Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 CC2650MODA SimpleLink™ Bluetooth® low energy Wireless MCU Module 1 Device Overview 1.1 Features 1 • Microcontroller – Powerful ARM® Cortex®-M3 – EEMBC CoreMark® Score: 142 – Up to 48-MHz Clock Speed – 128KB of In-System Programmable Flash – 8KB of SRAM for Cache – 20KB of Ultra-Low-Leakage SRAM – 2-Pin cJTAG and JTAG Debugging – Supports Over-The-Air (OTA) Upgrade • Ultra-Low-Power Sensor Controller – Can Run Autonomous From the Rest of the System – 16-Bit Architecture – 2KB of Ultra-Low-Leakage SRAM for Code and Data • Efficient Code Size Architecture, Placing Drivers, Bluetooth® low energy Controller, IEEE® 802.15.4 Medium Access Control (MAC), and Bootloader in ROM • Integrated Antenna • Peripherals – All Digital Peripheral Pins Can Be Routed to Any GPIO – Four General-Purpose Timer Modules (8 × 16-Bit or 4 × 32-Bit Timer, PWM Each) – 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX – Continuous Time Comparator – Ultra-Low-Power Analog Comparator – Programmable Current Source – UART – 2 × SSI (SPI, MICROWIRE, TI) – I2C – I2S – Real-Time Clock (RTC) – AES-128 Security Module – True Random Number Generator (TRNG) – 15 GPIOs – Support for Eight Capacitive Sensing Buttons – Integrated Temperature Sensor • External System – On-Chip Internal DC-DC Converter – No External Components Needed, Only Supply Voltage • Low Power – Wide Supply Voltage Range • Operation from 1.8 to 3.8 V – Active-Mode RX: 6.2 mA – Active-Mode TX at 0 dBm: 6.8 mA – Active-Mode TX at +5 dBm: 9.4 mA – Active-Mode MCU: 61 µA/MHz – Active-Mode MCU: 48.5 CoreMark/mA – Active-Mode Sensor Controller: 0.4 mA + 8.2 µA/MHz – Standby: 1 µA (RTC Running and RAM/CPU Retention) – Shutdown: 100 nA (Wake Up on External Events) • RF Section – 2.4-GHz RF Transceiver Compatible With Bluetooth low energy (BLE) 4.2 Specification and IEEE 802.15.4 PHY and MAC – Excellent Receiver Sensitivity (–97 dBm for Bluetooth low energy and –100 dBm for 802.15.4), Selectivity, and Blocking Performance – Programmable Output Power up to +5 dBm – Pre-certified for Compliance With Worldwide Radio Frequency Regulations • ETSI (Europe) • IC (Canada) • FCC (USA) • ARIB STD-T66 (Japan) • JATE (Japan) • Tools and Development Environment – Full-Feature and Low-Cost Development Kits – Multiple Reference Designs for Different RF Configurations – Packet Sniffer PC Software – Sensor Controller Studio – SmartRF™ Studio – SmartRF Flash Programmer 2 – IAR Embedded Workbench® for ARM – Code Composer Studio™ 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 1.2 • • • • • Applications Building Automation Medical and Health Appliances Industrial Consumer Electronics 1.3 www.ti.com • • • • Proximity Tags Alarm and Security Remote Controls Wireless Sensor Networks Description The SimpleLink™ CC2650MODA device is a wireless microcontroller (MCU) module that targets Bluetooth® low energy applications. The CC2650MODA device can also run ZigBee® and 6LoWPAN and ZigBee RF4CE™ remote control applications. The module is based on the SimpleLink CC2650 wireless MCU, a member of the CC26xx family of costeffective, ultra-low-power, 2.4-GHz RF devices. Very-low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin-cell batteries and in energy-harvesting applications. The CC2650MODA module contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low-power sensor controller. This sensor controller is good for interfacing with external sensors or for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2650MODA device is good for applications within a wide range of products including industrial, consumer electronics, and medical devices. The CC2650MODA module is pre-certified for operation under the regulations of the FCC, IC, ETSI, and ARIB. These certifications save significant cost and effort for customers when integrating the module into their products. The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly running on a separate ARM® Cortex®-M0 processor. This architecture improves overall system performance and power consumption and makes more flash memory available. The Bluetooth low energy software stack (BLE-Stack) and the ZigBee software stack ( Z-Stack™) are available free of charge. Device Information (1) PART NUMBER CC2650MODAMOH (1) 2 PACKAGE BODY SIZE MOH (Module) 16.90 mm × 11.00 mm For more information, see Section 9, Mechanical Packaging and Orderable Information. Device Overview Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 1.4 SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Functional Block Diagram Figure 1-1 is a block diagram for the CC2650MODA device. SimpleLinkTM CC2650MOD Wireless MCU Module 32.768-kHz Crystal Oscillator 24-MHz Crystal Oscillator RF Balun cJTAG RF core ROM Main CPU: ADC ADC 128-KB Flash ® ARM Cortex®-M3 Digital PLL DSP Modem 8-KB Cache 20-KB SRAM ARM® Cortex®-M0 ROM Sensor Controller General Peripherals / Modules I2C 4× 32-bit Timers UART 2× SSI (SPI, µWire, TI) 4-KB SRAM Sensor Controller Engine 12-bit ADC, 200 ks/s I2S Watchdog Timer 2× Analog Comparators 15 GPIOs TRNG SPI / I2C Digital Sensor IF AES Temp. / Batt. Monitor Constant Current Source 32 ch. µDMA RTC Time-to-Digital Converter 2-KB SRAM DC-DC converter Copyright © 2016, Texas Instruments Incorporated Figure 1-1. CC2650MODA Block Diagram Device Overview Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 3 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com Table of Contents 1 2 3 4 5 Device Overview ......................................... 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 1.4 Functional Block Diagram ............................ 3 6 Revision History ......................................... 4 Device Comparison ..................................... 5 Terminal Configuration and Functions .............. 6 4.1 Module Pin Diagram .................................. 6 4.2 Pin Functions ......................................... 7 Specifications ............................................ 8 5.1 Absolute Maximum Ratings .......................... 8 5.2 ESD Ratings .......................................... 8 5.3 Recommended Operating Conditions ................ 8 5.4 Power Consumption Summary ....................... 8 5.5 General Characteristics .............................. 9 Antenna ............................................. 10 1-Mbps GFSK (Bluetooth low energy) – RX ........ 10 1-Mbps GFSK (Bluetooth low energy) – TX ........ 11 5.6 5.7 5.8 5.9 5.10 5.11 5.12 5.13 5.14 5.15 5.16 5.17 5.18 5.19 5.20 5.21 5.22 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX ................................................... 11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX ................................................... 12 ............. 32.768-kHz Crystal Oscillator (XOSC_LF) .......... 48-MHz RC Oscillator (RCOSC_HF) ............... 32-kHz RC Oscillator (RCOSC_LF)................. ADC Characteristics................................. Temperature Sensor ................................ Battery Monitor ...................................... Continuous Time Comparator ....................... Low-Power Clocked Comparator ................... Programmable Current Source ..................... DC Characteristics .................................. 24-MHz Crystal Oscillator (XOSC_HF) 7 8 12 12 12 12 13 14 14 14 14 15 15 Thermal Resistance Characteristics for MOH Package ............................................. 16 9 ............................... ........................... 5.25 Typical Characteristics .............................. Detailed Description ................................... 6.1 Overview ............................................ 6.2 Functional Block Diagram ........................... 6.3 Main CPU ........................................... 6.4 RF Core ............................................. 6.5 Sensor Controller ................................... 6.6 Memory .............................................. 6.7 Debug ............................................... 6.8 Power Management ................................. 6.9 Clock Systems ...................................... 6.10 General Peripherals and Modules .................. 6.11 System Architecture ................................. 6.12 Certification .......................................... 6.13 End Product Labeling ............................... 6.14 Manual Information to the End User ................ Application, Implementation, and Layout ......... 7.1 Application Information .............................. 7.2 Layout ............................................... Device and Documentation Support ............... 8.1 Device Nomenclature ............................... 8.2 Tools and Software ................................. 8.3 Documentation Support ............................. 8.4 Texas Instruments Low-Power RF Website ........ 8.5 Low-Power RF eNewsletter ......................... 8.6 Community Resources .............................. 8.7 Additional Information ............................... 8.8 Trademarks.......................................... 8.9 Electrostatic Discharge Caution ..................... 8.10 Export Control Notice ............................... 8.11 Glossary ............................................. 5.23 Timing Requirements 5.24 Switching Characteristics 16 16 19 23 23 23 24 24 25 26 26 27 28 28 30 30 31 31 32 32 33 34 34 35 36 36 36 36 36 37 37 37 37 Mechanical, Packaging, and Orderable Information .............................................. 37 9.1 Packaging Information .............................. 37 2 Revision History Changes from August 25, 2016 to August 30, 2016 • 4 Changed document status to PRODUCTION DATA Page ............................................................................ Revision History 1 Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 3 Device Comparison Table 3-1. Device Family Overview DEVICE PHY SUPPORT CC2650MODAMOH (1) Multiprotocol (1) FLASH (KB) RAM (KB) GPIO PACKAGE 128 20 15 MOH The CC2650 device supports all PHYs and can be reflashed to run all the supported standards. Device Comparison Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 5 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 4 Terminal Configuration and Functions Section 4.1 shows pin assignments for the CC2650MODA device. 4.1 Module Pin Diagram Antenna GND 1 25 GND NC 2 24 NC GND 3 23 VDD DIO 0 4 22 VDD DIO 1 5 DIO 2 6 DIO 3 7 DIO 4 8 21 DIO 14 G1 G2 G3 G4 20 DIO 13 19 DIO 12 18 DIO 11 (Exposed GND Pads) 17 DIO 10 JTAG_TMS 9 13 14 15 16 nRESET DIO 7 DIO 8 DIO 9 (2) 12 DIO 5/JTAG_TDO JTAG_TCK (1) 11 DIO 6/JTAG_TDI 10 The following I/O pins marked in bold in the pinout have high-drive capabilities: • DIO 2 • DIO 3 • DIO 4 • JTAG_TMS • DIO 5/JTAG_TDO • DIO 6/JTAG_TDI The following I/O pins marked in italics in the pinout have analog capabilities: • DIO 7 • DIO 8 • DIO 9 • DIO 10 • DIO 11 • DIO 12 • DIO 13 • DIO 14 Figure 4-1. CC2650MODA MOH Package (16.9-mm × 11-mm) Module Pinout 6 Terminal Configuration and Functions Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 4.2 SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Pin Functions Table 4-1 describes the CC2650MODA pins. Table 4-1. Signal Descriptions – MOH Package PIN NAME PIN NO. PIN TYPE DESCRIPTION DIO_0 4 Digital I/O GPIO, Sensor Controller DIO_1 5 Digital I/O GPIO, Sensor Controller DIO_2 6 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_3 7 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_4 8 Digital I/O GPIO, Sensor Controller, high-drive capability DIO_5/JTAG_TDO 11 Digital I/O GPIO, high-drive capability, JTAG_TDO DIO_6/JTAG_TDI 12 Digital I/O GPIO, high-drive capability, JTAG_TDI DIO_7 14 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_8 15 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_9 16 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_10 17 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_11 18 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_12 19 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_13 20 Digital I/O, Analog I/O GPIO, Sensor Controller, analog DIO_14 21 Digital I/O, Analog I/O GPIO, Sensor Controller, analog EGP G1, G2, G3, G4 Power Ground – Exposed ground pad GND 1, 3, 25 — Ground JTAG_TCK 10 Digital I/O JTAG TCKC JTAG_TMS 9 Digital I/O JTAG TMSC, high-drive capability NC 2, 24 NC Not Connected—TI recommends leaving these pins floating nRESET 13 Digital input Reset, active low. No internal pullup VDD 22, 23 Power 1.8-V to 3.8-V main chip supply Terminal Configuration and Functions Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 7 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) VDD Supply voltage Voltage on any digital pin Vin (3) Voltage on ADC input MIN MAX UNIT –0.3 4.1 V V –0.3 VDD + 0.3, max 4.1 Voltage scaling enabled –0.3 VDD Voltage scaling disabled, internal reference –0.3 1.49 Voltage scaling disabled, VDD as reference –0.3 VDD / 2.9 5 dBm –40 85 °C Input RF level Tstg (1) (2) (3) Storage temperature V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to ground, unless otherwise noted. Including analog capable DIO. 5.2 ESD Ratings VALUE Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1) VESD Electrostatic discharge Charged device model (CDM), per JESD22-C101 (2) (1) (2) 5.3 ±1000 RF pins ±500 Non-RF pins ±500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Recommended Operating Conditions Ambient temperature Operating supply voltage (VDD) 5.4 All pins UNIT For operation in battery-powered and 3.3-V systems (internal DC-DC can be used to minimize power consumption) MIN MAX –40 85 UNIT °C 1.8 3.8 V Power Consumption Summary Tc = 25°C, VDD = 3.0 V with internal DC-DC converter, unless otherwise noted PARAMETER Icore Core current consumption TEST CONDITIONS TYP 100 Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF 1 Standby. With RTC, CPU, RAM and (partial) register retention. XOSC_LF 1.2 Standby. With Cache, RTC, CPU, RAM and (partial) register retention. RCOSC_LF 2.5 Standby. With Cache, RTC, CPU, RAM and (partial) register retention. XOSC_LF 2.7 Idle. Supply systems and RAM powered. Active. Core running CoreMark 8 MIN Reset. RESET_N pin asserted or VDD