Datasheet General Purpose CMOS Logic IC Quad-Analog Switch BU4066BC BU4066BCF BU4066BCFV General Description Key Specifications The BU4066BC series ICs each contain 4 independent switches capable of controlling either digital or analog signals. Features Operating Supply Voltage Range: 3V to 18V Input Voltage Range: VEE to VDD Operating Temperature Range: -40°C to +85°C Packages Low Power Consumption Wide Operating Supply Voltage Range DIP14 SOP14 SSOP-B14 DIP14 W(Typ) x D(Typ) x H(Max) 19.40mm x 6.50mm x 7.95mm 8.70mm x 6.20mm x 1.71mm 5.00mm x 6.40mm x 1.35mm SOP14 SSOP-B14 Truth Table Inputs CONT.A CONT.B CONT.C CONT.D H L H L H L H L 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 Switches SWA is turned on. (1pin－2pin) SWA is turned off. (1pin－2pin) SWB is turned on. (3pin－4pin) SWB is turned off. (3pin－4pin) SWC is turned on. (8pin－9pin) SWC is turned off. (8pin－9pin) SWD is turned on. (10pin－11pin) SWD is turned off. (10pin－11pin) 〇This product has no designed protection against radioactive rays 1/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Pin Configuration (TOP VIEW) IN/OUT.A 1 OUT/IN.A 2 OUT/IN.B 3 IN/OUT.B 4 CONT.B 5 CONT.C 6 14 VDD OUT/IN IN/OUT SWA SWD OUT/IN IN/OUT 13 CONT.A 12 CONT.D 11 IN/OUT.D IN/OUT OUT/IN SWB SWC IN/OUT OUT/IN 10 OUT/IN.D 9 OUT/IN.C 8 IN/OUT.C VEE 7 Pin Description Pin No. Pin Name I/O 1 IN/OUT.A I/O Analog Switch Input / Output.A 2 OUT/IN.A I/O Analog Switch Input / Output.A 3 OUT/IN.B I/O Analog Switch Input / Output.B 4 IN/OUT.B I/O Analog Switch Input / Output.B 5 CONT.B I Control Input.B 6 CONT.C I Control Input.C 7 VEE - Power Supply(-) 8 IN/OUT.C I/O Analog Switch Input / Output.C 9 OUT/IN.C I/O Analog Switch Input / Output.C 10 OUT/IN.D I/O Analog Switch Input / Output.D 11 IN/OUT.D I/O Analog Switch Input / Output.D 12 CONT.D I Control Input.D 13 CONT.A I Control Input.A 14 VDD - Power Supply(+) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function 2/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Block Diagram OUT / IN .A to D IN / OUT.A to D CONT.A to D Absolute Maximum Ratings (TA = 25°C) Parameter Symbol Rating Unit Supply Voltage VDD -0.5 to +20.0 V Input Voltage VIN (VEE-0.5) to (VDD+0.5) V Control Input Current IIN ±10 mA Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -55 to +150 °C Maximum Junction Temperature TJmax +150 °C Power Dissipation PD DIP14 1.18 (Note 1) SOP14 0.56 (Note 2) 0.87 (Note 3) SSOP-B14 W Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. (Note 1) Reduce 9.5mW/°C above 25°C. (Note 2) Mounted on 70.0mm x 70.0mm x 1.6mm board glass epoxy board, reduce 4.5mW/°C above 25°C. (Note 3) Mounted on 70.0mm x 70.0mm x 1.6mm board glass epoxy board, reduce 7.0mW/°C above 25°C. Recommended Operating Conditions (TA= -40°C to +85°C) Parameter Symbol Min Typ Max Unit Supply Voltage VDD 3.0 - 18.0 V Input Voltage VIN VEE - VDD V www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Electrical Characteristics (Unless otherwise specified VEE=0V TA=25°C) Parameter Symbol Min Typ Max Unit Conditions 3.5 - - 7.0 - - 11.0 - - VDD=15V - - 1.5 VDD=5V - - 3.0 - - 3.75 - - 0.3 µA VDD=15V VIH=15V µA Ω VDD=15V VDD=5V CONT=5V VDD=10V CONT=10V VDD=15V CONT=15V VDD=5V VIL=0V VIN=2.5V RL=10kΩ VIN=5V RL=10kΩ VIN=7.5V RL=10kΩ Ω VDD=10V DC Characteristics Input “H” Voltage Input “L” Voltage Input “H” Current Input “L” Current ON Resistance ON Resistance Defluxion Channel-OFF Leakage Current Static Supply Current VIH VIL IIH IIL RON △RON Input Capacitance CC (Control Input) Input capacitance CS (Switch Input) Switching Characteristics, CL=50pF Propagation Delay Time IN→OUT tPLH tPHL Propagation Delay Time CONT→OUT tPHZ,tPLZ Propagation Delay Time CONT→OUT tPZH,tPZL V V - - -0.3 - 500 600 - 120 500 - 80 280 - 25 - - 10 - - 5 - VDD=15V - - 0.3 VDD=15V - - -0.3 VDD=15V - - 1.0 VDD=5V - - 2.0 - - 4.0 - 8 - pF - f=1MHz - 10 - pF - f=1MHz - 20 50 - 12 40 - 10 30 - 40 90 - 35 80 - 30 70 VDD=15V - 60 140 VDD=5V - 20 50 - 15 40 µA µA VIN=15V VOUT=0V VIN=0V VOUT=15V VIN=VDD or VEE VDD=5V ns VDD=10V RL=10kΩ VDD=15V VDD=5V ns ns - 0.7 - MHz Sine Wave Distortion D - 0.1 - % CTc - - 600 mVP-P CT - 1 - MHz 4/16 VDD=10V VIN=VDD/2 RL=10kΩ VDD=15V FT www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VDD=10V - VDD=15V Feed Through Attenuation Cross Talk CONT→OUT Cross Talk Between Channels VDD=10V - IOFF IDD VDD=5V VDD=10V RL=1kΩ VDD=10V RL=1kΩ VDD=15V VDD=5V VSS=-5V VDD=5V VSS=-5V VDD=5V VSS=-5V VDD=5V VSS=-5V RL=10kΩ VIN=5VP-P VOUT=-50dB RL=10kΩ VIN=5VP-P RL=10kΩ,f=1MHz VIN=5VP-P RL=10kΩ VIN=5VP-P,VOUT=-50dB TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Waveforms of Switching Characteristics VDD IN/OUT (INPUT) VDD 50% 50% VEE CONT IN/OUT P.G 50% 50% OUT/IN (OUTPUT) OUT/IN CL RL VEE VEE tPHL tPLH Figure 2. Propagation Delay Time IN→OUT(tPHZ,tPLZ) Test Circuit Figure 1. Propagation Delay Time IN→OUT(tPHZ,tPLZ) Input/Output Waveform VDD CONT (INPUT) 50% 50% P.G VEE VDD CONT 90% OUT/IN (OUTPUT) IN/OUT 50% OUT/IN CL RL tPHZ tPZH VEE Figure 4. Figure 3. Propagation Delay Time CONT→OUT (tPZH,tPHZ) Input/Output Waveform VEE Propagation Delay Time CONT→OUT (tPZH,tPHZ) Test Circuit VDD CONT (INPUT) 50% 50% VDD P.G VDD VEE RL CL CONT IN/OUT OUT/IN (OUTPUT) 50% 10% OUT/IN VEE tPLZ tPZL Figure 6. Propagation Delay Time CONT→OUT (tPZL,tPLZ) Test Circuit Figure 5. Propagation Delay Time CONT→OUT (tPZL,tPLZ) Input/Output Waveform VDD CONT IN/OUT OUT/IN VOUT RL VIN= VDD/2 RON = RL(VIN/VOUT -1) VEE VEE Figure 7. ON Resistance (RON) Test Circuit www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV 1200 900 1000 750 ON Resistance [Ω] ON Resistance [Ω] Typical Performance Curves 800 85°C 25°C 600 -40°C 400 600 450 85°C 25°C -40°C 300 150 200 0 0 0.0 0.5 1.0 1.5 2.0 Input Voltage [V] 2.5 0 3.0 900 900 750 750 600 450 2 3 Input Voltage [V] 4 5 Figure 9. ON Resistance vs Input Voltage (VDD=5V, VEE=0V, CONT=5V) ON Resistance [Ω] ON Resistance [Ω] Figure 8. ON Resistance vs Input Voltage (VDD=3V, VEE=0V, CONT=3V) 1 85°C 25°C -40°C 300 150 600 450 85°C 25°C -40°C 300 150 0 0 0 2 4 6 Input Voltage [V] 8 10 0 6 9 Input Voltage [V] 12 15 Figure 11. ON Resistance vs Input Voltage (VDD=15V, VEE=0V, CONT=15V) Figure 10. ON Resistance vs Input Voltage (VDD=10V, VEE=0V, CONT=10V) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3 6/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Typical Performance Curves - continued 50 Operating Temperature Range 40 Propagation Delay Time [ns] Propagation Delay Time [ns] 50 30 VDD=3V 20 VDD=5V VDD=10V 10 Operating Temperature Range 40 30 VDD=3V 20 VDD=5V VDD=10V 10 VDD=18V VDD=18V 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 