H Disable normal charge pump operation TEST4[6] CHP_TEST_UP 0 H Force charge pump to output “up” current TEST4[5] CHP_TEST_DN 0 H Force charge pump to output “down” current TEST4[4:3] TM_IQ[1:0] 0 — Value of differential I and Q outputs from mixer when TM_ENABLE=1 REGISTER DESCRIPTION 0: I 1: I 2: I 3: I (1) output negative, Q output negative output negative, Q output positive output positive, Q output negative output positive, Q output positive TEST4[2] TM_ENABLE 0 H Enable DC control of mixer output (for testing) TEST4[1] TF_ENABLE 0 H Connect analog test module to filter inputs TEST4[0] TA_ENABLE 0 H Connect analog test module to ADC inputs If TF_ENABLE=1 or TA_ENABLE=1 in TEST4 register, then INTERFACE[3:0] controls analog test module: INTERFACE[3] = TEST_PD, INTERFACE[2:0] = TEST_MODE[2:0]. Otherwise, TEST_PD=1 and TEST_MODE[2]=1. Table 5-55. TEST5 Register (25h, for Test Only) NAME DEFAULT VALUE ACTIVE DESCRIPTION TEST5[7] F_COMP_ENABLE 0 H Enable frequency comparator output F_COMP from phase detector TEST5[6] SET_DITHER_CLOCK 1 H Enable dithering of delta-sigma clock TEST5[5] ADC_TEST_OUT 0 H Outputs ADC samples on LOCK and DIO, while ADC_CLK is output on DCLK TEST5[4] CHOP_DISABLE 0 H Disable chopping in ADC integrators TEST5[3] SHAPING_DISABLE 0 H Disable ADC feedback mismatch shaping TEST5[2] VCM_ROT_DISABLE 0 H Disable rotation for VCM mismatch shaping TEST5[1:0] ADC_ROTATE[1:0] 0 — Control ADC input rotation REGISTER 0: Rotate in 00 01 10 11 sequence 1: Rotate in 00 10 11 01 sequence 2: Always use 00 position 3: Rotate in 00 10 00 10 sequence Table 5-56. TEST6 Register (26h, for Test Only) NAME DEFAULT VALUE ACTIVE TEST6[7:4] — 0 — Reserved, write 0 TEST6[3] VGA_OVERRIDE 0 — Override VGA settings TEST6[2] AC1O 0 — Override value to first AC coupler in VGA REGISTER DESCRIPTION 0: Approx. 0 dB gain 1: Approx. –12 dB gain TEST6[1:0] AC2O[1:0] 0 — Override value to second AC coupler in VGA 0: Approx. 0 dB gain 1: Approx. –3 dB gain 2: Approx. –12 dB gain 3: Approx. –15 dB gain Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 79 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-57. TEST7 Register (27h, for Test Only) NAME DEFAULT VALUE ACTIVE TEST7[7:6] — 0 — Reserved, write 0 TEST7[5:4] VGA1O[1:0] 0 — Override value to VGA stage 1 TEST7[3:2] VGA2O[1:0] 0 — Override value to VGA stage 2 TEST7[1:0] VGA3O[1:0] 0 — Override value to VGA stage 3 REGISTER DESCRIPTION Table 5-58. STATUS Register (40h, Read Only) REGISTER NAME DEFAULT VALUE ACTIVE DESCRIPTION STATUS[7] CAL_COMPLETE — H Set to 0 when PLL calibration starts, and set to 1 when calibration has finished STATUS[6] SEQ_ERROR — H Set to 1 when PLL failed to lock during automatic power-up sequencing STATUS[5] LOCK_INSTANT — H Instantaneous PLL lock indicator STATUS[4] LOCK_CONTINUOUS — H STATUS[3] CARRIER_SENSE — H Carrier sense when RSSI is above CS_LEVEL STATUS[2] LOCK — H Logical level on LOCK pin STATUS[1] DCLK — H Logical level on DCLK pin STATUS[0] DIO — H Logical level on DIO pin PLL lock indicator, as defined by LOCK_ACCURACY. Set to 1 when PLL is in lock Table 5-59. RESET_DONE Register (41h, Read Only) NAME DEFAULT VALUE ACTIVE RESET_DONE[7] ADC_RESET_DONE — H Reset of ADC control logic done RESET_DONE[6] AGC_RESET_DONE — H Reset of AGC (VGA control) logic done RESET_DONE[5] GAUSS_RESET_DONE — H Reset of Gaussian data filter done RESET_DONE[4] AFC_RESET_DONE — H Reset of AFC / FSK decision level logic done RESET_DONE[3] BITSYNC_RESET_DONE — H Reset of modulator, bit synchronization logic and PN9 PRBS generator done RESET_DONE[2] SYNTH_RESET_DONE — H Reset digital part of frequency synthesizer done RESET_DONE[1] SEQ_RESET_DONE — H Reset of power-up sequencing logic done RESET_DONE[0] CAL_LOCK_RESET_DONE — H Reset of calibration logic and lock detector done REGISTER DESCRIPTION Table 5-60. RSSI Register (42h, Read Only) NAME DEFAULT VALUE ACTIVE RSSI[7] — — — Not in use, will read 0 RSSI[6:0] RSSI[6:0] — — Received signal strength indicator. REGISTER DESCRIPTION The relative power is given by RSSI × 1.5 dB in a logarithmic scale. The VGA gain set by VGA_SETTING must be taken into account. See Section 5.9.5 for more details. 