below Power-on-Reset threshold UNIT nA µA 550 1.45 mA + 31 µA/MHz Radio RX 6.2 Radio TX, 0-dBm output power 6.8 Radio TX, 5-dBm output power 9.4 Specifications MAX mA Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Power Consumption Summary (continued) Tc = 25°C, VDD = 3.0 V with internal DC-DC converter, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated) (1) Iperi (1) 5.5 Peripheral power domain Delta current with domain enabled 20 Serial power domain Delta current with domain enabled 13 RF core Delta current with power domain enabled, clock enabled, RF Core Idle 237 µDMA Delta current with clock enabled, module idle 130 Timers Delta current with clock enabled, module idle 113 I2C Delta current with clock enabled, module idle 12 I2S Delta current with clock enabled, module idle 36 SSI Delta current with clock enabled, module idle 93 UART Delta current with clock enabled, module idle 164 µA Iperi is not supported in Standby or Shutdown. General Characteristics Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FLASH MEMORY Supported flash erase cycles before failure Flash page/sector erase current 100 Average delta current k Cycles 12.6 mA Flash page/sector erase time (1) 8 ms Flash page/sector size 4 KB 8.15 mA 8 µs Flash write current Average delta current, 4 bytes at a time Flash write time (1) 4 bytes at a time (1) This number is dependent on flash aging and will increase over time and erase cycles. Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 9 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 5.6 www.ti.com Antenna Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Polarization TYP UNIT Linear Peak Gain 2450 MHz 1.26 Efficiency 2450 MHz 57% 5.7 MAX dBi 1-Mbps GFSK (Bluetooth low energy) – RX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity BER = 10 –3 –97 dBm Receiver saturation BER = 10–3 4 dBm Frequency error tolerance Difference between center frequency of the received RF signal and local oscillator frequency. Data rate error tolerance –350 350 kHz –750 750 ppm Co-channel rejection (1) Wanted signal at –67 dBm, modulated interferer in channel, BER = 10–3 –6 dB Selectivity, ±1 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz, BER = 10–3 7 / 3 (2) dB Selectivity, ±2 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±2 MHz, BER = 10–3 29 / 23 (2) dB Selectivity, ±3 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±3 MHz, BER = 10–3 38 / 26 (2) dB Selectivity, ±4 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±4 MHz, BER = 10–3 42 / 29 (2) dB Selectivity, ±5 MHz or more (1) Wanted signal at –67 dBm, modulated interferer at ≥ ±5 MHz, BER = 10–3 32 dB Selectivity, Image frequency (1) Wanted signal at –67 dBm, modulated interferer at image frequency, BER = 10–3 23 dB Selectivity, Image frequency ±1 MHz (1) Wanted signal at –67 dBm, modulated interferer at ±1 MHz from image frequency, BER = 10–3 3 / 26 (2) dB Out-of-band blocking (3) 30 MHz to 2000 MHz –20 dBm Out-of-band blocking 2003 MHz to 2399 MHz –5 dBm Out-of-band blocking 2484 MHz to 2997 MHz –8 dBm Out-of-band blocking 3000 MHz to 12.75 GHz –8 dBm Intermodulation Wanted signal at 2402 MHz, –64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level –34 dBm Spurious emissions, 30 MHz to 1000 MHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –71 dBm Spurious emissions, 1 GHz to 12.75 GHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 –62 dBm RSSI dynamic range 70 dB RSSI accuracy ±4 dB (1) (2) (3) 10 Numbers given as I/C dB X / Y, where X is +N MHz and Y is –N MHz Excluding one exception at Fwanted / 2, per Bluetooth Specification Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 5.8 SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 1-Mbps GFSK (Bluetooth low energy) – TX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Output power, highest setting Output power, lowest setting Spurious emission conducted measurement (1) (1) 5.9 TYP MAX UNIT 5 dBm –21 dBm f < 1 GHz, outside restricted bands –43 f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity PER = 1% –100 dBm Receiver saturation PER = 1% –7 dBm Adjacent channel rejection Wanted signal at –82 dBm, modulated interferer at ±5 MHz, PER = 1% 35 dB Alternate channel rejection Wanted signal at –82 dBm, modulated interferer at ±10 MHz, PER = 1% 52 dB Channel rejection, ±15 MHz or more Wanted signal at –82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1% 57 dB Blocking and desensitization, 5 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 64 dB Blocking and desensitization, 10 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 64 dB Blocking and desensitization, 20 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB Blocking and desensitization, 50 MHz from upper band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 68 dB Blocking and desensitization, –5 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB Blocking and desensitization, –10 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 63 dB Blocking and desensitization, –20 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 65 dB Blocking and desensitization, –50 MHz from lower band edge Wanted signal at –97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1% 67 dB Spurious emissions, 30 MHz to 1000 MHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66 –71 dBm Spurious emissions, 1 GHz to 12.75 GHz Conducted measurement in a 50-Ω single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T66 –62 dBm Frequency error tolerance Difference between center frequency of the received RF signal and local oscillator frequency >200 ppm 100 dB ±4 dB RSSI dynamic range RSSI accuracy Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 11 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 5.10 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX RF performance is specified in a single ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Output power, highest setting Output power, lowest setting Error vector magnitude Spurious emission conducted measurement (1) (1) TYP MAX UNIT 5 dBm –21 dBm At maximum output power 2% f < 1 GHz, outside restricted bands –43 f < 1 GHz, restricted bands ETSI –58 f < 1 GHz, restricted bands FCC –57 f > 1 GHz, including harmonics –45 dBm Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) 5.11 24-MHz Crystal Oscillator (XOSC_HF) (1) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Crystal frequency Start-up time (3) MAX 24 Crystal frequency tolerance (2) (1) (2) TYP –40 (3) UNIT MHz 40 150 ppm µs Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device. Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per Bluetooth and IEEE 802.15.4 specification Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection 5.12 32.768-kHz Crystal Oscillator (XOSC_LF) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN Crystal frequency Initial crystal frequency tolerance, Bluetooth low energy applications TYP MAX 32.768 Tc = 25°C Crystal aging UNIT kHz –20 20 ppm -3 3 ppm/year 5.13 48-MHz RC Oscillator (RCOSC_HF) Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Frequency TYP 48 Uncalibrated frequency accuracy ±1% Calibrated frequency accuracy (1) ±0.25% Start-up time (1) MAX UNIT MHz 5 µs Accuracy relatively to the calibration source (XOSC_HF). 