TI1 DRV8323HRTAR 6 to 60-v three-phase smart gate driver Datasheet

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DRV8320, DRV8320R
DRV8323, DRV8323R
SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
DRV832x 6 to 60-V Three-Phase Smart Gate Driver
1 Features
3 Description
•
The DRV832x family of devices are integrated gate
drivers for three-phase applications. The devices
provides three half-bridge gate drivers, each capable
of driving high-side and low-side N-channel power
MOSFETs. The DRV832x generates the proper gate
drive voltages using an integrated charge pump for
the high-side MOSFETs and a linear regulator for the
low-side MOSFETs. The smart gate drive architecture
supports up to 1-A source and 2-A sink peak gate
drive current capability. The DRV832x can operate
from a single power supply and supports a wide input
supply range of 6 to 60-V for the gate driver and 4 to
60-V for the optional buck regulator.
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Triple Half-Bridge Gate Driver
– Drives High-Side and Low-Side
N-Channel MOSFETs
– Supports 100% PWM Duty Cycle
Smart Gate Drive Architecture
– Adjustable Slew Rate Control
– 10-mA to 1-A Peak Source Current
– 20-mA to 2-A Peak Sink Current
Integrated Gate Driver Power Supplies
– High-Side Charge Pump
– Low-Side Linear Regulator
6 to 60-V Operating Voltage Range
Optional Integrated Buck Regulator
– LMR16006X SIMPLE SWITCHER®
– 4 to 60-V Operating Voltage Range
– 0.8 to 60-V, 600-mA Output Capability
Optional Integrated Triple Current
Shunt Amplifiers
– Adjustable Gain (5, 10, 20, 40 V/V)
– Bidirectional or Unidirectional Support
Selectable SPI or Hardware Interface
6x, 3x, 1x, and Independent PWM Modes
Supports 1.8-V, 3.3-V, and 5-V Logic Inputs
Low-Power Sleep Mode (20-µA)
Linear Voltage Regulator, 3.3 V, 30 mA
Compact QFN Packages and Footprints
Efficient System Design With CSD88599Q5DC
Integrated Protection Features
– VM Undervoltage Lockout (UVLO)
– Charge Pump Undervoltage (CPUV)
– MOSFET Overcurrent Protection (OCP)
– Gate Driver Fault (GDF)
– Thermal Warning and Shutdown (OTW/OTSD)
– Fault Condition Indicator (nFAULT)
The 6x, 3x, 1x, and independent input PWM modes
allow for simple interfacing to controller circuits. Gate
drive and device configuration settings are highly
configurable through a SPI or hardware (H/W)
interface. The DRV8323 and DRV8323R devices
have three, integrated low-side shunt amplifiers that
allow bidirectional current sensing on all three phases
of the drive stage. The DRV8320R and DRV8323R
devices integrate a 600-mA buck regulator.
A low-power sleep mode is provided to achieve low
quiescent current draw by shutting down most of the
internal circuitry. Internal protection functions are
provided for undervoltage lockout, charge pump fault,
MOSFET overcurrent, MOSFET short circuit, gate
driver fault, and overtemperature. Fault conditions are
indicated on the nFAULT pin with details through the
device registers for SPI device variants.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DRV8320
WQFN (32)
5.00 mm × 5.00 mm
DRV8320R
VQFN (40)
6.00 mm × 6.00 mm
DRV8323
WQFN (40)
6.00 mm × 6.00 mm
DRV8323R
VQFN (48)
7.00 mm × 7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
6 to 60 V
2 Applications
DRV832x
PWM
SPI or H/W
nFAULT
Current Sense
600 mA
Three-Phase
Smart Gate Driver
Gate Drive
Protection
Current
Sense
N-Channel
MOSFETs
BLDC Motor Modules
CPAPs, Fans, and Pumps
E-Bikes
Power Tools and Lawn Appliances
Drones, Robotics, and RC Toys
ATM and Currency Counting
Controller
•
•
•
•
•
•
M
3x Shunt Amplifiers
Buck Regulator
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8320, DRV8320R
DRV8323, DRV8323R
SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
1
1
1
2
3
3
9
Absolute Maximum Ratings ...................................... 9
ESD Ratings ............................................................ 9
Recommended Operating Conditions..................... 10
Thermal Information ................................................ 10
Electrical Characteristics......................................... 11
SPI Timing Requirements ....................................... 16
Typical Characteristics ............................................ 17
Detailed Description ............................................ 19
8.1
8.2
8.3
8.4
8.5
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
19
20
28
48
49
8.6 Register Maps ......................................................... 51
9
Application and Implementation ........................ 59
9.1 Application Information............................................ 59
9.2 Typical Application ................................................. 59
10 Power Supply Recommendations ..................... 68
10.1 Bulk Capacitance Sizing ....................................... 68
11 Layout................................................................... 69
11.1 Layout Guidelines ................................................. 69
11.2 Layout Example .................................................... 70
12 Device and Documentation Support ................. 71
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
Device Support......................................................
Documentation Support ........................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
71
71
71
71
72
72
72
72
13 Mechanical, Packaging, and Orderable
Information ........................................................... 72
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (February 2017) to Revision A
Page
•
Changed the test condition for the IBIAS parameter in the Electrical Characteristics table ................................................... 14
•
Changed the GHx values in the 3x PWM Mode Truth Table ............................................................................................... 29
•
Changed the calibration description and added auto calibration feature description .......................................................... 42
2
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: DRV8320 DRV8320R DRV8323 DRV8323R
DRV8320, DRV8320R
DRV8323, DRV8323R
www.ti.com
SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
5 Device Comparison Table
DEVICE
VARIANT
SHUNT AMPLIFIERS
BUCK REGULATOR
DRV8320H
DRV8320
None
DRV8320S
DRV8323H
SPI (S)
Hardware (H)
None
DRV8323S
SPI (S)
3
DRV8323RH
DRV8323R
Hardware (H)
600 mA (R)
DRV8320RS
DRV8323
SPI (S)
0
DRV8320RH
DRV8320R
INTERFACE
Hardware (H)
Hardware (H)
600 mA (R)
DRV8323RS
SPI (S)
6 Pin Configuration and Functions
INHC
INLB
INHB
INLA
INHA
28
27
26
25
INHA
25
INLC
INLA
26
29
INHB
27
30
INLB
28
PGND
INHC
29
31
INLC
30
CPL
PGND
31
DRV8320S RTV Package
32-Pin WQFN With Exposed Thermal Pad
Top View
32
CPL
32
DRV8320H RTV Package
32-Pin WQFN With Exposed Thermal Pad
Top View
CPH
1
24
DVDD
CPH
1
24
DVDD
VCP
2
23
AGND
VCP
2
23
AGND
VM
3
22
ENABLE
VM
3
22
ENABLE
VDRAIN
4
21
NC
VDRAIN
4
21
nSCS
Thermal
Pad
Thermal
Pad
13
14
15
16
SHC
GLC
SLC
Not to scale
GHC
nFAULT
12
17
11
8
SHB
SLA
GHB
nFAULT
10
17
GLB
8
9
SLA
SLB
SDO
16
18
SLC
7
15
GLA
GLC
MODE
14
18
SHC
7
13
GLA
GHC
SDI
12
SCLK
19
11
20
6
SHB
5
SHA
GHB
GHA
IDRIVE
10
VDS
19
GLB
20
6
9
5
SHA
SLB
GHA
Not to scale
Pin Functions—32-Pin DRV8320 Devices
PIN
TYPE (1)
NO.
DESCRIPTION
NAME
DRV8320H
DRV8320S
AGND
23
23
PWR
Device analog ground. Connect to system ground.
CPH
1
1
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
CPL
32
32
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
DVDD
24
24
PWR
3.3-V internal regulator output. Connect a X5R or X7R, 1-µF, 6.3-V ceramic capacitor between the DVDD and AGND pins.
This regulator can source up to 30 mA externally.
ENABLE
22
22
I
Gate driver enable. When this pin is logic low the device enters a low power sleep mode. An 8 to 40-µs pulse can be used to
reset fault conditions.
GHA
5
5
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHB
12
12
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHC
13
13
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GLA
7
7
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GLB
10
10
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
(1)
PWR = power, I = input, O = output, NC = no connection, OD = open-drain
Copyright © 2017, Texas Instruments Incorporated
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Product Folder Links: DRV8320 DRV8320R DRV8323 DRV8323R
3
DRV8320, DRV8320R
DRV8323, DRV8323R
SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
www.ti.com
Pin Functions—32-Pin DRV8320 Devices (continued)
PIN
TYPE (1)
NO.
DESCRIPTION
NAME
DRV8320H
DRV8320S
GLC
15
15
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
IDRIVE
19
—
I
Gate drive output current setting. This pin is a 7 level input pin set by an external resistor.
INHA
25
25
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHB
27
27
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHC
29
29
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INLA
26
26
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLB
28
28
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLC
30
30
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
MODE
18
—
I
PWM input mode setting. This pin is a 4 level input pin set by an external resistor.
NC
21
—
NC
No internal connection. This pin can be left floating or connected to system ground.
nFAULT
17
17
OD
Fault indicator output. This pin is pulled logic low during a fault condition and requires an external pullup resistor.
nSCS
—
21
I
PGND
31
31
PWR
SCLK
—
20
I
Serial clock input. Serial data is shifted out and captured on the corresponding rising and falling edge on this pin.
SDI
—
19
I
Serial data input. Data is captured on the falling edge of the SCLK pin.
SDO
—
18
OD
SHA
6
6
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHB
11
11
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHC
14
14
I
High-side source sense input. Connect to the high-side power MOSFET source.
SLA
8
8
I
Low-side source sense input. Connect to the low-side power MOSFET source.
SLB
9
9
I
Low-side source sense input. Connect to the low-side power MOSFET source.
SLC
16
16
I
Low-side source sense input. Connect to the low-side power MOSFET source.
VCP
2
2
PWR
VDRAIN
4
4
I
High-side MOSFET drain sense input. Connect to the common point of the MOSFET drains.
VDS
20
—
I
VDS monitor trip point setting. This pin is a 7 level input pin set by an external resistor.
VM
3
3
PWR
Serial chip select. A logic low on this pin enables serial interface communication.
Device power ground. Connect to system ground.
Serial data output. Data is shifted out on the rising edge of the SCLK pin. This pin requires an external pullup resistor.
Charge pump output. Connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between the VCP and VM pins.
Gate driver power supply input. Connect to the bridge power supply. Connect a X5R or X7R, 0.1-µF, VM-rated ceramic and
greater then or equal to 10-uF local capacitance between the VM and PGND pins.
SW
CB
BGND
INLC
INHC
INLB
35
34
33
32
31
INLB
31
36
INHC
32
NC
INLC
33
VIN
BGND
34
37
CB
35
38
SW
36
nSHDN
NC
37
FB
VIN
38
39
nSHDN
39
PGND
1
30
INHB
PGND
1
30
INHB
CPL
2
29
INLA
CPL
2
29
INLA
CPH
3
28
INHA
CPH
3
28
INHA
VCP
4
27
DVDD
VCP
4
27
DVDD
26
AGND
26
AGND
25
ENABLE
25
ENABLE
VM
5
VDRAIN
6
GHA
7
24
SHA
8
GLA
9
SLA
10
4
DRV8320RS RHA Package
40-Pin VQFN With Exposed Thermal Pad
Top View
40
FB
40
DRV8320RH RHA Package
40-Pin VQFN With Exposed Thermal Pad
Top View
VM
5
VDRAIN
6
NC
GHA
7
24
nSCS
23
VDS
SHA
8
23
SCLK
22
IDRIVE
GLA
9
22
SDI
21
MODE
SLA
10
21
SDO
20
17
GLC
nFAULT
16
SHC
19
15
GHC
18
14
SLC
13
SHB
GHB
GND
12
Pad
11
Not to scale
Thermal
SLB
17
GLC
20
16
SHC
nFAULT
15
GHC
19
14
18
13
SHB
GHB
SLC
12
Submit Documentation Feedback
GND
11
SLB
GLB
Pad
GLB
Thermal
Not to scale
Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: DRV8320 DRV8320R DRV8323 DRV8323R
DRV8320, DRV8320R
DRV8323, DRV8323R
www.ti.com
SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
Pin Functions—40-Pin DRV8320R Devices
PIN
TYPE (1)
NO.
DESCRIPTION
NAME
DRV8320RH
DRV8320RS
AGND
26
26
PWR
Device analog ground. Connect to system ground.
BGND
34
34
PWR
Buck regulator ground. Connect to system ground.
CB
35
35
PWR
Buck regulator bootstrap input. Connect a X5R or X7R, 0.1-µF, 16-V, capacitor between the CB and SW pins.
CPH
3
3
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
CPL
2
2
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
DVDD
27
27
PWR
3.3-V internal regulator output. Connect a X5R or X7R, 1-µF, 6.3-V ceramic capacitor between the DVDD and AGND pins.
This regulator can source up to 30 mA externally.
ENABLE
25
25
I
Gate driver enable. When this pin is logic low the device enters a low power sleep mode. An 8 to 40-µs low pulse can be
used to reset fault conditions.
FB
40
40
I
Buck feedback input. A resistor divider from the buck post inductor output to this pin sets the buck output voltage.
GHA
7
7
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHB
14
14
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHC
15
15
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GLA
9
9
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GLB
12
12
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GLC
17
17
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GND
19
19
PWR
IDRIVE
22
—
I
Gate drive output current setting. This pin is a 7 level input pin set by an external resistor.
INHA
28
28
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHB
30
30
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHC
32
32
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INLA
29
29
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLB
31
31
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLC
33
33
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
MODE
21
—
I
PWM input mode setting. This pin is a 4 level input pin set by an external resistor.
NC
24
—
NC
No internal connection. This pin can be left floating or connected to system ground.
NC
37
37
NC
No internal connection. This pin can be left floating or connected to system ground.
nFAULT
20
20
OD
Fault indicator output. This pin is pulled logic low during a fault condition and requires an external pullup resistor.
nSCS
—
24
I
Serial chip select. A logic low on this pin enables serial interface communication.
nSHDN
39
39
I
Buck shutdown input. Enable and disable input (high voltage tolerant). Internal pullup current source. Pull below 1.25 V to
disable. Float to enable. Establish input undervoltage lockout with two resistor divider.
Device ground. Connect to system ground.
PGND
1
1
PWR
SCLK
—
23
I
Serial clock input. Serial data is shifted out and captured on the corresponding rising and falling edge on this pin.
SDI
—
22
I
Serial data input. Data is captured on the falling edge of the SCLK pin.
SDO
—
21
OD
SHA
8
8
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHB
13
13
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHC
16
16
I
High-side source sense input. Connect to the high-side power MOSFET source.
SLA
10
10
I
Low-side source sense input. Connect to the low-side power MOSFET source.
SLB
11
11
I
Low-side source sense input. Connect to the low-side power MOSFET source.
SLC
18
18
I
Low-side source sense input. Connect to the low-side power MOSFET source.
SW
36
36
O
Buck switch node. Connect this pin to an inductor, diode, and the CB bootstrap capacitor.
VCP
4
4
PWR
VDRAIN
6
6
I
High-side MOSFET drain sense input. Connect to the common point of the MOSFET drains.
VDS
23
—
I
VDS monitor trip point setting. This pin is a 7 level input pin set by an external resistor.
VIN
38
38
PWR
Buck regulator power supply input. Place an X5R or X7R, VM-rated ceramic capacitor between the VIN and BGND pins.
VM
5
5
PWR
Gate driver power supply input. Connect to the bridge power supply. Connect a X5R or X7R, 0.1-µF, VM-rated ceramic and
greater then or equal to 10-uF local capacitance between the VM and PGND pins.
(1)
Device power ground. Connect to system ground.
Serial data output. Data is shifted out on the rising edge of the SCLK pin. This pin requires an external pullup resistor.
Charge pump output. Connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between the VCP and VM pins.
PWR = power, I = input, O = output, NC = no connection, OD = open-drain
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: DRV8320 DRV8320R DRV8323 DRV8323R
5
DRV8320, DRV8320R
DRV8323, DRV8323R
SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
www.ti.com
INHB
INLA
INHA
DVDD
AGND
CAL
35
34
33
32
31
CAL
31
36
AGND
32
INLB
DVDD
33
INHC
INHA
34
37
INLA
35
38
INHB
36
INLC
INLB
37
PGND
INHC
38
39
INLC
39
DRV8323S RTA Package
40-Pin WQFN With Exposed Thermal Pad
Top View
40
PGND
40
DRV8323H RTA Package
40-Pin WQFN With Exposed Thermal Pad
Top View
CPL
1
30
ENABLE
CPL
1
30
ENABLE
CPH
2
29
GAIN
CPH
2
29
nSCS
VCP
3
28
VDS
VCP
3
28
SCLK
VM
4
27
IDRIVE
VDRAIN
5
26
MODE
Thermal
Pad
VM
4
27
SDI
VDRAIN
5
26
SDO
Thermal
10
21
SOC
SNA
10
21
SOC
15
16
17
18
19
20
GHB
SHC
GLC
SPC
SNC
14
GHC
13
GLB
12
SHB
11
SPB
Not to scale
Pad
SNB
20
SOB
SNA
SNC
22
19
9
18
SPA
SPC
SOA
SOB
GLC
23
22
17
8
9
SHC
GLA
SPA
16
SOA
15
23
GHB
8
GHC
VREF
GLA
14
nFAULT
24
13
25
7
GLB
6
SHA
SHB
GHA
VREF
12
nFAULT
24
11
25
7
SPB
6
SHA
SNB
GHA
Not to scale
Pin Functions—40-Pin DRV8323 Devices
PIN
TYPE (1)
NO.
DESCRIPTION
NAME
DRV8323H
DRV8323S
AGND
32
32
PWR
CAL
31
31
I
CPH
2
2
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
CPL
1
1
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
DVDD
33
33
PWR
R 3.3-V internal regulator output. Connect a X5R or X7R, 1-µF, 6.3-V ceramic capacitor between the DVDD and AGND pins.
This regulator can source up to 30 mA externally.
ENABLE
30
30
I
Gate driver enable. When this pin is logic low the device enters a low power sleep mode. An 8 to 40-µs low pulse can be
used to reset fault conditions.
GAIN
29
—
I
Amplifier gain setting. The pin is a 4 level input pin set by an external resistor.
GHA
6
6
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHB
15
15
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHC
16
16
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GLA
8
8
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GLB
13
13
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GLC
18
18
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
IDRIVE
27
—
I
Gate drive output current setting. This pin is a 7 level input pin set by an external resistor.
INHA
34
34
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHB
36
36
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHC
38
38
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INLA
35
35
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLB
37
37
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLC
39
39
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
MODE
26
—
I
PWM input mode setting. This pin is a 4 level input pin set by an external resistor.
nFAULT
25
25
OD
nSCS
—
29
I
PGND
40
40
PWR
SCLK
—
28
I
Serial clock input. Serial data is shifted out and captured on the corresponding rising and falling edge on this pin.
SDI
—
27
I
Serial data input. Data is captured on the falling edge of the SCLK pin.
SDO
—
26
OD
(1)
6
Device analog ground. Connect to system ground.
Amplifier calibration input. Set logic high to internally short amplifier inputs and perform auto offset calibration.
Fault indicator output. This pin is pulled logic low during a fault condition and requires an external pullup resistor.
Serial chip select. A logic low on this pin enables serial interface communication.
Device power ground. Connect to system ground.
Serial data output. Data is shifted out on the rising edge of the SCLK pin. This pin requires an external pullup resistor.
PWR = power, I = input, O = output, NC = no connection, OD = open-drain
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Pin Functions—40-Pin DRV8323 Devices (continued)
PIN
TYPE (1)
NO.