80 Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 5-61. AFC Register (43h, Read Only) REGISTER NAME DEFAULT VALUE ACTIVE DESCRIPTION AFC[7 :0] AFC[7:0] — — Average received frequency deviation from IF. This 8-bit 2-complement signed value equals the demodulator decision level and can be used for AFC. The average frequency offset from the IF frequency is ΔF = Baud rate × AFC / 16 Table 5-62. GAUSS_FILTER Register (44h) REGISTER NAME DEFAULT VALUE ACTIVE GAUSS_FILTER[7 :0] GAUSS_FILTER[7:0] — — DESCRIPTION Readout of instantaneous IF frequency offset from nominal IF. Signed 8-bit value. ΔF = Baud rate × GAUSS_FILTER / 8 Table 5-63. STATUS1 Register (45h, for Test Only) REGISTER NAME DEFAULT VALUE ACTIVE STATUS1[7:4] CAL_DAC[3:0] — — Status vector defining applied Calibration DAC value STATUS1[3:0] CHP_CURRENT[3:0] — — Status vector defining applied CHP_CURRENT value DESCRIPTION Table 5-64. STATUS2 Register (46h, for Test Only) REGISTER NAME DEFAULT VALUE ACTIVE STATUS2[7:5] CC1020_VERSION[2:0] — — DESCRIPTION CC1020 version code: 0 : Pre-production version 1: First production version 2 through 7: Reserved for future use STATUS2[4:0] VCO_ARRAY[4:0] — — Status vector defining applied VCO_ARRAY value Table 5-65. STATUS3 Register (47h, for Test Only) REGISTER NAME DEFAULT VALUE ACTIVE STATUS3[7] F_COMP — — Frequency comparator output from phase detector STATUS3[6] VCO_CAL_COMP — — Readout of VCO current calibration comparator. DESCRIPTION Equals 1 if current defined by VCO_CURRENT_A/B is larger than the VCO core current STATUS3[5:0] VCO_CAL_CURRENT[5:0] — — Status vector defining applied VCO_CAL_CURRENT value Table 5-66. STATUS4 Register (48h, for Test Only) REGISTER NAME DEFAULT VALUE ACTIVE STATUS4[7:6] ADC_MIX[1:0] — — Readout of mixer input to ADC STATUS4[5:3] ADC_I[2:0] — — Readout of ADC “I” output STATUS4[2:0] ADC_Q[2:0] — — Readout of ADC “Q” output DESCRIPTION Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 81 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Table 5-67. STATUS5 Register (49h, for Test Only) REGISTER NAME DEFAULT VALUE ACTIVE STATUS5[7:0] FILTER_I[7:0] — — DESCRIPTION Upper bits of “I” output from channel filter Table 5-68. STATUS6 Register (4Ah, for Test Only) REGISTER NAME DEFAULT VALUE ACTIVE STATUS6[7:0] FILTER_Q[7:0] — — DESCRIPTION Upper bits of “Q” output from channel filter Table 5-69. STATUS7 Register (4Bh, for Test Only) NAME DEFAULT VALUE ACTIVE STATUS7[7:5] — — — Not in use, will read 0 STATUS7[4:0] VGA_GAIN_OFFSET[4:0] — — Readout of offset between VGA_SETTING and actual VGA gain set by AGC REGISTER 82 DESCRIPTION Detailed Description Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 6 Applications, Implementation, and Layout NOTE Information in Section 6 is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 6.1 Application Information Very few external components are required for the operation of CC1020. The recommended application circuit is shown in Figure 6-1. The external components are described in Table 6-1 and values are given in Table 6-2. 6.1.1 Typical Application Figure 6-1. Typical Application and Test Circuit (Power Supply Decoupling Not Shown) Applications, Implementation, and Layout Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 83 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com Figure 6-2. Alternative Application Circuit (Power Supply Decoupling Not Shown) Table 6-1. Overview of External Components (Excluding Supply Decoupling Capacitors) REF C1 LNA input match and DC block, see Section 5.11 C3 PA output match and DC block, see Section 5.11 C4 Crystal load capacitor, see Section 5.16 C5 Crystal load capacitor, see Section 5.16 C6 PLL loop filter capacitor C7 PLL loop filter capacitor (may be omitted for highest loop bandwidth) C8 PLL loop filter capacitor (may be omitted for highest loop bandwidth) C60 Decoupling capacitor L1 LNA match and DC bias (ground), see Section 5.11 L2 PA match and DC bias (supply voltage), see Section 5.11 R1 Precision resistor for current reference generator R2 PLL loop filter resistor R3 PLL loop filter resistor R10 PA output match, see Section 5.11 XTAL 84 DESCRIPTION Crystal, see Section 5.16 Applications, Implementation, and Layout Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 Table 6-2. Bill of Materials for the Application Circuit In Figure 6-1 (1) (2) ITEM 433 MHz 868 MHz 915 MHz C1 (3) 10 pF, 5%, NP0, 0402 47 pF, 5%, NP0, 0402 47 pF, 5%, NP0, 0402 C3 (3) 5.6 pF, 5%, NP0, 0402 10 pF, 5%, NP0, 0402 10 pF, 5%, NP0, 0402 C4 22 pF, 5%, NP0, 0402 22 pF, 5%, NP0, 0402 22 pF, 5%, NP0, 0402 C5 12 pF, 5%, NP0, 0402 12 pF, 5%, NP0, 0402 12 pF, 5%, NP0, 0402 C6 220 nF, 10%, X7R, 0603 100 nF, 10%, X7R, 