5.14 32-kHz RC Oscillator (RCOSC_LF) Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Calibrated frequency TYP 32.8 Temperature coefficient 12 MIN 50 Specifications MAX UNIT kHz ppm/°C Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 5.15 ADC Characteristics Tc = 25°C, VDD = 3.0 V and voltage scaling enabled, unless otherwise noted PARAMETER (1) TEST CONDITIONS Input voltage range MIN TYP 0 VDD Resolution 12 Sample rate Offset Gain error DNL (3) Differential nonlinearity INL (4) Integral nonlinearity Internal 4.3-V equivalent reference (2) , 200 ksps, THD (1) (2) (3) (4) (5) LSB 2.4 LSB >–1 LSB ±3 LSB 10 Bits 11.1 (2) , 200 ksps, –65 VDD as reference, 200 ksps, 9.6-kHz input tone –69 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone –71 dB Internal 4.3-V equivalent reference (2), 200 ksps, 9.6-kHz input tone 60 VDD as reference, 200 ksps, 9.6-kHz input tone 63 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone 69 Internal 4.3-V equivalent reference (2), 200 ksps, 9.6-kHz input tone 67 VDD as reference, 200 ksps, 9.6-kHz input tone 72 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone 73 Conversion time Serial conversion, time-to-output, 24-MHz clock 50 Current consumption Internal 4.3-V equivalent reference (2) 0.66 mA Current consumption VDD as reference 0.75 mA Reference voltage Equivalent fixed internal reference (input voltage scaling enabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS™ API to include the gain or offset compensation factors stored in FCFG1. SINAD Signal-to-noise and and SNDR distortion ratio SFDR ksps 2 9.8 Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Total harmonic distortion V (2) Effective number of bits VDD as reference, 200 ksps, 9.6-kHz input tone Internal 4.3-V equivalent reference 9.6-kHz input tone UNIT Bits 200 Internal 4.3-V equivalent reference (2) Internal 4.3-V equivalent reference 9.6-kHz input tone ENOB MAX Spurious-free dynamic range dB dB clockcycles 4.3 (2) (5) V Reference voltage Fixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API to include the gain or offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3 V) as follows: Vref = 4.3 V × 1408 / 4095 1.48 V Reference voltage VDD as reference (Also known as RELATIVE) (input voltage scaling enabled) VDD V Reference voltage VDD as reference (Also known as RELATIVE) (input voltage scaling disabled) VDD / 2.82 (5) V Input Impedance 200 ksps, voltage scaling enabled. Capacitive input, input impedance depends on sampling frequency and sampling time >1 MΩ Using IEEE Std 1241™-2010 for terminology and test methods. Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V. No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24. For a typical example, see Figure 5-25. Applied voltage must be within absolute maximum ratings (Section 5.1) at all times. Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 13 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 5.16 Temperature Sensor Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Resolution TYP MAX 4 Range –40 UNIT °C 85 °C Accuracy ±5 °C Supply voltage coefficient (1) 3.2 °C/V (1) Automatically compensated when using supplied driver libraries. 5.17 Battery Monitor Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Resolution TYP MAX 50 Range 1.8 Accuracy UNIT mV 3.8 13 V mV 5.18 Continuous Time Comparator Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 0 VDD V External reference voltage 0 VDD V Internal reference voltage DCOUPL as reference 1.27 Offset Hysteresis Decision time Step from –10 mV to +10 mV Current consumption when enabled (1) (1) V 3 mV <2 mV 0.72 µs 8.6 µA Additionally, the bias module must be enabled when running in standby mode. 5.19 Low-Power Clocked Comparator Tc = 25°C, VDD = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Input voltage range MIN TYP 0 Clock frequency MAX VDD 32 UNIT V kHz Internal reference voltage, VDD / 2 1.49–1.51 V Internal reference voltage, VDD / 3 1.01–1.03 V Internal reference voltage, VDD / 4 0.78–0.79 V Internal reference voltage, DCOUPL / 1 1.25–1.28 V Internal reference voltage, DCOUPL / 2 0.63–0.65 V Internal reference voltage, DCOUPL / 3 0.42–0.44 V Internal reference voltage, DCOUPL / 4 0.33–0.34 V Offset <2 Hysteresis <5 mV <1 clock-cycle 362 nA Decision time Step from –50 mV to +50 mV Current consumption when enabled 14 Specifications mV Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 5.20 Programmable Current Source Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS Current source programmable output range MIN TYP Current consumption (1) UNIT 0.25–20 µA 0.25 µA 23 µA Resolution (1) MAX Including current source at maximum programmable output Additionally, the bias module must be enabled when running in standby mode. 5.21 DC Characteristics PARAMETER TEST CONDITIONS MIN TYP 1.32 1.54 MAX UNIT TA = 25°C, VDD = 1.8 V GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only GPIO VOH at 4-mA load IOCURR = 1 GPIO VOL at 4-mA load IOCURR = 1 0.21 GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 71.7 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDD 21.1 µA GPIO high/low input transition, no hysteresis IH = 0, transition between reading 0 and reading 1 0.88 V GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.07 V GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 0.74 V GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.33 V GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 2.68 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.33 V GPIO VOH at 4-mA load IOCURR = 1 2.72 V GPIO VOL at 4-mA load IOCURR = 1 0.28 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDD 113 µA GPIO high/low input transition, no hysteresis IH = 0, transition between reading 0 and reading 1 1.67 V GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.94 V GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 1.54 V GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.4 V 0.26 1.32 V 0.32 1.58 V V 0.32 V TA = 25°C, VDD = 3.0 V TA = 25°C, VDD = 3.8 V TA = 25°C VIH Lowest GPIO input voltage reliably interpreted as a «High» VIL Highest GPIO input voltage reliably interpreted as a «Low» 0.8 0.2 VDD Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA VDD 15 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 5.22 Thermal Resistance Characteristics for MOH Package °C/W (1) (2) AIR FLOW (m/s) (3) NAME DESCRIPTION RΘJC Junction-to-case 20.0 RΘJB Junction-to-board 15.3 RΘJA Junction-to-free air 29.6 0 RΘJMA Junction-to-moving air 25.0 1 PsiJT Junction-to-package top 8.8 0 PsiJB Junction-to-board 14.8 0 (1) (2) (3) °C/W = degrees Celsius per watt. These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70ºC is assumed. m/s = meters per second. 