DESCRIPTION
NAME
DRV8323H
DRV8323S
SHA
7
7
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHB
14
14
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHC
17
17
I
High-side source sense input. Connect to the high-side power MOSFET source.
SNA
10
10
I
Shunt amplifier input. Connect to the low-side of the current shunt resistor.
SNB
11
11
I
Shunt amplifier input. Connect to the low-side of the current shunt resistor.
SNC
20
20
I
Shunt amplifier input. Connect to the low-side of the current shunt resistor.
SOA
23
23
O
Shunt amplifier output.
SOB
22
22
O
Shunt amplifier output.
SOC
21
21
O
Shunt amplifier output.
SPA
9
9
I
Low-side source sense and shunt amplifier input. Connect to the low-side power MOSFET source and high-side of the
current shunt resistor.
SPB
12
12
I
Low-side source sense and shunt amplifier input. Connect to the low-side power MOSFET source and high-side of the
current shunt resistor.
SPC
19
19
I
Low-side source sense and shunt amplifier input. Connect to the low-side power MOSFET source and high-side of the
current shunt resistor.
VCP
3
3
PWR
VDRAIN
5
5
I
High-side MOSFET drain sense input. Connect to the common point of the MOSFET drains.
VDS
28
—
I
VDS monitor trip point setting. This pin is a 7 level input pin set by an external resistor.
VM
4
4
PWR
Gate driver power supply input. Connect to the bridge power supply. Connect a X5R or X7R, 0.1-µF, VM-rated ceramic and
greater then or equal to 10-uF local capacitance between the VM and PGND pins.
VREF
24
24
PWR
Shunt amplifier power supply input and reference. Connect a X5R or X7R, 0.1-µF, 6.3-V ceramic capacitor between the
VREF and AGND pins.
Charge pump output. Connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between the VCP and VM pins.
BGND
INLC
INHC
INLB
INHB
INLA
INHA
42
41
40
39
38
37
INHA
37
CB
INLA
38
43
INHB
39
SW
INLB
40
44
INHC
41
45
INLC
42
NC
BGND
43
VIN
CB
44
46
SW
45
nSHDN
NC
46
47
VIN
47
DRV8323RS RGZ Package
48-Pin VQFN With Exposed Thermal Pad
Top View
48
nSHDN
48
DRV8323RH RGZ Package
48-Pin VQFN With Exposed Thermal Pad
Top View
FB
1
36
DVDD
FB
1
36
DVDD
PGND
2
35
AGND
PGND
2
35
AGND
CPL
3
34
CAL
CPL
3
34
CAL
CPH
4
33
ENABLE
CPH
4
33
ENABLE
VCP
5
32
GAIN
VCP
5
32
nSCS
VM
6
31
VDS
VM
6
31
SCLK
VDRAIN
7
30
IDRIVE
VDRAIN
7
30
SDI
GHA
8
29
MODE
GHA
8
29
SDO
SHA
9
28
nFAULT
SHA
9
28
nFAULT
GLA
10
27
DGND
GLA
10
27
DGND
SPA
11
26
VREF
SPA
11
26
VREF
SNA
12
25
SOA
SNA
12
25
SOA
19
20
21
22
23
24
SHC
GLC
SPC
SNC
SOC
SOB
24
SOB
18
23
SOC
GHC
22
SNC
17
21
SPC
16
20
GLC
SHB
19
SHC
GHB
18
GHC
15
17
GLB
16
SHB
GHB
14
15
GLB
Pad
13
14
SPB
Not to scale
Thermal
SPB
13
SNB
Pad
SNB
Thermal
Not to scale
Pin Functions—48-Pin DRV8323R Devices
PIN
TYPE (1)
NO.
DESCRIPTION
NAME
DRV8323RH
DRV8323RS
AGND
35
35
PWR
Device analog ground. Connect to system ground.
BGND
43
43
PWR
Buck regulator ground. Connect to system ground.
CAL
34
34
I
(1)
Amplifier calibration input. Set logic high to internally short amplifier inputs and perform auto offset calibration.
PWR = power, I = input, O = output, NC = no connection, OD = open-drain
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Pin Functions—48-Pin DRV8323R Devices (continued)
PIN
TYPE (1)
NO.
DESCRIPTION
NAME
DRV8323RH
DRV8323RS
CB
44
44
PWR
Buck regulator bootstrap input. Connect a X5R or X7R, 0.1-µF, 16-V, capacitor between the CB and SW pins.
CPH
4
4
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
CPL
3
3
PWR
Charge pump switching node. Connect a X5R or X7R, 47-nF, VM-rated ceramic capacitor between the CPH and CPL pins.
DGND
27
27
PWR
Device ground. Connect to system ground.
DVDD
36
36
PWR
3.3-V internal regulator output. Connect a X5R or X7R, 1-µF, 6.3-V ceramic capacitor between the DVDD and AGND pins.
This regulator can source up to 30 mA externally.
ENABLE
33
33
I
Gate driver enable. When this pin is logic low the device enters a low power sleep mode. An 8 to 40-µs low pulse can be
used to reset fault conditions.
FB
1
1
I
Buck feedback input. A resistor divider from the buck post inductor output to this pin sets the buck output voltage.
GAIN
32
—
I
Amplifier gain setting. The pin is a 4 level input pin set by an external resistor.
GHA
8
8
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHB
17
17
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GHC
18
18
O
High-side gate driver output. Connect to the gate of the high-side power MOSFET.
GLA
10
10
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GLB
15
15
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
GLC
20
20
O
Low-side gate driver output. Connect to the gate of the low-side power MOSFET.
IDRIVE
30
—
I
Gate drive output current setting. This pin is a 7 level input pin set by an external resistor.
INHA
37
37
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHB
39
39
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INHC
41
41
I
High-side gate driver control input. This pin controls the output of the high-side gate driver.
INLA
38
38
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLB
40
40
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
INLC
42
42
I
Low-side gate driver control input. This pin controls the output of the low-side gate driver.
MODE
29
—
I
PWM input mode setting. This pin is a 4 level input pin set by an external resistor.
NC
46
46
NC
No internal connection. This pin can be left floating or connected to system ground.
nFAULT
28
28
OD
Fault indicator output. This pin is pulled logic low during a fault condition and requires an external pullup resistor.
nSCS
—
32
I
Serial chip select. A logic low on this pin enables serial interface communication.
nSHDN
48
48
I
Buck shutdown input. Enable and disable input (high voltage tolerant). Internal pullup current source. Pull below 1.25 V to
disable. Float to enable. Establish input undervoltage lockout with two resistor divider.
PGND
2
2
PWR
SCLK
—
31
I
Serial clock input. Serial data is shifted out and captured on the corresponding rising and falling edge on this pin.
SDI
—
30
I
Serial data input. Data is captured on the falling edge of the SCLK pin.
SDO
—
29
OD
SHA
9
9
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHB
16
16
I
High-side source sense input. Connect to the high-side power MOSFET source.
SHC
19
19
I
High-side source sense input. Connect to the high-side power MOSFET source.
SNA
12
12
I
Shunt amplifier input. Connect to the low-side of the current shunt resistor.
SNB
13
13
I
Shunt amplifier input. Connect to the low-side of the current shunt resistor.
SNC
22
22
I
Shunt amplifier input. Connect to the low-side of the current shunt resistor.
SOA
25
25
O
Shunt amplifier output.
SOB
24
24
O
Shunt amplifier output.
SOC
23
23
O
Shunt amplifier output.
SPA
11
11
I
Low-side source sense and shunt amplifier input. Connect to the low-side power MOSFET source and high-side of the
current shunt resistor.
SPB
14
14
I
Low-side source sense and shunt amplifier input. Connect to the low-side power MOSFET source and high-side of the
current shunt resistor.
SPC
21
21
I
Low-side source sense and shunt amplifier input. Connect to the low-side power MOSFET source and high-side of the
current shunt resistor.
SW
45
45
O
Buck switch node. Connect this pin to an inductor, diode, and the CB bootstrap capacitor.
VCP
5
5
PWR
VDRAIN
7
7
I
High-side MOSFET drain sense input. Connect to the common point of the MOSFET drains.
VDS
31
—
I
VDS monitor trip point setting. This pin is a 7 level input pin set by an external resistor.
VIN
47
47
PWR
Buck regulator power supply input. Place an X5R or X7R, VM-rated ceramic capacitor between the VIN and BGND pins.
VM
6
6
PWR
Gate driver power supply input. Connect to the bridge power supply. Connect a X5R or X7R, 0.1-µF, VM-rated ceramic and
greater then or equal to 10-uF local capacitance between the VM and PGND pins.
VREF
26
26
PWR
Shunt amplifier power supply input and reference. Connect a X5R or X7R, 0.1-µF, 6.3-V ceramic capacitor between the
VREF and AGND pins.
8
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Device power ground. Connect to system ground.
Serial data output. Data is shifted out on the rising edge of the SCLK pin. This pin requires an external pullup resistor.
Charge pump output. Connect a X5R or X7R, 1-µF, 16-V ceramic capacitor between the VCP and VM pins.
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SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
7 Specifications
7.1 Absolute Maximum Ratings
at TA = –40°C to +125°C (unless otherwise noted) (1)
MIN
MAX
UNIT
GATE DRIVER
Power supply pin voltage (VM)
–0.3
65
V
Voltage differential between ground pins (AGND, BGND, DGND, PGND)
–0.3
0.3
V
MOSFET drain sense pin voltage (VDRAIN)
–0.3
65
V
Charge pump pin voltage (CPH, VCP)
–0.3
VVM + 13.5
V
Charge-pump negative-switching pin voltage (CPL)
–0.3
VVM
V
Internal logic regulator pin voltage (DVDD)
–0.3
3.8
V
Digital pin voltage (CAL, ENABLE, GAIN, IDRIVE, INHx, INLx, MODE, nFAULT, nSCS,
SCLK, SDI, SDO, VDS)
–0.3
5.75
V
VVCP + 0.5
V
VVCP + 0.5
V
Continuous high-side gate drive pin voltage (GHx)
–5
Transient 200-ns high-side gate drive pin voltage (GHx)
(2)
–7
High-side gate drive pin voltage with respect to SHx (GHx)
–0.3
13.5
V
Continuous high-side source sense pin voltage (SHx)
–5 (2)
VVM + 5
V
–7
VVM + 7
V
–0.5
13.5
V
Transient 200-ns high-side source sense pin voltage (SHx)
Continuous low-side gate drive pin voltage (GLx)
Gate drive pin source current (GHx, GLx)
Internally limited
A
Gate drive pin sink current (GHx, GLx)
Internally limited
A
Continuous low-side source sense pin voltage (SLx)
–1
1
V
Transient 200-ns low-side source sense pin voltage (SLx)
–3
3
V
Continuous shunt amplifier input pin voltage (SNx, SPx)
–1
1
V
Transient 200-ns shunt amplifier input pin voltage (SNx, SPx)
–3
3
V
Reference input pin voltage (VREF)
–0.3
5.75
V
Shunt amplifier output pin voltage (SOx)
–0.3
VVREF + 0.3
V
BUCK REGULATOR
Power supply pin voltage (VIN)
–0.3
65
V
Shutdown control pin voltage (nSHDN)
–0.3
VVIN
V
Voltage feedback pin voltage (FB)
–0.3
7
V
Bootstrap pin voltage with respect to SW (CB)
–0.3
7
V
Switching node pin voltage (SW)
–0.3
VVIN
V
–2
VVIN
V
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
Switching node pin voltage less than 30-ns transients (SW)
DRV832x
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Continuous high-side gate pin (GHx) and phase node pin voltage (SHx) should be limited to –2 V minimum for an absolute maximum of
65 V on VM. At 60 V and below, the full specification of –5 V continuous on GHx and SHx is allowable.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
±3000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000
V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±500 V
may actually have higher performance.
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7.3 Recommended Operating Conditions
at TA = –40°C to +125°C (unless otherwise noted)
MIN
MAX
UNIT
GATE DRIVER
VVM
Power supply voltage (VM)
6
60
V
VI
Input voltage (CAL, ENABLE, GAIN, IDRIVE, INHx, INLx, MODE, nSCS,
SCLK, SDI, VDS)
0
5.5
V
fPWM
Applied PWM signal (INHx, INLx)
0
200 (1)
kHz
IGATE_HS
High-side average gate-drive current (GHx)
0
25 (1)
mA
IGATE_LS
Low-side average gate-drive current (GLx)
0
25 (1)
mA
(1)
mA
IDVDD
External load current (DVDD)
0
VVREF
Reference voltage input (VREF)
3
30
5.5
ISO
Shunt amplifier output current (SOx)
0
5
VOD
Open drain pullup voltage (nFAULT, SDO)
0
5.5
IOD
Open drain output current (nFAULT, SDO)
0
5
mA
V
mA
V
BUCK REGULATOR
VVIN
Power supply voltage (VIN)
4
60
V
VnSHDN
Shutdown control input voltage (nSHDN)
0
60
V
–40
125
°C
DRV832x
TA
(1)
Operating ambient temperature
Power dissipation and thermal limits must be observed
7.4 Thermal Information
DRV832x
THERMAL METRIC (1)
RθJA
RHA
(VQFN)
RTA
(WQFN)
RGZ
(VQFN)
32 PINS
40 PINS
40 PINS
48 PINS
UNIT
32.9
30.1
32.1
26.6
°C/W
RθJC(top) Junction-to-case (top) thermal resistance
15.8
16.7
11
13.9
°C/W
RθJB
Junction-to-board thermal resistance
6.8
9.9
7.1
9.2
°C/W
ψJT
Junction-to-top characterization parameter
0.2
0.5
0.1
0.3
°C/W
ψJB
Junction-to-board characterization parameter
6.8
9.9
7.1
9.1
°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance
2.1
2.2
2.1
2
°C/W
(1)
10
Junction-to-ambient thermal resistance
RTV
(WQFN)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
at TA = –40°C to +125°C, VVM = 6 to 60 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
10.5
14
12
20
UNIT
POWER SUPPLIES (DVDD, VCP, VM)
IVM
VM operating supply current
VVM = 24 V, ENABLE = 3.3 V, INHx/INLx = 0 V
ENABLE = 0 V, VVM = 24 V, TA = 25°C
mA
IVMQ
VM sleep mode supply current
tRST (1)
Reset pulse time
ENABLE = 0 V period to reset faults
40
µs
tWAKE
Turnon time
VVM > VUVLO, ENABLE = 3.3 V to outputs ready
1
ms
tSLEEP
Turnoff time
ENABLE = 0 V to device sleep mode
1
ms
VDVDD
DVDD regulator voltage
IDVDD = 0 to 30 mA
VVCP
VCP operating voltage
w.r.t VM
ENABLE = 0 V, VVM = 24 V, TA = 125°C (1)
50
8
3
3.3
3.6
VVM = 13 V, IVCP = 0 to 25 mA
8.4
11
12.5
VVM = 10 V, IVCP = 0 to 20 mA
6.3
9
10
VVM = 8 V, IVCP = 0 to 15 mA
5.4
7
8
VVM = 6 V, IVCP = 0 to 10 mA
4
5
6
µA
V
V
LOGIC-LEVEL INPUTS (CAL, ENABLE, INHx, INLx, nSCS, SCLK, SDI)
VIL
Input logic low voltage
0
0.8
VIH
Input logic high voltage
VHYS
Input logic hysteresis
IIL
Input logic low current
VVIN = 0 V
IIH
Input logic high current
VVIN = 5 V
50
RPD
Pulldown resistance
To AGND
100
kΩ
tPD
Propagation delay
INHx/INLx transition to GHx/GLx transition
150
ns
1.5
5.5
100
–5
V
V
mV
5
µA
70
µA
FOUR-LEVEL H/W INPUTS (GAIN, MODE)
VI1
Input mode 1 voltage
Tied to AGND
VI2
Input mode 2 voltage
45 kΩ ± 5% to tied AGND
0
V
1.2
VI3
Input mode 3 voltage
Hi-Z
V
2
V
VI4
Input mode 4 voltage
Tied to DVDD
3.3
V
RPU
Pullup resistance
Internal pullup to DVDD
50
kΩ
RPD
Pulldown resistance
Internal pulldown to AGND
84
kΩ
SEVEN-LEVEL H/W INPUTS (IDRIVE, VDS)
VI1
Input mode 1 voltage
Tied to AGND
VI2
Input mode 2 voltage
