CREE CGHV37400F 400 w, 3500 - 3700 mhz, 50-ohm input/output matched, gan hemt for s-band radar system Datasheet

CGHV37400F
400 W, 3500 - 3700 MHz, 50-Ohm Input/Output Matched, GaN HEMT for S-Band Radar Systems
Cree’s CGHV37400F is a gallium nitride (GaN) high electron mobility transistor (HEMT)
designed specifically with high efficiency, high gain and wide bandwidth capabilities,
which makes the CGHV37400F ideal for 3.5 - 3.7 GHz S-Band radar amplifier applications.
The transistor is matched to 50-ohms on the input and 50-ohms on the output. The
CGHV35400 is based on Cree’s high power density 50 V, 0.4 µm GaN on silicon carbide
(SiC) foundry process. The transistor is supplied in a ceramic/metal flange package, type
440217.
PN: CGHV374
00F
Package Type
: 440217
Typical Performance Over 3.5-3.7 GHz (TC = 25˚C) of Demonstration Amplifier
Parameter
3.5 GHz
3.6
3.7 GHz
Units
Output Power
555
560
555
W
Gain
11.4
11.5
11.4
dB
55
55
55
%
Drain Efficiency
Note:
Measured in the CGHV37400F-AMP application circuit, under 100 μs pulse width, 10% duty cycle, PIN = 46 dBm.
20
Rev 0.0 - March
18
Features
•
3.3 - 3.8 GHz Operation
•
550 W Typical Output Power
•
11.5 dB Power Gain
•
55% Typical Drain Efficiency
•
50 Ohm Internally Matched
•
<0.3 dB Pulsed Amplitude Droop
Subject to change without notice.
www.cree.com/rf
1
Absolute Maximum Ratings (not simultaneous)
Parameter
Symbol
Rating
Units
Pulse Width
PW
100
µs
Conditions
Duty Cycle
DC
10
%
Drain-Source Voltage
VDSS
125
Volts
25˚C
Gate-to-Source Voltage
VGS
-10, +2
Volts
25˚C
Storage Temperature
˚C
TSTG
-65, +150
Operating Junction Temperature
TJ
225
˚C
Maximum Forward Gate Current
IGMAX
80
mA
25˚C
Maximum Drain Current
IDMAX
24
A
25˚C
Soldering Temperature2
TS
245
˚C
1
τ
40
in-oz
Pulsed Thermal Resistance, Junction to Case
RθJC
0.22
˚C/W
100 μsec, 10%, 85˚C , PDISS = 418 W
Pulsed Thermal Resistance, Junction to Case
RθJC
0.30
˚C/W
500 μsec, 10%, 85˚C, PDISS = 418 W
TC
-40, +125
˚C
Screw Torque
Case Operating Temperature
Notes:
1
Current limit for long term, reliable operation
2
Refer to the Application Note on soldering at http://www.cree.com/rf/tools-and-support/document-library
Electrical Characteristics
Characteristics
Symbol
Min.
Typ.
Max.
