Rohm BM60051FV-C Fault signal output function Datasheet

Datasheet
1ch Gate Driver Providing Galvanic Isolation
2500Vrms Isolation Voltage
BM60051FV-C
General Description
Key Specifications
The BM60051FV-C is a gate driver with an isolation
voltage of 2500Vrms, I/O delay time of 260ns, minimum
input pulse width of 180ns, and incorporates the fault
signal output function, under voltage lockout (UVLO)
function, short circuit protection (SCP) function, active
miller clamping function, temperature monitoring function,
switching controller function and output state feedback
function.
Isolation Voltage:
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Packages
2500 [Vrms] (Max)
24 [V] (Max)
260 [ns] (Max)
180 [ns] (Max)
W(Typ) x D(Typ) x H(Max)
9.2mm x 10.4mm x 2.4mm
SSOP-B28W
Features
 Fault signal output function
Under voltage lockout function
Short circuit protection function
Active Miller Clamping
Temperature monitor
Switching controller
Output State Feedback Function
UL1577 Recognized:File No. E356010
(Note 1)
AEC-Q100 Qualified
(Note 1:Grade1)
Applications

Automotive isolated IGBT/MOSFET inverter
gate drive.
Automotive DC-DC converter.
Industrial inverters system.
UPS system.



Typical Application Circuit
OSC
GND1
FLT
UVLO1
GND2
TIMER
FLT
OUT2
RESE T OSC
Q
OSFB
ECU
PREDRIVER
LOGIC
DIS
NC
S
R
INA
OUT1
VCC2
VCC2
LOGIC
+
SENSOR
+
PROOUT
VCC1
VCC1
FLT
+
OSC
EDGE
R
TO1
+
RST
V_BATT
Snubber
S
Q
UVLO1
UVLO_BA TT
REGULATOR
VREG
GND1
SLOPE
OSC
OSC
FET_G
VCC2
Q
Rectifier
/ Ripple f ilter
S
SCPIN3
Filter
SCPIN2
Filter
+
DAC
COMP
V_BA TT
SCPIN1
Filter
SENSE
UVLOIN
MAX.Duty
+
R
GND2
TC
TO2
+
+
+
+
FB
Rectifier
/ Ripple f ilter
CURRENT
SOURCE
+
OSFB
GND1
GND2
UVLO_BATT
GND2
GND1
Figure 1. Typical Application Circuit
〇Product structure : Silicon integrated circuit
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BM60051FV-C
Recommended Range Of External Constants
Pin Configuration
(TOP VIEW)
Pin Name
Symbol
Recommended Value
Min
Typ
1
28 GND1
kΩ
UVLOIN
2
27 SENSE
10
MΩ
SCPIN1
3
26 FET_G
-
µF
SCPIN2
4
25 VREG
SCPIN3
5
24 V_BATT
TO1
6
TO2
7
23 COMP
22 FB
TC
8
21 VCC1
PROOUT
9
20 SENSOR
(Note2)
RTC
1.25
-
50
(Note3)
RTC
0.1
1
CVBATT
3
-
TC
TC
VBATT
Unit
GND2
Max
VCC1
CVCC1
0.2
-
-
µF
VCC2
CVCC2
0.4
-
-
µF
VREG
CVREG
0.1
1
10
µF
(Note2) Use Temperature monitor
(Note3) No use Temperature monitor
VCC2 10
OUT1 14
1
NC 12
19 OSFB
9
18 INA
OUT2 13
16 FLT
GND2 14
15 GND1
17 DIS
Figure 2. Pin configuration
Pin Descriptions
Pin No.
Pin Name
Function
1
GND2
2
UVLOIN
Output-side ground pin
Output-side UVLO setting pin
3
SCPIN1
Short circuit current detection pin 1
4
SCPIN2
Short circuit current detection pin 2
5
SCPIN3
Short circuit current detection pin 3
6
TO1
Constant current output pin / sensor voltage input pin 1
7
TO2
Constant current output pin / sensor voltage input pin 2
8
TC
Constant current setting resistor connection pin
9
PROOUT
10
VCC2
Output-side power supply pin
11
OUT1
Output pin
12
NC
No connect
13
OUT2
Output pin for Miller Clamp
14
GND2
Output-side ground pin
15
GND1
Input-side ground pin
16
FLT
Fault output pin
17
DIS
Input enabling signal input pin
18
INA
Control input pin
19
OSFB
20
SENSOR
21
VCC1
22
FB
23
COMP
24
V_BATT
Soft turn-OFF pin /Gate voltage input pin
Output state feedback output pin
Temperature information output pin
Input-side power supply pin
Error amplifier inverting input pin for switching controller
Error amplifier output pin for switching controller
Main power supply pin
25
VREG
Power supply pin for driving MOS FET for switching controller
26
FET_G
MOS FET control pin for switching controller
27
SENSE
Current feedback resistor connection pin for switching controller
28
GND1
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Input-side ground pin
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TSZ02201-0818ABH00010-1-2
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BM60051FV-C
Absolute Maximum Ratings
Parameter
Symbol
Main Power Supply Voltage
Rating
VBATTMAX
Input-Side Control Block Supply Voltage
Output-Side Supply Voltage
-0.3 to +30.0
VINMAX
FLT, OSFB Pin Input Voltage
SENSOR Pin Output Current
FB Pin Input Voltage
(Note 5)
-0.3 to +VCC1+0.3V or +7.0V
VFLTMAX
FLT Pin, OSFB Pin Output Current
V
-0.3 to +7.0
VCC2MAX
INA, DIS Pin Input Voltage
V
(Note 4)
-0.3 to+40.0
VCC1MAX
Unit
(Note 4)
-0.3 to +7.0V
IFLT
10
ISENSOR
10
VFBMAX
(Note 4)
-0.3 to +VCC1+0.3V or +7.0V
1000
SCPIN1 Pin, SCPIN2 Pin, SCPIN3 Pin
Input Voltage
VSCPINMAX
-0.3 to +6.0
UVLOIN Pin Input Voltage
VUVLOINMAX
-0.3 to VCC2+0.3
TO1 Pin, TO2 Pin Output Current
ITOMAX
OUT1 Pin Output Current (Peak5µs)
OUT2 Pin Output Current
(Peak5µs)
(Note 5)
V
V
(Note 5)
V
(Note 5)
V