18 kΩ ± 5% tied to AGND
VI3
Input mode 3 voltage
75 kΩ ± 5% tied to AGND
VI4
Input mode 4 voltage
Hi-Z
VI5
Input mode 5 voltage
VI6
0
V
0.5
V
1.1
V
1.65
V
75 kΩ ± 5% tied to DVDD
2.2
V
Input mode 6 voltage
18 kΩ ± 5% tied to DVDD
2.8
V
VI7
Input mode 7 voltage
Tied to DVDD
3.3
V
RPU
Pullup resistance
Internal pullup to DVDD
73
kΩ
RPD
Pulldown resistance
Internal pulldown to AGND
73
kΩ
OPEN DRAIN OUTPUTS (nFAULT, SDO)
VOL
Output logic low voltage
IO = 5 mA
IOZ
Output high impedance leakage
VO = 5 V
(1)
–2
0.1
V
2
µA
Specified by design and characterization data
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Electrical Characteristics (continued)
at TA = –40°C to +125°C, VVM = 6 to 60 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VVM = 13 V, IVCP = 0 to 25 mA
8.4
11
12.5
VVM = 10 , IVCP = 0 to 20 mA
6.3
9
10
VVM = 8 V, IVCP = 0 to 15 mA
5.4
7
8
VVM = 6 V, IVCP = 0 to 10 mA
4
5
6
VVM = 12 V, IVGLS = 0 to 25 mA
9
11
12
VVM = 10 V, IVGLS = 0 to 20 mA
7.5
9
10
VVM = 8 V, IVGLS = 0 to 15 mA
5.5
7
8
VVM = 6 V, IVGLS = 0 to 10 mA
4
5
6
UNIT
GATE DRIVERS (GHx, GLx)
VGSH
(1)
VGSL (1)
tDEAD
High-side gate drive voltage
w.r.t SHx
Low-side gate drive voltage
w.r.t PGND
Gate drive
dead time
SPI Device
DEAD_TIME = 00b
50
DEAD_TIME = 01b
100
DEAD_TIME = 10b
200
DEAD_TIME = 11b
400
H/W Device
tDRIVE
Peak current
gate drive time
SPI Device
IDRIVEP
Peak source
gate current
500
TDRIVE = 01b
1000
TDRIVE = 10b
2000
TDRIVE = 11b
4000
10
IDRIVEP_HS or IDRIVEP_LS = 0001b
30
IDRIVEP_HS or IDRIVEP_LS = 0010b
60
IDRIVEP_HS or IDRIVEP_LS = 0011b
80
IDRIVEP_HS or IDRIVEP_LS = 0100b
120
IDRIVEP_HS or IDRIVEP_LS = 0101b
140
IDRIVEP_HS or IDRIVEP_LS = 0110b
170
IDRIVEP_HS or IDRIVEP_LS = 0111b
190
IDRIVEP_HS or IDRIVEP_LS = 1000b
260
IDRIVEP_HS or IDRIVEP_LS = 1001b
330
IDRIVEP_HS or IDRIVEP_LS = 1010b
370
IDRIVEP_HS or IDRIVEP_LS = 1011b
440
IDRIVEP_HS or IDRIVEP_LS = 1100b
570
IDRIVEP_HS or IDRIVEP_LS = 1101b
680
IDRIVEP_HS or IDRIVEP_LS = 1110b
820
IDRIVEP_HS or IDRIVEP_LS = 1111b
1000
IDRIVE = Tied to AGND
10
IDRIVE = 18 kΩ ± 5% tied to AGND
30
120
IDRIVE = 75 kΩ ± 5% tied to DVDD
260
mA
570
IDRIVE = Tied to DVDD
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ns
60
IDRIVE = Hi-Z
IDRIVE = 18 kΩ ± 5% tied to DVDD
12
ns
4000
IDRIVEP_HS or IDRIVEP_LS = 0000b
IDRIVE = 75 kΩ ± 5% tied to AGND
H/W Device
V
100
TDRIVE = 00b
H/W Device
SPI Device
V
1000
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SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
Electrical Characteristics (continued)
at TA = –40°C to +125°C, VVM = 6 to 60 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
IDRIVEN_HS or IDRIVEN_LS = 0000b
SPI Device
IDRIVEN
Peak sink
gate current
MAX
UNIT
20
IDRIVEN_HS or IDRIVEN_LS = 0001b
60
IDRIVEN_HS or IDRIVEN_LS = 0010b
120
IDRIVEN_HS or IDRIVEN_LS = 0011b
160
IDRIVEN_HS or IDRIVEN_LS = 0100b
240
IDRIVEN_HS or IDRIVEN_LS = 0101b
280
IDRIVEN_HS or IDRIVEN_LS = 0110b
340
IDRIVEN_HS or IDRIVEN_LS = 0111b
380
IDRIVEN_HS or IDRIVEN_LS = 1000b
520
IDRIVEN_HS or IDRIVEN_LS = 1001b
660
IDRIVEN_HS or IDRIVEN_LS = 1010b
740
IDRIVEN_HS or IDRIVEN_LS = 1011b
880
IDRIVEN_HS or IDRIVEN_LS = 1100b
1140
IDRIVEN_HS or IDRIVEN_LS = 1101b
1360
IDRIVEN_HS or IDRIVEN_LS = 1110b
1640
IDRIVEN_HS or IDRIVEN_LS = 1111b
2000
IDRIVE = Tied to AGND
H/W Device
TYP
mA
20
IDRIVE = 18 kΩ ± 5% tied to AGND
60
IDRIVE = 75 kΩ ± 5% tied to AGND
120
IDRIVE = Hi-Z
240
IDRIVE = 75 kΩ ± 5% tied to DVDD
520
IDRIVE = 18 kΩ ± 5% tied to DVDD
1140
IDRIVE = Tied to DVDD
2000
Source current after tDRIVE
10
Sink current after tDRIVE
50
IHOLD
Gate holding current
mA
ISTRONG
Gate strong pulldown current
GHx to SHx and GLx to PGND
2
A
ROFF
Gate hold off resistor
GHx to SHx and GLx to PGND
150
kΩ
CURRENT SHUNT AMPLIFIER (SNx, SOx, SPx, VREF)
SPI Device
GCSA
Amplifier gain
H/W Device
tSET (1)
Settling time to ±1%
CSA_GAIN = 00b
4.85
5
5.15
CSA_GAIN = 01b
9.7
10
10.3
CSA_GAIN = 10b
19.4
20
20.6
CSA_GAIN = 11b
38.8
40
41.2
GAIN = Tied to AGND
4.85
5
5.15
GAIN = 45 kΩ ± 5% tied to AGND
9.7
10
10.3
GAIN = Hi-Z
19.4
20
20.6
GAIN = Tied to DVDD
38.8
40
41.2
VO_STEP = 0.5 V, GCSA = 5 V/V
150
VO_STEP = 0.5 V, GCSA = 10 V/V
300
VO_STEP = 0.5 V, GVSA = 20 V/V
600
VO_STEP = 0.5 V, GCSA = 40 V/V
1200
VCOM
Common mode input range
VDIFF
Differential mode input range
VOFF
Input offset error
VSP = VSN = 0 V, CAL = 3.3 V, VREF = 3.3 V
VDRIFT (1)
Drift offset
VSP = VSN = 0 V
VLINEAR
Copyright © 2017, Texas Instruments Incorporated
ns
–0.15
0.15
–0.3
0.3
–4
4
10
SOx output voltage linear range
0.25
V
V
mV
µV/°C
VVREF
– 0.25
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V
13
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Electrical Characteristics (continued)
at TA = –40°C to +125°C, VVM = 6 to 60 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SOx output voltage SPI Device
bias
H/W Device
VBIAS
MIN
TYP
VSP = VSN = 0 V, CAL = 3.3 V, VREF_DIV = 0b
VVREF – 0.3
VSP = VSN = 0 V, CAL = 3.3 V, VREF_DIV = 1b
VVREF / 2
VSP = VSN = 0 V, CAL = 3.3 V
VVREF / 2
IBIAS
SPx/SNx input bias current
VREF_DIV = 1b
VSLEW (1)
SOx output slew rate
60-pF load
10
IVREF
VREF input current
VVREF = 5 V
2
UGB (1)
Unity gain bandwidth
60-pF load
1
MAX
UNIT
V
100
µA
V/µs
3
mA
MHz
PROTECTION CIRCUITS
VM falling, UVLO report
5.4
5.6
5.8
VM rising, UVLO recovery
5.6
5.8
6
VUVLO
VM undervoltage lockout
VUVLO_HYS
VM undervoltage hysteresis
Rising to falling threshold
tUVLO_DEG
VM undervoltage deglitch time
VM falling, UVLO report
VCPUV
Charge pump undervoltage
lockout
VCP falling, CPUV report
VGS_CLAMP
High-side gate clamp
SPI Device
VVDS_OCP
VDS overcurrent
trip voltage
H/W Device
15
0.06
VDS_LVL = 0001b
0.13
VDS_LVL = 0010b
0.2
VDS_LVL = 0011b
0.26
VDS_LVL = 0100b
0.31
VDS_LVL = 0101b
0.45
VDS_LVL = 0110b
0.53
VDS_LVL = 0111b
0.6
VDS_LVL = 1000b
0.68
VDS_LVL = 1001b
0.75
VDS_LVL = 1010b
0.94
VDS_LVL = 1011b
1.13
VDS_LVL = 1100b
1.3
VDS_LVL = 1101b
1.5
VDS_LVL = 1110b
1.7
VDS_LVL = 1111b
1.88
VDS = Tied to AGND
0.06
VDS = 18 kΩ ± 5% tied to AGND
0.13
VDS = 75 kΩ ± 5% tied to AGND
0.26
VDS = Hi-Z
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V
18
V
V
0.6
1.13
1.88
Disabled
OCP_DEG = 00b
2
OCP_DEG = 01b
4
OCP_DEG = 10b
6
OCP_DEG = 11b
8
H/W Device
14
16.5
VDS_LVL = 0000b
VDS = Tied to DVDD
SPI Device
µs
–0.7
VDS = 18 kΩ ± 5% tied to DVDD
VDS and VSENSE
overcurrent
deglitch time
mV
10
Negative clamping voltage
VDS = 75 kΩ ± 5% tied to DVDD
tOCP_DEG
200
VVM + 2.8
Positive clamping voltage
V
µs
4
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SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
Electrical Characteristics (continued)
at TA = –40°C to +125°C, VVM = 6 to 60 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SEN_LVL = 00b
VSEN_OCP
VSENSE overcurrent SPI Device
trip voltage
MAX
UNIT
0.25
SEN_LVL = 01b
0.5
SEN_LVL = 10b
0.75
SEN_LVL = 11b
1
H/W Device
SPI Device
TYP
V
1
TRETRY = 0b
4
ms
TRETRY = 1b
50
μs
tRETRY
Overcurrent retry
time
TOTW (1)
Thermal warning temperature
Die temperature, TJ
130
150
165
°C
TOTSD (1)
Thermal shutdown temperature
Die temperature, TJ
150
170
185
°C
Thermal hysteresis
Die temperature, TJ
H/W Device
THYS
(1)
4
ms
20
°C
BUCK REGULATOR SUPPLY (VIN)
InSHDN
Shutdown supply current
VnSHDN = 0 V
IQ
Operating quiescent current
VVIN = 12 V, no load; non-switching
VVIN_UVLO
VIN undervoltage lockout
threshold
VIN Rising
1
3
28
µA
4
VIN Falling
µA
3
V
BUCK REGULATOR SHUTDOWN (nSHDN)
VnSHDN_TH
Rising nSHDN threshold
InSHDN
Input current
InSHDN_HYS
Hysteresis current
1.05
1.25
VnSHDN = 2.3 V
–4.2
VnSHDN = 0.9 V
–1
1.38
V
µA
–3
µA
900
mΩ
BUCK REGULATOR HIGH-SIDE MOSFET
RDS_ON
MOSFET on resistance
VVIN = 12 V, VCB to VSW = 5.8 V, TA = 25°C
BUCK REGULATOR VOLTAGE REFERENCE (FB)
VFB
Feedback voltage
0.747
0.765
0.782
V
BUCK REGULATOR CURRENT LIMIT
ILIMIT
VVIN = 12 V, TA = 25°C
Peak current limit
1200
1700
mA
BUCK REGULATOR SWITCHING (SW)
fSW
Switching frequency
DMAX
Maximum duty cycle
595
700
805
kHz
96%
BUCK REGULATOR THERMAL SHUTDOWN
TSHDN (1)
THYS
(1)
Thermal shutdown threshold
170
°C
Thermal shutdown hysteresis
10
°C
Copyright © 2017, Texas Instruments Incorporated
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7.6 SPI Timing Requirements (1)
at TA = –40°C to +125°C, VVM = 6 to 60 V (unless otherwise noted)
MIN
NOM
MAX
UNIT
SPI (nSCS, SCLK, SDI, SDO)
tREADY
SPI ready after enable
tCLK
SCLK minimum period
tCLKH
VM > UVLO, ENABLE = 3.3 V
1
ms
100
ns
SCLK minimum high time
50
ns
tCLKL
SCLK minimum low time
50
ns
tSU_SDI
SDI input data setup time
20
ns
tH_SDI
SDI input data hold time
30
ns
tD_SDO
SDO output data delay time
tSU_nSCS
nSCS input setup time
50
ns
tH_nSCS
nSCS input hold time
50
ns
tHI_nSCS
nSCS minimum high time before active low
tDIS_nSCS
nSCS disable time
(1)
SCLK high to SDO valid
30
400
nSCS high to SDO high impedance
ns
ns
10
ns
Specified by design and characterization data
tHI_nSCS
tSU_nSCS
tH_nSCS
nSCS
tCLK
SCLK
tCLKH
SDI
X
tCLKL
MSB
LSB
X
tSU_SDI tH_SDI
SDO
Z
MSB
tEN_nSCS
LSB
tD_SDO
Z
tDIS_nSCS
Figure 1. SPI Slave Mode Timing Diagram
16
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SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
16
15
14
14
13
12
Supply Current (mA)
Supply Current (mA)
7.7 Typical Characteristics
10
8
6
4
10
20
30
40
Supply Voltage (V)
50
10
9
8
VVM = 6 V
VVM = 24 V
VVM = 60 V
6
0
0
11
7
TA = 40qC
TA = 25qC
TA = 125qC
2
12
5
-40
60
0
20
40
60
80
Ambient Temperature (°C)
100
120
140
D002
Figure 3. Supply Current Over Temperature
24
24
22
22
20
20
18
18
Sleep Current (PA)
Sleep Current (PA)
Figure 2. Supply Current Over VM
16
14
12
10
8
16
14
12
10
8
6
6
TA = 40qC
TA = 25qC
TA = 125qC
4
2
0
10
20
30
40
Supply Voltage (V)
50
VVM = 6 V
VVM = 24 V
VVM = 60 V
4
2
0
-40
0
60
-20
0
D003
Figure 4. Sleep Current Over VM
20
40
60
80
100
Ambient Temperature (qC)
120
140
D004
Figure 5. Sleep Current Over Temperature
4
4
TA = 40qC
TA = 25qC
TA = 125qC
3.75
TA = 40qC
TA = 25qC
TA = 125qC
3.75
3.5
DVDD Voltage (V)
3.5
DVDD Voltage (V)
-20
D001
3.25
3
2.75
3.25
3
2.75
2.5
2.5
2.25
2.25
2
2
0
10
20
30
40
Supply Voltage (V)
50
0-mA load
60
0
10
D005
20
30
40
Supply Voltage (V)
50
60
D006
30-mA load
Figure 6. DVDD Voltage Over VM
Copyright © 2017, Texas Instruments Incorporated
Figure 7. DVDD Voltage Over VM
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12
14
10
12
8
VCP Voltage (V)
VCP Voltage (V)
Typical Characteristics (continued)
6
4
2.5
5
7.5
10 12.5 15 17.5
Load Current (mA)
20
22.5
6
VVM = 6 V
VVM = 8 V
VVM = 10 V
VVM = 13 V
2
0
0
8
4
VVM = 6 V
VVM = 8 V
VVM = 10 V
VVM = 13 V
2
10
25
0
-40
-20
0
D007
20
40
60
80
Ambient Temperature (°C)
100
120
140
D008
0-mA load
Figure 8. VCP Voltage Over Load
18
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Figure 9. VCP Voltage Over Temperature
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8 Detailed Description
8.1 Overview
The DRV832x family of devices are integrated 6 to 60-V gate drivers for three-phase motor drive applications.
These devices reduce system component count, cost, and complexity by integrating three independent halfbridge gate drivers, charge pump and linear regulator for the high-side and low-side gate driver supply voltages,
optional triple current shunt amplifiers, and an optional 600-mA buck regulator. A standard serial peripheral
interface (SPI) provides a simple method for configuring the various device settings and reading fault diagnostic
information through an external controller. Alternatively, a hardware interface (H/W) option allows for configuring
the most commonly used settings through fixed external resistors.
The gate drivers support external N-channel high-side and low-side power MOSFETs and can drive up to 1-A
source, 2-A sink peak currents with a 25-mA average output current. The high-side gate drive supply voltage is
generated using a doubler charge-pump architecture that regulates the VCP output to VVM + 11 V. The low-side
gate drive supply voltage is generated using a linear regulator from the VM power supply that regulates to 11 V.
A smart gate-drive architecture provides the ability to dynamically adjust the output gate-drive current strength
allowing for the gate driver to control the power MOSFET VDS switching speed. This allows for the removal of
external gate drive resistors and diodes reducing BOM component count, cost, and PCB area. The architecture
also uses an internal state machine to protect against gate-drive short-circuit events, control the half-bridge dead
time, and protect against dV/dt parasitic turnon of the external power MOSFET.
The DRV8323 and DRV8323R devices integrate three, bidirectional current-shunt amplifiers for monitoring the
current level through each of the external half-bridges using a low-side shunt resistor. The gain setting of the
shunt amplifier can be adjusted through the SPI or hardware interface with the SPI providing additional flexibility
to adjust the output bias point.
The DRV8320R and DRV8323R devices integrate a 600-mA buck regulator that can be used to power an
external controller or other logic circuits. The buck regulator is implemented as a separate internal die that can
use either the same or a different power supply from the gate driver.
In addition to the high level of device integration, the DRV832x family of devices provides a wide range of
integrated protection features. These features include power-supply undervoltage lockout (UVLO), charge-pump
undervoltage lockout (CPUV), VDS overcurrent monitoring (OCP), gate-driver short-circuit detection (GDF), and
overtemperature shutdown (OTW/OTSD). Fault events are indicated by the nFAULT pin with detailed information
available in the SPI registers on the SPI device version.
The DRV832x family of devices are available in 0.5-mm pin pitch, QFN surface-mount packages. The QFN sizes
are 5 × 5 mm for the 32-pin package, 6 × 6 mm for the 40-pin package, and 7 × 7 mm for the 48-pin package.