5.23 Timing Requirements MAX UNIT Rising supply-voltage slew rate MIN 0 NOM 100 mV/µs Falling supply-voltage slew rate 0 20 mV/µs 3 mV/µs 5 °C/s Falling supply-voltage slew rate, with low-power flash settings (1) Positive temperature gradient in standby (2) No limitation for negative temperature gradient, or outside standby mode CONTROL INPUT AC CHARACTERISTICS (3) RESET_N low duration 1 µs SYNCHRONOUS SERIAL INTERFACE (SSI) (4) System clocks S1 (SLAVE) (5) tclk_per SSIClk period S2 (5) tclk_high SSIClk high time 0.5 tclk_per S3 (5) tclk_low SSIClk low time 0.5 tclk_per (1) (2) (3) (4) (5) 12 65024 For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDD input capacitor (see Section 7.1.1) must be used to ensure compliance with this slew rate. Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see Section 5.14). TA = –40°C to +85°C, VDD = 1.7 V to 3.8 V, unless otherwise noted. Tc = 25°C, VDD = 3.0 V, unless otherwise noted. Device operating as slave. For SSI master operation, see Section 5.24. Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3. 5.24 Switching Characteristics Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKEUP AND TIMING Idle → Active Standby → Active Shutdown → Active 16 Specifications 14 µs 151 µs 1015 µs Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Switching Characteristics (continued) Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDD = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS SYNCHRONOUS SERIAL INTERFACE (SSI) MIN TYP MAX UNIT (1) S1 (TX only) (2) tclk_per (SSIClk period) One-way communication to SLAVE 4 65024 System clocks S1 (TX and RX) (2) tclk_per (SSIClk period) Normal duplex operation 8 65024 System clocks S2 (2) tclk_high (SSIClk high time) S3 (1) (2) (2) tclk_low (SSIClk low time) 0.5 tclk_per 0.5 tclk_per Device operating as master. For SSI slave operation, see Section 5.23. Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3. S1 S2 SSIClk S3 SSIFss SSITx SSIRx MSB LSB 4 to 16 bits Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement S2 S1 SSIClk S3 SSIFss SSITx MSB LSB 8-bit control SSIRx 0 MSB LSB 4 to 16 bits output data Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 17 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com S1 S2 SSIClk (SPO = 0) S3 SSIClk (SPO = 1) SSITx (Master) MSB SSIRx (Slave) MSB LSB LSB SSIFss Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 18 Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 5.25 Typical Characteristics This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted. -95 -93 Sensitivity Sensitivity -96 -94 Sensitivity (dBm) Sensitivity (dBm) -97 -95 -96 -97 -98 -99 -100 -101 -98 -102 -99 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 -103 -40 -30 -20 -10 80 D004 10 20 30 40 Temperature (qC) 50 -95 70 80 D005 -95 BLE Sensitivity IEEE 802.15.4 Sensitivity -96 Sensitivity (dBm) -96 -97 -98 -99 -100 -97 -98 -99 -100 -101 1.8 2.3 2.8 VDDS (V) 3.3 -101 1.9 3.8 2.4 D006 Figure 5-6. Bluetooth low energy Sensitivity vs Supply Voltage (VDD) 2.9 VDDS (V) 3.4 D007 -95 Sensitivity Sensitivity -95.5 Sensitivity Level (dBm) -96 -97 -98 -99 -100 -101 2400 3.8 Figure 5-7. IEEE 802.15.4 Sensitivity vs Supply Voltage (VDD) -95 Sensitivity Level (dBm) 60 Figure 5-5. IEEE 802.15.4 Sensitivity vs Temperature Figure 5-4. Bluetooth low energy Sensitivity vs Temperature Sensitivity (dBm) 0 -96 -96.5 -97 -97.5 -98 -98.5 2410 2420 2430 2440 2450 Frequency (MHz) 2460 2470 2480 -99 2400 2410 D008 Figure 5-8. IEEE 802.15.4 Sensitivity vs Channel Frequency 2420 2430 2440 2450 Frequency (MHz) 2460 2470 2480 D009 Figure 5-9. Bluetooth low energy Sensitivity vs Channel Frequency Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 19 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com Typical Characteristics (continued) 6 6 5 5 Output power (dBm) Output Power (dBm) This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted. 4 3 2 4 3 2 1 1 5-dBm Setting 5-dBm Setting 0 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 0 1.8 80 2.3 2.8 VDDS (V) D010 Figure 5-10. TX Output Power vs Temperature 3.3 3.8 D011 Figure 5-11. TX Output Power vs Supply Voltage (VDD) 8 16 5-dBm Setting 15 7 14 13 TX Current (mA) Output Power (dBm) 6 5 4 3 2 12 11 10 9 8 7 1 6 0 5 5-dBm setting -1 2400 2410 2420 2430 2440 2450 Frequency (MHz) 2460 2470 4 1.8 2480 Figure 5-12. TX Output Power vs Channel Frequency 9.5 9 RX Current (mA) Current Consumption (mA) 10 8.5 8 7.5 7 6.5 6 5.5 5 2 2.25 2.5 2.75 3 3.25 3.5 3.75 Voltage (V) 4 4.25 4.5 2.4 7 6.9 6.8 6.7 6.6 6.5 6.4 6.3 6.2 6.1 6 5.9 5.8 5.7 5.6 5.5 -40 -30 -20 -10 D014 Figure 5-14. RX Mode Current vs Supply Voltage (VDD) 20 2.2 2.6 2.8 3 VDDS (V) 3.2 3.4 3.6 3.8 D013 Figure 5-13. TX Current Consumption vs Supply Voltage (VDD) 10.5 4.5 1.75 2 D012 RX Current 0 10 20 30 40 Temperature (qC) 50 60 70 80 D015 Figure 5-15. RX Mode Current Consumption vs Temperature Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Typical Characteristics (continued) This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted. 12 Active Mode Current Consumpstion (mA) 3.1 TX Current (mA) 10 8 6 4 2 5-dBm Setting 0 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 Active Mode Current 3.05 3 2.95 2.9 2.85 -40 -30 -20 -10 80 D016 Figure 5-16. TX Mode Current Consumption vs Temperature 50 60 70 80 D006 4 Standby Mode Current Active Mode Current 3.5 4.5 3 4 Current (uA) Current Consumption (mA) 10 20 30 40 Temperature (qC) Figure 5-17. Active Mode (MCU Running, No Peripherals) Current Consumption vs Temperature 5 3.5 3 2.5 2 1.5 1 2.5 2 1.8 0.5 2.3 2.8 VDDS (V) 3.3 0 -20 3.8 0 10 20 30 40 50 Temperature (qC) 60 70 80 D008 Figure 5-19. Standby Mode Current Consumption With RCOSC RTC vs Temperature 1006.4 11.4 11.2 -10 D007 Figure 5-18. Active Mode (MCU Running, No Peripherals) Current Consumption vs Supply Voltage (VDD) Fs= 200 kHz, No Averaging Fs= 200 kHz, 32 samples averaging 1006.2 11 1006 10.8 ADC Code Effective Number of Bits 0 10.6 10.4 10.2 1005.8 1005.6 1005.4 10 1005.2 9.8 1005 9.6 9.4 200 300 500 1000 2000 5000 10000 20000 Input Frequency (Hz) 100000 1004.8 1.8 D009 Figure 5-20. SoC ADC Effective Number of Bits vs Input Frequency (Internal Reference) 2.3 2.8 VDDS (V) 3.3 3.8 D012 Figure 5-21. SoC ADC Output vs Supply Voltage (Fixed Input, Internal Reference) Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 21 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com Typical Characteristics (continued) This section contains typical performance plots measured on the CC2650F128RHB device. They are published in the CC2650 data sheet, and the plots relevant for the CC2650MODA device are repeated here. RF performance is specified in a single-ended 50-Ω reference plane at the antenna feeding point with Tc = 25°C and VDD = 3.0 V, unless otherwise noted. 10.5 1007.5 ENOB Internal Reference (No Averaging) ENOB Internal Reference (32 Samples Averaging) 10.4 1007 10.3 10.2 ENOB ADC Code 1006.5 1006 10.1 10 9.9 1005.5 9.8 1005 9.7 1004.5 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 9.6 1k 80 10k Sampling Frequency (Hz) D013 Figure 5-22. SoC ADC Output vs Temperature (Fixed Input, Internal Reference) 100k 200k D009A Figure 5-23. SoC ADC ENOB vs Sampling Frequency (Input Frequency = FS / 10) 3.5 3 2.5 2 DNL 1.5 1 0.5 0 -0.5 -1 ADC Code 4200 4000 3800 3600 3400 3200 3000 2800 2600 2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 0 -1.5 D010 Figure 5-24. SoC ADC DNL vs ADC Code (Internal Reference) 3 2 1 INL 0 -1 -2 -3 -4 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 3200 3400 3600 3800 4000 4200 ADC Code D011 Figure 5-25. SoC ADC INL vs ADC Code (Internal Reference) 22 Specifications Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 6 Detailed Description 6.1 Overview Figure 6-1 shows the core modules of the CC2650MODA device. 