8
IOUT2PEAK
(Note 4)
mA
-0.3 to VCC2+0.3
IOUT1PEAK
V
mA
IFET_GPEAK
VTOMAX
V
mA
FED_G Pin Output Current (Peak5µs)
TO1 Pin, To2 Pin Input Voltage
V
(Note 4)
mA
5000
(Note 6)
mA
5000
(Note 6)
mA
mA
PROOUT Pin Output Current (Peak5µs)
IPROOUTPEAK5
2500
(Note 6)
PROOUT Pin Output Current (Peak10µs)
IPROOUTPEAK10
1000
(Note 6)
mA
(Note 7)
W
Power Dissipation
Pd
1.12
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Tjmax
+150
°C
Junction Temperature
(Note 4) Relative to GND1
(Note 5) Relative to GND2
(Note 6) Should not exceed Pd and Tj=150C
(Note 7) Derate above Ta=25C at a rate of 9.0mW/C. Mounted on a glass epoxy of 114.3 mm  76.2 mm  1.6 mm.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Main Power Supply Voltage
Min
Max
Units
(Note 8)
4.5
24.0
V
VCC1
(Note 8)
4.5
5.5
V
VCC2
(Note 9)
9
24
V
6
-
V
VBATT
Input-side Control Block Supply Voltage
Output-side Supply Voltage
(Note 9)
Output side UVLO voltage
VUV2TH
(Note 8) GND1 reference
(Note 9) GND2 reference
Insulation Related Characteristics
Parameter
Symbol
Characteristic
RS
>10
Insulation Withstand Voltage / 1min
VISO
2500
Vrms
Insulation Test Voltage / 1sec
VISO
3000
Vrms
Insulation Resistance (VIO=500V)
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9
Unit
Ω
TSZ02201-0818ABH00010-1-2
20.May.2015 Rev.002
BM60051FV-C
Electrical Characteristics
(Unless otherwise specified Ta=-40°C to125°C, VBATT=5V to 24V, VCC1=4.5V to 5.5V, VCC2=9V to 24V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
General
Main Power Supply
FET_G Pin
IBATT1
0.37
0.84
1.47
mA
Circuit Current 1
switching operating
Main Power Supply
FET_G Pin
IBATT2
0.34
0.77
1.35
mA
Circuit Current 2
No Switching
Input Side Circuit Current 1
ICC11
0.13
0.31
0.49
mA
OUT=L
Input Side Circuit Current 2
Input Side Circuit Current 3
Input Side Circuit Current 4
ICC12
ICC13
ICC14
0.13
0.25
0.31
0.31
0.42
0.53
0.49
0.59
0.74
mA
mA
mA
OUT=H
INA =10kHZ, Duty=50%
INA =20kHZ, Duty=50%
Output Side Circuit Current
ICC2
Switching Power Supply Controller
2.7
4.7
7.1
mA
RTC=10kΩ
FET_G Output Voltage H1
VFETGH1
4.5
5.0
5.5
V
FET_G Output Voltage H2
VFETGH2
4.0
4.5
-
V
FET_G Output Voltage L
VFETGL
0
-
0.3
V
IOUT=0A(open)
V_BATT=4.5V
IOUT=0A(open)
IOUT=0A(open)
FET_G ON-Resistance
(Source-side)
RONGH
3
6
12
Ω
10mA
RONGL
0.3
0.6
1.3
Ω
10mA
fOSC_SW
80
100
120
kHz
Soft-start Time
FB Pin Threshold Voltage
tSS
VFB
1.47
1.50
50
1.53
ms
V
FB Pin Input Current
COMP Pin Sink Current
IFB
0
-80
+0.8
-40
µA
µA
FET_G ON-Resistance
(Sink-side)
Oscillation Frequency
ICOMPSINK
-0.8
-160
COMP Pin Source Current
V_BATT UVLO OFF Voltage
ICOMPSOURCE
VUVLOBATTH
40
4.05
80
4.25
160
4.45
µA
V
V_BATT UVLO ON Voltage
Maximum ON DUTY
VUVLOBATTL
DONMAX
3.95
75
4.15
85
4.35
95
V
%
Logic Block
Logic High Level Input Voltage
VINH
0.7×VCC1
-
VCC1
V
INA、DIS
Logic Low Level Input Voltage
Logic Pull-Down Resistance
VINL
RIND
0
25
50
0.3×VCC1
100
V
kΩ
INA、DIS
INA
Logic Pull-Up Resistance
Logic Input Filtering Time
RINU
tINFIL
25
80
50
130
100
180
kΩ
ns
DIS
INA
DIS Input Filtering Time
DIS Input Delay Time
TDISFIL
tDDIS
4
4
10
10
20
20
µs
µs
Output
OUT1 ON-Resistance
(Source-side)
OUT1 ON-Resistance
(Sink-side)
RONH
0.2
0.55
1.3
Ω
IOUT=40mA
RONL
0.2
0.55
1.3
Ω
IOUT=40mA
OUT1 Maximum Current
IOUTMAX
5.0
-
-
A
PROOUT ON-Resistance
Turn ON time
RONPRO
tPON
0.5
1.2
2.7
140
200
260
Ω
ns
Turn OFF time
Propagation Distortion
tPOFF
tPDIST
140
-60
200
0
260
+60
ns
ns
Rise Time
Fall Time
OUT2 ON-Resistance
OUT2 ON Threshold Voltage
OUT2 Output Delay Time
tRISE
tFALL
RON2
VOUT2ON
tOUT2ON
0.4
1.8
-
30
30
0.9
2.0
15
50
50
2.0
2.2
50
ns
ns
Ω
V
ns
CM
100
-
-
kV/µs
Common Mode Transient Immunity
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VCC2=15V
Guaranteed by design
IPROOUT=40mA
tPOFF - tPON
Load=1nF
Load=1nF
IOUT=40mA
Design assurance
TSZ02201-0818ABH00010-1-2
20.May.2015 Rev.002
BM60051FV-C
Electrical Characteristics - continued
(Unless otherwise specified Ta=-40°C to125°C, VBATT=5V to 24V, VCC1=4.5V to 5.5V, VCC2=8V to 24V)
Parameter
Temperature Monitor
Symbol
Min
Typ
Max
Unit
VTC
ITO
fOSC_TO
DSENSOR1
DSENSOR2
DSENSOR3
0.975
0.97
8
87
47
5
1.000
1.00
10
90
50.0
10
1.025
1.03
14
93
53
15
V
mA
kHz
%
%
%
VTOH
7
8
9
V
RSENSORH
-
60
160
Ω
ISENSOR=5mA
RSENSORL
-
60
160
Ω
ISENSOR=5mA
Protection Functions
Input-side UVLO OFF Voltage
VUVLO1H
4.05
4.25
4.45
V
Input-side UVLO ON Voltage
Input-side UVLO Filtering Time
VUVLO1L
tUVLO1FIL
3.95
2
4.15
10
4.35
30
V
µs
tDUVLO1OUT
2
10
30
µs
tDUVLO1FLT
2
10
30
µs
VUVLO2H
0.95
1.00
1.05
V
VUVLO2L
0.85
0.90
0.95
V
tUVLO2FIL
2
10
30
µs
Output-side UVLO Delay Time
(OUT)
tDUVLO2OUT
2
10
30
µs
Output-side UVLO Delay Time
(FLT)
tDUVLO2FLT
3
-
65
µs
VSCDET
0.67
0.70
0.73
V
tSCPFIL