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8.2 Functional Block Diagram
VM
VM
VDRAIN
VM
VCP
VCP
GHA
HS
1 …F
>10 …F 0.1 …F
47 nF
1 …F
VGLS
CPL
SLA
VGLS
Linear
Regulator
Gate Driver
VM
VCP
DVDD
AGND
GLA
LS
VGLS
30 mA
SHA
VCP
Charge
Pump
CPH
DVDD
Linear
Regulator
GHB
HS
SHB
PGND
Power
VGLS
Digital
Core
ENABLE
GLB
LS
SLB
INHA
Gate Driver
VM
INLA
Smart Gate
Drive
VCP
GHC
HS
INHB
Protection
SHC
INLB
Control
Inputs
VGLS
GLC
LS
INHC
SLC
VCC
Gate Driver
INLC
nFAULT
Fault Output
MODE
RPU
IDRIVE
VDS
Copyright © 2017, Texas Instruments Incorporated
Figure 10. Block Diagram for DRV8320H
20
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Functional Block Diagram (continued)
VM
VM
VDRAIN
VM
VCP
VCP
GHA
HS
1 …F
>10 …F 0.1 …F
47 nF
SHA
VCP
Charge
Pump
CPH
VGLS
CPL
VGLS
30 mA
DVDD
1 …F
AGND
GLA
LS
SLA
VGLS
Linear
Regulator
Gate Driver
VM
VCP
DVDD
Linear
Regulator
GHB
HS
Power
SHB
PGND
VGLS
Digital
Core
ENABLE
GLB
LS
SLB
INHA
Gate Driver
INLA
INHB
VM
Control
Inputs
Smart Gate
Drive
VCP
GHC
HS
Protection
SHC
INLB
VGLS
INHC
GLC
LS
SLC
INLC
VCC
Gate Driver
VCC
SDI
SPI
RPU
nFAULT
Fault Output
RPU
SDO
SCLK
nSCS
Copyright © 2017, Texas Instruments Incorporated
Figure 11. Block Diagram for DRV8320S
Copyright © 2017, Texas Instruments Incorporated
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Functional Block Diagram (continued)
VM
VM
VDRAIN
VM
VCP
VCP
GHA
HS
1 …F
>10 …F 0.1 …F
47 nF
1 …F
VGLS
CPL
GLA
LS
VGLS
30 mA
SHA
VCP
Charge
Pump
CPH
SLA
VGLS
Linear
Regulator
Gate Driver
VM
DVDD
AGND
DVDD
Linear
Regulator
PGND
Power
VCP
GHB
HS
SHB
VGLS
Digital
Core
ENABLE
GLB
LS
SLB
INHA
Gate Driver
INLA
VM
Smart Gate
Drive
INHB
VCP
GHC
HS
Protection
SHC
INLB
Control
Inputs
VGLS
INHC
GLC
LS
SLC
INLC
VCC
Gate Driver
MODE
RPU
nFAULT
Fault Output
IDRIVE
VDS
VIN
VIN
CB
nSHDN
SW
0.1 µF
CIN
Buck Regulator
(LMR16006X)
BGND
FB
LOUT
DOUT
RFB1
600 mA
COUT
RFB2
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Figure 12. Block Diagram for DRV8320RH
22
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Functional Block Diagram (continued)
VM
VM
VDRAIN
VM
VCP
VCP
GHA
HS
1 …F
>10 …F 0.1 …F
47 nF
SHA
VCP
Charge
Pump
CPH
VGLS
CPL
VGLS
30 mA
GLA
LS
SLA
VGLS
Linear
Regulator
Gate Driver
VM
DVDD
1 …F
AGND
PGND
DVDD
Linear
Regulator
VCP
GHB
HS
Power
SHB
ENABLE
VGLS
Digital
Core
INHA
GLB
LS
SLB
INLA
Gate Driver
INHB
VCP
VM
Control
Inputs
Smart Gate
Drive
GHC
HS
INLB
Protection
SHC
INHC
VGLS
GLC
LS
INLC
SLC
VCC
SDI
SPI
RPU
VCC
Gate Driver
SDO
nFAULT
Fault Output
RPU
SCLK
nSCS
VIN
VIN
CB
0.1 µF
CIN
nSHDN
SW
Buck Regulator
(LMR16006X)
LOUT
DOUT
BGND
FB
RFB1
600 mA
COUT
RFB2
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Figure 13. Block Diagram for DRV8320RS
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Functional Block Diagram (continued)
VM
VM
VDRAIN
VM
VCP
VCP
GHA
HS
1 …F
>10 …F 0.1 …F
47 nF
1 …F
VGLS
CPL
VGLS
Linear
Regulator
Gate Driver
VM
DVDD
AGND
PGND
GLA
LS
VGLS
30 mA
SHA
VCP
Charge
Pump
CPH
VCP
DVDD
Linear
Regulator
GHB
HS
SHB
Power
VGLS
Digital
Core
ENABLE
GLB
LS
INHA
Gate Driver
INLA
VM
Smart Gate
Drive
INHB
VCP
GHC
HS
Protection
INLB
SHC
Control
Inputs
INHC
VGLS
GLC
LS
INLC
VCC
Gate Driver
RPU
MODE
nFAULT
Fault Output
IDRIVE
VDS
GAIN
VCC
SPC
VREF
0.1 …F
AV
SNC
RSEN
SOC
SPB
SOB
SOA
Output
Offset
Bias
AV
SNB
RSEN
SPA
CAL
AV
SNA
RSEN
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Figure 14. Block Diagram for DRV8323H
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Functional Block Diagram (continued)
VM
VM
VDRAIN
VM
VCP
VCP
GHA
HS
1 …F
>10 …F 0.1 …F
47 nF
1 …F
VGLS
CPL
VGLS
Linear
Regulator
Gate Driver
VM
DVDD
AGND
PGND
GLA
LS
VGLS
30 mA
SHA
VCP
Charge
Pump
CPH
VCP
DVDD
Linear
Regulator
GHB
HS
Power
SHB
VGLS
ENABLE
Digital
Core
GLB
LS
INHA
Gate Driver
INLA
VM
INHB
Control
Inputs
Smart Gate
Drive
VCP
GHC
HS
Protection
INLB
SHC
VGLS
INHC
GLC
LS
INLC
VCC
Gate Driver
VCC
RPU
SDI
SPI
RPU
Fault Output
nFAULT
SDO
SCLK
nSCS
VCC
SPC
VREF
0.1 …F
AV
SNC
RSEN
SOC
SOB
SOA
Output
Offset
Bias
SPB
AV
SNB
RSEN
SPA
CAL
AV
SNA
RSEN
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Figure 15. Block Diagram for DRV8323S
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Functional Block Diagram (continued)
VM
VM
VDRAIN
VM
VCP
VCP
GHA
HS
1 …F
>10 …F 0.1 …F
47 nF
VGLS
Linear
Regulator
Gate Driver
VM
VCP
DVDD
AGND
GLA
LS
VGLS
1 …F
VGLS
CPL
DGND
30 mA
SHA
VCP
Charge
Pump
CPH
DVDD
Linear
Regulator
GHB
HS
SHB
PGND
Power
VGLS
Digital
Core
GLB
LS
ENABLE
Gate Driver
INHA
Smart Gate
Drive
INLA
VM
VCP
GHC
HS
Protection
INHB
SHC
VGLS
INLB
Control
Inputs
GLC
LS
INHC
VCC
Gate Driver
INLC
RPU
Fault Output
nFAULT
MODE
IDRIVE
VDS
VCC
GAIN
SPC
VREF
0.1 …F
AV
SNC
RSEN
SOC
SPB
Output
Offset
Bias
SOB
SOA
AV
RSEN
SNB
SPA
CAL
AV
VIN
RSEN
SNA
CB
VIN
0.1 µF
CIN
nSHDN
Buck Regulator
(LMR16006X)
BGND
SW
FB
DOUT
LOUT
RFB1
600 mA
COUT
RFB2
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Figure 16. Block Diagram for DRV8323RH
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Functional Block Diagram (continued)
VM
VM
VM
VDRAIN
VCP
VCP
1 …F
>10 …F 0.1 …F
47 nF
CPH
SHA
VGLS
CPL
DGND
1 …F
GLA
LS
VGLS
30 mA
GHA
HS
VCP
Charge
Pump
VGLS
Linear
Regulator
Gate Driver
DVDD
AGND
PGND
VM
DVDD
Linear
Regulator
VCP
GHB
HS
Power
SHB
VGLS
ENABLE
Digital
Core
GLB
LS
INHA
Gate Driver
INLA
INHB
Control
Inputs
Smart Gate
Drive
VM
VCP
GHC
HS
Protection
INLB
SHC
VGLS
INHC
GLC
LS
INLC
VCC
Gate Driver
VCC
SDI
RPU
SPI
RPU
Fault Output
nFAULT
SDO
SCLK
VCC
nSCS
SPC
AV
VREF
SOC
0.1 …F
SOB
SOA
SNC
RSEN
SPB
Output
Offset
Bias
AV
RSEN
SNB
SPA
CAL
AV
VIN
RSEN
SNA
CB
VIN
0.1 µF
nSHDN
Buck Regulator
(LMR16006X)
CIN
BGND
SW
FB
DOUT
LOUT
RFB1
600 mA
COUT
RFB2
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Figure 17. Block Diagram for DRV8323RS
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8.3 Feature Description
Table 1 lists the recommended values of the external components for the gate driver. Table 2 lists the
recommended values of the external components for the buck regulator.
Table 1. DRV832x Gate-Driver External Components
COMPONENTS
PIN 1
PIN 2
RECOMMENDED
CVM1
VM
PGND
X5R or X7R, 0.1-µF, VM-rated capacitor
CVM2
VM
PGND
≥ 10 µF, VM-rated capacitor
CVCP
VCP
VM
X5R or X7R, 16-V, 1-µF capacitor
CSW
CPH
CPL
X5R or X7R, 47-nF, VM-rated capacitor
CDVDD
DVDD
AGND
X5R or X7R, 1-µF, 6.3-V capacitor
RnFAULT
VCC (1)
nFAULT
Pullup resistor
RSDO
(1)
VCC
(1)
SDO
Pullup resistor
RIDRIVE
IDRIVE
AGND or DVDD
DRV832x hardware interface
RVDS
VDS
AGND or DVDD
DRV832x hardware interface
RMODE
MODE
AGND or DVDD
DRV832x hardware interface
RGAIN
GAIN
AGND or DVDD
DRV832x hardware interface
CVREF
VREF
AGND or DGND
Optional capacitor rated for VREF
RASENSE
SPA
SNA and PGND
Sense shunt resistor
RBSENSE
SPB
SNB and PGND
Sense shunt resistor
RCSENSE
SPC
SNC and PGND
Sense shunt resistor
The VCC pin is not a pin on the DRV832x family of devices, but a VCC supply voltage pullup is required for the open-drain output
nFAULT and SDO. These pins can also be pulled up to DVDD.
Table 2. DRV832xR Buck Regulator External Components
(1)
COMPONENT
PIN 1
PIN 2
RECOMMENDED
CVIN
VIN
BGND
X5R or X7R, 1 to 10 µF, VM-rated capacitor
CBOOT
SW
CB
X5R or X7R, 0.1-µF, 16-V capacitor
DSW
SW
BGND
Schottky diode
LSW
SW
OUT (1)
Output inductor
COUT
OUT (1)
BGND
X5R or X7R, OUT rated capacitor
RFB1
OUT
(1)
RFB2
FB
FB
BGND
Resistor divider to set buck output voltage
The OUT pin is not a pin on the DRV8320R and DRV8323R devices, but is the regulated output voltage of the buck regulator after the
output inductor.
8.3.1 Three Phase Smart Gate Drivers
The DRV832x family of devices integrates three, half-bridge gate drivers, each capable of driving high-side and
low-side N-channel power MOSFETs. A doubler charge pump provides the proper gate bias voltage to the highside MOSFET across a wide operating voltage range in addition to providing 100% duty-cycle support. An
internal linear regulator provides the gate-bias voltage for the low-side MOSFETs. The half-bridge gate drivers
can be used in combination to drive a three-phase motor or separately to drive other types of loads.
The DRV832x family of devices implements a smart gate-drive architecture which allows the user to dynamically
adjust the gate drive current without requiring external gate current limiting resistors. Additionally, this
architecture provides a variety of protection features for the external MOSFETs including automatic dead-time
insertion, parasitic dV/dt gate turnon prevention, and gate-fault detection.
8.3.1.1 PWM Control Modes
The DRV832x family of devices provides four different PWM control modes to support various commutation and
control methods. Texas Instruments does not recommend changing the MODE pin or PWM_MODE register
during operation of the power MOSFETs. Set all INHx and INLx pins to logic low before making a MODE or
PWM_MODE change.
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8.3.1.1.1 6x PWM Mode (PWM_MODE = 00b or MODE Pin Tied to AGND)
In this mode, each half-bridge supports three output states: low, high, or high-impedance (Hi-Z). The
corresponding INHx and INLx signals control the output state as listed in Table 3.
Table 3. 6x PWM Mode Truth Table
INLx
INHx
GLx
GHx
SHx
0
0
L
L
Hi-Z
0
1
L
H
H
1
0
H
L
L
1
1
L
L
Hi-Z
8.3.1.1.2 3x PWM Mode (PWM_MODE = 01b or MODE Pin = 47 kΩ to AGND)
In this mode, the INHx pin controls each half-bridge and supports two output states: low or high. The INLx pin is
used to change the half-bridge to high impedance. If the high-impedance (Hi-Z) sate is not required, tie all INLx
pins logic high. The corresponding INHx and INLx signals control the output state as listed in Table 4.
Table 4. 3x PWM Mode Truth Table
INLx
INHx
GLx
GHx
SHx
0
X
L
L
Hi-Z
1
0
H
L
L
1
1
L
H
H
8.3.1.1.3 1x PWM Mode (PWM_MODE = 10b or MODE Pin = Hi-Z)
In this mode, the DRV832x family of devices uses 6-step block commutation tables that are stored internally.
This feature allows for a three-phase BLDC motor to be controlled using a single PWM sourced from a simple
controller. The PWM is applied on the INHA pin and determines the output frequency and duty cycle of the halfbridges.
The half-bridge output states are managed by the INLA, INHB, and INLB pins which are used as state logic
inputs. The state inputs can be controlled by an external controller or connected directly to hall sensor digital
outputs from the motor (INLA = HALL_A, INHB = HALL_B, INLB = HALL_C). The 1x PWM mode normally
operates with synchronous rectification, however it can be configured to use asynchronous diode freewheeling
rectification on SPI devices. This configuration is set using the 1PWM_COM bit through the SPI registers.
The INHC input controls the direction through the 6-step commutation table which is used to change the direction
of the motor when hall sensors are directly controlling the INLA, INHB, and INLB state inputs. Tie the INHC pin
low if this feature is not required.
The INLC input brakes the motor by turning off all high-side MOSFETs and turning on all low-side MOSFETs
when it is pulled low. This brake is independent of the states of the other input pins. Tie the INLC pin high if this
feature is not required.
Table 5. Synchronous 1x PWM Mode
LOGIC AND HALL INPUTS
STATE
INHC = 0
GATE-DRIVE OUTPUTS
INHC = 1
PHASE A
INLA
INHB
INLB
INLA
INHB
INLB
GHA
PHASE B
GLA
GHB
PHASE C
GLB
GHC
GLC
DESCRIPTION
Stop
0
0
0
0
0
0
L
L
L
L
L
L
Stop
Align
1
1
1
1
1
1
PWM
!PWM
L
H
L
H
Align
1
1
1
0
0
0
1
L
L
PWM
!PWM
L
H
B→C
2
1
0
0
0
1
1
PWM
!PWM
L
L
L
H
A→C
3
1
0
1
0
1
0
PWM
!PWM
L
H
L
L
A→B
4
0
0
1
1
1
0
L
L
L
H
PWM
!PWM
C→B
5
0
1
1
1
0
0
L
H
L
L
PWM
!PWM
C→A
6
0
1
0
1
0
1
L
H
PWM
!PWM
L
L
B→A
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Table 6. Asynchronous 1x PWM Mode 1PWM_COM = 1 (SPI Only)
LOGIC AND HALL INPUTS
INHC = 0
STATE
GATE-DRIVE OUTPUTS
INHC = 1
PHASE A
INLA
INHB
INLB
INLA
INHB
INLB
PHASE B
GHA
GLA
GHB
PHASE C
GLB
GHC
GLC
DESCRIPTION
Stop
0
0
0
0
0
0
L
L
L
L
L
L
Stop
Align
1
1
1
1
1
1
PWM
L
L
H
L
H
Align
1
1
1
0
0
0
1
L
L
PWM
L
L
H
B→C
2
1
0
0
0
1
1
PWM
L
L
L
L
H
A→C
3
1
0
1
0
1
0
PWM
L
L
H
L
L
A→B
4
0
0
1
1
1
0
L
L
L
H
PWM
L
C→B
5
0
1
1
1
0
0
L
H
L
L
PWM
L
C→A
6
0
1
0
1
0
1
L
H
PWM
L
L
L
B→A
Figure 18 and Figure 19 show the different possible configurations in 1x PWM mode.
MCU_PWM
MCU_GPIO
MCU_GPIO
INHA
INLA
INHB
INLB
MCU_GPIO
MCU_GPIO
MCU_GPIO
INHC
INLC
INHA
MCU_PWM
PWM
INLA
STATE0
INHB
STATE1
INLB
BLDC Motor
STATE2
INHC
MCU_GPIO
DIR
INLC
MCU_GPIO
PWM
H
STATE0
STATE1
H
BLDC Motor
STATE2
H
DIR
nBRAKE
nBRAKE
Figure 18. 1x PWM—Simple Controller
Figure 19. 1x PWM—Hall Sensor
8.3.1.1.4 Independent PWM Mode (PWM_MODE = 11b or MODE Pin Tied to DVDD)
In this mode, the corresponding input pin independently controls each high-side and low-side gate driver. This
control mode allows for the DRV832x family of devices to drive separate high-side and low-side loads with each
half-bridge. These types of loads include unidirectional brushed DC motors, solenoids, and low-side and highside switches. In this mode, if the system is configured in a half-bridge configuration, simultaneously turning on
both the high-side and low-side MOSFETs causes shoot-through.
Table 7. Independent PWM Mode Truth Table
30
INLx
INHx
GLx
GHx
0
0
L
L
0
1
L
H
1
0
H
L
1
1
H
H
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Because the high-side and low-side VDS overcurrent monitors share the SHx sense line, using the monitors if
both the high-side and low-side gate drivers of one half-bridge are split and being used is not possible. In this
case, connect the SHx pin to the high-side driver and disable the VDS overcurrent monitors as shown in
Figure 20.
Disable
VDS
+
±
VM
VDRAIN
VCP
GHx
HS
INHx
Load
SHx
VGLS
INLx
GLx
LS
Load
SLx/SPx
Gate Driver
Disable
VDS
+
±
Figure 20. Independent PWM High-Side and Low-Side Drivers
If the half-bridge is used to implement only a high-side or low-side driver, using the VDS overcurrent monitors is
still possible. Connect the SHx pin as shown in Figure 21 or Figure 22. The unused gate driver and the
corresponding input can be left disconnected.
VDS
+
±
VDS
VM
+
±
VCP
VCP
INHx
GHx
HS
INHx
GHx
HS
VGLS
INLx
GLx
LS
Load
SLx/SPx
Gate Driver
Load
SHx
SHx
INLx
VM
VDRAIN
VDRAIN
VGLS
GLx
LS
SLx/SPx
Gate Driver
+
VDS ±
+
VDS ±
Figure 21. Single High-Side Driver
Figure 22. Single Low-Side Driver
8.3.1.2 Device Interface Modes
The DRV832x family of devices supports two different interface modes (SPI and hardware) to allow the end
application to design for either flexibility or simplicity. The two interface modes share the same four pins, allowing
the different versions to be pin to pin compatible. This allows for application designers to evaluate with one
interface version and potentially switch to another with minimal modifications to their design.
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8.3.1.2.1 Serial Peripheral Interface (SPI)
The SPI devices support a serial communication bus that allows for an external controller to send and receive
data with the DRV832x. This allows for the external controller to configure device settings and read detailed fault
information. The interface is a four wire interface utilizing the SCLK, SDI, SDO, and nSCS pins.
•
•
•
•
The SCLK pin is an input which accepts a clock signal to determine when data is captured and propagated on
SDI and SDO.
The SDI pin is the data input.
The SDO pin is the data output. The SDO pin uses an open-drain structure and requires an external pullup
resistor.
The nSCS pin is the chip select input. A logic low signal on this pin enables SPI communication with the
DRV832x.
For more information on the SPI, see the SPI Communication section.
8.3.1.2.2 Hardware Interface
Hardware interface devices convert the four SPI pins into four resistor configurable inputs, GAIN, IDRIVE,
MODE, and VDS. This allows for the application designer to configure the most commonly used device settings
by tying the pin logic high or logic low, or with a simple pullup or pulldown resistor. This removes the requirement
for an SPI bus from the external controller. General fault information can still be obtained through the nFAULT
pin.
•
•
•
•
The
The
The
The
GAIN pin configures the current shunt amplifier gain.
IDRIVE pin configures the gate drive current strength.
MODE pin configures the PWM control mode.
VDS pin configures the voltage threshold of the VDS overcurrent monitors.
For more information on the hardware interface, see the Pin Diagrams section.
DVDD
RGAIN
SCLK
SPI
Interface
DVDD
GAIN
DVDD
Hardware
Interface
DVDD
SDI
IDRIVE
VCC
RPU
DVDD
SDO
MODE
DVDD
nSCS
VDS
RVDS
Figure 23. SPI
Figure 24. Hardware Interface
8.3.1.3 Gate Driver Voltage Supplies
The high-side gate-drive voltage supply is created using a doubler charge pump that operates from the VM
voltage supply input. The charge pump allows the gate driver to properly bias the high-side MOSFET gate with
respect to the source across a wide input supply voltage range. The charge pump is regulated to maintain a fixed
output voltage of VVM + 11 V and supports an average output current of 25 mA. When VVM is less than 12 V, the
charge pump operates in full doubler mode and generates VVCP = 2 × VVM – 1.5 V when unloaded. The charge
pump is continuously monitored for undervoltage to prevent under-driven MOSFET conditions. The charge pump
requires a X5R or X7R, 1-µF, 16-V ceramic capacitor between the VM and VCP pins to act as the storage
capacitor. Additionally, a X5R or X7R, 47-nF, VM-rated ceramic capacitor is required between the CPH and CPL
pins to act as the flying capacitor.
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VM
VM
1 …F
VCP
CPH
VM
47 nF
Charge
Pump
Control
CPL
Figure 25. Charge Pump Architecture
The low-side gate drive voltage is created using a linear regulator that operates from the VM voltage supply
input. The linear regulator allows the gate driver to properly bias the low-side MOSFET gate with respect to
ground. The linear regulator output is fixed at 11 V and supports an output current of 25 mA.
8.3.1.4 Smart Gate Drive Architecture
The DRV832x gate drivers use an adjustable, complimentary, push-pull topology for both the high-side and lowside drivers. This topology allows for both a strong pullup and pulldown of the external MOSFET gates.
Additionally, the gate drivers use a smart gate-drive architecture to provide additional control of the external
power MOSFETs, take additional steps to protect the MOSFETs, and allow for optimal tradeoffs between
efficiency and robustness. This architecture is implemented through two components called IDRIVE and TDRIVE
which are detailed in the IDRIVE: MOSFET Slew-Rate Control section and TDRIVE: MOSFET Gate Drive
Control section. Figure 26 shows the high-level functional block diagram of the gate driver.
The IDRIVE gate-drive current and TDRIVE gate-drive time should be initially selected based on the parameters
of the external power MOSFET used in the system and the desired rise and fall times (see the Application and
Implementation section).
The high-side gate driver also implements a Zener clamp diode to help protect the external MOSFET gate from
overvoltage conditions in the case of external short-circuit events on the MOSFET.