0603 100 nF, 10%, X7R, 0603 C7 8.2 nF, 10%, X7R, 0402 3.9 nF, 10%, X7R, 0402 3.9 nF, 10%, X7R, 0402 C8 2.2 nF, 10%, X7R, 0402 1.0 nF, 10%, X7R, 0402 1.0 nF, 10%, X7R, 0402 C60 220 pF, 5%, NP0, 0402 220 pF, 5%, NP0, 0402 220 pF, 5%, NP0, 0402 L1 (3) 33 nH, 5%, 0402 82 nH, 5%, 0402 82 nH, 5%, 0402 (3) 3.6 nH, 5%, 0402 L2 (1) (2) (3) 22 nH, 5%, 0402 3.6 nH, 5%, 0402 R1 82 kΩ, 1%, 0402 82 kΩ, 1%, 0402 82 kΩ, 1%, 0402 R2 1.5 kΩ, 5%, 0402 2.2 kΩ, 5%, 0402 2.2 kΩ, 5%, 0402 R3 4.7 kΩ, 5%, 0402 6.8 kΩ, 5%, 0402 6.8 kΩ, 5%, 0402 R10 82 Ω, 5%, 0402 82 Ω, 5%, 0402 82 Ω, 5%, 0402 XTAL 14.7456 MHz crystal, 16 pF load 14.7456 MHz crystal, 16 pF load 14.7456 MHz crystal, 16 pF load The PLL loop filter component values in Table 6-2 (R2, R3, C6-C8) can be used for data rates up to 4.8 kBaud. The SmartRF Studio software provides component values for other data rates using the equations in Section 5.12.2. Items shaded vary for different frequencies. For 433 MHz, 12.5 kHz channel, a loop filter with lower bandwidth is used to improve adjacent and alternate channel rejection. In the CC1020EMX reference design (CC1020EMX), LQG15HS series inductors from Murata have been used. The switch is SW-456 from M/A-COM. The LC filter in Figure 6-1 is inserted in the TX path only. The filter will reduce the emission of harmonics and the spurious emissions in the TX path. An alternative is to insert the LC filter between the antenna and the T/R switch as shown in Figure 6-2. The filter will reduce the emission of harmonics and the spurious emissions in the TX path as well as increase the receiver selectivity. The sensitivity will be slightly reduced due to the insertion loss of the LC filter. 6.2 6.2.1 Design Requirements Input and Output Matching L1 and C1 are the input match for the receiver. L1 is also a DC choke for biasing. L2 and C3 are used to match the transmitter to 50 Ω. Internal circuitry makes it possible to connect the input and output together and match the CC1020 to 50 Ω in both RX and TX mode. However, it is recommended to use an external T/R switch for optimum performance. See Section 5.11 for details. Component values for the matching network are easily found using the SmartRF Studio software. 6.2.2 Bias Resistor The precision bias resistor R1 is used to set an accurate bias current. 6.2.3 PLL Loop Filter The loop filter consists of two resistors (R2 and R3) and three capacitors (C6 through C8). C7 and C8 may be omitted in applications where high loop bandwidth is desired. The values shown in Table 6-2 can be used for data rates up to 4.8 kBaud. Component values for higher data rates are easily found using the SmartRF Studio software. Applications, Implementation, and Layout Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 85 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 6.2.4 www.ti.com Crystal An external crystal with two loading capacitors (C4 and C5) is used for the crystal oscillator. See Section 5.16 for details. 6.2.5 Additional Filtering Additional external components (for example, RF, LC, or SAW filter) may be used in order to improve the performance in specific applications. See Section 5.11 for further information. 6.2.6 Power Supply Decoupling and Filtering Power supply decoupling and filtering must be used (not shown in the application circuit). The placement and size of the decoupling capacitors and the power supply filtering are very important to achieve the optimum performance for narrowband applications. TI provides a reference design that should be followed very closely. 6.3 PCB Layout Recommendations The top layer should be used for signal routing, and the open areas should be filled with metallization connected to ground using several vias. The area under the chip is used for grounding and must be connected to the bottom ground plane with several vias. In the TI reference designs we have placed 9 vias inside the exposed die attached pad. These vias should be “tented” (covered with solder mask) on the component side of the PCB to avoid migration of solder through the vias during the solder reflow process. Do not place a via underneath CC1020 at “pin #1 corner” as this pin is internally connected to the exposed die attached pad, which is the main ground connection for the chip. Each decoupling capacitor should be placed as close as possible to the supply pin it is supposed to decouple. Each decoupling capacitor should be connected to the power