0 25 50 75 Ambient Temperature [°C] 100 Figure 13. Propagation Delay Time IN→OUT(tPHL) vs Ambient Temperature Figure 12. Propagation Delay Time IN→OUT(tPLH) vs Ambient Temperature 200 200 Operating Temperature Range 160 Propagation Delay Time [ns] Propagation Delay Time [ns] -25 120 VDD=3V 80 VDD=5V 40 VDD=10V Operating Temperature Range 160 120 VDD=3V 80 VDD=5V VDD=10V 40 VDD=18V VDD=18V 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 Figure 14. Propagation Delay Time CONT→OUT(tPZH) vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/16 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 15. Propagation Delay Time CONT→OUT(tPHZ) vs Ambient Temperature TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Typical Performance Curves - continued 200 Operating Temperature Range 160 Propagation Delay Time [ns] Propagation Delay Time [ns] 200 120 VDD=3V VDD=5V 80 VDD=10V VDD=18V 40 Operating Temperature Range 160 120 VDD=3V 80 VDD=5V 40 VDD=10V VDD=18V 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 Figure 16. Propagation Delay Time CONT→OUT(tPLZ) vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 17. Propagation Delay Time CONT→OUT(tPZL) vs Ambient Temperature 8/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Power Dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at T A=25°C(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θJA (°C/W).The temperature of IC inside the package can be estimated by this thermal resistance. Figure 11 shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the equation below: θJA = (TJmax - TA) / PD (°C/W) Derating curve in Figure 12 indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. 1.6 1.4 BU4066BC(DIP14) θJA =( TJmax - TA)/ PD Power Dissipation [W] 1.2 (°C/W) Ta [℃]TA (℃) Ambient周囲温度 temperature 1.0 BU4066BCFV (SSOP-B14) 0.8 0.6 0.4 BU4066BCF (SOP14) 0.2 0.0 Chip surface temperature TJ(℃) チップ 表面温度 Tj [℃] 0 消費電力 P [W] 25 50 75 85 100 125 150 Ambient Temperature [℃] Figure 18. Thermal Resistance Figure 19. Derating Curve I/O Equivalent Circuits Pin No. Input Terminals 5,6,12,13 VDD Input/Output Terminals 1,2,3,4,8,9,10,11 VDD VDD VDD VEE VEE Equivalence Circuit VEE www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage above that of the VDD pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Ordering Information B U 4 0 6 6 Part Number BU4066BC BU4066BCF BU4066BCFV B C x Package None: DIP14 F : SOP14 FV : SSOP-B14 x - x x Packaging and forming specification None: Tube E2 : Embossed tape and reel Marking Diagrams DIP14(TOP VIEW) SOP14(TOP VIEW) Part Number Marking BU4066BC Part Number Marking BU4066BCF LOT Number LOT Number 1PIN MARK SSOP-B14(TOP VIEW) Part Number Marking 4066C LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DIP14 13/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Physical Dimension, Tape and Reel Information – continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP-B14 15/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 BU4066BC BU4066BCF BU4066BCFV Revision History Date Revision 12.Nov.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/16 TSZ02201-0RDR0GZ00270-1-2 12.Nov.2014 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU4066BC - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU4066BC DIP14 1000 25 Tube inquiry Yes