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VCP
INHx
INLx
VM
Control
Inputs
GHx
Level
Shifters
150 k
SHx
VGS
+
±
VGLS
Digital
Core
GLx
Level
Shifters
150 k
SLx/SPx
VGS
+
±
PGND
Figure 26. Gate Driver Block Diagram
8.3.1.4.1 IDRIVE: MOSFET Slew-Rate Control
The IDRIVE component implements adjustable gate-drive current to control the MOSFET VDS slew rates. The
MOSFET VDS slew rates are a critical factor for optimizing radiated emissions, energy and duration of diode
recovery spikes, dV/dt gate turnon leading to shoot-through, and switching voltage transients related to parasitics
in the external half-bridge. IDRIVE operates on the principal that the MOSFET VDS slew rates are predominately
determined by the rate of gate charge (or gate current) delivered during the MOSFET QGD or Miller charging
region. By allowing the gate driver to adjust the gate current, it can effectively control the slew rate of the external
power MOSFETs.
IDRIVE allows the DRV832x family of devices to dynamically switch between gate drive currents either through a
register setting on SPI devices or the IDRIVE pin on hardware interface devices. The SPI devices provide 16
IDRIVE settings ranging between 10-mA to 1-A source and 20-mA to 2-A sink. Hardware interface devices
provides 7 IDRIVE settings between the same ranges. The gate drive current setting is delivered to the gate during
the turnon and turnoff of the external power MOSFET for the tDRIVE duration. After the MOSFET turnon or turnoff,
the gate driver switches to a smaller hold IHOLD current to improve the gate driver efficiency. Additional details on
the IDRIVE settings are described in the Register Maps section for the SPI devices and in the Pin Diagrams
section for the hardware interface devices.
8.3.1.4.2 TDRIVE: MOSFET Gate Drive Control
The TDRIVE component is an integrated gate-drive state machine that provides automatic dead time insertion
through switching handshaking, parasitic dV/dt gate turnon prevention, and MOSFET gate-fault detection.
The first component of the TDRIVE state machine is automatic dead-time insertion. Dead time is period of time
between the switching of the external high-side and low-side MOSFETs to ensure that they do not cross conduct
and cause shoot-through. The DRV832x family of devices uses VGS voltage monitors to measure the MOSFET
gate-to-source voltage and determine the proper time to switch instead of relying on a fixed time value. This
feature allows the gate-driver dead time to adjust for variation in the system such a temperature drift and
variation in the MOSFET parameters. An additional digital dead time (tDEAD) can be inserted and is adjustable
through the registers on SPI devices.
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The second component focuses on parasitic dV/dt gate turnon prevention. To implement this, the TDRIVE state
machine enables a strong pulldown ISTRONG current on the opposite MOSFET gate whenever a MOSFET is
switching. The strong pulldown last for the TDRIVE duration. This feature helps remove parasitic charge that
couples into the MOSFET gate when the half-bridge switch-node voltage slews rapidly.
The third component implements a gate-fault detection scheme to detect pin-to-pin solder defects, a MOSFET
gate failure, or a MOSFET gate stuck-high or stuck-low voltage condition. This implementation is done with a pair
of VGS gate-to-source voltage monitors for each half-bridge gate driver. When the gate driver receives a
command to change the state of the half-bridge it begins to monitor the gate voltage of the external MOSFET. If
at the end of the tDRIVE period the VGS voltage has not reached the proper threshold the gate driver will report a
fault. To ensure that a false fault is not detected, a tDRIVE time should be selected that is longer than the time
required to charge or discharge the MOSFET gate. The tDRIVE time does not increase the PWM time and will
terminate if another PWM command is received while active. Additional details on the TDRIVE settings are
described in the Register Maps section for SPI devices and in the Pin Diagrams section for hardware interface
devices.
Figure 27 shows an example of the TDRIVE state machine in operation.
VINHx
VINLx
VGHx
tDEAD
IHOLD
IDRIVE
IHOLD
tDEAD
ISTRONG
IHOLD
ISTRONG
IHOLD
IGHx
IDRIVE
tDRIVE
IHOLD
tDRIVE
VGLx
tDEAD
IHOLD
ISTRONG
tDEAD
IHOLD
IDRIVE
IHOLD
ISTRONG
IHOLD
IGLx
IDRIVE
tDRIVE
IHOLD
tDRIVE
Figure 27. TDRIVE State Machine
8.3.1.4.3 Propagation Delay
The propagation delay time (tpd) is measured as the time between an input logic edge to a detected output
change. This time comprises three parts consisting of the digital input deglitcher delay, the digital propagation
delay, and the delay through the analog gate drivers.
The input deglitcher prevents high-frequency noise on the input pins from affecting the output state of the gate
drivers. To support multiple control modes and dead time insertion, a small digital delay is added as the input
command propagates through the device. Lastly, the analog gate drivers have a small delay that contributes to
the overall propagation delay of the device.
8.3.1.4.4 MOSFET VDS Monitors
The gate drivers implement adjustable VDS voltage monitors to detect overcurrent or short-circuit conditions on
the external power MOSFETs. When the monitored voltage is greater than the VDS trip point (VVDS_OCP) for
longer than the deglitch time (tOCP), an overcurrent condition is detected and action is taken according to the
device VDS fault mode.
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The high-side VDS monitors measure the voltage between the VDRAIN and SHx pins. In devices with three
current-shunt amplifiers (DRV8323 and DRV8323R), the low-side VDS monitors measure the voltage between the
SHx and SPx pins. If the current shunt amplifier is unused, tie the SP pins to the common ground point of the
external half-bridges. On device options without the current shunt amplifiers (DRV8320 and DRV8320R) the lowside VDS monitor measures between the SHx and SLx pins.
For the SPI devices, the low-side VDS monitor reference point can be changed between the SPx and SNx pins if
desired with the LS_REF register setting.
The VVDS_OCP threshold is programmable between 0.06 V and 1.88 V. Additional information on the VDS monitor
levels are described in the Register Maps section for SPI devices and in the Pin Diagrams section hardware
interface device.
VM
VM
VDS
VDS
+
±
+
±
VDS
VVDS_OCP
VDS
VVDS_OCP
VDRAIN
+
±
VDS
+
±
GHx
+
VDS
±
VVDS_OCP
SHx
+
±
VDS
GLx
+
±
VDRAIN
VDS
VVDS_OCP
GHx
SHx
+
±
GLx
SPx
SLx
0
1
PGND
LS_REF
(SPI Only)
SNx
RSENSE
PGND
Figure 28. DRV8320 and DRV8320R VDS Monitors
Figure 29. DRV8323 and DRV8323R VDS Monitors
8.3.1.4.5 VDRAIN Sense Pin
The DRV832x family of devices provides a separate sense pin for the common point of the high-side MOSFET
drain. This pin is called VDRAIN. This pin allows the sense line for the overcurrent monitors (VDRAIN) and the
power supply (VM) to remain separate and prevent noise on the VDRAIN sense line. This separation also allows
for a small filter to be implemented on the gate driver supply (VM) or to insert a boost converter to support lower
voltage operation if desired. Care must still be taken when the filter or separate supply is designed because VM
is still the reference point for the VCP charge pump that supplies the high-side gate drive voltage (VGSH). The VM
supply must not drift to far from the VDRAIN supply to avoid violating the VGS voltage specification of the external
power MOSFETs.
8.3.2 DVDD Linear Voltage Regulator
A 3.3-V, 30-mA linear regulator is integrated into the DRV832x family of devices and is available for use by
external circuitry. This regulator can provide the supply voltage for a low-power microcontroller or other lowcurrent supporting circuitry. The output of the DVDD regulator should be bypassed near the DVDD pin with a
X5R or X7R, 1-µF, 6.3-V ceramic capacitor routed directly back to the adjacent AGND ground pin.
The DVDD nominal, no-load output voltage is 3.3 V. When the DVDD load current exceeds 30 mA, the regulator
functions like a constant-current source. The output voltage drops significantly with a current load greater than 30
mA.
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VM
REF
+
±
DVDD
3.3 V, 30 mA
0.1 …F
AGND
Figure 30. DVDD Linear Regulator Block Diagram
Use Equation 1 to calculate the power dissipated in the device because of the DVDD linear regulator.
P
VVM VDVDD u IDVDD
(1)
For example, at VVM = 24 V, drawing 20 mA out of DVDD results in a power dissipation as shown in Equation 2.
P 24 V 3.3 V u 20 mA 414 mW
(2)
8.3.3 Pin Diagrams
Figure 31 shows the input structure for the logic-level pins, INHx, INLx, CAL, ENABLE, nSCS, SCLK, and SDI.
The input can be driven with a voltage or external resistor.
DVDD
STATE
RESISTANCE
INPUT
VIH
Tied to DVDD
Logic High
VIL
Tied to AGND
Logic Low
100 k
Figure 31. Logic-Level Input Pin Structure
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Figure 32 shows the structure of the four level input pins, MODE and GAIN, on hardware interface devices. The
input can be set with an external resistor.
MODE
GAIN
Independent
40 V/V
1x PWM
20V/V
3x PWM
10 V/V
6x PWM
5 V/V
DVDD
STATE
RESISTANCE
DVDD
+
VI4
Tied to DVDD
VI3
Hi-Z (>500 kŸ WR
AGND)
VI2
47 NŸ “5%
to AGND
VI1
Tied to AGND
50 k
84 k
±
+
±
+
±
Figure 32. Four Level Input Pin Structure
Figure 33 shows the structure of the seven level input pins, IDRIVE and VDS, on hardware interface devices.
The input can be set with an external resistor.
IDRIVE
VDS
1/2 A
Disabled
570/1140 mA
1.88 V
260/520 mA
1.13 V
120/240 mA
0.60 V
60/120 mA
0.26 V
30/60 mA
0.13 V
10/20 mA
0.06 V
+
STATE
RESISTANCE
VI7
Tied to DVDD
VI6
18 k ± 5%
to DVDD
VI5
75 k ± 5%
to DVDD
VI4
Hi-Z (>500 kŸ
to AGND)
VI3
75 k ± 5%
to AGND
VI2
18 NŸ “5%
to AGND
VI1
±
DVDD
DVDD
+
±
73 k
+
±
73 k
+
±
+
Tied to AGND
±
+
±
Figure 33. Seven Level Input Pin Structure
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Figure 34 shows the structure of the open-drain output pins nFAULT and SDO. The open-drain output requires
an external pullup resistor to function properly.
DVDD
RPU
STATE
STATUS
No Fault
Inactive
OUTPUT
Fault
Active
Active
Inactive
Figure 34. Open-Drain Output Pin Structure
8.3.4 Low-Side Current-Shunt Amplifiers (DRV8323 and DRV8323R Only)
The DRV8323 and DRV8323R integrate three, high-performance low-side current-shunt amplifiers for current
measurements using low-side shunt resistors in the external half-bridges. Low-side current measurements are
commonly used to implement overcurrent protection, external torque control, or brushless DC commutation with
the external controller. All three amplifiers can be used to sense the current in each of the half-bridge legs or one
amplifier can be used to sense the sum of the half-bridge legs. The current shunt amplifiers include features such
as programmable gain, offset calibration, unidirectional and bidirectional support, and a voltage reference pin
(VREF).
8.3.4.1 Bidirectional Current Sense Operation
The SOx pin on the DRV8323 and DRV8323R outputs an analog voltage equal to the voltage across the SPx
and SNx pins multiplied by the gain setting (GCSA). The gain setting is adjustable between four different levels (5
V/V, 10 V/V, 20 V/V, and 40 V/V). Use Equation 3 to calculate the current through the shunt resistor.
VVREF
VSOx
2
I
GCSA u RSENSE
(3)
R2
R3
R4
R5
R6
SOx
I
R1
VCC
±
VREF
+
0.1 …F
R2
SPx
R1
RSENSE
SNx
½
+
R3
±
R4
R5
Figure 35. Bidirectional Current-Sense Configuration
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SO (V)
VREF
VVREF / 2
VLINEAR
SP ± SN (V)
Figure 36. Bidirectional Current-Sense Output
I
SP
SO
R
AV
SN
SO
VREF
SP ± SN
±0.3 V
VVREF ± 0.25 V
±I × R
VSO(range±)
VSO(off)max
VVREF / 2
VOFF,
VDRIFT
0V
VSO(off)min
VSO(range+)
0.25 V
I×R
0.3 V
0V
Figure 37. Bidirectional Current Sense Regions
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8.3.4.2 Unidirectional Current Sense Operation (SPI only)
On the DRV8323 and DRV8323R SPI devices, use the VREF_DIV bit to remove the VREF divider. In this case
the shunt amplifier operates unidirectionally and SOx outputs an analog voltage equal to the voltage across the
SPx and SNx pins multiplied by the gain setting (GCSA). Use Equation 4 to calculate the current through the shunt
resistor.
VVREF VSOx
I
GCSA u RSENSE
(4)
R2
R3
R4
R5
R6
SOx
I
R1
±
+
SPx
R1
RSENSE
SNx
VCC
R2
VREF
+
0.1 …F
R3
±
R4
R5
Figure 38. Unidirectional Current-Sense Configuration
SO (V)
VREF
VVREF ± 0.3 V
VLINEAR
SP ± SN (V)
Figure 39. Unidirectional Current-Sense Output
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I
SP
SO
R
AV
SN
SO
VREF
VVREF ± 0.25 V
VSO(off)max
VOFF,
VVREF ± 0.3 V
VDRIFT
SP ± SN
0V
VSO(off)min
VSO(range)
I×R
0.3 V
0.25 V
0V
Figure 40. Unidirectional Current-Sense Regions
8.3.4.3 Auto Offset Calibration
To minimize DC offset, the DRV8323 and DRV8323R devices can perform an automatic offset calibration
through the SPI registers (CSA_CAL_X) or CAL pin. When the calibration is enabled, the inputs to the amplifier
are shorted, the load disconnected, and the gain (GCSA) of the amplifier changed to the 40 V/V setting. The
amplifier then goes through an automatic trim routine to minimize the input offset. The automatic trim routine
requires 100 µs to complete after the calibration is enabled. After this time, the inputs of the amplifier remain
shorted, the load disconnected, and the gain at 40 V/V if further offset calibration is desired to be done by the
external controller. To complete the offset calibration, the CSA_CAL_X registers or CAL pin should be taken
back low. For the best results, perform offset calibration when the external MOSFETS are not switching to
reduce the potential noise impact to the amplifier.
8.3.4.4 MOSFET VDS Sense Mode (SPI Only)
The current-sense amplifiers on the DRV8323 and DRV8323R SPI devices can be configured to amplify the
voltage across the external low-side MOSFET VDS. This allows for the external controller to measure the voltage
drop across the MOSFET RDS(on) without the shunt resistor and then calculate the half-bridge current level.
To enable this mode set the CSA_FET bit to 1. The positive input of the amplifier is then internally connected to
the SHx pin with an internal clamp to prevent high voltage on the SHx pin from damaging the sense amplifier
inputs. During this mode of operation, the SPx pins should be left disconnected. When the CSA_FET bit is set to
1, the negative reference for the low-side VDS monitor is automatically set to SNx, regardless of the state of the
LS_REF bit state. This setting is implemented to prevent disabling of the low-side VDS monitor.
If the system operates in MOSFET VDS sensing mode, route the SHx and SNx pins with Kelvin connections
across the drain and source of the external low-side MOSFETs.
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VM
VM
VDRAIN
High-Side
VDS
VDRAIN
High-Side
VDS Monitor
VDS Monitor
+
±
VDS
+
±
GHx
GHx
(SPI only)
(SPI only)
CSA_FET = 0
CSA_FET = 1
SHx
LS_REF = 0
LS_REF = X
Low-Side
Low-Side
VDS Monitor
VDS Monitor
VDS
SHx
+
±
VDS
GLx
+
±
GLx
0
0
1
1
10 k
10 k
10 k
SPx
SOx
10 k
SPx
10 k
SNx
SOx
RSENSE
AV
10 k
AV
SNx
GND
GND
Figure 41. Resistor Sense Configuration
Figure 42. VDS Sense Configuration
When operating in MOSFET VDS sense mode, the amplifier is enabled at the end of the tDRIVE time. At this time,
the amplifier input is connected to the SHx pin, and the SOx output is valid. When the low-side MOSFET
receives a signal to turn off, the amplifier inputs, SPx and SNx, are shorted together internally.
8.3.5 Step-Down Buck Regulator
The DRV8320R and DRV8323R have an integrated buck regulator (LMR16006) to supply power for an external
controller or system voltage rail. The LMR16006 device is a 60-V, 600-mA, buck (step-down) regulator.
The buck regulator has a very-low quiescent current during light loads to prolong battery life. The LMR16006
device improves performance during line and load transients by implementing a constant-frequency current-mode
control scheme which requires less output capacitance and simplifies frequency compensation design. The
LMR160006 is the LMR16006X device version that uses a 0.7-MHz switching frequency.
The LMR16006 device reduces the external component count by integrating the bootstrap recharge diode. The
bias voltage for the integrated high-side MOSFET is supplied by a capacitor on the CB to SW pin. The bootstrap
capacitor voltage is monitored by a UVLO circuit and turns off the high-side MOSFET when the boot voltage falls
below a preset threshold.
The LMR16006 device can operate at high duty cycles because of the boot UVLO and then refreshs the wimp
MOSFET. The output voltage can be stepped down to as low as the 0.8-V reference. The internal soft-start
feature minimizes inrush currents.
For additional details and design information refer to LMR16006 SIMPLE SWITCHER® 60 V 0.6 A Buck
Regulators With High Efficiency Eco-mode.
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8.3.5.1 Fixed Frequency PWM Control
The LMR16006 device has a fixed switching frequency and implements peak current-mode control. The output
voltage is compared through external resistors on the FB pin to an internal voltage reference by an error amplifier
which drives the internal COMP node. An internal oscillator initiates the turnon of the high-side power switch. The
error amplifier output is compared to the high-side power switch current. When the power switch current reaches
the level set by the internal COMP voltage, the power switch turns off. The internal COMP node voltage
increases and decreases as the output current increases and decreases. The device implements a current limit
by clamping the COMP node voltage to a maximum level.
8.3.5.2 Bootstrap Voltage (CB)
The LMR16006 device has an integrated bootstrap regulator, and requires a small ceramic capacitor between
the CB and SW pins to provide the gate drive voltage for the high-side MOSFET. The CB capacitor is refreshed
when the high-side MOSFET is off and the low-side diode conducts. To improve dropout, the LMR16006 device
is designed to operate at 100% duty cycle as long as the CB to SW pin voltage is greater than 3 V. When the
voltage from the CB to SW pin drops below 3 V, the high-side MOSFET turns off using a UVLO circuit which
allows the low-side diode to conduct and refresh the charge on the CB capacitor. Because the supply current
sourced from the CB capacitor is low, the high-side MOSFET can remain on for more switching cycles than are
required to refresh the capacitor. Therefore, the effective duty cycle of the switching regulator is high. Attention
must be taken in maximum duty-cycle applications with a light load. To ensure the SW pin can be pulled to
ground to refresh the CB capacitor, an internal circuit charges the CB capacitor when the load is light or the
device is working in dropout condition.
8.3.5.3 Output Voltage Setting
The output voltage is set using the feedback pin (FB) and a resistor divider connected to the output as shown in
the Figure 51 section. The voltage of the feedback pin is 0.765 V, so the ratio of the feedback resistors sets the
output voltage according to Equation 5.
§ ª R1 º ·
VO 0.765 V u ¨ 1 « » ¸
© ¬ R2 ¼ ¹
(5)
Typically the starting value of R2 is from 1 kΩ to 100 kΩ. Use Equation 6 to calculate the value of R1.