0.15
0.30
0.45
µs
tDSCPOUT
0.16
0.33
0.50
µs
OUT1=30kΩ Pull down
tDSCPPRO
0.17
0.35
0.53
µs
PROOUT=30kΩ Pull up
Short Current Detection
Delay Time (FLT)
tDSCPFLT
1
-
35
µs
Soft Turn OFF Release Time
FLT Output ON-Resistance
tSCPOFF
RFLTL
30
-
30
110
80
µs
Ω
Fault Output Holding Time
Gate State H Detection
Threshold Voltage
Gate State L Detection
Threshold Voltage
tFLTRLS
20
40
60
ms
VOSFBH
4.5
5.0
5.5
V
VOSFBL
4.0
4.5
5.0
V
OSFB Output Filtering Time
OSFB Output ON-Resistance
tOSFBFIL
ROSFB
1.5
-
2.0
30
2.5
80
µs
Ω
OSFB Output Holding Time
tOSFBRLS
20
40
60
ms
TC Pin Voltage
TOx Pin Output Current
SENSOR Output Frequency
SENSOR Output Duty1
SENSOR Output Duty2
SENSOR Output Duty3
TOx Pin Disconnect Detection
Voltage
SENSOR ON Resistance
(Source-side)
SENSOR ON Resistance
(Sink-side)
Input-side UVLO Delay Time
(OUT)
Input-side UVLO Delay Time
(FLT)
Output-side UVLO OFF
Threshold Voltage
Output-side UVLO ON
Threshold Voltage
Output-side UVLO
Filtering Time
Short Current Detection
Voltage
Short Current Detection
Filtering Time
Short Current Detection
Delay time (OUT)
Short Current Detection
Delay Time (PROOUT)
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Conditions
RTC=10kΩ
VTOx=1.35V
VTOx=2.59V
VTOx=3.84V
OUT1=30kΩ Pull up
IFLT=5mA
IOSFB=5mA
TSZ02201-0818ABH00010-1-2
20.May.2015 Rev.002
BM60051FV-C
Typical Performance Curves
1.37
1.37
1.17
1.17
125°C
IBATT1 [mA]
IBATT1 [mA]
25°C
0.97
VBATT=24V
0.97
0.77
0.77
0.57
0.57
VBATT=14V
-40°C
VBATT=4.5V
0.37
0.37
4.5
9
13.5
18
-40
22.5
0
80
120
Ta [°C]
VBATT [V]
Figure 3. Main Power SupplyCircuit Current 1
(FET_G Pin switching operating)
Figure 4. Main Power SupplyCircuit Current 1
(FET_G Pin switching operating)
1.34
1.34
1.14
1.14
25°C
VBATT=24V
125°C
IBATT2 [mA]
IBATT2 [mA]
40
0.94
0.74
0.54
0.94
0.74
VBATT=14V
0.54
-40°C
VBATT=4.5V
0.34
0.34
4.5
9
13.5
18
22.5
-40
VBATT [V]
40
80
120
Ta [°C]
Figure 6. Main Power SupplyCircuit Current 2
(FET_G Pin no switching)
Figure 5. Main Power SupplyCircuit Current 2
(FET_G Pin no switching)
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BM60051FV-C
0.48
0.48
25°C
0.43
VCC1=5.5V
125°C
0.43
0.38
ICC11 [mA]
ICC11 [mA]
0.38
0.33
0.28
VCC1=5.0V
0.28
VCC1=4.5V
-40°C
0.23
0.33
0.23
0.18
0.18
0.13
0.13
4.5
4.75
5
5.25
5.5
-40
0
VCC1 [V]
80
120
Ta [°C]
Figure 7. Input Side Circuit Current 1
(OUT1=L)
Figure 8. Input Side Circuit Current 1
(OUT1=L)
0.48
0.48
125°C
25°C
0.43
VCC1=5.5V
0.43
0.38
ICC12 [mA]
0.38
ICC12 [mA]
40
0.33
0.28
-40°C
0.23
0.33
0.18
0.13
0.13
4.75
VCC1=4.5V
0.23
0.18
4.5
VCC1=5.0V
0.28
5
5.25
5.5
-40
VCC1 [V]
40
80
120
Ta [°C]
Figure 9. Input Side Circuit Current 2
(OUT1=H)
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0
Figure 10. Input Side Circuit Current 2
(OUT1=H)
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BM60051FV-C
0.55
0.55
125°C
VCC1=5.5V
0.5
25°C
ICC13 [mA]
ICC13 [mA]
0.5
0.45
0.4
0.35
0.45
0.4
VCC1=5.0V
0.35
VCC1=4.5V
-40°C
0.3
0.3
0.25
0.25
4.5
4.75
5
5.25
5.5
-40
0
VCC1 [V]
0.71
0.66
0.66
ICC14 [mA]
ICC14 [mA]
0.61
125°C
0.56
0.51
0.51
0.46
0.41
0.41
-40°C
VCC1=5.5V
0.56
0.46
0.36
120
Figure 12. Input Side Circuit Current 3
(INA=10kHz, Duty=50%)
0.71
25°C
80
Ta [°C]
Figure 11. Input Side Circuit Current 3
(INA=10kHz, Duty=50%)
0.61
40
VCC1=5.0V
VCC1=4.5V
0.36
0.31
0.31
4.5
4.75
5
5.25
-40
5.5
40
80
120
Ta [°C]
VCC1 [V]
Figure 13. Input Side Circuit Current 4
(INA=20kHz, Duty=50%)
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Figure 14. Input Side Circuit Current 4
(INA=20kHz, Duty=50%)
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BM60051FV-C
6.7
6.7
6.2
6.2
5.7
125°C
25°C
ICC2 [mA]
ICC2 [mA]
5.7
5.2
4.7
VCC2=15V VCC2=24V
5.2
4.7
4.2
4.2
-40°C
3.7
3.2
3.2
2.7
2.7
9
12
VCC2=9V
3.7
15
18
21
-40
24
0
Figure 15. Output Side Circuit Current
(OUT=L, RTC=10kΩ)
6.7
6.2
6.2
5.7
125°C
ICC2 [mA]
ICC2 [mA]
120
Figure 16. Output Side Circuit Current
(OUT=L, RTC=10kΩ)
6.7
25°C
80
Ta [°C]
VCC2 [V]
5.7
40
5.2
4.7
4.2
VCC2=15V
VCC2=24V
5.2
4.7
4.2
-40°C
3.7
3.2
3.2
2.7
2.7
9
12
VCC2=9V
3.7
15
18
21
-40
24
40
80
120
Ta [°C]
VCC2 [V]
Figure 17. Output Side Circuit Current
(OUT=H, RTC=10kΩ)
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Figure 18. Output Side Circuit Current
(OUT=H, RTC=10kΩ)
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BM60051FV-C
5.5
0.3
25°C
0.2
5
0.1
VFETGL [V]
VFETGH [V]
-40°C
5.25
4.75
125°C
4.5
25°C
-40°C
0
-0.1
125°C
-0.2
4.25
4
-0.3
4.5
9
13.5
18
22.5
4.5
9
13.5
VBATT [V]
18
22.5
VBATT [V]
Figure 19. FET_G Output Voltage H1/H2
Figure 20. FET_G Output Voltage L
12
1.3
1.1
125°C
9
RONGL [Ω]
RONGH [Ω]
25°C
125°C
25°C
0.9
0.7
6
0.5
-40°C
-40°C
3
4.5
9
0.3
13.5
18
22.5
4.5
VBATT [V]
13.5
18
22.5