line (or power plane) by separate vias. The best routing is from the power line (or power plane) to the decoupling capacitor and then to the CC1020 supply pin. Supply power filtering is very important, especially for pins 23, 22, 20 and 18. Each decoupling capacitor ground pad should be connected to the ground plane using a separate via. Direct connections between neighboring power pins will increase noise coupling and should be avoided unless absolutely necessary. The external components should ideally be as small as possible and surface mount devices are highly recommended. Precaution should be used when placing the microcontroller in order to avoid noise interfering with the RF circuitry. A CC1020/1070DK Development Kit with a fully assembled CC1020EMX Evaluation Module is available. It is strongly advised that this reference layout is followed very closely in order to get the best performance. The layout Gerber files are available from the CC1020EMX product folder. 86 Applications, Implementation, and Layout Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 CC1020 www.ti.com SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 7 Device and Documentation Support 7.1 7.1.1 Device Support Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC1020 is in production; therefore, no prefix is assigned). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RSS). For orderable part numbers of CC1020 devices in the RSS package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. 7.2 Documentation Support The following documents describe the CC1020 device. Copies of these documents are available on the Internet at www.ti.com. 1. [1] AN022 CC1020 Crystal Frequency Selection (SWRA070) 2. [2] AN029 CC1020/1021 Automatic Frequency Control (AFC) (SWRA063) 3. [3] AN030 CC1020/1021 Received Signal Strength Indicator (SWRA062) 4. [4] AN070 CC1020 Automatic Power-Up Sequencing (SWRA279) 5. [5] AN023 CC1020 MCU Interfacing (SWRA069) 6. [6] CC1020 Errata Note 004, available in the CC1020 product folder. 7. [7] CC1020 Errata Note 002, available in the CC1020 product folder. 8. [8] AN001 SRD Regulations For License Free Transceiver Operation (SWRA090). 9. [9] AN027 Temperature Compensation by Indirect Method (SWRA065) 10. [10] AN003 SRD Antennas (SWRA088) 11. [11] SmartRF Studio 12. [12] CC1020EMX Evaluation Module 7.2.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster Device and Documentation Support Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC1020 87 CC1020 SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015 www.ti.com collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 7.3 Trademarks SmartRF, E2E are trademarks of Texas Instruments. 7.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 7.5 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 7.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 8 Mechanical Packaging and Orderable Information 8.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 88 Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: CC1020 Copyright © 2006–2015, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 7-Mar-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC1020-RTB1 OBSOLETE VQFNP RUZ 32 TBD Call TI Call TI -40 to 85 CC1020 CC1020-RTR1 NRND VQFNP RUZ 32 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1020 CC1020RSS OBSOLETE VQFNP RUZ 32 TBD Call TI Call TI -40 to 85 CC1020 CC1020RSSG4 ACTIVE QFN RSS 32 TBD Call TI Call TI -40 to 85 CC1020RSSR ACTIVE QFN RSS 32 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1020 CC1020RSST ACTIVE QFN RSS 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1020 CC1020RUZ OBSOLETE VQFNP RUZ 32 TBD Call TI Call TI -40 to 85 CC1020 CC1020RUZR OBSOLETE VQFNP RUZ 32 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1020 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 7-Mar-2016 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device CC1020RSSR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant QFN RSS 32 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC1020RSST QFN RSS 32 250 180.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC1020RUZR VQFNP RUZ 32 0 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC1020RSSR QFN RSS 32 2500 336.6 336.6 28.6 CC1020RSST QFN RSS 32 250 213.0 191.0 55.0 CC1020RUZR VQFNP RUZ 32 0 336.6 336.6 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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