Rohm BU52177GXZ-E2 Omnipolar detection hall ic Datasheet

Datasheet
Omnipolar Detection Hall IC
(Dual Outputs for both S and N Pole Polarity Detection)
BU52177GXZ
General Description
Key Specifications







The BU52177GXZ is omnipolar Hall IC incorporating a
polarity determination circuit that enables separate
operation (output) of both the South and North poles.
This Hall IC product can be in tablets, smart phones, and
other applications in order to detect open and close of
the cover.
And this Hall IC product can be in digital video cameras
and other applications involving display panels in order to
detect the front/back location or determine the rotational
direction of the panel.
VDD Voltage Range:
Operate Point:
Hysteresis:
Period:
Supply Current (AVG):
Output Type:
Operating Temperature Range:
Package
1.65V to 3.6V
±15.0mT(Typ)
0.9mT(Typ)
50ms(Typ)
5.0µA (Typ)
CMOS
-40°C to +85°C
W(Typ) x D(Typ) x H(Max)
0.65mm x 0.65mm x 0.33mm
XCSP30L1
Features

Omnipolar Detection (Polarity Detection for both S
and N Poles with Separate, Dual Outputs)
Micro Power Operation (Small Current Using
Intermittent Operation Method)
Ultra-compact CSP4 Package (XCSP30L1)
Polarity Judgment and Separate Output on both
Poles
(OUT1=S-pole Output; OUT2=N-pole Output)



Applications

Tablets, Smart Phones, Notebook Computers,
Digital Video Cameras, Digital Still Cameras, etc.
Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions
VDD
0.1µF
B1
Adjust the bypass capacitor value
as necessary, according to voltage
noise conditions, etc.
LATCH
TIMING
LOGIC
The CMOS output terminals
enable direct connection to
the PC, with no external
pull-up resistor required.
GND
VDD
LATCH
×
B2 OUT1
SAMPLE
& HOLD
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
HALL
A2 OUT2
A1
GND
Pin No.
Pin Name
Function
(TOP VIEW)
A1
A1
GND
Ground
A2
OUT2
Output (React to the north pole)
B1
VDD
OUT1
A2
A2
A1
B2
B1
Power supply
B1
B2
(BOTTOM VIEW)
B2
Output (React to the south pole)
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit, Block Diagram, Pin Configurations and Pin Descriptions ..................................................................... 1
Absolute Maximum Ratings ............................................................................................................................................................ 3
Recommended Operating Conditions ............................................................................................................................................. 3
Magnetic, Electrical Characteristics ................................................................................................................................................ 3
Measurement Circuit ....................................................................................................................................................................... 4
Typical Performance Curves ........................................................................................................................................................... 4
Figure 6. Operate Point, Release Point vs Ambient Temperature ............................................................................................... 5
Figure 7. Operate Point, Release Point vs Supply Voltage ......................................................................................................... 5
Figure 8. Period vs Ambient Temperature ................................................................................................................................... 5
Figure 9. Period vs Supply Voltage ............................................................................................................................................. 5
Figure 10. Supply Current vs Ambient Temperature .................................................................................................................... 6
Figure 11. Supply Current vs Supply Voltage .............................................................................................................................. 6
Description of Operations ............................................................................................................................................................... 7
Intermittent Operation at Power ON .............................................................................................................................................. 10
Magnet Selection .......................................................................................................................................................................... 10
Slide-by Position Sensing ............................................................................................................................................................. 11
Position of the Hall Element .......................................................................................................................................................... 11
