Diodes DMN33D8LV-13 Low on-resistance Datasheet

DMN33D8LV
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
NEW PRODUCT
NEW PRODUCT
ADVANCE
INFORMATION
V(BR)DSS
Features and Benefits
ID max
TA = +25°C
RDS(ON) max
3Ω @ VGS = 4.5V
30V
350 mA
7Ω @ VGS = 2.5V
Description
This MOSFET has been designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
•
Low On-Resistance
•
Low Input Capacitance
•
Fast Switching Speed
•
ESD Protected Gate to 2kV
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 standards for High Reliability
Mechanical Data
•
•
Applications
Case: SOT563
Case Material: Molded Plastic, “Green” Molding Compound UL
Flammability Classification Rating 94V-0
•
Motor Control
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Power Management Functions
•
Terminal Connections: See Diagram
•
DC-DC Converters
•
•
Backlighting
Terminals: Finish – Matte Tin annealed over Copper leadframe
Solderable per MIL-STD-202, Method 208 e3
•
Weight: 0.006 grams (approximate)
SOT563
ESD protected
D2
G1
S1
S2
G2
D1
Equivalent Circuit
Top View
Ordering Information (Note 4)
Part Number
DMN33D8LV-7
DMN33D8LV-13
Notes:
Case
SOT563
SOT563
Packaging
3K/Tape & Reel
10K/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
D2
G1
S1
33B = Product Type Marking Code
YM = Date Code Marking
Y = Year ex: V = 2008
M = Month ex: 9 = September
33B YM
S2
Date Code Key
Year
Code
Month
Code
2011
Y
Jan
1
G2
D1
2012
Z
Feb
2
DMN33D8LV
Document number: DS36892 Rev. 2 - 2
Mar
3
2013
A
Apr
4
May
5
2014
B
Jun
6
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2015
C
Jul
7
Aug
8
2016
D
Sep
9
Oct
O
2017
E
Nov
N
Dec
D
July 2014
© Diodes Incorporated
DMN33D8LV
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
NEW PRODUCT
NEW PRODUCT
ADVANCE
INFORMATION
Symbol
Value
Units
Drain-Source Voltage
VDSS
30
V
Gate-Source Voltage
VGSS
±20
V
ID
350
200
mA
Continuous Drain Current (Note 5) VGS = 4.5V
Steady
State
TA = +25°C
TA = +70°C
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10µs pulse, duty cycle=1%)
IS
0.5
A
IDM
0.8
A
Value
Units
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
TA = +25°C
Total Power Dissipation (Note 5)
PD
TA = +70°C
Steady State
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
0.43
W
0.20
RθJA
288
°C/W
TJ, TSTG
-55 to 150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Symbol
Min
Typ
Max
BVDSS
30
—
—
V
VGS = 0V, ID = 1mA
IDSS
—
—
1
μA
VDS = 30V, VGS = 0V
IGSS
—
—
±10
μA
VGS = ±16V, VDS = 0V
VGS(th)
0.8
—
1.5
V
VDS = 3V, ID = 100μA
—
—
2.4
VGS = 10V, ID = 250mA
—
—
3.0
VGS = 4.5V, ID = 250mA
—
—
5.0
—
—
7.0
|Yfs|
10
—
-
mS
VDS = 3V, ID = 10mA
VSD
—
—
1.2
V
VGS = 0V, IS = 115mA
Input Capacitance
Ciss
—
48
—
pF
Output Capacitance
Coss
—
11
—
pF
Reverse Transfer Capacitance
Crss
—
8
—
pF
Total Gate Charge (VGS = 4.5V)
Qg
—
0.55
—
nC
Total Gate Charge (VGS = 10V)
Qg
—
1.23
—
nC
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
@TC = +25°C
Unit
Test Condition
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
RDS(ON)
Ω
VGS = 4.0V, ID = 10mA
VGS = 2.5V, ID = 10mA
DYNAMIC CHARACTERISTICS (Note 7)
Gate-Source Charge
Qgs
—
0.14
—
nC
Gate-Drain Charge
Qgd
—
0.14
—
nC
Turn-On Delay Time
tD(on)
—
2.9
—
ns
Turn-On Rise Time
tr
—
2.6
—
ns
Turn-Off Delay Time
tD(off)
—
18.2
—
ns
tf
—
13.6
—
ns
Turn-Off Fall Time
Notes:
VDS = 5V, VGS = 0V,
f = 1.0MHz
VGS = 10V, VDS = 10V,
ID = 250mA
VDD = 30V, VGS = 10V,
RG = 25Ω, ID = 200mA
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
DMN33D8LV
Document number: DS36892 Rev. 2 - 2