Units
Conditions
Gate Threshold Voltage
VGS(th)
-3.8
-3.0
-2.3
VDC
VDS = 10 V, ID = 83.6 mA
Gate Quiescent Voltage
VGS(Q)
–
-2.7
–
VDC
VDS = 50 V, ID = 0.5 A
Saturated Drain Current
IDS
62.7
75.5
–
A
VDS = 6.0 V, VGS = 2.0 V
Drain-Source Breakdown Voltage
VBR
150
–
–
VDC
VGS = -8 V, ID = 83.6 mA
DC Characteristics1 (TC = 25˚C)
2
RF Characteristics (TC = 25˚C, F0 = 3.5 - 3.7 GHz unless otherwise noted)
3
Output Power at 3.5 GHz
POUT1
–
555
–
W
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
Output Power at 3.6 GHz
POUT2
–
560
–
W
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
Output Power at 3.7 GHz
POUT3
–
555
–
W
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
Power Gain at 3.5 GHz
GP1
–
11.4
–
dB
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
Power Gain at 3.6 GHz
GP2
–
11.5
–
dB
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
Power Gain at 3.7 GHz
GP3
–
11.4
–
dB
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
Drain Efficiency
DE
–
55
–
%
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
Small Signal Gain
S21
–
14
–
dB
VDD = 50 V, IDQ = 1000 mA, PIN = -10 dBm
Input Return Loss
S11
–
-9
–
dB
VDD = 50 V, IDQ = 1000 mA, PIN = -10 dBm
Output Return Loss
S22
–
-6
–
dB
VDD = 50 V, IDQ = 1000 mA, PIN = -10 dBm
D
–
-0.3
–
dB
VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm
VSWR
–
5:1
–
Y
No damage at all phase angles, VDD = 50 V, IDQ = 1000 mA, PIN = 46 dBm Pulsed
Amplitude Droop
Output Stress Match
Notes:
1
Measured on wafer prior to packaging.
2
Scaled from PCM data.
3
Measured in CGHV37400F-AMP. Pulse Width = 100 μS, Duty Cycle = 10%.
4
The device is not recommended for 5:1 VSWR applications below 3.3 GHz.
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
2
CGHV37400F Rev 0.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Electrostatic Discharge (ESD) Classifications
Parameter
Symbol
Class
Test Methodology
Human Body Model
HBM
1A (> 250 V)
JEDEC JESD22 A114-D
Charge Device Model
CDM
II (200 < 500 V)
JEDEC JESD22 C101-C
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
3
CGHV37400F Rev 0.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Typical Performance
Figure 1. - Typical Small
Signal GainSparameters
and Return Losses vs Frequency
CGHV37400F
VDD = 50 V, IDQ = 1.0 A
Vdd = 50 V, Idq = 1 A
20
15
10
Magnitude (dB)
5
0
-5
S21
-10
S11
S22
-15
-20
-25
2.5
2.7
2.9
3.1
3.3
3.5
3.7
3.9
Frequency (GHz)
4.1
4.3
4.5
650
90
600
80
550
70
500
60
450
50
400
40
350
2.8
2.9
3.0
3.1
3.2
3.3
3.4
Frequency (GHz)
3.5
3.6
3.7
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
4
CGHV37400F Rev 0.0
3.8
3.9
Drain Efficiency (%)
Output Power (W)
Figure 2. - CGHV37400F Output Power and Drain Efficiency vs Frequency
CGHV37400F Output Power and Drain Efficiency vs. Frequency
VDD = 50 V, IDQ =
1.0
A, V,
PINIdq
= =46
dBm,
Width
100µs,
Duty
Cycle
= 10
%,%TCASE = 25˚C
Vdd
= 50
1 A,
Pin =Pulse
46 dBm,
Pulse=Width
= 100
us, Duty
Cycle
= 10
30
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Typical Performance
Figure 3. - Typical Output Power vs Input Power of the CGHV37400F
VDD = 50 V, IDQ = 1.0CGHV37400F
A, Pulse Width
= 100µs, Duty Cycle = 10%, TCASE = 25˚C
Output Power vs. Input Power
60
Output Power (dBm)
55
50
3.5 GHz
45
3.6 GHz
3.7 GHz
40
35
25
30
35
40
Input Power (dBm)
45
50
60
16
50
14
Drain Efficiency - 3.5 GHz
40
12
Drain Efficiency - 3.6 GHz
Drain Efficiency - 3.7 GHz
Gain - 3.5 GHz
30
10
Gain - 3.6 GHz
Gain - 3.7 GHz
20
8
10
6
0
25
30
35
40
Input Power (dBm)
45
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
5
CGHV37400F Rev 0.0
50
Gain (dB)
Drain Efficiency (%)
Figure 2. - CGHV37400F Drain Efficiency and Gain vs Input Power
VDD = 50 V, IDQ CGHV37400F
= 1.0 A, Pulse
Width
= 100µs,
Dutyvs.Cycle
10 %, TCASE = 25˚C
Drain
Efficiency
and Gain