§ ª VO º ·
R1 R2 u ¨ «
» 1¸
© ¬ 0.765 V ¼ ¹
(6)
8.3.5.4 Enable nSHDN and VIN Undervoltage Lockout
The nSHDN pin of the LMR16006 device is a high-voltage tolerant input with an internal pullup circuit. The
device can be enabled even if the nSHDN pin is floating. The regulator can also be turned on using 1.23-V or
higher logic signals. If the use of a higher voltage is desired because of system or other constraints, a 100-kΩ or
larger value resistor is recommended between the applied voltage and the nSHDN pin to help protect the device.
When the nSHDN pin is pulled down to 0 V, the device turns off and enters the lowest shutdown current mode.
In shutdown mode the supply current decreases to approximately 1 µA. If the shutdown function is unused, the
nSHDN pin can be tied to the VIN pin with a 100-kΩ resistor. The maximum voltage to the nSHDN pin should not
exceed 60 V. The LMR16006 device has an internal UVLO circuit to shut down the output if the input voltage
falls below an internally-fixed UVLO-threshold level which ensures that the regulator is not latched into an
unknown state during low input voltage conditions. The regulator powers up when the input voltage exceeds the
voltage level. If the UVLO voltage must be higher, use the nSHDN pin to adjust the system UVLO by using
external resistors.
8.3.5.5 Current Limit
The LMR16006 device implements current mode control which uses the internal COMP voltage to turn off the
high-side MOSFET on a cycle-by-cycle basis. Each cycle, the switch current and internal COMP voltage are
compared. When the peak switch current intersects the COMP voltage, the high-side switch turns off. During
overcurrent conditions that pull the output voltage low, the error amplifier responds by driving the COMP node
high, increasing the switch current. The error amplifier output is clamped internally, which functions as a switch
current limit.
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8.3.5.6 Overvoltage Transient Protection
The LMR16006 device incorporates an overvoltage transient protection (OVTP) circuit to minimize voltage
overshoot when recovering from output fault conditions or strong unload transients on power supply designs with
low-value output capacitance. For example, when the power supply output is overloaded, the error amplifier
compares the actual output voltage to the internal reference voltage. If the voltage of the FB pin is lower than the
internal reference voltage for a considerable time, the output of the error amplifier responds by clamping the error
amplifier output to a high voltage, therefore requesting the maximum output current. When the condition is
removed, the regulator output rises and the error amplifier output transitions to the steady-state duty cycle. In
some applications, the power-supply output voltage can respond faster than the error amplifier output can
respond which leads to the possibility of an output overshoot. The OVTP feature minimizes the output overshoot
when using a low-value output capacitor by implementing a circuit to compare the FB pin voltage to the OVTP
threshold which is 108% of the internal voltage reference. If the FB pin voltage is greater than the OVTP
threshold, the high-side MOSFET is disabled preventing current from flowing to the output and minimizing output
overshoot. When the FB voltage drops lower than the OVTP threshold, the high-side MOSFET is allowed to turn
on at the next clock cycle.
8.3.5.7 Thermal Shutdown
The device implements an internal thermal shutdown to help protect the device if the junction temperature
exceeds 170°C (typical). The thermal shutdown forces the device to stop switching when the junction
temperature exceeds the thermal trip threshold. When the junction temperature decreases below 160°C (typical),
the device reinitiates the power up sequence.
8.3.6 Gate-Driver Protective Circuits
The DRV832x family of devices is fully protected against VM undervoltage, charge pump undervoltage, MOSFET
VDS overcurrent, gate driver shorts, and overtemperature events.
Table 8. Fault Action and Response
FAULT
CONDITION
CONFIGURATION
REPORT
GATE DRIVER
LOGIC
RECOVERY
VM
undervoltage
(UVLO)
VVM < VUVLO
—
nFAULT
Hi-Z
Disabled
Automatic:
VVM > VUVLO
Charge pump
undervoltage
(CPUV)
DIS_CPUV = 0b
nFAULT
Hi-Z
Active
VVCP < VCPUV
DIS_CPUV = 1b
None
Active
Active
OCP_MODE = 00b
nFAULT
Hi-Z
Active
Latched:
CLR_FLT, ENABLE Pulse
OCP_MODE = 01b
nFAULT
Hi-Z
Active
Retry:
tRETRY
OCP_MODE = 10b
nFAULT
Active
Active
No action
OCP_MODE = 11b
None
Active
Active
No action
OCP_MODE = 00b
nFAULT
Hi-Z
Active
Latched:
CLR_FLT, ENABLE Pulse
OCP_MODE = 01b
nFAULT
Hi-Z
Active
Retry:
tRETRY
VDS overcurrent
(VDS_OCP)
VSENSE
overcurrent
(SEN_OCP)
Gate driver fault
(GDF)
VDS > VVDS_OCP
VSP > VSEN_OCP
OCP_MODE = 10b
nFAULT
Active
Active
No action
OCP_MODE = 11b or
DIS_SEN = 1b
None
Active
Active
No action
DIS_GDF = 0b
nFAULT
Hi-Z
Active
Latched:
CLR_FLT, ENABLE Pulse
DIS_GDF = 1b
None
Active
Active
No action
Gate voltage stuck > tDRIVE
Thermal
warning
(OTW)
TJ > TOTW
Thermal
shutdown
(OTSD)
TJ > TOTSD
Automatic:
VVCP > VCPUV
OTW_REP = 1b
nFAULT
Active
Active
Automatic:
TJ < TOTW – THYS
OTW_REP = 0b
None
Active
Active
No action
—
nFAULT
Hi-Z
Active
Automatic:
TJ < TOTSD – THYS
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8.3.6.1 VM Supply Undervoltage Lockout (UVLO)
If at any time the input supply voltage on the VM pin falls below the VUVLO threshold, all of the external MOSFETs
are disabled, the charge pump is disabled, and the nFAULT pin is driven low. The FAULT and VM_UVLO bits
are also latched high in the registers on SPI devices. Normal operation resumes (gate driver operation and the
nFAULT pin is released) when the VM undervoltage condition is removed. The VM_UVLO bit remains set until
cleared through the CLR_FLT bit or an ENABLE pin reset pulse (tRST).
8.3.6.2 VCP Charge-Pump Undervoltage Lockout (CPUV)
If at any time the voltage on the VCP pin (charge pump) falls below the VCPUV threshold voltage of the charge
pump, all of the external MOSFETs are disabled and the nFAULT pin is driven low. The FAULT and CPUV bits
are also latched high in the registers on SPI devices. Normal operation resumes (gate-driver operation and the
nFAULT pin is released) when the VCP undervoltage condition is removed. The CPUV bit remains set until
cleared through the CLR_FLT bit or an ENABLE pin reset pulse (tRST). Setting the DIS_CPUV bit high on the SPI
devices disables this protection feature. On hardware interface devices, the CPUV protection is always enabled.
8.3.6.3 MOSFET VDS Overcurrent Protection (VDS_OCP)
A MOSFET overcurrent event is sensed by monitoring the VDS voltage drop across the external MOSFET RDS(on).
If the voltage across an enabled MOSFET exceeds the VVDS_OCP threshold for longer than the tOCP_DEG deglitch
time, a VDS_OCP event is recognized and action is done according to the OCP_MODE. On hardware interface
devices, the VVDS_OCP threshold is set with the VDS pin, the tOCP_DEG is fixed at 4 µs, and the OCP_MODE is
configured for 4-ms automatic retry but can be disabled by tying the VDS pin to DVDD. On SPI devices, the
VVDS_OCP threshold is set through the VDS_LVL SPI register, the tOCP_DEG is set through the OCP_DEG SPI
register, and the OCP_MODE bit can operate in four different modes: VDS latched shutdown, VDS automatic retry,
VDS report only, and VDS disabled.
8.3.6.3.1 VDS Latched Shutdown (OCP_MODE = 00b)
After a VDS_OCP event in this mode, all the external MOSFETs are disabled and the nFAULT pin is driven low.
The FAULT, VDS_OCP, and corresponding MOSFET OCP bits are latched high in the SPI registers. Normal
operation resumes (gate driver operation and the nFAULT pin is released) when the VDS_OCP condition is
removed and a clear faults command is issued either through the CLR_FLT bit or an ENABLE reset pulse (tRST).
8.3.6.3.2 VDS Automatic Retry (OCP_MODE = 01b)
After a VDS_OCP event in this mode, all the external MOSFETs are disabled and the nFAULT pin is driven low.
The FAULT, VDS_OCP, and corresponding MOSFET OCP bits are latched high in the SPI registers. Normal
operation resumes automatically (gate driver operation and the nFAULT pin is released) after the tRETRY time
elapses. The FAULT, VDS_OCP, and MOSFET OCP bits remain latched until the tRETRY period expires.
8.3.6.3.3 VDS Report Only (OCP_MODE = 10b)
No protective action occurs after a VDS_OCP event in this mode. The overcurrent event is reported by driving
the nFAULT pin low and latching the FAULT, VDS_OCP, and corresponding MOSFET OCP bits high in the SPI
registers. The gate drivers continue to operate normally. The external controller manages the overcurrent
condition by acting appropriately. The reporting clears (nFAULT pin is released) when the VDS_OCP condition is
removed and a clear faults command is issued either through the CLR_FLT bit or an ENABLE reset pulse (tRST).
8.3.6.3.4 VDS Disabled (OCP_MODE = 11b)
No action occurs after a VDS_OCP event in this mode.
8.3.6.4 VSENSE Overcurrent Protection (SEN_OCP)
Half-bridge overcurrent is also monitored by sensing the voltage drop across the external current-sense resistor
with the SP pin. If at any time, the voltage on the SP input of the current-sense amplifier exceeds the VSEN_OCP
threshold for longer than the tOCP_DEG deglitch time, a SEN_OCP event is recognized and action is done
according to the OCP_MODE. On hardware interface devices, the VSENSE threshold is fixed at 1 V, tOCP_DEG is
fixed at 4 µs, and the OCP_MODE for VSENSE is fixed for 4-ms automatic retry. On SPI devices, the VSENSE
threshold is set through the SEN_LVL SPI register, the tOCP_DEG is set through the OCP_DEG SPI register, and
the OCP_MODE bit can operate in four different modes: VSENSE latched shutdown, VSENSE automatic retry,
VSENSE report only, and VSENSE disabled.
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8.3.6.4.1 VSENSE Latched Shutdown (OCP_MODE = 00b)
After a SEN_OCP event in this mode, all the external MOSFETs are disabled and the nFAULT pin is driven low.
The FAULT and SEN_OCP bits are latched high in the SPI registers. Normal operation resumes (gate driver
operation and the nFAULT pin is released) when the SEN_OCP condition is removed and a clear faults
command is issued either through the CLR_FLT bit or an ENABLE reset pulse (tRST).
8.3.6.4.2 VSENSE Automatic Retry (OCP_MODE = 01b)
After a SEN_OCP event in this mode, all the external MOSFETs are disabled and the nFAULT pin is driven low.
The FAULT, SEN_OCP, and corresponding sense OCP bits are latched high in the SPI registers. Normal
operation resumes automatically (gate driver operation and the nFAULT pin is released) after the tRETRY time
elapses. The FAULT , SEN_OCP, and sense OCP bits remain latched until the tRETRY period expires.
8.3.6.4.3 VSENSE Report Only (OCP_MODE = 10b)
No protective action occurs after a SEN_OCP event in this mode. The overcurrent event is reported by driving
the nFAULT pin low and latching the FAULT and SEN_OCP bits high in the SPI registers. The gate drivers
continue to operate. The external controller manages the overcurrent condition by acting appropriately. The
reporting clears (nFAULT released) when the SEN_OCP condition is removed and a clear faults command is
issued either through the CLR_FLT bit or an ENABLE reset pulse (tRST).
8.3.6.4.4 VSENSE Disabled (OCP_MODE = 11b or DIS_SEN = 1b)
No action occurs after a SEN_OCP event in this mode. The SEN_OCP bit can be disabled independently of the
VDS_OCP bit by using the DIS_SEN SPI register.
8.3.6.5 Gate Driver Fault (GDF)
The GHx and GLx pins are monitored such that if the voltage on the external MOSFET gate does not increase or
decrease after the tDRIVE time, a gate driver fault is detected. This fault may be encountered if the GHx or GLx
pins are shorted to the PGND, SHx, or VM pins. Additionally, a gate driver fault may be encountered if the
selected IDRIVE setting is not sufficient to turn on the external MOSFET within the tDRIVE period. After a gate drive
fault is detected, all external MOSFETs are disabled and the nFAULT pin driven low. In addition, the FAULT,
GDF, and corresponding VGS bits are latched high in the SPI registers. Normal operation resumes (gate driver
operation and the nFAULT pin is released) when the gate driver fault condition is removed and a clear faults
command is issued either through the CLR_FLT bit or an ENABLE reset pulse (tRST). On SPI devices, setting the
DIS_GDF_UVLO bit high disables this protection feature.
Gate driver faults can indicate that the selected IDRIVE or tDRIVE settings are too low to slew the external MOSFET
in the desired time. Increasing either the IDRIVE or tDRIVE setting can resolve gate driver faults in these cases.
Alternatively, if a gate-to-source short occurs on the external MOSFET, a gate driver fault is reported because of
the MOSFET gate not turning on.
8.3.6.6 Thermal Warning (OTW)
If the die temperature exceeds the trip point of the thermal warning (TOTW), the OTW bit is set in the registers of
SPI devices. The device performs no additional action and continues to function. When the die temperature falls
below the hysteresis point of the thermal warning, the OTW bit clears automatically. The OTW bit can also be
configured to report on the nFAULT pin by setting the OTW_REP bit to 1 through the SPI registers.
8.3.6.7 Thermal Shutdown (OTSD)
If the die temperature exceeds the trip point of the thermal shutdown limit (TOTSD), all the external MOSFETs are
disabled, the charge pump is shut down, and the nFAULT pin is driven low. In addition, the FAULT and TSD bits
are latched high. Normal operation resumes (gate driver operation and the nFAULT pin is released) when the
overtemperature condition is removed. The TSD bit remains latched high indicating that a thermal event occurred
until a clear fault command is issued either through the CLR_FLT bit or an ENABLE reset pulse (tRST). This
protection feature cannot be disabled.
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8.4 Device Functional Modes
8.4.1 Gate Driver Functional Modes
8.4.1.1 Sleep Mode
The ENABLE pin manages the state of the DRV832x family of devices. When the ENABLE pin is low, the device
enters a low-power sleep mode. In sleep mode, all gate drivers are disabled, all external MOSFETs are disabled,
the charge pump is disabled, the DVDD regulator is disabled, and the SPI bus is disabled. The tSLEEP time must
elapse after a falling edge on the ENABLE pin before the device enters sleep mode. The device comes out of
sleep mode automatically if the ENABLE pin is pulled high. The tWAKE time must elapse before the device is
ready for inputs.
In sleep mode and when VVM < VUVLO, all external MOSFETs are disabled. The high-side gate pins, GHx, are
pulled to the SHx pin by an internal resistor and the low-side gate pins, GLx, are pulled to the PGND pin by an
internal resistor.
It should be noted that during power up and power down of the device through the ENABLE pin, the nFAULT pin
will be held low as the internal regulators enable or disable. After the regulators have enabled or disabled, the
nFAULT pin will be automatically released. The duration that nFAULT is low will not exceed the tSLEEP or tWAKE
time.
8.4.1.2 Operating Mode
When the ENABLE pin is high and VVM > VUVLO, the device enters operating mode. The tWAKE time must elapse
before the device is ready for inputs. In this mode the charge pump, low-side gate regulator, DVDD regulator,
and SPI bus are active
8.4.1.3 Fault Reset (CLR_FLT or ENABLE Reset Pulse)
In the case of device latched faults, the DRV832x family of devices enters a partial shutdown state to help
protect the external power MOSFETs and system.
When the fault condition has been removed the device can reenter the operating state by either setting the
CLR_FLT SPI bit on SPI devices or issuing a result pulse to the ENABLE pin on either interface variant. The
ENABLE reset pulse (tRST) consists of a high-to-low-to-high transition on the ENABLE pin. The low period of the
sequence should fall with the tRST time window or else the device will begin the complete shutdown sequence.
The reset pulse has no effect on any of the regulators, device settings, or other functional blocks
8.4.2 Buck Regulator Functional Modes
8.4.2.1 Continuous Conduction Mode (CCM)
The LMR16006 integrated buck regulator steps the input voltage down to a lower output voltage. In continuous
conduction mode (when the inductor current never reaches zero at CCM), the buck regulator operates in two
cycles. The power switch is connected between the VIN and SW pins. During the first cycle of operation, the
transistor is closed and the diode is reverse biased. Energy is collected in the inductor and the load current is
supplied by the COUT capacitor and the rising current through the inductor. During the second cycle of operation,
the transistor is open and the diode is forward biased because the inductor current cannot instantaneously
change direction. The energy stored in the inductor is transferred to the load and output capacitor. The ratio of
these two cycles determines the output voltage. Equation 7 and Equation 8 define the approximate output
voltage.
VO
D
VVIN
where
•
D'
D is the duty cycle of the switch
(7)
1 D
(8)
The value of D and D' will be required for design calculations.
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Device Functional Modes (continued)
8.4.2.2 Eco-mode™ Control Scheme
The LMR16006 device operates with the Eco-mode control scheme at light load currents to improve efficiency by
reducing switching and gate-drive losses. The LMR16006 device is designed so that if the output voltage is
within regulation and the peak switch current at the end of any switching cycle is below the sleep-current
threshold, IINDUCTOR ≤ 80 mA, the device enters Eco-mode. For Eco-mode operation, the LMR16006 device
senses peak current, not average or load current, so the load current when the device enters Eco-mode is
dependent on the input voltage, the output voltage, and the value of the output inductor. When the load current is
low and the output voltage is within regulation, the device enters Eco-mode and draws only 28-µA input
quiescent current.
8.5 Programming
This section applies only to the DRV832x SPI devices.
8.5.1 SPI Communication
8.5.1.1 SPI
On DRV832x SPI devices, an SPI bus is used to set device configurations, operating parameters, and read out
diagnostic information. The SPI operates in slave mode and connects to a master controller. The SPI input data
(SDI) word consists of a 16 bit word, with a 5 bit command and 11 bits of data. The SPI output data (SDO) word
consists of 11-bit register data. The first 5 bits are don’t care bits.
A
•
•
•
•
•
•
•
•
valid frame must meet the following conditions:
The SCLK pin should be low when the nSCS pin transitions from high to low and from low to high.
The nSCS pin should be pulled high for at least 400 ns between words.
When the nSCS pin is pulled high, any signals at the SCLK and SDI pins are ignored and the SDO pin is
placed in the Hi-Z state.
Data is captured on the falling edge of SCLK and data is propagated on the rising edge of SCLK.
The most significant bit (MSB) is shifted in and out first.
A full 16 SCLK cycles must occur for transaction to be valid.
If the data word sent to the SDI pin is less than or more than 16 bits, a frame error occurs and the data word
is ignored.
For a write command, the existing data in the register being written to is shifted out on the SDO pin following
the 5 bit command data.
8.5.1.1.1 SPI Format
The SDI input data word is 16 bits long and consists of the following format:
• 1 read or write bit, W (bit B15)
• 4 address bits, A (bits B14 through B11)
• 11 data bits, D (bits B11 through B0)
The SDO output data word is 16 bits long and the first 5 bits are don't care bits. The data word is the content of
the register being accessed.
For a write command (W0 = 0), the response word on the SDO pin is the data currently in the register being
written to.
For a read command (W0 = 1), the response word is the data currently in the register being read.
Table 9. SDI Input Data Word Format
R/W
ADDRESS
DATA
B15
B14
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
W0
A3
A2
A1
A0
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
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Table 10. SDO Output Data Word Format
DON'T CARE BITS
DATA
B15
B14
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
X
X
X
X
X
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
nSCS
SCLK
SDI
X
MSB
LSB
X
SDO
Z
MSB
LSB
Z
Capture
Point
Propagate
Point
Figure 43. SPI Slave Timing Diagram
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8.6 Register Maps
This section applies only to the DRV832x SPI devices.
