a FEATURES Low Insertion Loss and On Resistance: 2.2 Typical On Resistance Flatness 0.5 Typical Automotive Temperature Range –40C to +125C –3 dB Bandwidth = 240 MHz Single 3 V/5 V Supply Operation Rail-to-Rail Operation Very Low Distortion: 0.5% Low Quiescent Supply Current (1 nA Typical) Fast Switching Times tON 7 ns tOFF 4 ns TTL/CMOS Compatible CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux ADG774 FUNCTIONAL BLOCK DIAGRAM ADG774 S1A D1 S1B S2A D2 S2B S3A D3 S3B S4A D4 S4B 1 OF 2 DECODER APPLICATIONS USB 1.1 Signal Switching Circuits Cell Phones PDAs Battery-Powered Systems Communications Systems Data Acquisition Systems Token Ring 4 Mbps/16 Mbps Audio and Video Switching Relay Replacement GENERAL DESCRIPTION The ADG774 is a monolithic CMOS device comprising four 2:1 multiplexer/demultiplexers with high impedance outputs. The CMOS process provides low power dissipation yet gives high switching speed and low on resistance. The on resistance variation is typically less than 0.5 Ω with an input signal ranging from 0 V to 5 V. The bandwidth of the ADG774 is greater than 200 MHz; this, coupled with low distortion (typically 0.5%), makes the part suitable for switching USB 1.1 data signals and fast Ethernet signals. The on resistance profile is very flat over the full analog input range ensuring excellent linearity and low distortion when switching audio signals. Fast switching speed, coupled with high signal bandwidth, also makes the parts suitable for video signal switching. CMOS construction ensures ultralow power dissipation, making the parts ideally suited for portable and batterypowered instruments. EN IN The ADG774 operates from a single 3.3 V/5 V supply and is TTL logic compatible. The control logic for each switch is shown in the Truth Table. These switches conduct equally well in both directions when ON, and have an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. The ADG774 switches exhibit break-before-make switching action. PRODUCT HIGHLIGHTS 1. Wide –3 dB Bandwidth, 240 MHz. 2. Ultralow Power Dissipation. 3. Extended Signal Range. The ADG774 is fabricated on a CMOS process giving an increased signal range that fully extends to the supply rails. 4. Low Leakage Over Temperature. 5. Break-Before-Make Switching. This prevents channel shorting when the switches are configured as a multiplexer. 6. Crosstalk Typically –70 dB @ 30 MHz. 7. Off Isolation Typically –60 dB @ 10 MHz. REV. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved. ADG774–SPECIFICATIONS SINGLE SUPPLY (V DD = 5 V 10%, GND = 0 V. All specifications TMIN to TMAX unless otherwise noted.) Parameter +25C ANALOG SWITCH Analog Signal Range On Resistance (RON) 2.2 On Resistance Match between Channels (RON) On Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH B Version1 –40C to –40C to +85C +125C 5 0 V to VDD V Ω typ 7 Ω max 0.5 0.5 1 1 ±1 ± 1.5 ±1 ± 1.5 ±1 ± 1.5 nA typ nA max nA typ nA max nA typ nA max VD = 4.5 V, VS = 1 V; VD = 1 V, VS = 4.5 V; Test Circuit 2 VD = 4.5 V, VS = 1 V; VD = 1 V, VS = 4.5 V; Test Circuit 2 VD = VS = 4.5 V; VD = VS = 1 V; Test Circuit 3 2.0 0.8 V min V max ± 0.5 µA typ µA max VIN = VINL or VINH ns typ ns max ns typ ns max ns typ ns min dB typ dB typ MHz typ % typ pC typ pF typ pF typ pF typ RL = 100 Ω, CL = 35 pF, VS = +3 