VBATT [V]
Figure 21. FET_G ON-Resistance
(Source-side)
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Figure 22. FET_G ON-Resistance
(Sink-side)
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120
50
40
110
125°C
tSS [ms]
fOSC_SW [kHz]
25°C
100
30
25°C
125°C
20
-40°C
90
10
-40°C
80
0
4.5
9
13.5
18
22.5
4.5
9
VBATT [V]
13.5
18
22.5
VBATT [V]
Figure 23. Oscillation Frequency
Figure 24. Soft-start Time
1.53
0.8
1.52
0.4
25°C
-40°C
25°C
-40°C
IFB [μA]
VFB [V]
1.51
1.5
0
1.49
125°C
125°C
-0.4
1.48
1.47
-0.8
4.5
9
13.5
18
22.5
4.5
VBATT [V]
13.5
18
22.5
VBATT [V]
Figure 25. FB Pin Threshold Voltage
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Figure 26. FB Pin Input Current
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160
-40
125°C
-40°C
140
25°C
25°C
ICOMPSOURCE [μA]
ICOMPSINK [μA]
-60
-80
-100
-120
120
100
80
125°C
60
-140
-40°C
40
-160
4.5
9
13.5
18
4.5
22.5
9
13.5
18
22.5
VBATT [V]
VBATT [V]
Figure 27. COMP COMP Pin Sink Current
Figure 28. COMP Pin Source Current
95
6
125°C
125°C
90
DONMAX [%]
VFLT [V]
4
25°C
85
2
-40°C
25°C
80
-40°C
0
3.95
75
4.05
4.15
4.25
4.35
4.5
4.45
13.5
18
22.5
VBATT [V]
VBATT [V]
Figure 29. V_BATT UVLO ON/OFFVoltage
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Figure 30. Maximum ON DUTY
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100
5.5
5
4.5
25°C
85
125°C
-40°C
RIND/RINU [kΩ]
VINH / VINL [V]
4
3.5
H レベル
3
2.5
2
L レベル
1.5
-40°C
70
25°C
55
-40°C
25°C
1
125°C
40
0.5
125°C
25
0
4.5
4.75
5
5.25
4.5
5.5
4.75
5
5.25
5.5
VCC1 [V]
VCC1 [V]
Figure 31. Logic High / Low Level Input Voltage
(INA, DIS)
Figure 32. Logic Pull-Down Resistance (INA)
Pull-Up Resistance (DIS)
180
180
155
155
-40°C
tINFIL [ns]
tINFIL [ns]
125°C
130
-40°C
105
130
25°C
105
25°C
125°C
80
80
4.5
4.75
5
5.25
5.5
4.5
VCC1 [V]
5
5.25
5.5
VCC1 [V]
Figure 34. Logic Input Filtering Time
(H pulse)
Figure 33. Logic Input Filtering Time
(L pulse)
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20
20
16
16
-40°C
25°C
tDDIS [µs]
tDISFIL [μs]
-40°C
12
25°C
12
8
8
125°C
125°C
4
4
4.5
4.75
5
5.25
4.5
5.5
4.75
5
5.5
VCC1 [V]
VCC1 [V]
Figure 35. DIS Input Filtering Time
Figure 36. DIS Input Delay Time
1.2
1.2
125°C
1
1
25°C
25°C
RONL [Ω]
RONH [Ω]
5.25
0.8
125°C
0.8
0.6
0.6
0.4
0.4
-40°C
0.2
-40°C
0.2
9
12
15
18
21
24
9
VCC2 [V]
15
18
21
24
VCC2 [V]
Figure 38. OUT1 ON-Resistance (Sink-side)
(IOUT1=40mA)
Figure 37. OUT1 ON-Resistance(Source-side)
(IOUT1=40mA)
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260
260
230
230
125°C
-40°C
tPOFF [ns]
tPON [ns]
BM60051FV-C
200
-40°C
125°C
200
25°C
25°C
170
170
140
140
9
12
15
18
21
24
9
12
VCC2 [V]
50
40
40
30
30
tFALL [ns]
tRISE [ns]
21
24
21
24
Figure 40. Turn OFF time
50
25°C
-40°C
18
VCC2 [V]
Figure 39. Turn ON time
20
15
20
125°C
25°C
10
10
125°C
-40°C
0
0
9
12
15
18
21
24
9
VCC2 [V]
15
18
VCC2 [V]
Figure 41. Rise time
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Figure 42. Fall time
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2
2.5
125°C
1.6
125°C
25°C
RON2 [Ω]
RONPRO [Ω]
2.1
1.7
1.2
25°C
1.3
0.8
0.9
-40°C
0.5
-40°C
0.4
9
12
15
18
21
24
9
12
VCC2 [V]
18
21
24
VCC2 [V]
Figure 44. OUT2 ON-Resistance
(IOUT2=40mA)
Figure 43. PROOUT ON-Resistance
(IPROOUT=40mA)
50
2.2
40
2.1
125°C
tOUT2ON [ns]
VOUT2ON [V]
15
2
30
20
25°C
1.9
125°C
-40°C
25°C
-40°C
10
0
1.8
9
12
15
18
21
9
24
15
18
21
24
VCC2 [V]
V [V]
CC2
Figure 45. OUT2 ON Threshold Voltage
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Figure 46. OUT2 Output Delay Time
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1.025
1.03
1.02
1.015
25°C
25°C
1.01
1.005
ITO [mA]
VTC [V]
-40°C
0.995
125°C
1
0.99
125°C
-40°C
0.985
0.98
0.975
0.97
9
12
15
18
21
24
9
12
VCC2 [V]
15
18
21
24
VCC2 [V]
Figure 47. TC Pin Voltage
Figure 48. TOx Pin Output Current (RTC=10kΩ)
10
14
fOSC_TO [kHz]
ITO [mA]
13
1
12
11
25°C
125°C
10
9
-40°C
8
0.1
1
10
100
12
15
18
21
24
VCC2 [V]
RTC [kΩ ]
Figure 49. TOx Pin Output Current
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Figure 50. SENSOR Output Frequency
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100
93
90
92
80
-40°C
-40°C
DSENSOR1 [%]
DSENSOR [%]
70
60
25°C
50
40
30
25°C
91
90
89
125°C
20
88
10
125°C
0
1
1.5
2
2.5
3
3.5
87
4
9
12
VTOx [V]
18
21
24
VCC2 [V]
Figure 51. SENSOR Output Duty
Figure 52. SENSOR Output Duty1
(VTOx=1.35V)
53
15
52
13
51
DSENSOR3 [%]
DSENSOR2 [%]
15
25°C
-40°C
50
49
11
25°C
-40°C
9
7
48
125°C
125°C
47
9
12
15
18
5
21
24
9
VCC2 [V]
15
18
21
24
VCC2 [V]
Figure 53. SENSOR Output Duty2
(VTOx=2.59V)
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Figure 54. SENSOR Output Duty3
(VTOx=3.84V)
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160
9
-40°C
135
8.5