NOTE
Do not modify reserved registers or addresses not listed in the register map (Table 11). Writing to these registers may have
unintended effects. For all reserved bits, the default value is 0. To help prevent erroneous SPI writes from the master controller,
set the LOCK bits to lock the SPI registers.
Table 11. DRV832xS and DRV832xRS Register Map
Name
10
9
8
Fault Status 1
VGS Status 2
FAULT
SA_OC
VDS_OCP
SB_OC
GDF
SC_OC
Driver Control
Reserved
DIS_CPUV
DIS_GDF
Gate Drive HS
Gate Drive LS
OCP Control
Reserved
Reserved
CBC
TRETRY
LOCK
TDRIVE
DEAD_TIME
Fault Status 1
VGS Status 2
FAULT
SA_OC
VDS_OCP
SB_OC
GDF
SC_OC
Driver Control
Reserved
DIS_CPUV
DIS_GDF
Gate Drive HS
Gate Drive LS
OCP Control
CBC
TRETRY
CSA Control
CSA_FET
LOCK
TDRIVE
DEAD_TIME
VREF_DIV
Reserved
LS_REF
7
6
5
4
3
2
1
0
DRV8320S and DRV8320RS
UVLO
OTSD
VDS_HA
VDS_LA
VDS_HB
VDS_LB
VDS_HC
VDS_LC
OTW
CPUV
VGS_HA
VGS_LA
VGS_HB
VGS_LB
VGS_HC
VGS_LC
1PWM_CO
OTW_REP
PWM_MODE
1PWM_DIR
COAST
BRAKE
CLR_FLT
M
IDRIVEP_HS
IDRIVEN_HS
IDRIVEP_LS
IDRIVEN_LS
OCP_MODE
OCP_DEG
VDS_LVL
Reserved
Reserved
DRV8323S and DRV8323RS
UVLO
OTSD
VDS_HA
VDS_LA
VDS_HB
VDS_LB
VDS_HC
VDS_LC
OTW
CPUV
VGS_HA
VGS_LA
VGS_HB
VGS_LB
VGS_HC
VGS_LC
1PWM_CO
OTW_REP
PWM_MODE
1PWM_DIR
COAST
BRAKE
CLR_FLT
M
IDRIVEP_HS
IDRIVEN_HS
IDRIVEP_LS
IDRIVEN_LS
OCP_MODE
OCP_DEG
VDS_LVL
CSA_CAL_ CSA_CAL_ CSA_CAL_
CSA_GAIN
DIS_SEN
SEN_LVL
A
B
C
Reserved
Type
Address
R
R
0h
1h
RW
2h
RW
RW
RW
RW
RW
3h
4h
5h
6h
7h
R
R
0h
1h
RW
2h
RW
RW
RW
3h
4h
5h
RW
6h
RW
7h
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8.6.1 Status Registers
The status registers are used to reporting warning and fault conditions. The status registers are read-only
registers
Complex bit access types are encoded to fit into small table cells. Table 12 shows the codes that are used for
access types in this section.
Table 12. Status Registers Access Type Codes
Access Type
Code
Description
R
Read
Read Type
R
Reset or Default Value
-n
Value after reset or the default value
8.6.1.1 Fault Status Register 1 (address = 0x00h)
The fault status register 1 is shown in Figure 44 and described in Table 13.
Register access type: Read only
Figure 44. Fault Status Register 1
10
FAULT
R-0b
9
VDS_OCP
R-0b
8
GDF
R-0b
7
UVLO
R-0b
6
OTSD
R-0b
5
VDS_HA
R-0b
4
VDS_LA
R-0b
3
VDS_HB
R-0b
2
VDS_LB
R-0b
1
VDS_HC
R-0b
0
VDS_LC
R-0b
Table 13. Fault Status Register 1 Field Descriptions
52
Bit
Field
Type
Default
Description
10
FAULT
R
0b
Logic OR of FAULT status registers. Mirrors nFAULT pin.
9
VDS_OCP
R
0b
Indicates VDS monitor overcurrent fault condition
8
GDF
R
0b
Indicates gate drive fault condition
7
UVLO
R
0b
Indicates undervoltage lockout fault condition
6
OTSD
R
0b
Indicates overtemperature shutdown
5
VDS_HA
R
0b
Indicates VDS overcurrent fault on the A high-side MOSFET
4
VDS_LA
R
0b
Indicates VDS overcurrent fault on the A low-side MOSFET
3
VDS_HB
R
0b
Indicates VDS overcurrent fault on the B high-side MOSFET
2
VDS_LB
R
0b
Indicates VDS overcurrent fault on the B low-side MOSFET
1
VDS_HC
R
0b
Indicates VDS overcurrent fault on the C high-side MOSFET
0
VDS_LC
R
0b
Indicates VDS overcurrent fault on the C low-side MOSFET
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8.6.1.2 Fault Status Register 2 (address = 0x01h)
The fault status register 2 is shown in Figure 45 and described in Table 14.
Register access type: Read only
Figure 45. Fault Status Register 2
10
SA_OC
R-0b
9
SB_OC
R-0b
8
SC_OC
R-0b
7
OTW
R-0b
6
CPUV
R-0b
5
VGS_HA
R-0b
4
VGS_LA
R-0b
3
VGS_HB
R-0b
2
VGS_LB
R-0b
1
VGS_HC
R-0b
0
VGS_LC
R-0b
Table 14. Fault Status Register 2 Field Descriptions
Bit
Field
Type
Default
Description
10
SA_OC
R
0b
Indicates overcurrent on phase A sense amplifier (DRV8323xS)
9
SB_OC
R
0b
Indicates overcurrent on phase B sense amplifier (DRV8323xS)
8
SC_OC
R
0b
Indicates overcurrent on phase C sense amplifier (DRV8323xS)
7
OTW
R
0b
Indicates overtemperature warning
6
CPUV
R
0b
Indicates charge pump undervoltage fault condition
5
VGS_HA
R
0b
Indicates gate drive fault on the A high-side MOSFET
4
VGS_LA
R
0b
Indicates gate drive fault on the A low-side MOSFET
3
VGS_HB
R
0b
Indicates gate drive fault on the B high-side MOSFET
2
VGS_LB
R
0b
Indicates gate drive fault on the B low-side MOSFET
1
VGS_HC
R
0b
Indicates gate drive fault on the C high-side MOSFET
0
VGS_LC
R
0b
Indicates gate drive fault on the C low-side MOSFET
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8.6.2 Control Registers
The control registers are used to configure the device. The control registers are read and write capable
Complex bit access types are encoded to fit into small table cells. Table 15 shows the codes that are used for
access types in this section.
Table 15. Control Registers Access Type Codes
Access Type
Code
Description
R
Read
W
Write
Read Type
R
Write Type
W
Reset or Default Value
-n
Value after reset or the default value
8.6.2.1 Driver Control Register (address = 0x02h)
The driver control register is shown in Figure 46 and described in Table 16.
Register access type: Read/Write
Figure 46. Driver Control Register
10
Reserved
R/W-0b
9
DIS
_CPUV
R/W-0b
8
DIS
_GDF
R/W-0b
7
OTW
_REP
R/W-0b
6
5
PWM_MODE
R/W-00b
4
1PWM
_COM
R/W-0b
3
1PWM
_DIR
R/W-0b
2
1
COAST
BRAKE
R/W-0b
R/W-0b
0
CLR
_FLT
R/W-0b
Table 16. Driver Control Field Descriptions
Bit
Field
Type
Default
Description
10
Reserved
R/W
0b
Reserved
9
DIS_CPUV
R/W
0b
0b = Charge-pump undervoltage lockout fault is enabled
8
DIS_GDF
R/W
0b
7
OTW_REP
R/W
0b
PWM_MODE
R/W
00b
1b = Charge-pump undervoltage lockout fault is disabled
0b = Gate drive fault is enabled
1b = Gate drive fault is disabled
0b = OTW is not reported on nFAULT or the FAULT bit
1b = OTW is reported on nFAULT and the FAULT bit
6-5
00b = 6x PWM Mode
01b = 3x PWM mode
10b = 1x PWM mode
11b = Independent PWM mode
4
1PWM_COM
R/W
0b
0b = 1x PWM mode uses synchronous rectification
1b = 1x PWM mode uses asynchronous rectification (diode
freewheeling)
54
3
1PWM_DIR
R/W
0b
In 1x PWM mode this bit is ORed with the INHC (DIR) input
2
COAST
R/W
0b
Write a 1 to this bit to put all MOSFETs in the Hi-Z state
1
BRAKE
R/W
0b
Write a 1 to this bit to turn on all three low-side MOSFETs in 1x
PWM mode.
This bit is ORed with the INLC (BRAKE) input.
0
CLR_FLT
R/W
0b
Write a 1 to this bit to clear latched fault bits.
This bit automatically resets after being writen.
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8.6.2.2 Gate Drive HS Register (address = 0x03h)
The gate drive HS register is shown in Figure 47 and described in Table 17.
Register access type: Read/Write
Figure 47. Gate Drive HS Register
10
9
LOCK
R/W-011b
8
7
6
5
IDRIVEP_HS
R/W-1111b
4
3
2
1
IDRIVEn_HS
R/W-1111b
0
Table 17. Gate Drive HS Field Descriptions
Bit
Field
Type
Default
Description
10-8
LOCK
R/W
011b
Write 110b to lock the settings by ignoring further register writes
except to these bits and address 0x02h bits 0-2.
Writing any sequence other than 110b has no effect when
unlocked.
Write 011b to this register to unlock all registers.
Writing any sequence other than 011b has no effect when
locked.
7-4
IDRIVEP_HS
R/W
1111b
0000b = 10 mA
0001b = 30 mA
0010b = 60 mA
0011b = 80 mA
0100b = 120 mA
0101b = 140 mA
0110b = 170 mA
0111b = 190 mA
1000b = 260 mA
1001b = 330 mA
1010b = 370 mA
1011b = 440 mA
1100b = 570 mA
1101b = 680 mA
1110b = 820 mA
1111b = 1000 mA
3-0
IDRIVEN_HS
R/W
1111b
0000b = 20 mA
0001b = 60 mA
0010b = 120 mA
0011b = 160 mA
0100b = 240 mA
0101b = 280 mA
0110b = 340 mA
0111b = 380 mA
1000b = 520 mA
1001b = 660 mA
1010b = 740 mA
1011b = 880 mA
1100b = 1140 mA
1101b = 1360 mA
1110b = 1640 mA
1111b = 2000 mA
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8.6.2.3 Gate Drive LS Register (address = 0x03h)
The gate drive LS register is shown in Figure 48 and described in Table 18.
Register access type: Read/Write
Figure 48. Gate Drive LS Register
10
CBC
R/W-1b
9
8
7
6
5
IDRIVEP_LS
R/W-1111b
TDRIVE
R/W-11b
4
3
2
1
IDRIVEN_LS
R/W-1111b
0
Table 18. Gate Drive LS Register Field Descriptions
Bit
Field
Type
Default
Description
10
CBC
R/W
1b
In retry OCP_MODE, for both VDS_OCP and SEN_OCP, the
fault is automatically cleared when a PWM input is given
9-8
TDRIVE
R/W
11b
00b = 500-ns peak gate-current drive time
01b = 1000-ns peak gate-current drive time
10b = 2000-ns peak gate-current drive time
11b = 4000-ns peak gate-current drive time
7-4
IDRIVEP_LS
R/W
1111b
0000b = 10 mA
0001b = 30 mA
0010b = 60 mA
0011b = 80 mA
0100b = 120 mA
0101b = 140 mA
0110b = 170 mA
0111b = 190 mA
1000b = 260 mA
1001b = 330 mA
1010b = 370 mA
1011b = 440 mA
1100b = 570 mA
1101b = 680 mA
1110b = 820 mA
1111b = 1000 mA
3-0
IDRIVEN_LS
R/W
1111b
0000b = 20 mA
0001b = 60 mA
0010b = 120 mA
0011b = 160 mA
0100b = 240 mA
0101b = 280 mA
0110b = 340 mA
0111b = 380 mA
1000b = 520 mA
1001b = 660 mA
1010b = 740 mA
1011b = 880 mA
1100b = 1140 mA
1101b = 1360 mA
1110b = 1640 mA
1111b = 2000 mA
56
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8.6.2.4 OCP Control Register (address = 0x05h)
The OCP control register is shown in Figure 49 and described in Table 19.
Register access type: Read/Write
Figure 49. OCP Control Register
10
TRETRY
R/W-0b
9
8
DEAD_TIME
R/W-00b
7
6
OCP_MODE
R/W-01b
5
4
3
2
OCP_DEG
R/W-01b
1
0
VDS_LVL
R/W-1001b
Table 19. OCP Control Field Descriptions
Bit
Field
Type
Default
Description
10
TRETRY
R/W
0b
0b = VDS_OCP and SEN_OCP retry time is 4 ms
9-8
DEAD_TIME
R/W
01b
1b = VDS_OCP and SEN_OCP retry time is 50 µs
00b = 50-ns dead time
01b = 100-ns dead time
10b = 200-ns dead time
11b = 400-ns dead time
7-6
OCP_MODE
R/W
01b
00b = Overcurrent causes a latched fault
01b = Overcurrent causes an automatic retrying fault
10b = Overcurrent is report only but no action is taken
11b = Overcurrent is not reported and no action is taken
5-4
OCP_DEG
R/W
01b
00b = Overcurrent deglitch of 2 µs
01b = Overcurrent deglitch of 4 µs
10b = Overcurrent deglitch of 6 µs
11b = Overcurrent deglitch of 8 µs
3-0
VDS_LVL
R/W
1001b
0000b = 0.06 V
0001b = 0.13 V
0010b = 0.2 V
0011b = 0.26 V
0100b = 0.31 V
0101b = 0.45 V
0110b = 0.53 V
0111b = 0.6 V
1000b = 0.68 V
1001b = 0.75 V
1010b = 0.94 V
1011b = 1.13 V
1100b = 1.3 V
1101b = 1.5 V
1110b = 1.7 V
1111b = 1.88 V
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8.6.2.5 CSA Control Register (DRV8323x Only) (address = 0x06h)
The CSA control register is shown in Figure 50 and described in Table 20.
Register access type: Read/Write
This register is only available with the DRV8323x family of devices.
Figure 50. CSA Control Register
10
CSA
_FET
R/W-0b
9
VREF
_DIV
R/W-1b
8
LS
_REF
R/W-0b
7
6
5
DIS
_SEN
R/W-0b
CSA
_GAIN
R/W-10b
4
CSA
_CAL_A
R/W-0b
3
CSA
_CAL_B
R/W-0b
2
CSA
_CAL_C
R/W-0b
1
0
SEN
_LVL
R/W-11b
Table 20. CSA Control Field Descriptions
Bit
Field
Type
Default
Description
10
CSA_FET
R/W
0b
0b = Sense amplifier positive input is SPx
1b = Sense amplifier positive input is SHx (also automatically
sets the LS_REF bit to 1)
9
VREF_DIV
R/W
1b
8
LS_REF
R/W
0b
0b = Sense amplifier reference voltage is VREF (unidirectional
mode)
1b = Sense amplifier reference voltage is VREF divided by 2
0b = VDS_OCP for the low-side MOSFET is measured
across SHx to SPx
1b = VDS_OCP for the low-side MOSFET is measured across
SHx to SNx
7-6
CSA_GAIN
R/W
10b
00b = 5-V/V shunt amplifier gain
01b = 10-V/V shunt amplifier gain
10b = 20-V/V shunt amplifier gain
11b = 40-V/V shunt amplifier gain
5
DIS_SEN
R/W
0b
4
CSA_CAL_A
R/W
0b
3
CSA_CAL_B
R/W
0b
2
CSA_CAL_C
R/W
0b
SEN_LVL
R/W
11b
0b = Sense overcurrent fault is enabled
1b = Sense overcurrent fault is disabled
0b = Normal sense amplifier A operation
1b = Short inputs to sense amplifier A for offset calibration
0b = Normal sense amplifier B operation
1b = Short inputs to sense amplifier B for offset calibration
0b = Normal sense amplifier C operation
1b = Short inputs to sense amplifier C for offset calibration
1-0
00b = Sense OCP 0.25 V
01b = Sense OCP 0.5 V
10b = Sense OCP 0.75 V
11b = Sense OCP 1 V
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DRV832x family of devices is primarily used in three-phase brushless DC motor control applications. The
design procedures in the Typical Application section highlight how to use and configure the DRV832x family of
devices.
9.2 Typical Application
9.2.1 Primary Application
The DRV8323R SPI device is used in this application example.
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Typical Application (continued)
LOUT
0.8 to 60 V, 600 mA
VCC
VM
0.1 µF
COUT
CIN
37
INHA
38
INLA
INHB
39
40
INLB
41
INHC
43
42
INLC
45
46
44
CB
BGND
FB
SW
1
NC
VIN
nSHDN
RFB1
47
48
100 k
36
2
RFB2
35
PGND
AGND
3
47 nF
34
CPL
CAL
CPH
ENABLE
VCP
nSCS
VM
SCLK
4
33
5
VM
1 µF
32
6
31
GND
(PAD)
7
0.1 µF
VDRAIN
VDRAIN
30
GHA
SDO
SHA
nFAULT
GLA
DGND
SPA
VREF
SNA
SOA
24
SOB
SOC
23
SNC
SNC
22
SPC
SPC
21
GLC
20
GLC
SHC
19
SHC
GHC
GHC
18
GHB
GHB
17
SHB
16
SHB
GLB
15
GLB
SPB
14
SPB
SNB
13
SNB
25
VM
VM
VM
VCC
1 µF
26
12
SNA
10 k
27
11
SPA
VCC
28
10
GLA
10 k
29
9
SHA
VCC
SDI
8
GHA
3.3 V, 30 mA
1 µF
DVDD
VM
VM
+
+
VDRAIN
GHB
GHA
SHA
A
GHC
SHB
B
SHC
GLA
GLB
GLC
SPA
SPB
SPC
RSENSE
RSENSE
RSENSE
SNA
SNB
C
SNC
Figure 51. Primary Application Schematic
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Typical Application (continued)
9.2.1.1 Design Requirements
Table 21 lists the example input parameters for the system design.
Table 21. Design Parameters
EXAMPLE DESIGN PARAMETER
REFERENCE
Nominal supply voltage
EXAMPLE VALUE
24 V
VVM
Supply voltage range
8 V to 45 V
MOSFET part number
CSD18536KCS
MOSFET total gate charge
Qg
83 nC (typical) at VVGS = 10 V
MOSFET gate to drain charge
Qgd
14 nC (typical)
Target output rise time
tr
100 to 300 ns
Target output fall time
tf
50 to 150 ns
PWM Frequency
ƒPWM
45 kHz
Buck regulator output voltage
VVCC
3.3 V
Maximum motor current
Imax
100 A
ADC reference voltage
VVREF
3.3 V
Winding sense current range
ISENSE
–40 A to +40 A
IRMS
28.3 A
Motor RMS current
Sense resistor power rating
System ambient temperature
PSENSE
2W
TA
–20°C to +105°C
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 External MOSFET Support
The DRV832x family of devices MOSFET support is based on the charge-pump capacity and output PWM
switching frequency. For a quick calculation of MOSFET driving capacity, use Equation 9 and Equation 10 for
three phase BLDC motor applications.
Trapezoidal 120° Commutation: IVCP > Qg ׃PWM
Sinusoidal 180° Commutation: IVCP > 3 × Qg ׃PWM
(9)
where
•
•
•
ƒPWM is the maximum desired PWM switching frequency.