6.2 Functional Block Diagram SimpleLinkTM CC2650MOD Wireless MCU Module 32.768-kHz Crystal Oscillator 24-MHz Crystal Oscillator RF Balun cJTAG RF core ROM Main CPU: ADC ADC 128-KB Flash ® ARM Cortex®-M3 Digital PLL DSP Modem 8-KB Cache 20-KB SRAM ARM® Cortex®-M0 ROM Sensor Controller General Peripherals / Modules I2C 4× 32-bit Timers UART 2× SSI (SPI, µWire, TI) I2S Watchdog Timer 4-KB SRAM Sensor Controller Engine 12-bit ADC, 200 ks/s 2× Analog Comparators 15 GPIOs TRNG SPI / I2C Digital Sensor IF AES Temp. / Batt. Monitor Constant Current Source 32 ch. µDMA RTC Time-to-Digital Converter 2-KB SRAM DC-DC converter Copyright © 2016, Texas Instruments Incorporated Figure 6-1. CC2650MODA Functional Block Diagram Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 23 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 6.3 www.ti.com Main CPU The SimpleLink CC2650MODA wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack. The CM3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts. CM3 features include: • 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications • Outstanding processing performance combined with fast interrupt handling • ARM Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few kilobytes of memory for microcontroller-class applications: – Single-cycle multiply instruction and hardware divide – Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral control – Unaligned data access, enabling data to be efficiently packed into memory • Fast code execution permits slower processor clock or increases sleep mode time • Harvard architecture characterized by separate buses for instruction and data • Efficient processor core, system, and memories • Hardware division and fast digital-signal-processing oriented multiply accumulate • Saturating arithmetic for signal processing • Deterministic, high-performance interrupt handling for time-critical applications • Enhanced system debug with extensive breakpoint and trace capabilities • Serial wire trace reduces the number of pins required for debugging and tracing • Migration from the ARM7™ processor family for better performance and power efficiency • Optimized for single-cycle flash memory use • Ultra-low-power consumption with integrated sleep modes • 1.25 DMIPS per MHz 6.4 RF Core The RF core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band circuitries, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core offers a high-level, command-based API to the main CPU. The RF core can autonomously handle the time-critical aspects of the radio protocols (802.15.4 RF4CE and ZigBee, Bluetooth low energy) thus offloading the main CPU and leaving more resources for the user application. The RF core has a dedicated 4-KB SRAM block and runs initially from separate ROM memory. The ARM Cortex-M0 processor is not programmable by customers. 24 Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 6.5 SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Sensor Controller The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main CM3 CPU. The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and typical use cases may be (but are not limited to): • Analog sensors using integrated ADC • Digital sensors using GPIOs and bit-banged I2C or SPI • UART communication for sensor reading or debugging • Capacitive sensing • Waveform generation • Pulse counting • Keyboard scan • Quadrature decoder for polling rotation sensors • Oscillator calibration The peripherals in the Sensor Controller include the following: • The low-power clocked comparator can be used to wake the device from any state in which the comparator is active. A configurable internal reference can be used with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC. • Capacitive sensing functionality is implemented through the use of a constant current source, a timeto-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take care of baseline tracking, hysteresis, filtering and other related functions. • The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC can be triggered by many different sources, including timers, I/O pins, software, the analog comparator, and the RTC. • The Sensor Controller also includes a SPI/I2C digital interface. • The analog modules can be connected to up to eight different GPIOs. The peripherals in the Sensor Controller can also be controlled from the main application processor. Table 6-1 lists the GPIOs that are connected to the Sensor Controller. Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 25 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com Table 6-1. GPIOs Connected to the Sensor Controller (1) (1) 6.6 ANALOG CAPABLE 16.9 × 11 MOH DIO NUMBER Y 14 Y 13 Y 12 Y 11 Y 9 Y 10 Y 8 Y 7 N 4 N 3 N 2 N 1 N 0 Up to 13 pins can be connected to the Sensor Controller. Up to eight of these pins can be connected to analog modules Memory The flash memory provides nonvolatile storage for code and data. The flash memory is in-system programmable. The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two 4-KB blocks and two 6-KB blocks. Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled, the 8KB of cache can be used as a general-purpose RAM. The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib and lower layer protocol stack software (802.15.4 MAC and Bluetooth low energy Controller). The ROM also contains a bootloader that can be used to reprogram the device using SPI or UART. 6.7 Debug The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface. 26 Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 6.8 SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Power Management To minimize power consumption, the CC2650MODA device supports a number of power modes and power-management features (see Table 6-2). Table 6-2. Power Modes SOFTWARE-CONFIGURABLE POWER MODES ACTIVE IDLE STANDBY SHUTDOWN RESET PIN HELD CPU Active Off Off Off Off Flash On Available Off Off Off SRAM On On On Off Off Radio Available Available Off Off Off MODE Supply System Current On On Duty Cycled Off Off 1.45 mA + 31 µA/MHz 550 µA 1 µA 0.15 µA 0.1 µA – 14 µs 151 µs 1015 µs 1015 µs Full Full Partial No No Wake-up time to CPU active (1) Register retention SRAM retention Full Full Full No No High-speed clock XOSC_HF or RCOSC_HF XOSC_HF or RCOSC_HF Off Off Off Low-speed clock XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF XOSC_LF or RCOSC_LF Off Off Peripherals Available Available Off Off Off Sensor Controller Available Available Available Off Off Wake up on RTC Available Available Available Off Off Wake up on pin edge Available Available Available Available Off Wake