RSENSORH [Ω]
VTOH [V]
25°C
8
110
125°C
25°C
85
60
7.5
35
125°C
-40°C
10
7
9
12
15
18
21
4.5
24
4.75
5
5.25
5.5
VCC1 [V]
VCC2 [V]
Figure 55. TOx Pin Disconnect Detection Voltage
Figure 56. SENSOR ON Resistance(Source-side)
(ISEBSOR=5mA)
6
160
110
4
125°C
VFLT [V]
RSENSORL [Ω]
135
25°C
85
125°C
2
60
25°C
35
-40°C
-40°C
10
4.5
4.75
5
5.25
0
3.95
5.5
4.15
4.25
4.35
4.45
VCC1 [V]
VCC1 [V]
Figure 58. Input-side UVLO ON/OFF Voltage
Figure 57. SENSOR ON Resistance (Sink-side)
(ISENSOR=5mA)
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30
30
26
26
22
22
tDUVLO1OUT [µs]
tUVLO1FIL [µs]
BM60051FV-C
18
14
18
14
10
10
6
6
2
2
-40
0
40
80
120
-40
0
Ta [°C]
40
80
120
Ta [°C]
Figure 59. Input-side UVLO Filtering Time
Figure 60. Input-side UVLO Delay Time (OUT1)
30
6
22
4
18
VFLT [V]
tDUVLO1FLT [µs]
26
14
125°C
2
10
25°C
6
-40°C
0
0.85
2
-40
0
40
80
120
0.95
1
1.05
VUVLOIN [V]
Ta [°C]
Figure 61. Input-side UVLO Delay Time (FLT)
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Figure 62. Output-side UVLO ON / OFF
Threshold Voltage
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30
30
26
26
22
22
tDUVLO2OUT [V]
tUVLO2FIL [µs]
BM60051FV-C
18
14
18
14
10
10
6
6
2
2
-40
0
40
80
120
-40
0
Ta [°C]
80
120
Ta [°C]
Figure
. 出力側 UVLO
フィルタ時間
Figure
63. Output-side
UVLO
Filtering Time
Figure
Figure
64. Output-side
64. Output-side
UVLO
UVLO
Delay
Delay
TimeTime
(OUT1)
63
0.73
53
0.72
25°C
125°C
0.71
43
VSCDET [V]
tDUVLO2FLT [µs]
40
33
0.7
23
0.69
13
0.68
3
0.67
-40
0
40
80
9
120
12
15
18
21
24
VCC2 [V]
Ta [°C]
Figure 65. Output-side UVLO Delay Time (FLT)
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Figure 66. Short Current Detection Voltage
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0.45
0.46
0.4
-40°C
0.4
tDSCPOUT [µs]
0.35
tSCPFIL [µs]
125°C
-40°C
125°C
0.3
0.25
0.34
25°C
0.28
25°C
0.2
0.22
0.15
0.16
9
12
15
18
21
24
9
12
15
VCC2 [V]
18
21
24
VCC2 [V]
Figure 67. Short Current Detection Filtering Time
Figure 68. Short Current Detection Delay time (OUT1)
0.53
31
0.47
-40°C
0.41
0.35
25°C
0.29
125°C
26
125°C
tDSCPFLT [µs]
tDSCPPRO [µs]
25°C
-40°C
21
Maximum
16
Minimum
11
0.23
6
-40°C
125°C
25°C
1
0.17
9
12
15
18
21
9
24
15
18
21
24
VCC2 [V]
VCC2 [V]
Figure 69. Short Current Detection Delay time (PROOUT)
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Figure 70. Short Current Detection Delay time (FLT)
TSZ02201-0818ABH00010-1-2
20.May.2015 Rev.002
BM60051FV-C
80
110
-40°C
60
Maximum
RFLTL [Ω]
tSCPOFF [µs]
90
70
125°C
25°C
70
Minimum
-40°C
50
125°C
-40°C
25°C
40
125°C
25°C
30
50
20
10
30
9
12
15
18
21
4.5
24
4.75
5
5.5
VCC1 [V]
VCC2 [V]
Figure 71. Soft Turn OFF Release Time
Figure 72. FLT Output ON-Resistance
(IFLT=5mA)
5.5
60
5.25
-40°C
25°C 125°C
50
-40°C
5
125°C
VOSFB [V]
tFLTRLS [ms]
5.25
40
H 論理
4.75
4.5
25°C
L 論理
30
4.25
-40°C
125°C
25°C
4
20
4.5
4.75
5
5.25
9
5.5
15
18
21
24
VCC2 [V]
VCC1 [V]
Figure 73. Fault Output Holding Time
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Figure 74. Gate State H /L
Detection Threshold Voltage
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2.5
80
70
2.3
-40°C
60
2.1
ROSFBL [Ω]
tOSFBFIL [us]
25°C
1.9
50
125°C
25°C
40
125°C
30
1.7
20
-40°C
1.5
10
4.5
4.75
5
5.25
5.5
VCC1 [V]
4.5
4.75
5
5.25
5.5
VCC1 [V]
Figure 75. OSFB Output Filtering Time
Figure 76. OSFB Output ON-Resistance
(IOSFB=5mA)
60
tOSFBRLS [ms]
50
-40°C
125°C
40
25°C
30
20
4.5
4.75
5
5.25
5.5
VCC1 [V]
Figure 77. OSFB Output Holding Time
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Description of Pins and Cautions on Layout of Board
1.
V_BATT (Main power supply pin)
This is the main power supply pin. Connect a bypass capacitor between V_BATT and GND1 in order to suppress voltage
variations. Be sure to apply a power supply even when the switching power supply is not used, since the internal
reference voltage of the input side chip is generated from this power supply.
2.
VCC1 (Input-side power supply pin)
The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the driving current of the
internal transformer, connect a bypass capacitor between the VCC1 and the GND1 pins.
3.
GND1 (Input-side ground pin)
The GND1 pin is a ground pin on the input side.
4.
VCC2 (Output-side positive power supply pin)
The VCC2 pin is a positive power supply pin on the output side. To reduce voltage fluctuations due to the driving current of
the internal transformer and output current, connect a bypass capacitor between the VCC2 and the GND2 pins.
5.
GND2 (Output-side ground pin)
The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter / source of output device.
6.
INA, DIS (Control input pin, input enabling signal input pin)
They are pins for deciding the output logic.