Footprint Dimensions .................................................................................................................................................................... 11
I/O Equivalence Circuit ................................................................................................................................................................. 11
Operational Notes ......................................................................................................................................................................... 12
Ordering Information ..................................................................................................................................................................... 14
Marking Diagrams ......................................................................................................................................................................... 14
Physical Dimension, Tape and Reel Information ........................................................................................................................... 15
Revision History ............................................................................................................................................................................ 16
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
(Note 1)
Power Supply Voltage
VDD
-0.1 to +4.5
V
Output Current
IOUT
±0.5
Power Dissipation
Pd
0.44
(Note 2)
W
Operating Temperature Range
Topr
-40 to +85
°C
Storage Temperature Range
Tstg
-40 to +125
°C
mA
(Note 1) Not to exceed Pd
(Note 2) Derate by 4.4mW/°C when operating above Ta=25°C (when mounted in 60mm x 60mm x 1.6mm size glass epoxy board).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Power Supply Voltage
Symbol
Min
Typ
Max
Unit
VDD
1.65
1.80
3.60
V
Magnetic, Electrical Characteristics (Unless otherwise specified VDD=1.80V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
BopS
-
15.0
19.0
BopN
-19.0
-15.0
-
BrpS
10.1
14.1
-
BrpN
-
-14.1
-10.1
BhysS
-
0.9
-
BhysN
-
0.9
-
Tp
-
50
100
ms
Output High Voltage
VOH
VDD
-0.2
-
-
V
Output Low Voltage
VOL
-
-
0.2
V
IDD(AVG)
-
5
8
µA
Average
IDD(EN)
-
2.8
-
mA
During startup time value
IDD(DIS)
-
1.8
-
µA
During standby time value
Operate Point
mT
Release Point
mT
Hysteresis
Period
Supply Current
Supply Current During Startup
Time
Supply Current During Standby
Time
Unit
Conditions
Output: OUT1
(React to the south pole)
Output: OUT2
(React to the north pole)
Output: OUT1
(React to the south pole)
Output: OUT2
(React to the north pole)
mT
(Note 3)
BrpN<B<BrpS
IOUT=-0.5mA
(Note 3)
B<BopN, BopS<B
IOUT=+0.5mA
(Note 3) B = Magnetic Flux Density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
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Measurement Circuit
Bop/Brp
Tp
200Ω
VDD
VDD
VDD
OUT1
/OUT2
100µF
GND
OUT1
/OUT2
VDD
Oscilloscope
V
GND
The period is monitored by an oscilloscope
Bop and Brp are measured by applying an external magnetic
field
Figure 1. Bop,Brp Measurement Circuit
Figure 2. Tp Measurement Circuit
VOH
VDD
OUT1
/OUT2
100µF
VDD
GND
IOUT
V
Figure 3. VOH Measurement Circuit
VOL
VDD
100µF
VDD
OUT1
/OUT2
GND
V
IOUT
Figure 4. VOL Measurement Circuit
IDD
A
VDD
2200µF
VDD
OUT1
/OUT2
GND
Figure 5. IDD Measurement Circuit
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Typical Performance Curves
20.0
20.0
Ta = 25°C
Bop S
Operate Point, Release Point [mT]
Operate Point, Release Point [mT]
VDD=1.8V
Brp S
10.0
0.0
-10.0
Brp N
Bop S
Brp S
10.0
0.0
-10.0
Brp N
Bop N
Bop N
-20.0
-20.0
-60
-40
-20
0
20
40
60
Ambient Temperature [°C]
80
100
1.4
2.2
2.6
3.0
3.4
3.8
Supply Voltage [V]
Figure 6. Operate Point, Release Point vs Ambient
Temperature
Figure 7. Operate Point, Release Point vs Supply Voltage
100
100
VDD=1.8V
90
90
80
80
70
70
60
60
Period [ms]
Period [ms]
1.8
50
40
Ta = 25°C
50
40
30
30
20
20
10
10
0
0
-60
-40
-20
0
20
40
60
80
1.4
100
2.2
2.6
3.0
3.4
3.8
Supply Voltage [V]
Ambient Temperature [°C]
Figure 8. Period vs Ambient Temperature
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1.8
Figure 9. Period vs Supply Voltage
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Typical Performance Curves
- continued
20.0
20.0
VDD=1.8V
Ta=25°C
18.0
16.0
16.0
14.0
14.0
Supply Current [µA]
Supply Current [µA]
18.0
12.0
10.0
8.0
6.0
12.0
10.0
8.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60
-40
-20
0
20
40
60
80
100
1.4
Ambient Temperature [°C]
2.2
2.6
3.0
3.4
3.8
Supply Voltage [V]
Figure 10. Supply Current vs Ambient Temperature
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1.8
Figure 11. Supply Current vs Supply Voltage
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Description of Operations
Micropower Operation (Small Current Consumption Using Intermittent Sensing)
The dual output omnipolar detection Hall IC uses
intermittent sensing save energy. At startup the Hall
elements, amplifier, comparator, and other detection circuits
power on and magnetic detection begins. During standby,
the detection circuits power off, thereby reducing current
consumption. The detection results are held while standby
is active, and then output.