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© Diodes Incorporated
DMN33D8LV
1.0
1
VGS = 10V
VGS = 3.0V
0.9
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
0.7
VGS = 4.5V
0.6
VGS = 2.5V
0.5
0.4
0.3
0.2
VGS = 1.6V
VGS = 1.8V
VGS = 2.0V
0.6
0.5
0.4
0.3
TA = 125°C
0.1
0.0
0
0
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
3
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
VGS = 2.5V
1.8
1.6
1.4
1.2
1
0.8
0.6
VGS = 4.0V
0.4
VGS = 4.5V
VGS = 10V
0.2
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0.8
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
VGS = 10V
ID = 500mA
VGS = 4.5V
ID = 300mA
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
DMN33D8LV
Document number: DS36892 Rev. 2 - 2
TA = 150°C
0.2
2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.7
0.1
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
NEW PRODUCT
NEW PRODUCT
ADVANCE
INFORMATION
0.8
VGS = 4.0V
0.8
VDS = 5.0V
0.9
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TA = 85°C
TA = 25°C
T A = -55°C
0
0.5
1
1.5
2
2.5
3
3.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
4
0.6
VGS = 4.5V
0.5
T A = 150°C
TA = 125°C
0.4
TA = 85°C
0.3
TA = 25°C
TA = -55°C
0.2
0.1
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
1
0.5
VGS = 4.5V
ID = 300mA
0.4
0.3
VGS = 10V
ID = 500mA
0.2
0.1
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
July 2014
© Diodes Incorporated
1
1.8
0.9
1.6
0.8
IS, SOURCE CURRENT (A)
VGS(th), GATE THRESHOLD VOLTAGE (V)
2
1.4
ID = 1mA
1.2
ID = 250µA
1
0.8
0.6
0.4
0.2
0.6
TA = 150°C
0.5
0.4
TA = 125°C
T A = 25°C
0.3
TA = 85°C
0.2
0
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
100
TA = -55°C
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
10
VGS GATE THRESHOLD VOLTAGE (V)
f = 1MHz
C iss
10
Coss
C rss
1
0.7
0.1
0
-50
CT, JUNCTION CAPACITANCE (pF)
0
10
20
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
1
r(t), TRANSIENT THERMAL RESISTANCE
NEW PRODUCT
NEW PRODUCT
ADVANCE
INFORMATION
DMN33D8LV
30
8
6
VDS = 10V
ID = 250mA
4
2
0
0
0.2
0.4
0.6
0.8
1
1.2
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate Charge
1.4
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RθJA(t) = r(t) * RθJA
RθJA = 289°C/W
Duty Cycle, D = t1/ t2
D = 0.005
D = Single Pulse
0.001
0.000001 0.00001
DMN33D8LV
Document number: DS36892 Rev. 2 - 2
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
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10
100
1000
July 2014
© Diodes Incorporated
DMN33D8LV
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
NEW PRODUCT
NEW PRODUCT
ADVANCE
INFORMATION
A
B
C
D
G
M
K
H
SOT563
Dim Min
Max
Typ
A
0.15 0.30 0.20
B
1.10 1.25 1.20
C
1.55 1.70 1.60
D
0.50
G
0.90 1.10 1.00
H
1.50 1.70 1.60
K
0.55 0.60 0.60
L
0.10 0.30 0.20
M
0.10 0.18 0.11
All Dimensions in mm
L
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C2
Z
C2
Dimensions Value (in mm)
Z
2.2
G
1.2
X
0.375
Y
0.5
C1
1.7
C2
0.5
C1
G
Y
X
DMN33D8LV
Document number: DS36892 Rev. 2 - 2
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© Diodes Incorporated
DMN33D8LV
NEW PRODUCT
NEW PRODUCT
ADVANCE
INFORMATION
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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labeling can be reasonably expected to result in significant injury to the user.
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Copyright © 2014, Diodes Incorporated
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DMN33D8LV
Document number: DS36892 Rev. 2 - 2
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