7.
DIS
INA
OUT1
H
X
L
L
L
L
L
H
H
X: Don't care
FLT (Fault output pin)
The FLT pin is an open drain pin that outputs a fault signal when a fault occurs (i.e., when the under voltage lockout
function (UVLO) or short circuit protection function (SCP) is activated).
State
FLT
While in normal operation
When a Fault occurs
(UVLO / SCP)
8.
L
OSFB (Output pin for monitoring gate condition)
This is an open drain pin which compares gate logic of the output element monitored with PROOUT pin and DIS/INA pin
input logic, and outputs L when they disaccord.
Status
DIS
INA
PROOUT(input)
OSFB
Normal operation
Fault
9.
Hi-Z
H
X
H
L
H
X
L
Hi-Z
L
L
H
L
L
L
L
Hi-Z
L
H
H
Hi-Z
L
H
L
X
X
X
L
Hi-Z
X: Don't care
SENSOR (Temperature information output pin)
This is a pin which outputs the voltage of either TO1 or TO2, whichever is lower, converted to Duty cycle.
10. FB (Error amplifier inverting input pin for switching controller)
This is a voltage feedback pin of the switching controller. Connect it to VCC1 when the switching controller is not used.
11. COMP (Error amplifier output pin for switching controller)
This is the gain control pin of the switching controller. Connect a phase compensation capacitor and resistor. When the
switching controller is not used, connect it to GND1.
12. VREG (Power supply pin for the driving MOS FET of the switching controller)
This is the power supply pin for the driving MOSFET of the switching controller transformer drive. Be sure to connect a
capacitor between VREG and GND1 even when the switching controller is not used, in order to prevent oscillation and
suppress voltage variation due to FET_G output current.
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Description of Pins and Cautions on Layout of Board – continued
13. FET_G (MOS FET control pin for switching controller)
This is a MOSFET control pin for the switching controller transformer drive. Leave it unconnected when the switching
controller is not used.
14. SENSE (Connection to the current feedback resistor of the switching controller)
This is a pin connected to the resistor of the switching controller current feedback. FET_G pin output duty is controlled by
the voltage value of this pin. Connect it to VCC1 when switching controller is not used.
15. OUT(Output pin)
The OUT pin is a gate driving pin.
16. OUT2 (Miller clamp pin)
This is the miller clamp pin for preventing a rise of gate voltage due to miller current of output element connected to OUT1.
OUT2 should be unconnected when miller clamp function is not used.
17. PROOUT (Soft turn-OFF pin)
This is a pin for soft turn-OFF of output pin when short-circuit protection is in action. It also functions as a pin for
monitoring gate voltage for miller clamp function and output state feedback function.
18. SCPIN1, SCPIN2, SCPIN3 (Short circuit current detection pin)
These are the pins used to detect current for short circuit protection. When the SCPIN1 pin, SCPIN2 pin or SCPIN3 pin
voltage exceeds the voltage set with the VSCDET parameter, the SCP function will be activated, this will make the IC
function in an open state. To avoid such trouble, connect a resistor between the SCPIN and the GND2 or short the SCPIN
pin to GND2 when the SCP function is not used.
19. TC (Resistor connection pin for setting constant current source output)
The TC pin is a resistor connection pin for setting the constant current output. If an arbitrary resistance value is connected
between TC and GND2, it is possible to set the constant current value output from TO.
20. TO1, TO2 (Constant current output / sensor voltage input pin)
The TO1 pin and the TO2 pin are constant current output / voltage input pins. It can be used as a sensor input by
connecting an element with arbitrary impedance between TOx pin and GND. Furthermore, the TOx pin disconnect
detection function is built-in.
21. UVLOIN (Output-side UVLO setting input pin)
The UVLOIN pin is a pin for deciding UVLO setting value of VCC2. The threshold value of UVLO can be set by dividing
the resistance voltage of VCC2 and inputting such value.
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Description of Functions and Examples of Constant Setting
1. Fault status output
This function is used to output a fault signal from the FLT pin when a fault occurs (i.e., when the under voltage lockout
function (UVLO) or short circuit protection function (SCP) is activated) and hold the fault signal until fault output holding
time (tFLTRLS) is completed.
Fault occurs (UVLO or SCP)
Status
Status
FLT pin
Normal
Hi-Z
Fault occurs
L
Hi-Z
FLT
L
H
OUT
L
Fault output holding time (tFLTRLS)
（tFLTRLS）
Figure 78. Fault Status Output Timing Chart
2.
Under voltage Lockout (UVLO) function
The BM60051FV-C incorporates the under voltage lockout (UVLO) function on V_BATT, VCC1 and VCC2. When the
power supply voltage drops to the UVLO ON voltage, the OUT pin and the FLT pin will both output the “L” signal. When the
power supply voltage rises to the UVLO OFF voltage, these pins will be reset. However, during the fault output holding
time set in “Fault status output” section, the OUT pin and the FLT pin will hold the “L” signal. In addition, to prevent
mis-triggers due to noise, mask time tUVLO1FIL and tUVLO2FIL are set on both low and high voltage sides.
H
L
VUVLOBATTH
VUVLOBATTL
INA
V_BATT
Hi-Z
L
H
L
H
L
FLT
OUT1
FET_G
Figure 79. V_BATT UVLO Function Operation Timing Chart
H
L
VUVLO1H
VUVLO1L
INA
VCC1
FLT
OUT1
FET_G
Figure 80. VCC1 UVLO Function Operation Timing Chart
Hi-Z
L
H
L
H
L
H
L
INA
VUVLO2H
VUVLO2L
UVLOIN
Hi-Z
L
H
L
H
L
FLT
OUT1
FET_G
Figure 81. VCC2 UVLO Function Operation Timing Chart
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Description of Functions and Examples of Constant Setting - continued
3. Short circuit protection (SCP) function
When the SCPIN pin voltage exceeds a voltage set with the VSCDET parameter, the SCP function will be activated. When
the SCP function is activated, the OUT pin voltage will be set to the “Hi-Z” level and the PROOUT pin voltage will go to the
“L” level first (soft turn-OFF).Next, when the short-circuit current falls below the threshold value and after tSCPOFF has
passed, OUT pin and PROOUT pin become L. Finally, when the fault output holding time is completed, the SCP function
will be released.
H
L
IN
tSCPOFF
tSCPOFF
VSCDET
SCPINx
SCP Filter
Threshold
SCPMSK
Internal voltage
H
Hi-Z
L
Hi-Z
L
Hi-Z
L
OUT
PROOUT
FLT
Gate voltage
tSCPFIL
tSCPFIL
Fault output holding time
Fault output holding time
Figure 82. SCP Operation Timing Chart
Start
OUT1=L、PROOUT=L
VSCPIN>VSCDET
No
Exceed tFLTRLS
Yes
Exceed filter time
No
Yes
No
Yes
FLT=Hi-Z
OUT=Hi-Z、PROOUT=L、FLT=L
No
IN=H
No
Yes
VSCPIN<VSCDET
Yes
OUT=H、PROOUT=Hi-Z
No
Exceed tSCPOFF
Yes
Figure 83. SCP Operation Status Transition Diagram
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Description of Functions and Examples of Constant Setting - continued
4. Miller Clamp function
When OUT1=L and PROOUT pin voltage < VOUT2ON, internal MOS of OUT2 pin is turned ON, and miller clamp function
operates. While the short-circuit protection function is activated, miller clamp function operates after lapse of soft turn-OFF
release time tSCPOFF.