IDD
Period
Startup Time
Standby Time
t
Reference Period: 50ms (MAX100ms)
Reference Startup Time: 48µs
Figure 12
(Offset Cancellation)
VDD
I
B×
+
Hall Voltage
-
GND
Figure 13
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The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from
changes in resistance due to package or bonding stress. A
dynamic offset cancellation circuit is employed to cancel this
offset voltage.
When the Hall elements are connected as shown in Figure 13
and a magnetic field is applied perpendicular to the Hall
elements, a voltage is generated at the mid-point terminal of
the bridge. This is known as Hall voltage.
Dynamic cancellation switches the wiring (shown in the
figure) to redirect the current flow to a 90° angle from its
original path, and thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.
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(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux Direction
Flux Direction
Figure 14
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
OUT1
N
S
S
N
High
OUT1[V]
Flux
High
N
S
Flux
High
Low
B
Brp S
N-pole
0
Magnetic Flux Density [mT]
Bop S
S-pole
Figure 15. S-pole Detection
The OUT1 pin detects and outputs for the S-pole only. Since the OUT1 pin output is unipolar, the output does not respond to
the N-pole.
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OUT2
N
S
N
S
S
N
OUT2[V]
Flux
High
Flux
High
High
Low
B
Bop N
Brp N
N-pole
0
Magnetic Flux Density [mT]
S-pole
Figure 16. N-pole Detection
The OUT2 pin detects and outputs for the N-pole only. Since the OUT2 pin output is unipolar, the output does not respond to
the S-pole. The dual output omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of
the package. There is an inverse relationship between magnetic flux density and the distance separating the magnet and the
Hall IC: when distance increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH.
When the magnet gets closer to the IC and magnetic density rises to the operate point, the output switches LOW. In LOW
output mode, the distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop,
and output returns HIGH. The point where magnetic flux density restores a HIGH output is known as the release point, Brp.
This detection and adjustment mechanism is designed to prevent noise, oscillation, and other erratic system operation.
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Intermittent Operation at Power ON
Power ON
VDD
Startup Time
Standby Time
Standby Time
Startup Time
Supply Current
(Intermittent Action)
Indefinite
Interval
OUT
High
(No Magnetic
Field Present)
Indefinite
Interval
OUT
(Magnetic
Field Present)
Low
Figure 17
The dual output omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during
startup, as shown in Figure 17. The IC outputs to the appropriate terminal based on the detection result and maintains the
output condition during the standby period. The time from power ON until the end of the initial startup period is an indefinite
interval, but it cannot exceed the maximum period of 100ms. To accommodate the system design, the Hall IC output read
should be programmed within 100ms of power ON, but after the time allowed for the period, ambient temperature, and
supply voltage.
Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment
applications. Figure 18 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm x 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Figure 19 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52177GXZ operating point max of
19.0mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 4.4mm, 5.5mm, and 6.1mm,
respectively. To increase the magnet’s detection distance, either increases the magnet’s thickness or sectional area.