Input =
Power
4
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
CGHV37400F-AMP Application Circuit Bill of Materials
Designator
Description
Qty
R1
RES, 511, OHM, +/- 1%, 1/16W, 0603
1
R2
RES, 5.1, OHM, +/- 1%, 1/16W, 0603
1
C1
CAP, 6.8pF, +/-0.25%, 250V, 0603
1
C2, C7, C8
CAP, 10.0pF, +/-1%, 250V, 0805
3
C3
CAP, 10.0pF, +/-5%, 250V, 0603
1
CAP, 470pF, 5%, 100V, 0603, X
2
C5
CAP, 33000 pF, 0805, 100V, X7R
1
C6
CAP, 10uF 16V TANTALUM
1
C10
CAP, 1.0uF, 100V, 10%, X7R, 1210
1
C11
CAP, 33uF, 20%, G CASE
1
C12
CAP, 3300uF, +/-20%, 100V, ELECTROLYTIC
1
CONN, SMA, PANEL MOUNT JACK, FL
2
J3
HEADER, RT>PLZ, 0.1CEN LK 9POS
1
J4
CONNECTOR; SMB, Straight, JACK, SMD
1
W1
CABLE, 18 AWG, 4.2
1
PCB, RO4350, 2.5 X 4.0 X 0.030
1
CGHV37400F
1
C4, C9
J1,J2
Q1
CGHV37400F Power Dissipation De-rating Curve
CGHV35400F Transient Power Dissipation De-Rating Curve
450
400
Power Dissipation (W)
350
Note 1
300
250
200
150
100
100 us 10 %
500 us 10 %
50
0
0
25
50
75
100
125
150
175
Case Temperature (°C)
Maximum Maximum
Case Temperature
(°C)
200
225
250
Note 1. Area exceeds Maximum Case Temperature (See Page 2).
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
6
CGHV37400F Rev 0.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
CGHV37400F-AMP Application Circuit Outline
CGHV37400F-AMP Application Circuit Schematic
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
7
CGHV37400F Rev 0.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Product Dimensions CGHV37400F (Package Type ­— 440217)
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
8
CGHV37400F Rev 0.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Part Number System
CGHV37400F
Package
Power Output (W)
Upper Frequency (GHz)
Cree GaN High Voltage
Parameter
Upper Frequency
1
Power Output
Package
Value
Units
3.7
GHz
400
W
Flange
-
Table 1.
Note1: Alpha characters used in frequency code
indicate a value greater than 9.9 GHz. See Table
2 for value.
Character Code
Code Value
A
0
B
1
C
2
D
3
E
4
F
5
G
6
H
7
J
8
K
9
Examples:
1A = 10.0 GHz
2H = 27.0 GHz
Table 2.
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
9
CGHV37400F Rev 0.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Product Ordering Information
Order Number
Description
Unit of Measure
CGHV37400F
GaN HEMT
Each
Test board without GaN HEMT
Each
Test board with GaN HEMT installed
Each
CGHV37400F-TB
CGHV37400F-AMP
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
10
CGHV37400F Rev 0.0
Image
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Disclaimer
Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet to be accurate
and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty,
representation or guarantee regarding the suitability of its products for any particular purpose. “Typical” parameters are the average
values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different
applications and actual performance can vary over time. All operating parameters should be validated by customer’s technical experts
for each application. Cree products are not designed, intended or authorized for use as components in applications intended for surgical
implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or
death or in applications for planning, construction, maintenance or direct operation of a nuclear facility.
For more information, please contact:
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
www.cree.com/rf
Sarah Miller
Marketing
Cree, RF Components
1.919.407.5302
Ryan Baker
Marketing & Sales
Cree, RF Components
1.919.407.7816
Tom Dekker
Sales Director
Cree, RF Components
1.919.407.5639
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
11
CGHV37400F Rev 0.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
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