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS = +3 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS1 = VS2 = +5 V; Test Circuit 5 RL = 100 Ω, f = 10 MHz; Test Circuit 7 RL = 100 Ω, f = 10 MHz; Test Circuit 8 RL = 100 Ω; Test Circuit 6 RL = 100 Ω CL = 1 nF; Test Circuit 9 f = 1 kHz f = 1 kHz f = 1 MHz 0.001 7 15 4 8 5 1 –65 –75 240 0.5 10 10 20 30 tOFF Break-Before-Make Time Delay, tD Off Isolation Channel-to-Channel Crosstalk Bandwidth –3 dB Distortion Charge Injection CS (OFF) CD (OFF) CD, CS (ON) 20 9 POWER REQUIREMENTS IDD 1 1 1 100 1 µA max µA typ µA typ mA max 0.001 IIN IO VD = 0 V to VDD, IS = –10 mA VD = 0 V to VDD, IS = –10 mA 0.5 DYNAMIC CHARACTERISTICS2 tON Test Conditions/Comments Ω typ Ω max Ω typ Ω max 0.15 ± 0.01 ± 0.5 ± 0.01 ± 0.5 ± 0.01 ± 0.5 Unit VD = 0 V to VDD, IS = –1 mA VDD = +5.5 V Digital Inputs = 0 V or VDD VIN = +5 V VS/VD = 0 V NOTES 1 Temperature range: B Version, –40°C to +125°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. –2– REV. C ADG774 SINGLE SUPPLY (VDD = 3 V 10%, GND = 0 V. All specifications TMIN to TMAX unless otherwise noted.) Parameter +25C ANALOG SWITCH Analog Signal Range On Resistance (RON) 4 On Resistance Match between Channels (RON) B Version1 –40C to –40C to +85C +125C LEAKAGE CURRENTS Source OFF Leakage IS (OFF) 8 0.5 0.5 4 4 ±1 ± 1.5 ±1 ± 1.5 ±1 ± 1.5 nA typ nA max nA typ nA max nA typ nA max 2.0 0.8 V min V max ± 0.5 µA typ µA max VIN = VINL or VINH ns typ ns max ns typ ns max ns typ ns min dB typ dB typ MHz typ % typ pC typ pF typ pF typ pF typ RL = 100 Ω, CL = 35 pF, VS = +1.5 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS = +1.5 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS1 = VS2 = 3 V; Test Circuit 5 RL = 50 Ω, f = 10 MHz; Test Circuit 7 RL = 50 Ω, f = 10 MHz; Test Circuit 8 RL = 50 Ω; Test Circuit 6 RL = 50 Ω CL = 1 nF; Test Circuit 9 f = 1 kHz f = 1 kHz f = 1 MHz Ω typ Ω max Ω typ Ω max Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH 2 ± 0.01 ± 0.5 ± 0.01 ± 0.5 ± 0.01 ± 0.5 0.001 DYNAMIC CHARACTERISTICS2 tON 8 16 5 10 5 1 –65 –75 240 2 3 10 20 30 tOFF Break-Before-Make Time Delay, tD Off Isolation Channel-to-Channel Crosstalk Bandwidth –3 dB Distortion Charge Injection CS (OFF) CD (OFF) CD, CS (ON) 21 11 POWER REQUIREMENTS IDD 1 1 1 100 1 µA max µA typ µA typ mA max 0.001 IIN IO Test Conditions/Comments 0 V to VDD V Ω typ 9 Ω max 0.15 On Resistance Flatness (RFLAT(ON)) Unit VD = 0 V to VDD, IS = –10 mA VD = 0 V to VDD, IS = –10 mA VD = 0 V to VDD, IS = –10 mA VD = 3 V, VS = 1 V; VD = 1 V, VS = 3 V; Test Circuit 2 VD = 3 V, VS = 1 V; VD = 1 V, VS = 3 V; Test Circuit 2 VD = VS = 3 V; VD = VS = 1 V; Test Circuit 3 VDD = +3.3 V Digital Inputs = 0 V or VDD VIN = +3 V VS/VD = 0 V NOTES 1 Temperature range: B Version, –40°C to +125°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. Table I. Truth Table REV. C EN IN D1 D2 D3 D4 Function 1 0 0 X 0 1 Hi-Z S1A S1B Hi-Z S2A S2B Hi-Z S3A S3B Hi-Z S4A S4B DISABLE IN = 0 IN = 1 –3– ADG774 ABSOLUTE MAXIMUM RATINGS 1 QSOP Package, Power Dissipation . . . . . . . . . . . . . . . 566 mW JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 149.97°C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C I R Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV (TA = 25°C unless otherwise noted.) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA (Pulsed at 1 ms, 10% Duty Cycle max) Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +125°C Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. ORDERING GUIDE Model Temperature Range Package Descriptions Package Options ADG774BR ADG774BR-REEL ADG774BR-REEL7 ADG774BRZ* ADG774BRZ-REEL* ADG774BRZ-REEL7* ADG774BRQ ADG774BRQ-REEL ADG774BRQ-REEL7 ADG774BRQZ* ADG774BRQZ-REEL* ADG774BRQZ-REEL7* –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C Standard Small Outline Package (SOIC) Standard Small Outline Package (SOIC) Standard Small Outline Package (SOIC) Standard Small Outline Package (SOIC) Standard Small Outline Package (SOIC) Standard Small Outline Package (SOIC) Shrink Small Outline Package (QSOP) Shrink Small Outline Package (QSOP) Shrink Small Outline Package (QSOP) Shrink Small Outline Package (QSOP) Shrink Small Outline Package (QSOP) Shrink Small Outline Package (QSOP) R-16 R-16 R-16 R-16 R-16 R-16 RQ-16 RQ-16 RQ-16 RQ-16 RQ-16 RQ-16 *Z = Pb-free part. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG774 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. C ADG774 PIN CONFIGURATION (SOIC/QSOP) IN 1 16 VDD S1A 2 15 EN S1B 3 14 S4A D1 4 S2A 5 S2B 6 11 S3A D2 7 10 S3B GND 8 9 ADG774 13 S4B TOP VIEW (Not to Scale) 12 D4 D3 TERMINOLOGY VDD GND S D IN EN RON RON RFLAT(ON) IS (OFF) ID (OFF) ID, IS (ON) VD (VS) CS (OFF) CD (OFF) CD, CS (ON) tON tOFF tD Crosstalk Off Isolation Bandwidth Distortion REV. C Most Positive Power Supply Potential. Ground (0 V) Reference. Source Terminal. May be an input or output. Drain Terminal. May be an input or output. Logic Control Input. Logic Control Input. Ohmic Resistance between D and S. On Resistance Match between any Two Channels, i.e., RON max – RON min. Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range. Source Leakage Current with the Switch OFF. Drain Leakage Current with the Switch OFF. Channel Leakage Current with the Switch ON. Analog Voltage on Terminals D, S. OFF Switch Source Capacitance. OFF Switch Drain Capacitance. ON Switch Capacitance. Delay between Applying the Digital Control Input and the Output Switching on. See Test Circuit 4. Delay between Applying the Digital Control Input and the Output Switching Off. OFF Time or ON Time Measured between the 90% Points of Both Switches, When Switching from One Address State to Another. See Test Circuit 5. A Measure of Unwanted Signal that is Coupled through from One Channel to Another as a Result of Parasitic Capacitance. A Measure of Unwanted Signal Coupling through an OFF Switch. Frequency Response of the Switch in the ON State Measured at 3 dB Down. RFLAT(ON)/RL –5– ADG774 –Typical Performance Characteristics 5.0 0 TA = 25C 4.5 VDD = 2.7V VDD = 5V 4.0 3.0 ON RESPONSE – dB RON – 3.5 VDD = 3.0V 2.5 VDD = 4.5V 2.0 1.5 –2 –4 VDD = 5.0V 1.0 0.5 0 1.3 2.5 3.7 VS OR VD DRAIN OR SOURCE VOLTAGE – V –6 10k 4.9 TPC 1. On Resistance as a Function of VD (VS) for Various Single Supplies 10M 1M FREQUENCY – Hz 100M TPC 4. On Response vs. Frequency 0 3.0 VDD = 5V –10 2.5 VDD = 5V RL = 100 –20 1.5 ATTENUATION – dB +85C 2.0 RON – 100k +25C –40C 1.0 –30 –40 –50 –60 –70 –80 0.5 –90 0 1.3 2.5 3.7 VS OR VO DRAIN OR SOURCE VOLTAGE – V –100 100k 4.9 4.5 –10 +85C –20 ATTENUATION – dB 3.5 RON – 100M 1G 0 VDD = 3V 4.0 +25C 2.5 –40C 2.0 1.5 1.0 VDD = 5V RL = 100 V P-P = 0.316V –30 –40 –50 –60 –70 –80 0.5 0 10M FREQUENCY – Hz TPC 5. Off Isolation vs. Frequency TPC 2. On Resistance as a Function of VD (VS) for Different Temperatures with 5 V Single Supplies 3.0 1M –90 –100 100k 0.6 1.1 1.6 2.1 2.6 VS OR VD DRAIN OR SOURCE VOLTAGE – V TPC 3. On Resistance as a Function of VD (VS) for Different Temperatures with 3 V Single Supplies 1M 10M FREQUENCY – Hz 100M 1G TPC 6. Crosstalk vs. Frequency –6– REV. C ADG774 20 15 CHARGE INJECTION – pC TX1 VDD = 5V TA = 25 C 10 RX1 5 Figure 1. Loop Back 0 –5 –10 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 SOURCE VOLTAGE – V 4.0 4.5 120 5.0 100 TPC 7. Charge Injection vs. Source Voltage Figure 2. Line Termination Figure 3. Line Clamp REV. C –7– ADG774 Test Circuits IDS V1 IS (OFF) S VS A D ID (OFF) S D VS RON = V1/IDS ID (ON) S A VD VS Test Circuit 2. Off Leakage Test Circuit 1. On Resistance D A VD Test Circuit 3. On Leakage 5V 0.1F VIN 3V VDD 50% S 50% VOUT D 90% VS RL 100 IN CL 35pF 90% VOUT tOFF tON EN GND Test Circuit 4. Switching Times 5V 0.1F VDD 3V S1A VOUT D1 VS VIN RL 100 VS CL 35pF 50% 50% 0V S1B VOUT 50% 50% VS DECODER tD EN tD GND Test Circuit 5. Break-Before-Make Time Delay –8– REV. C ADG774 5V 5V 0.1F 0.1F 5V 0.1F VDD VDD S1A VOUT D1 S1A RL 100 IN VS VDD D1 RL 100 IN VS VIN EN VS VIN EN GND S2A NC D2 EN Test Circuit 6. Bandwidth GND VOUT RL 100 GND Test Circuit 8. Off Isolation VIN CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG |VS/VOUT| Test Circuit 7. Channel-to-Channel Crosstalk 5V VDD RS VS ADG774 S1A CL 1nF S1B S2A CL 1nF S2B S3A CL 1nF S3B S4A CL 1nF S4B D1 VOUT 3V VIN D2 VOUT D4 VOUT 1 OF 2 DECODER EN IN Test Circuit 9. Charge Injection REV. C –9– VOUT VOUT D3 VOUT VOUT S1B 100 D1 QINJ = CL VOUT ADG774 OUTLINE DIMENSIONS 16-Lead Standard Small Outline Package [SOIC] Narrow Body (R-16) Dimensions shown in millimeters and (inches) 10.00 (0.3937) 9.80 (0.3858) 4.00 (0.1575) 3.80 (0.1496) 16 9 1 8 1.27 (0.0500) BSC 6.20 (0.2441) 5.80 (0.2283) 1.75 (0.0689) 1.35 (0.0531) 0.50 (0.0197) 45 0.25 (0.0098) 0.25 (0.0098) 0.10 (0.0039) 8 0.51 (0.0201) SEATING 0.25 (0.0098) 0 1.27 (0.0500) 0.31 (0.0122) PLANE 0.40 (0.0157) 0.17 (0.0067) COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MS-012AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN 16-Lead Shrink Small Outline Package [QSOP] (RQ-16) Dimensions shown in inches 0.193 BSC 9 16 0.154 BSC 1 0.236 BSC 8 PIN 1 0.069 0.053 0.065 0.049 0.010 0.025 0.004 BSC COPLANARITY 0.004 0.012 0.008 SEATING PLANE 0.010 0.006 8 0 0.050 0.016 COMPLIANT TO JEDEC STANDARDS MO-137AB –10– REV. C ADG774 Revision History Location Page 3/04—Data Sheet changed from REV. B to REV. C. Added APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 10/03—Data Sheet changed from REV. A to REV. B. Updated formatting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Universal Renumbered TPCs amd Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Universal Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Updated ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Delete Figure 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4/03—Data Sheet changed from REV. 0 to REV. A. Renumbered TPCs and Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Universal Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 REV. C –11– –12– C00049–0–3/04(C)