Short current
SCPIN
INA
PROOUT
OUT2
Detected
Not less than
VSCDET
X
X
Hi-Z
X
L
X
L
X
H
Not detected
Not less than
VOUT2ON
Not more than
VOUT2ON
X
Hi-Z
L
Hi-Z
VCC2
PREDRIV ER
OUT1
PREDRIV ER
PROOUT
LOGIC
PREDRIV ER
OUT2
PREDRIV ER
+
VOUT2ON
GND2
Figure 84. Block Diagram of Miller Clamp Function
H
H
INA
INA
LL
V
VSCDET
SCDET
SCPIN
SCPIN
Hi-Z
Hi-Z
FLT
FLT
L
L
H
H
Hi-Z
Hi-Z
LL
OUT1
OUT1
PROOUT
PROOUT
VOUT20N
OUT2ON
V
Hi-Z
Hi-Z
OUT2
OUT2
PON
ttPON
SCPOFF
ttSCPOFF
tFLTRLS
tFLTRLS
ttOUT2ON
OUT20N
LL
Figure 85. Timing chart of Miller Clamp Function
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Description of Functions and Examples of Constant Setting - continued
5. Temperature monitor function
Constant current is supplied from TOx pins from the built-in constant current circuit. This current value can be adjusted in
accordance with the resistance value connected between TC and GND2. Furthermore, TOX pin has voltage input function,
and outputs signal of TOx pin voltage converted to Duty from SENSOR pin. When voltage of either one of TOX pins is no
less than disconnect detection voltage VTOH, SENSOR pin outputs L. Therefore, when only one of the TOX pins is used,
connect a resistor between the other TO pins and GND2 to keep pin voltage at no more than VTOH.
Constant current value

VTC 10
R TC
VCC2
VCC2
OSC
OSC
×10
TO
TO
SENSOR
SENSOR
Z
Z
TC
TC
R
RTC
TC
GND2
GND2
Figure 86. Block Diagram of Temperature Monitor Function
VTOH
TOH
V
4.1V
4.1V
TOx
voltage
TOx pin
pin voltage
TOy
pin
voltage
TOy pin voltage
1.1V
1.1V
SENSOR pin output
output
SENSORpin
When voltage is no more than VTOH, either one of TO1 and TO2 terminals with lower voltage has precedence.
Figure 87. Timing Chart of Temperature Monitor Function
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Description of Functions and Examples of Constant Setting - continued
6. Switching regulator
(1) Basic action
This IC has a built-in switching power supply controller which repeats ON/OFF synchronizing with internal clock.
When VBATT voltage is supplied (VBATT > VUVLOBATTH), FTE_G pin starts switching by soft-start. Output voltage is
determined by the following equation by external resistance and winding ratio “n” of flyback transformer (n= VOUT2 side
winding number/VOUT1 side winding number)
VOUT 2  VFB  R1  R2  / R2 n V
(2) MAX DUTY
When, for example, output load is large, and voltage level of SENSE pin does not reach current detection level, output
is forcibly turned OFF by Maximum On Duty (DONMAX).
(3) Pinconditions when the switching power supply controller is not used
Implement pin treatment as shown below when switching power supply is not used.
Pin Number
Pin Name
Treatment Method
22
FB
Connect to VCC1
23
COMP
Connect to GND1
24
V_BATT
Connect power supply
25
VREG
Connect capacitor
26
FET_G
No connection
27
SENSE
Connect to VCC1
7.
Gate state monitoring function
When gate logic and input logic of output device monitored with PROOUT pin are compared, a logic L is output from OSFB
pin when they disaccord. In order to prevent the detection error due to delay of input and output, OSFB filter time tOSFBON is
provided.
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Description of Functions and Examples of Constant Setting - continued
8. I/O condition table
Input
No.
Status
VCC1
1
SCP
2
UVLOIN
VBATT
Output
S
C
P
I
N
x
D
I
S
I
N
A
P
R
O
O
U
T
O
U
T
1
O
U
T
2
P
R
O
O
U
T
F
L
T
O
S
F
B
○
H
○
H
L
H
X
Z
Z
L
L
Z
UVLO
X
X
L
X
X
H
L
Z
Z
L
Z
UVLO
X
X
L
X
X
L
L
L
Z
L
Z
X
L
X
L
X
X
H
L
Z
Z
L
Z
X
L
X
L
X
X
L
L
L
Z
L
Z
X
X
UVLO
L
X
X
H
L
Z
Z
L
Z
X
X
UVLO
L
X
X
L
L
L
Z
L
Z
○
H
○
L
H
X
H
L
Z
Z
Z
L
○
H
○
L
H
X
L
L
L
Z
Z
Z
○
H
○
L
L
L
H
L
Z
Z
Z
L
○
H
○
L
L
L
L
L
L
Z
Z
Z
○
H
○
L
L
H
H
H
Z
Z
Z
Z
○
H
○
L
L
H
L
H
Z
Z
Z
L
VCC1UVLO
3
4
VCC2UVLO
5
6
7
8
9
10
11
12
13
VBATT1UVLO
Disable
Normal Operation
L Input
Normal Operation
H Input
○: VCC1 > UVLO, X: Don't care, Z: Hi-Z
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Description of Functions and Examples of Constant Setting - continued
9. Power supply startup / shutoff sequence
H
L
INA
V_BATT
VUVLOBATTL
VUVLOBATTL
VCC1
VCC2
VUVLOBATTL
VUVLO1H
VUVLO2H
VUVLO2H
OUT2
PROOUT
FLT
H
L
INA
VCC1
VUVLOBATTL
0V
VUVLO1H
VUVLO1L
VCC2
VUVLO2H
VUVLO1L
VUVLO2H
OUT1
OUT2
PROOUT
FLT
V_BATT
VCC2
VUVLOBATTH
VUVLO1H
VUVLO1H
VUVLO2L
VUVLO1L
VUVLO2L
OUT2
PROOUT
FLT
0V
0V
H
L
INA
VCC1
0V
H
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
0V
H
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
OUT1
V_BATT
0V
H
L
INA
VCC1
0V
0V
H
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
OUT1
V_BATT
0V
VUVLOBATTH
VUVLOBATTH
VUVLOBATTH
VUVLO1L
0V
0V
VUVLO2L
VUVLO2L
VCC2
0V
H
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
OUT1
OUT2
PROOUT
FLT
: Since the VCC2 to GND2 pin voltage is low and the output MOS does not turn ON,
the output pins become Hi-Z conditions.