25
t=3mm
Magnetic Flux Density [mT]
t=1mm
20
15
t=2mm
10
4.4mm
5.5mm
5
6.1mm
0
0
2
4
6
8
10
12
14
16
18
20
Distance betw een Magnet and Hall IC [mm]
Figure 18. Magnetic Flux Density vs Distance between Magnet and Hall IC
X
Magnet
Y
t
Magnet Material: NEOMAX-44H (Material)
Maker: NEOMAX CO.,LTD.
t
Fig.2 X=Y=4mm
Fig.2
BU520t=1mm,2mm,3mm
L:BU52011
Variable
Fig.
Fig.2
HFV Density Measuring Point
Magnet Size 11HFV
…Flux
2
BU52
Fig.
Figure 19.
Magnet Dimensions and BU520152
BU520
BU5
011H
15GUL
2011 BU52011HFV
FluxFig.2
Density
Measuring Point
FV
GUL BU5
HFV BBU52015GUL
B
201
Bop,Brp
op,Brp
Fig.2
BU52011HFV
BU52
1HF
op,Brp
温
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BU5
温rights
度 特温度特性
TSZ02201-0M2M0F415010-1-2
015G
V
© 2015
ROHM Co., Ltd. All
reserved.
度特性
BU52015GUL
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性
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Bop,Br
5GU
B
p 温度特性 BU5
L
BU52177GXZ
Slide-by Position Sensing
d
A
Hall IC
L
Figure 20
B
S
Flux
N
Figure 21
Magnetic Flux Density [mT]
Figure 20 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet
and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen in
Figure 21, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output omnipolar detection
Hall IC can detect the S-pole at Point A and the N-pole at Point B, the sensor can switch the output ON as the magnet slides
by in the process of position detection. Figure 22 plots magnetic flux density during the magnet slide-by. Although a reverse
magnetic field was generated in the process, the magnetic flux density decreases compared with the center of the magnet.
This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the reverse magnetic field and
prevents malfunctions.
10.0
Flux
Magnet
Reverse
Slide
5.0
0.0
-5.0
-10.0
0
2
4
6
8
10
Horizontal Distance from the Magnet
[mm]
Figure 22. Magnetic Flux Density vs Horizontal
Distance from the Magnet
Position of the Hall Element
(Reference)
XCSP30L1
0.325
0.325
0.23
(UNIT: mm)
Footprint Dimensions
(Optimize footprint dimensions to the board design and soldering condition)
XCSP30L1
SD
Symbol
b3
e
SE
e
e
b3
SD
SE
Reference
value
0.35
φ0.18
0.175
0.175
(UNIT: mm)
I/O Equivalence Circuit
OUT1, OUT2
VDD
GND
The Hall ICs output pins are configured for CMOS (inverter)
output removing the need for external resistance and allow
direct connection to the host. Removing the need for external
resistors allows for reduction of the current that would
otherwise flow to the external resistor during magnetic field
detection thereby supporting an overall lower current
(micropower) operation.
Figure 23
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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Ordering Information
B
U
5
2
1
Part Number
7
7
G
X
Z
Package
GXZ:XCSP30L1
-
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
1PIN MARK
XCSP30L1 (TOP VIEW)
Part Number Marking
H7
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LOT Number
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Physical Dimension, Tape and Reel Information
Package Name
XCSP30L1(BU52177GXZ)
Unit [mm]
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
6000pcs
Direction of feed
E2
The direction is the pin 1 of product is at the upper left when you
hold reel on the left hand and you pull out the tape on the right
hand
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Revision History
Date
Revision
6.Feb.2015
25.Jul.2016
001
002
Changes
New Release
Change of the physical dimension tolerance
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/16
TSZ02201-0M2M0F415010-1-2
25.Jul.2016 Rev.002
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BU52177GXZ - Web Page
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BU52177GXZ
XCSP30L1
6000
6000
Taping
inquiry
Yes
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