IVCP is the charge pump capacity, which depends on the VM pin voltage.
The multiplier based on the commutation control method, may vary based on implementation.
(10)
9.2.1.2.1.1 Example
If a system at VVM = 8 V (IVCP = 15 mA) uses a maximum PWM switching frequency of 45 kHz, then the chargepump can support MOSFETs using trapezoidal commutation with a Qg < 167 nC, and MOSFETs with sinusoidal
commutation Qg < 56 nC.
9.2.1.2.2 IDRIVE Configuration
The gate drive current strength, IDRIVE, is selected based on the gate-to-drain charge of the external MOSFETs
and the target rise and fall times at the outputs. If IDRIVE is selected to be too low for a given MOSFET, then the
MOSFET may not turn on completely within the tDRIVE time and a gate drive fault may be asserted. Additionally,
slow rise and fall times will lead to higher switching power losses. TI recommends adjusting these values in
system with the required external MOSFETs and motor to determine the best possible setting for any application.
The IDRIVEP and IDRIVEN current for both the low-side and high-side MOSFETs are independently adjustable on
SPI devices through the SPI registers. On hardware interface devices, both source and sink settings are selected
simultaneously on the IDRIVE pin.
For MOSFETs with a known gate-to-drain charge Qgd, desired rise time (tr), and a desired fall time (tf), use
Equation 11 and Equation 12 to calculate the value of IDRIVEP and IDRIVEN (respectively).
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IDRIVEP ! Qgd u tr
(11)
IDRIVEN ! Qgd u t f
(12)
9.2.1.2.2.1 Example
Use Equation 13 and Equation 14 to calculate the value of IDRIVEP1 and IDRIVEP2 (respectively) for a gate to drain
charge of 14 nC and a rise time from 100 to 300 ns.
14 nC
IDRIVEP1
140 mA
100 ns
(13)
14 nC
IDRIVEP2
47 mA
300 ns
(14)
Select a value for IDRIVEP that is between 47 mA and 140 mA. For this example, the value of IDRIVEP was selected
as 120-mA source.
Use Equation 15 and Equation 16 to calculate the value of IDRIVEN1 and IDRIVEN2 (respectively) for a gate to drain
charge of 14 nC and a fall time from 50 to 150 ns.
14 nC
IDRIVEN1
280 mA
50 ns
(15)
14 nC
IDRIVEN2
93 mA
150 ns
(16)
Select a value for IDRIVEN that is between 93 mA and 280 mA. For this example, the value of IDRIVEN was selected
as 240-mA sink.
9.2.1.2.3 VDS Overcurrent Monitor Configuration
The VDS monitors are configured based on the worst-case motor current and the RDS(on) of the external
MOSFETs as shown in Equation 17.
VDS _ OCP ! Imax u RDS(on)max
(17)
9.2.1.2.3.1 Example
The goal of this example is to set the VDS monitor to trip at a current greater than 100 A. According to the
CSD18536KCS 60 V N-Channel NexFET™ Power MOSFET data sheet, the RDS(on) value is 1.8 times higher at
175°C, and the maximum RDS(on) value at a VGS of 10 V is 1.6 mΩ. From these values, the approximate worstcase value of RDS(on) is 1.8 × 1.6 mΩ = 2.88 mΩ.
Using Equation 17 with a value of 2.88 mΩ for RDS(on) and a worst-case motor current of 100 A, Equation 18
shows the calculated the value of the VDS monitors.
VDS _ OCP ! 100 A u 2.88 m:
VDS _ OCP ! 0.288 V
(18)
For this example, the value of VDS_OCP was selected as 0.31 V.
The SPI devices allow for adjustment of the deglitch time for the VDS overcurrent monitor. The deglitch time can
be set to 2 µs, 4 µs, 6 µs, or 8 µs.
9.2.1.2.4 Sense-Amplifier Bidirectional Configuration (DRV8323 and DRV8323R)
The sense amplifier gain on the DRV8323, DRV8323R devices and sense resistor value are selected based on
the target current range, VREF voltage supply, sense-resistor power rating, and operating temperature range. In
bidirectional operation of the sense amplifier, the dynamic range at the output is approximately calculated as
shown in Equation 19.
VVREF
VO
VVREF 0.25 V
2
(19)
Use Equation 20 to calculate the approximate value of the selected sense resistor with VO calculated using
Equation 19.
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VO
AV u I
PSENSE ! IRMS2 u R
(20)
From Equation 19 and Equation 20, select a target gain setting based on the power rating of the target sense
resistor.
9.2.1.2.4.1 Example
In this system example, the value of VREF voltage is 3.3 V with a sense current from –40 to +40 A. The linear
range of the SOx output is 0.25 V to VVREF – 0.25 V (from the VLINEAR specification). The differential range of the
sense amplifier input is –0.3 to +0.3 V (VDIFF).
3.3 V
VO
3.3 V 0.25 V
1.4 V
(21)
2
1.4 V
R
2 W ! 28.32 u R o R 2.5 m:
A V u 40 A
(22)
2.5 m: !
1.4 V
o A V ! 14
A V u 40 A
(23)
Therefore, the gain setting must be selected as 20 V/V or 40 V/V and the value of the sense resistor must be
less than 2.5 mΩ to meet the power requirement for the sense resistor. For this example, the gain setting was
selected as 20 V/V. The value of the resistor and worst case current can be verified that R < 2.5 mΩ and Imax =
40 A does not violate the differential range specification of the sense amplifier input (VSPxD).
9.2.1.2.5 Buck Regulator Configuration (DRV8320R and DRV8323R)
For a detailed design procedure and information on selecting the proper buck regulator external components,
refer to LMR16006 SIMPLE SWITCHER® 60 V 0.6 A Buck Regulators With High Efficiency Eco-mode.
9.2.1.3 Application Curves
Figure 52. Gate-Drive 20% Duty Cycle
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Figure 53. Gate-Drive 80% Duty Cycle
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Figure 54. BLDC Motor Commutation 1000 RPM
Figure 55. BLDC Motor Commutation 2000 RPM
Figure 56. IDRIVE Maximum Setting Positive Current
Figure 57. IDRIVE Maximum Setting Negative Current
Figure 58. IDRIVE Minimum Setting Positive Current
Figure 59. IDRIVE Minimum Setting Negative Current
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Figure 60. IDRIVE 260 to 520-mA Setting Negative Current
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Figure 61. IDRIVE 260 to 520-mA Setting Positive Current
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9.2.2 Alternative Application
In this application, a single-sense amplifier is used in unidirectional mode for a summing current sense scheme
often used in trapezoidal or hall-based BLDC commutation control.
LOUT
0.8 to 60 V, 600 mA
VCC
VM
0.1 µF
COUT
CIN
INLA
INHA
37
38
39
INHB
INLB
40
41
INHC
43
42
INLC
45
46
44
CB
BGND
FB
SW
1
NC
VIN
nSHDN
RFB1
47
48
100 k
36
2
RFB2
35
PGND
AGND
3
47 nF
34
CPL
CAL
CPH
ENABLE
VCP
nSCS
4
33
5
VM
1 µF
32
6
31
VM
VDRAIN
VDRAIN
30
SDI
8
GHA
GHA
SDO
SHA
nFAULT
GLA
DGND
SPA
VREF
SNA
SOA
24
SOB
SOC
23
SNC
22
SPC
SPC
21
GLC
20
GLC
SHC
19
SHC
GHC
GHC
18
GHB
GHB
17
SHB
16
SHB
GLB
15
GLB
SPB
14
SPB
13
SNB
25
VM
VM
VM
VCC
1 µF
26
12
SNA
10 k
27
11
SPA
VCC
28
10
GLA
10 k
29
9
SHA
VCC
SCLK
GND
(PAD)
7
0.1 µF
3.3 V, 30 mA
1 µF
DVDD
VM
VM
+
+
VDRAIN
GHB
GHA
SHA
A
SHB
GHC
B
SHC
GLA
GLB
GLC
SPA
SPB
SPC
C
RSENSE
SNA
Figure 62. Alternative Application Schematic
66
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9.2.2.1 Design Requirements
Table 22 lists the example design input parameters for system design.
Table 22. Design Parameters
EXAMPLE DESIGN PARAMETER
REFERENCE
EXAMPLE VALUE
ADC reference voltage
VVREF
3.3 V
Sensed current
ISENSE
0 to 40 A
IRMS
28.3 A
Motor RMS current
Sense-resistor power rating
System ambient temperature
PSENSE
3W
TA
–20°C to +105°C
9.2.2.2 Detailed Design Procedure
9.2.2.2.1 Sense Amplifier Unidirectional Configuration
The sense amplifiers are configured to be unidirectional through the registers on SPI devices by writing a 0 to the
VREF_DIV bit.
The sense-amplifier gain and sense resistor values are selected based on the target current range, VREF,
sense-resistor power rating, and operating temperature range. In unidirectional operation of the sense amplifier,
use Equation 24 to calculate the approximate value of the dynamic range at the output.
VO
VVREF 0.25 V 0.25 V VVREF 0.5 V
(24)
Use Equation 25 to calculate the approximate value of the selected sense resistor.
VO
R
PSENSE ! IRMS2 u R
AV u I
where
•
VO
VVREF
0.5 V
(25)
From Equation 24 and Equation 25, select a target gain setting based on the power rating of a target sense
resistor.
9.2.2.2.1.1 Example
In this system example, the value of VREF is 3.3 V with a sense current from 0 to 40 A. The linear range of the
SOx output for the DRV8323x device is 0.25 V to VVREF – 0.25 V (from the VLINEAR specification). The differential
range of the sense-amplifier input is –0.3 to +0.3 V (VDIFF).
VO 3.3 V 0.5 V 2.8 V
(26)
R
2.8 V
A V u 40 A
3 W ! 28.32 u R o R
3.75 m:
(27)
2.8 V
3.75 m: !
o A V ! 18.7
A V u 40 A
(28)
Therefore, the gain setting must be selected as 20 V/V or 40 V/V and the value of the sense resistor must be
less than 3.75 mΩ to meet the power requirement for the sense resistor. For this example, the gain setting was
selected as 20 V/V. The value of the resistor and worst-case current can be verified that R < 3.75 mΩ and Imax =
40 A does not violate the differential range specification of the sense amplifier input (VSPxD).
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10 Power Supply Recommendations
The DRV832x family of devices is designed to operate from an input voltage supply (VM) range between 6 V and
60 V. A 0.1-µF ceramic capacitor rated for VM must be placed as close to the device as possible. In addition, a
bulk capacitor must be included on the VM pin but can be shared with the bulk bypass capacitance for the
external power MOSFETs. Additional bulk capacitance is required to bypass the external half-bridge MOSFETs
and should be sized according to the application requirements.
10.1 Bulk Capacitance Sizing
Having appropriate local bulk capacitance is an important factor in motor drive system design. It is generally
beneficial to have more bulk capacitance, while the disadvantages are increased cost and physical size. The
amount of local capacitance depends on a variety of factors including:
• The highest current required by the motor system
• The power supply's type, capacitance, and ability to source current
• The amount of parasitic inductance between the power supply and motor system
• The acceptable supply voltage ripple
• Type of motor (brushed DC, brushless DC, stepper)
• The motor startup and braking methods
The inductance between the power supply and motor drive system will limit the rate current can change from the
power supply. If the local bulk capacitance is too small, the system will respond to excessive current demands or
dumps from the motor with a change in voltage. When adequate bulk capacitance is used, the motor voltage
remains stable and high current can be quickly supplied.
The data sheet provides a recommended minimum value, but system level testing is required to determine the
appropriate sized bulk capacitor.
Parasitic Wire
Inductance
Motor Drive System
Power Supply
VM
+
+
Motor Driver
±
GND
Local
Bulk Capacitor
IC Bypass
Capacitor
Figure 63. Motor Drive Supply Parasitics Example
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11 Layout
11.1 Layout Guidelines
Bypass the VM pin to the PGND pin using a low-ESR ceramic bypass capacitor with a recommended value of
0.1 µF. Place this capacitor as close to the VM pin as possible with a thick trace or ground plane connected to
the PGND pin. Additionally, bypass the VM pin using a bulk capacitor rated for VM. This component can be
electrolytic. This capacitance must be at least 10 µF.
Additional bulk capacitance is required to bypass the high current path on the external MOSFETs. This bulk
capacitance should be placed such that it minimizes the length of any high current paths through the external
MOSFETs. The connecting metal traces should be as wide as possible, with numerous vias connecting PCB
layers. These practices minimize inductance and allow the bulk capacitor to deliver high current.
Place a low-ESR ceramic capacitor between the CPL and CPH pins. This capacitor should be 47 nF, rated for
VM, and be of type X5R or X7R. Additionally, place a low-ESR ceramic capacitor between the VCP and VM pins.
This capacitor should be 1 µF, rated for 16 V, and be of type X5R or X7R.
Bypass the DVDD pin to the AGND pin with a 1-µF low-ESR ceramic capacitor rated for 6.3 V and of type X5R
or X7R. Place this capacitor as close to the pin as possible and minimize the path from the capacitor to the
AGND pin.
The VDRAIN pin can be shorted directly to the VM pin. However, if a significant distance is between the device
and the external MOSFETs, use a dedicated trace to connect to the common point of the drains of the high-side
external MOSFETs. Do not connect the SLx pins directly to PGND. Instead, use dedicated traces to connect
these pins to the sources of the low-side external MOSFETs. These recommendations allow for more accurate
VDS sensing of the external MOSFETs for overcurrent detection.
Minimize the loop length for the high-side and low-side gate drivers. The high-side loop is from the GHx pin of
the device to the high-side power MOSFET gate, then follows the high-side MOSFET source back to the SHx
pin. The low-side loop is from the GLx pin of the device to the low-side power MOSFET gate, then follows the
low-side MOSFET source back to the PGND pin.
11.1.1 Buck-Regulator Layout Guidelines
Layout is a critical portion of good power supply design. The following guidelines will help users design a PCB
with the best power conversion performance, thermal performance, and minimized generation of unwanted EMI:
• Place the feedback network resistors close to the FB pin and away from the inductor to minimize coupling
noise into the feedback pin.
• Place the input bypass capacitor close to the VIN pin to reduce copper trace resistance which effects input
voltage ripple of the device.
• Place the inductor close to the SW pin to reduce magnetic and electrostatic noise.
• Place the output capacitor close to the junction of the inductor and the diode. The inductor, diode, and COUT
trace should be as short as possible to reduce conducted and radiated noise and increase overall efficiency.
• Make the ground connection for the diode, CVIN, and COUT as small as possible and tie it to the system
ground plane in only one spot (preferably at the COUT ground point) to minimize conducted noise in the
system ground plane.
For more detail on switching power supply layout considerations refer to AN-1149 Layout Guidelines for
Switching Power Supplies.
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S
D
S
D
G
D
D
G
D
S
D
S
D
S
D
G
D
S
D
S
D
S
S
D
S
D
S
D
G
D
S
D
S
D
S
D
G
D
D
G
D
S
D
S
D
S
OUTC
SOB
D
SOC
SOA
VREF
CAL
ENABLE
nSCS
SCLK
SDI
SO
nFAULT
S
36
35
34
33
32
31
30
29
28
27
26
25
DVDD
AGND
CAL
ENABLE
nSCS
SCLK
SDI
SDO
nFAULT
DGND
VREF
SOA
DVDD
INLC
INHA
INHC
INHB
INLA
INHA
VO
11.2 Layout Example
37
38
39
40
41
42
43
44
45
46
47
48
Thermal Pad
24
23
22
21
20
19
18
17
16
15
14
13
SOB
SOC
SNC
SPC
GLC
SHC
GHC
GHB
SHB
GLB
SPB
SNB
OUTA
FB
PGND
CPL
CPH
VCP
VM
VDRAIN
GHA
SHA
GLA
SPA
SNA
OUTB
1
2
3
4
5
6
7
8
9
10
11
12
INHA
INLA
INHB
INLB
INHC
INLC
BGND
CB
SW
NC
VIN
nSHDN
Figure 64. Layout Example
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DRV8323, DRV8323R
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SLVSDJ3A – FEBRUARY 2017 – REVISED APRIL 2017
12 Device and Documentation Support
12.1 Device Support
12.1.1 Device Nomenclature
The following figure shows a legend for interpreting the complete device name:
DRV83
(2)
(3)
(R)
(S)
(RGZ) (R)
Prefix
DRV83 ± Three Phase Brushless DC
Tape and Reel
R ± Tape and Reel
T ± Small Tape and Reel
Series
2 ± 60 V device
Package
RTV ± 5 × 5 × 0.75 mm QFN
RHA ± 6 x 6 × 0.9 mm QFN
RTA ± 6 x 6 × 0.75 mm QFN
RGZ ± 7 × 7 × 0.9 mm QFN
Sense amplifiers
0 ± No sense amplifiers
3 ± 3x sense amplifiers
Interface
S ± SPI interface
H ± Hardware interface
Buck Regulator
[blank] ± No buck regulator
R ± Buck regulator
12.2 Documentation Support
12.2.1 Related Documentation
• AN-1149 Layout Guidelines for Switching Power Supplies
• CSD18536KCS 60 V N-Channel NexFET™ Power MOSFET
• Hardware Design Considerations for an Efficient Vacuum Cleaner using BLDC Motor
• Hardware Design Considerations for an Electric Bicycle using BLDC Motor
• Industrial Motor Drive Solution Guide
• Layout Guidelines for Switching Power Supplies
• LMR16006 SIMPLE SWITCHER® 60 V 0.6 A Buck Regulators With High Efficiency Eco-mode
• QFN/SON PCB Attachment
• Sensored 3-Phase BLDC Motor Control Using MSP430™
• Understanding IDRIVE and TDRIVE In TI Motor Gate Drivers
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 23. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DRV8320
Click here
Click here
Click here
Click here
Click here
DRV8320R
Click here
Click here
Click here
Click here
Click here
DRV8323
Click here
Click here
Click here
Click here
Click here
DRV8323R
Click here
Click here
Click here
Click here
Click here
12.4 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
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12.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.6 Trademarks
Eco-mode, NexFET, MSP430, E2E are trademarks of Texas Instruments.
SIMPLE SWITCHER is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.7 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
72
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PACKAGE OPTION ADDENDUM
www.ti.com
4-May-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DRV8320HRTVR
PREVIEW
WQFN
RTV
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8320H
DRV8320HRTVT
PREVIEW
WQFN
RTV
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8320H
DRV8320RHRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV
8320RH
DRV8320RHRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV
8320RH
DRV8320RSRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV
8320RS
DRV8320RSRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV
8320RS
DRV8320SRTVR
PREVIEW
WQFN
RTV
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8320S
DRV8320SRTVT
PREVIEW
WQFN
RTV
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8320S
DRV8323HRTAR
PREVIEW
WQFN
RTA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8323H
DRV8323HRTAT
PREVIEW
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8323H
DRV8323RHRGZR
PREVIEW
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV8323RH
DRV8323RHRGZT
PREVIEW
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV8323RH
DRV8323RSRGZR
PREVIEW
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV8323RS
DRV8323RSRGZT
PREVIEW
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV8323RS
DRV8323SRTAR
PREVIEW
WQFN
RTA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8323S
DRV8323SRTAT
PREVIEW
WQFN
RTA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
DRV8323S
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
4-May-2017
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-May-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DRV8320RHRHAR
VQFN
RHA
40
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
DRV8320RHRHAT
VQFN
RHA
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
DRV8320RSRHAR
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
DRV8320RSRHAT
VQFN
RHA
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-May-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV8320RHRHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
DRV8320RHRHAT
VQFN
RHA
40
250
210.0
185.0
35.0
DRV8320RSRHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
DRV8320RSRHAT
VQFN
RHA
40
250
210.0
185.0
35.0
Pack Materials-Page 2
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Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
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requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
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