: Since the VCC1 pin voltage is low and the FLT output MOS does not turn ON, the
output pins become Hi-Z conditions.
Figure 88. Power Supply Startup / Shutoff Sequence
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Selection of Components Externally Connected
Recommended
ROHM
MCR03EZP
Recommended
sumida
CEEH139C
CEER117
Recommended
ROHM
MCR100JZH
MCR18EZP
Recommended
ROHM
MCR03EZP
UVLO1
OSC
GND1
FLT
GND2
T IMER
FLT
OUT2
RESE T OSC
DIS
Q
OSFB
NC
R
INA
ECU
PREDRIVER
LOGIC
S
OUT1
VCC2
VCC2
LOGIC
+
SENSOR
+
PROOUT
VCC1
S
Q
Snubber
TO1
+
V_BATT
OSC
EDGE
R
RST
UVLO1
UVLO_BA TT
SCPIN3
Filter
SCPIN2
Filter
+
+
+
DAC
COMP
V_BA TT
TC
TO2
+
+
+
FB
Rectifier
/ Ripple f ilter
CURRENT
SOURCE
FLT
VCC1
+
OSFB
SCPIN1
Filter
REGULATOR
VREG
GND1
SLOPE
OSC
OSC
FET_G
VCC2
Q
Rectifier
/ Ripple f ilter
S
SENSE
UVLOIN
MAX.Duty
+
R
GND2
GND1
GND2
UVLO_BATT
GND2
GND1
Recommended
ROHM
RB168M150
Recommended
ROHM
LTR18EZP
Recommended
ROHM
MCR03EZP
MCR18EZP
Recommended
ROHM
MCR03EZP
Recommended
ROHM
MCR100JZH
Figure 89. For using switching power supply controller
Recommended
ROHM
MCR03EZP
MCR100JZH
MCR18EZP
Recommended
ROHM
MCR03EZP
OSC
GND1
FLT
UVLO1
FLT
OUT2
PREDRIVER
LOGIC
Q
OSFB
ECU
GND2
T IMER
RESE T OSC
DIS
NC
S
R
INA
Recommended
ROHM
MCR03EZPMC
R03EZP
OUT1
VCC2
VCC2
LOGIC
+
SENSOR
+
PROOUT
VCC1
CURRENT
SOURCE
FLT
VCC1
S
TO1
+
V_BATT
OSC
EDGE
RST
UVLO1
UVLO_BA TT
SCPIN3
Filter
SCPIN2
Filter
+
Q
R
COMP
TC
TO2
+
DAC
+
+
+
+
FB
+
OSFB
SCPIN1
Filter
REGULATOR
VREG
SLOPE
OSC
OSC
FET_G
Q
S
SENSE
UVLOIN
MAX.Duty
+
R
GND1
GND1
GND2
UVLO_BATT
GND1
GND2
GND1
Recommended
ROHM
MCR03EZPMC
R03EZP
Recommended
ROHM
MCR03EZPMC
R100JZH
Figure 90. For no using switching power supply controller
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Power Dissipation
1.5
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
3
Board size：114.3×76.2×1.6mm
1-layer board：θja=111.1℃/W
Power Dissiqation : Pd [W]
1.25
1
0.75
0.5
0.25
0
0
25
50
75
100
125
150
175
Ambient Temperature : Ta [℃]
Figure 91. SSOP-B28W Power Dissipation Curve (Pd-Ta Curve)
Thermal Design
Please make sure that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W),
package power (Pd) and ambient temperature (Ta). When Tj=150°C is exceeded, the IC may malfunctions or some problems
(ex. abnormal operation of various parasitic elements and increasing of leak current) may occur. Constant use under these
circumstances leads to deterioration and eventually IC may destruct. Tjmax=150°C must be strictly obeyed under all
circumstances.
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I/O Equivalent Circuit
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
VCC2
Internal pow er
supply
UVLOIN
2
UVLOIN
Output-side UVLO setting pin
GND2
SCPIN1
3
VCC2
Short circuit current detection pin 1
Internal pow er
supply
SCPIN1
SCPIN2
SCPIN3
SCPIN2
4
Short circuit current detection pin 2
GND2
SCPIN3
5
Short circuit current detection pin 3
TO1
VCC2
Internal pow er
supply
6
Constant current output pin /
sensor voltage input pin 1
TO1
TO2
TO2
7
Constant current output pin /
sensor voltage input pin 2
TC
TC
8
GND2
Constant current setting resistor
connection pin
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I/O Equivalent Circuit - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
VCC2
OUT1
11
OUT1
Output pin
GND2
VCC2
Inter nal power
suppl y
PROOUT
Inter nal power
suppl y
9
PROOUT
Soft turn-OFF pin /Gate voltage input pin
GND2
VCC2
OUT2
OUT2
13
Output pin for Miller Clamp
GND2
FLT
FLT
OSFB
16
Fault output pin
OSFB
GND1
19
Output state feedback output pin
VCC1
SENSOR
SENSOR
20
Temperature information output pin
GND1
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I/O Equivalent Circuit - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
VCC1
DIS
DIS
17
Input enabling signal input pin
GND1
VCC1
INA
18
INA
Control input pin
GND1
V_BATT
FB
22
Internal pow er
supply
FB
Error amplifier inverting input pin
for switching controller
GND1
V_BATT
Internal pow er
supply
COMP
COMP
23
Error amplifier output pin
for switching controller
GND1
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I/O Equivalent Circuit - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
VREG
V_BATT
Internal pow er
supply
25
Power supply pin for driving MOS FET
of switching controller
VREG
FET_G
FET_G
26
GND1
MOS FET control pin
for switching controller
V_BATT
Internal pow er
supply
SENSE
27
SENSE
Current feedback resistor connection pin
for switching controller
GND1
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has
more than one power supply. Therefore, give special consideration to power coupling capacitance, power
wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 24. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Ordering Information
B
M
6
0
0
Part Number
5
1
F
V
Package
FV : SSOP-B28W
-
CE2
Product class
C : for Automotive applications
Packaging and forming specification
E2 : Embossed tape and reel
(SSOP-B28W)
Marking Diagram
SSOP-B28W (TOP VIEW)
Part Number Marking
BM60051
LOT Number
1PIN MARK
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20.May.2015 Rev.002
BM60051FV-C
Physical Dimension, Tape and Reel Information
Package Name
SSOP-B28W
(Max 9.55 (include.BURR))
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TSZ02201-0818ABH00010-1-2
20.May.2015 Rev.002
BM60051FV-C
Revision History
Date
Revision
25.Apr.2014
001
13.May.2015
002
Changes
New Release
P.1 Features Adding item (UL1577 Recognized)
P.21,22 Typical Performance Curves Correcting mistakes
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
44/44
TSZ02201-0818ABH00010-1-2
20.May.2015 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001