up on reset pin Available Available Available Available Available Brown Out Detector (BOD) Active Active Duty Cycled (2) Off N/A Power On Reset (POR) Active Active Active Active N/A (1) (2) Not including RTOS overhead The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset or POR releases it. To avoid this, TI recommends that STANDBY mode is avoided if there is a risk that the supply voltage (VDD) may drop below the specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a battery replacement, triggers a Power-on-reset by ensuring that the VDD decoupling network is fully depleted before applying supply voltage again (for example, inserting new batteries). In active mode, the application CM3 CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 6-2). In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event will bring the processor back into active mode. In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode. In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller. The I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin, defined as a wake from Shutdown pin, wakes up the device and functions as a reset trigger. The CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the flash memory contents. Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 27 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the main CPU, which means that the main CPU does not have to wake up, for example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to configure the sensor controller and choose which peripherals are controlled and which conditions wake up the main CPU. 6.9 Clock Systems The CC2650MODA device supports two external and two internal clock sources. A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to create a 48-MHz clock. The 32-kHz crystal is optional. Bluetooth low energy requires a slow-speed clock with better than ±500-ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal 32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed crystal oscillator is designed for use with a 32-kHz watch-type crystal. The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem. The internal low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystal oscillator is not used. The 32-kHz clock source can be used as external clocking reference through GPIO. 6.10 General Peripherals and Modules The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge (configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high-drive capabilities (marked in bold in Section 4). The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz. The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baudrate generation up to a maximum of 3 Mbps. 28 Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module. Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0. In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF timer can be synchronized to the RTC. The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave. The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit. The watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached. The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer more data. Some features of the µDMA controller include the following (this is not an exhaustive list): • Highly flexible and configurable channel operation of up to 32 channels • Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-toperipheral • Data sizes of 8, 16, and 32 bits The AON domain contains circuitry that is always enabled, except in Shutdown mode (where the digital supply is off). This circuitry includes the following: • The RTC can be used to wake the device from any state where it is active. The RTC contains three compare and one capture registers. With software support, the RTC can be used for clock and calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used instead of a crystal. • The battery monitor and temperature sensor are accessible by software and give a battery status indication as well as a coarse temperature measure. Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 29 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 6.11 System Architecture Depending on the product configuration, CC26xx can function either as a Wireless Network Processor (WNP—an IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the device. In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack. 6.12 Certification The CC2650MODA module is certified to the standards listed in Table 6-3 (with IDs where applicable): Table 6-3. CC2650MODA List of Certifications REGULATORY BODY FCC (USA) IC (Canada) SPECIFICATION Part 15C:2015+MPE FCC 1.1307 RF Exposure (Bluetooth) Part 15C:2015+MPE FCC 1.1307 RF Exposure (802.15.4) RSS-102 (MPE) and RSS-247 (Bluetooth) RSS-102 (MPE) and RSS-247 (IEEE 802.15.4) ID (IF APPLICABLE) FCC ID: ZAT26M1 ID: 451H-26M1 EN300328 v1.9.1 (Bluetooth) EN300328 v1.9.1 (802.15.4) IEC/EN62479:Ver 2010 (MPE) ETSI/CE (Europe) EN301489-1 v1.9.2:2011 EN301489-17 v2.2.1:2012 (EMC) EN55022:2010+AC:2011 EN55024:2011 EN 60950-1:2006/A11:2009/A1:2010/A12:2011/A2:2013 Japan MIC ARIB STD-T66 No: 201-160413/00 JATE D 16 0092 201/00 6.12.1 Federal Communications Commission Statement You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference and 2. This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be colocated or operating with any other antenna or transmitter. 30 Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 6.12.2 Canada, Industry Canada (IC) This device complies with Industry Canada licence-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. IC RF Radiation Exposure Statement: To comply with IC RF exposure requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur. 6.13 End Product Labeling This module is designed to comply with the FCC statement, FCC ID : ZAT26M1. The host system using this module must display a visible label indicating the following text: "Contains FCC ID: ZAT26M1" This module is designed to comply with the IC statement, IC : 451H-26M1. The host system using this module must display a visible label indicating the following text: "Contains IC: 451H-26M1" 6.14 Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual must include all required regulatory information/warning as shown in this manual. Detailed Description Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 31 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 7 Application, Implementation, and Layout NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 7.1 7.1.1 Application Information Typical Application Circuit No external components are required for the operation of the CC2650MODA device. Figure 7-1 shows the application circuit. VDDS U1 VDDS R28 100k nReset JTAG-TCK JTAG-TMS DIO0 DIO1 DIO2 DIO3 DIO4 DIO5 DIO6 DIO7 DIO8 DIO9 DIO10 DIO11 DIO12 DIO13 DIO14 4 5 6 7 8 11 12 14 15 16 17 18 19 20 21 13 10 9 1 3 25 DIO_0 DIO_1 DIO_2 DIO_3 DIO_4 DIO_5/JTAG_TDO DIO_6/JTAG_TDI DIO_7 DIO_8 DIO_9 DIO_10 DIO_11 DIO_12 DIO_13 DIO_14 VDDS VDDS NC_2 NC_24 nRESET JTAG_TCKC JTAG_TMSC GND GND GND EGP EGP EGP EGP 22 23 2 24 26 27 28 29 CC2650MODAMOH Copyright © 2016, Texas Instruments