Everlight EAST10053WA0 Compatible with automatic placement equipment. Datasheet

SMD ƒ B
EAST10053WA0
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS compliant version.
․Compliance with EU REACH.
․Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm).
Description
․The SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing
density, reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
Device Selection Guide
Chip
Materials
InGaN
Emitted Color
Resin Color
Pure White
Yellow Diffused
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
IFP
100
mA
Pd
110
mW
ESDHBM
150
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Peak Forward Current
(Duty 1/10 @1KHz)
Power Dissipation
Electrostatic Discharge
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Luminous Intensity
Iv
72.0
-----
180
mcd
Viewing Angle
2θ1/2
-----
130
-----
deg
Forward Voltage
VF
IR
2.6
----
3.0
V
-----
-----
50
μA
Reverse Current
Condition
IF=5mA
VR=5V
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Forward Voltage: ±0.05V
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
Q1
Q2
R1
R2
72.0
90.0
112
140
90.0
112
140
180
mcd
IF =5mA
Unit
Condition
mcd
IF =5mA
Bin Range Of Luminous Voltage
Bin Code
Min.
Max.
28
2.6
2.7
29
2.7
2.8
30
2.8
2.9
31
2.9
3.0
Note:
1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Forward Voltage: ±0.05V
Chromaticity Coordinates Specifications for Bin Grading
Group
Bin Code
1
2
3
A
4
5
6
CIE_X
CIE_Y
Condition
0.274
0.274
0.294
0.294
0.274
0.274
0.294
0.294
0.294
0.294
0.314
0.314
0.294
0.294
0.314
0.314
0.314
0.314
0.334
0.334
0.314
0.314
0.334
0.334
0.226
0.258
0.286
0.254
0.258
0.291
0.319
0.286
0.254
0.286
0.315
0.282
0.286
0.319
0.347
0.315
0.282
0.315
0.343
0.311
0.315
0.347
0.376
0.343
IF =5mA
Notes:
1.The C.I.E. 1931 chromaticity diagram ( Tolerance ±0.01 ).
2.The products are sensitive to static electricity and care must be fully taken when
handling products.
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
CIE Chromaticity Diagram
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
Typical Electro-Optical Characteristics Curves
Forward Current vs.
Forward Voltage
Ta=25°C
100
Ta=25°C
Forward Current I F (mA)
Relative luminous intensity (%)
Spectrum Distribution
75
50
25
0
400
500
600
700
800
Forward Voltage VF (V)
Wavelength λ (nm)
Luminous Intensity vs.
Luminous Intensity vs.
Forward Current
Ta=25°C
Relative luminous intensity (% )
Relative luminous intensity (% )
Ambient Temperature
Ambient Temperature Ta (°C)
Radiation Diagram
Ta=25°C
Forward Current
I F (mA)
Forward Current Derating Curve
Forward Current I F (mA)
Ambient Temperature Ta (°C)
5
Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
Package Dimension
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need.
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Chromaticity Coordinates
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label
8
Aluminum moisture-proof bag
Desiccant
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Label
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DATASHEET
SMD ƒ B
EAST10053WA0
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
26 0 °C M ax.
10 sec. M ax.
A b ov e2 5 5°C
3 0 sec.M ax .
3 °C /sec.M ax .
6 °C /sec.M ax .
P re-h eatin g
A b o ve 2 1 7 °C
6 0 ~ 1 5 0sec.
15 0 ~ 2 00 °C
6 0 ~ 12 0 sec.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful
because the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head
soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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DATASHEET
SMD ƒ B
EAST10053WA0
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,
and medical equipment may require different product. If you have any concerns, please contact
Everlight Americas before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
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Copyright © 2010, Everlight Americas Inc. All Rights Reserved. Release Date : 29-Apr-2013. Issue No: 1 Rev.1
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