2U HIGH-DENSITY AND POWEREFFICIENT PLATFORM YR292-B5538 B5538Y292X4-080V4HR-HE Front View • Unified HDD bracket design • Each bracket supports up to (4) hot-swap 2.5” Back View 2U High-Density and Power-Efficient Platform for VHD/VDI Applications Single LGA1150 socket supports Intel® Xeon® (1) E3-1200 v3 series processors (per blade) Intel® C226 PCH (per blade) (4) DDR3 DIMM slots (per blade) Supporting up to 32GB UDIMM ECC 1333/1066 memory (1) PCI-E Gen3 x16 slot (per blade) (4) hot-swap 2.5" SAS/SATA 6G HDDs (per blade) (2) GbE + (1) dedicated for IPMI (via Intel® I350-AM2 + via Intel® I210) (per blade) Onboard BMC w/ IPMI and iKVM support (per blade) (1+1) RPSU high-efficiency 800W 80 plus Platinum Specifications are subject to change without notice. Items pictured may only be representative. YR292-B5538 Specifications B5538Y292X4-080V4HR-HE System Form Factor 2U Rackmount Feature Four nodes in one chassis Chassis Name YR292 Dimension (H x W x D) 28.74" x 17.32" x 1.72" (730 x 440 x 43.6mm) Motherboard S5538GM3NR-HE Gross Weight 29KG Buttons (1) RST / (1) PWR / (1) ID Front Panel (per LEDs blade) I/O Ports External Drive Bay (per blade) Type / Q'ty Supported HDD Interface System Cooling FAN Configuration (per blade) Power Supply Connector Storage (per blade) Graphic (per blade) (1) PWR / (1) BMC / (2) LAN / (1) HDD (2) USB ports 2.5" Hot-Swap / (4) SATA-III 6.0Gb/s Input /Output (per blade) (3) 4cm fans Type RPSU Input Range Full-range AC(100-240V) 240VDC support Output Watts 800 Watts Efficiency PFC / 80-plus Platinum Redundancy 1+1 Chipset (per blade) Memory (per blade) Socket Type / Q'ty LGA 1150/ (1) Thermal Design Power (TDP) wattage Max up to 95W Chipset Intel C226 Super I/O - Supported DIMM Qty (4) DIMM slots DIMM Type / Speed DDR3/DDR3L 1066 / 1333 /1600 UDIMM ECC Capacity Up to 32GB UDIMM ECC 1333/1066 memory Memory channel 2 Channels per CPU Memory voltage 1.5V Expansion Slots PCI-E (per blade) LAN (per blade) (2) GbE ports + (1) dedicated for IPMI Controller Intel I350-AM2 / Intel I210 D-Sub 15-pin Resolution 1600x1200 Chipset Aspeed AST2300 USB (4) ports (2 at front, 2 at rear) VGA (1) D-Sub 15-pin VGA port RJ-45 (3) ports (1 dedicate port for IPMI) Chipset Aspeed AST2300 Japan Tel: +81-3-3769-8311 Fax: +81-3-3769-8328 Monitors temperature for CPU & system environment Onboard Chipset Onboard Aspeed AST2300 AST2300 IPMI Feature IPMI 2.0 compliant baseboard management controller (BMC) / Supports storage over IP and remote platform-flash / USB 2.0 virtual hub AST2300 iKVM Feature 24-bit high quality video compression / 10/100/1000 Mb/s MAC interface Brand / ROM size AMI / 16MB Feature User-configurable H/W monitoring / ACPI 3.0 power management/PXE boot / ACPI sleeping states S3,S4,S5 / SMBIOS 2.8/PnP/Wake on LAN FCC (DoC) Class A CE (DoC) Yes Operating Temp. 10° C ~ 35° C (50° F~ 95° F) Operating Environment Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F) In/Non-operating Humidity 90%, non-condensing at 35° C RoHS RoHS 6/6 Complaint Yes System Management (per blade) (Specifications are subject to change without notice. Items pictured may only be representative.) TYAN Business Unit Taiwan Tel: +886-2-2652-5888 Fax: +886-2-2652-5805 RAID 0/1/10/5 (Intel RAID) Connector type MiTAC Computing Technology Corp. USA Tel: +1-510-651-8868 Fax: +1-510-651-7688 6.0 Gb/s RAID Fan fail LED indicator / Over temperature warning indicator Regulation Port Q'ty Intel C226 LEDs BIOS (per blade) (1) PCI-E Low-Profile Gen.3 x16 slot (6) SATA Speed System Voltage Monitoring (per blade) Supported CPU Series Intel Xeon E3-1200 v3 series processors Processor (per blade) SATA Controller China Shanghai Tel: +86-21-61431188 Ext 1366 China Tel:-86-010-62555015 Ext 8302