Incorporated Figure 7-1. CC2650MODA Application Circuit 32 Application, Implementation, and Layout Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 7.2 7.2.1 SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Layout Layout Guidelines Use the following guidelines to lay out the CC2650MODA device: • The module must be placed close to the edge of the PCB. • TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in Figure 7-2 and Figure 7-3. • TI recommends using a generous amount of ground vias to stitch together the ground planes on different layers. Several ground vias should be placed close to the exposed ground pads of the module. • No external decoupling is required. • The reset line should have an external pullup resistor unless the line is actively driven. Placement of this component is not critical. • TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads. Figure 7-2. Top Layer Figure 7-3. Bottom Layer Application, Implementation, and Layout Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 33 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com 8 Device and Documentation Support 8.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, CC2650MODA is in production; therefore, no prefix/identification is assigned). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, MOH). For orderable part numbers of CC2650MODA devices in the MOH package type, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. CC2650 MOD A MOH PREFIX X = Experimental device Blank = Qualified device PACKAGE DESIGNATOR MOH = 29-pin Module DEVICE FAMILY SimpleLink™ Multistandard Wireless MCU ROM version 1 Flash = 128KB DEVICE MOD = Module Figure 8-1. Device Nomenclature 34 Device and Documentation Support Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com 8.2 SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 Tools and Software TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The following products support development of the CC2650MODA device applications: Software Tools: SmartRF Studio 7: SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at an early stage in the design process. • Test functions for sending and receiving radio packets, continuous wave transmit and receive • Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger • Can also be used without any hardware, but then only to generate, edit and export radio configuration settings • Can be used in combination with several development kits for TI's CCxxxx RF-ICs Sensor Controller Studio: Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple background tasks autonomously and independent of the System CPU state. • Allows for Sensor Controller task algorithms to be implemented using a C-like programming language • Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller machine code and associated definitions • Allows for rapid development by using the integrated Sensor Controller task testing and debugging functionality. This allows for live visualization of sensor data and algorithm verification. IDEs and Compilers: Code Composer Studio: • Integrated development environment with project management tools and editor • Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family • Best support for XDS debuggers; XDS100v3, XDS110 and XDS200 • High integration with TI-RTOS with support for TI-RTOS Object View IAR Embedded Workbench for ARM • Integrated development environment with project management tools and editor • IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family • Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link • Integrated development environment with project management tools and editor • RTOS plugin is available for TI-RTOS For a complete listing of development-support tools for the CC2650MODA platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. Device and Documentation Support Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA 35 CC2650MODA SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 8.3 www.ti.com Documentation Support To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. The following documents describe the CC2650MODA device. Copies of these documents are available on the Internet at www.ti.com. CC26xx SimpleLink™ Wireless MCU Technical Reference Manual CC26xx SimpleLink™ Wireless MCU Errata 8.4 Texas Instruments Low-Power RF Website TI's Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to www.ti.com/lprf. 8.5 Low-Power RF eNewsletter The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up at: www.ti.com/lprfnewsletter 8.6 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community The TI engineer-ro-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community • Forums, videos, and blogs • RF design help • E2E interaction Join here. Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including: • RF circuit, low-power RF, and ZigBee design services • Low-power RF and ZigBee module solutions and development tools • RF certification services and RF circuit manufacturing For help with modules, engineering services or development tools: Search the Low-Power RF Developer Network to find a suitable partner. www.ti.com/lprfnetwork 8.7 Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, modules, and Systems-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands. 36 Device and Documentation Support Copyright © 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MODA CC2650MODA www.ti.com SWRS187A – AUGUST 2016 – REVISED AUGUST 2016 In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world. With a broad selection of product solutions, end-application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. 8.8 Trademarks IAR Embedded Workbench is a registered trademark of IAR Systems AB. SmartRF, Code Composer Studio, SimpleLink, Z-Stack, TI-RTOS, E2E are trademarks of Texas Instruments. ARM7 is a trademark of ARM Limited (or its subsidiaries). ARM, Cortex, Thumb are registered trademarks of ARM Limited (or its subsidiaries). Bluetooth is a registered trademark of Bluetooth SIG, Inc. CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium. IEEE Std 1241 is a trademark of The Institute of Electrical and Electronics Engineers, Inc. IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc. ZigBee is a registered trademark of ZigBee Alliance, Inc. ZigBee RF4CE is a trademark of Zigbee Alliance, Inc. All other trademarks are the property of their respective owners. 8.9 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.10 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or reexport is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 8.11 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 9 Mechanical, Packaging, and Orderable Information 9.1 Packaging Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2016, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Product Folder Links: CC2650MODA 37 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC2650MODAMOHR PREVIEW QFM MOH 29 1 TBD Call TI Call TI -40 to 85 CC2650MODAMOHT PREVIEW QFM MOH 29 250 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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