Formosa MS FFM301-BS THRU FFM307-BS Chip Fast Recovery Rectifiers List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings and Electrical characteristics ................................... 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date Revised Date Revision Page. DS-121212 2012/10/25 - A 7 Formosa MS FFM301-BS THRU FFM307-BS Chip Fast Recovery Rectifiers 3.0A Surface Mount Fast Recovery Rectifiers-50-1000V Package outline SMB-S Features • Batch process design, excellent power dissipation offers 0.220(5.6) 0.205(5.2) better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to • • • • • • optimize board space. High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead-free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free parts, ex. FFM301-ΒS-H. 0.020(0.5) Typ. 0.083(2.1) 0.138(3.5) 0.122(3.1) 0.075(1.9) Mechanical data • Epoxy:UL94-V0 rated flame retardant • Case : Molded plastic, DO-214AA / SMB-S • Terminals : Solder plated, solderable per 0.067(1.7) 0.060(1.5) 0.040(1.0) Typ. MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.072 gram 0.040 (1.0) Typ. Dimensions in inches and (millimeters) Maximum ratings and Electrical characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave (JEDEC methode) V R = V RRM T J = 25 OC Reverse current Diode junction capacitance UNIT IO 3.0 A I FSM 100 A MIN. TYP. 5.0 IR V R = V RRM T J = 125 OC Thermal resistance MAX. Symbol Junction to ambient R θJA 36 Junction to case R θJC 22 CJ 60 f=1MHz and applied 4V DC reverse voltage Storage temperature T STG SYMBOLS *1 V RRM (V) V RMS*2 (V) *3 VR (V) FFM301-BS 50 35 50 FFM302-BS 100 70 100 FFM303-BS 200 140 200 FFM304-BS 400 280 400 FFM305-BS 600 420 600 FFM306-BS 800 560 800 FFM307-BS 1000 700 1000 *4 VF (V) Operating temperature T J, ( OC) *5 t rr (ns) μA 300 O pF +175 -65 C/W O C *1 Repetitive peak reverse voltage *2 RMS voltage 150 *3 Continuous reverse voltage 1.30 -55 to +150 250 *4 Maximum forward voltage@I F=3.0A *5 Maximum Reverse recovery time, note 1 500 Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date Revised Date Revision Page. DS-121212 2012/10/25 - A 7 Rating and characteristic curves (FFM301-BS THRU FFM307-BS) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 3.0 1.0 3.6 3.0 2.4 1.8 1.2 0.6 0 0 20 TJ=25 C 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE (°C) Pulse Width 300us 1% Duty Cycle 0.1 FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT .01 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) ( ) PEAK FORWAARD SURGE CURRENT,(A) 100 80 Sine Wave JEDEC method 40 20 0 1 (+) 1W NONINDUCTIVE 8.3ms Single Half TJ=25 C 60 5 50 10 100 NUMBER OF CYCLES AT 60Hz OSCILLISCOPE (NOTE 1) FIG.5-TYPICAL JUNCTION CAPACITANCE NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD CURRENT,(A) 50 trr | | | | | | | | +0.5A 0 -0.25A -1.0A REVERSE VOLTAGE,(V) 1cm SET TIME BASE FOR 50 / 10ns / cm http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 3 Document ID Issued Date Revised Date Revision Page. DS-121212 2012/10/25 - A 7 Formosa MS FFM301-BS THRU FFM307-BS Chip Fast Recovery Rectifiers Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 1 2 2 Marking Type number Marking code FFM301-BS FFM302-BS FFM303-BS FFM304-BS FFM305-BS FFM306-BS FFM307-BS F31 F32 F33 F34 F35 F36 F37 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SMB-S 0.078 (2.00) 0.059 (1.50) 0.110 (2.80) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 4 Document ID Issued Date Revised Date Revision Page. DS-121212 2012/10/25 - A 7 Formosa MS FFM301-BS THRU FFM307-BS Chip Fast Recovery Rectifiers Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SMB-S Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.81 5.74 2.24 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 5 Document ID Issued Date Revised Date Revision Page. DS-121212 2012/10/25 - A 7 Formosa MS FFM301-BS THRU FFM307-BS Chip Fast Recovery Rectifiers Reel packing PACKAGE SMB-S REEL SIZE 13" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 4,000 8.0 8,000 335*335*38 330 CARTON SIZE (m/m) 382*356*392 APPROX. GROSS WEIGHT (kg) CARTON (pcs) 17.0 88,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 6 Document ID Issued Date Revised Date Revision Page. DS-121212 2012/10/25 - A 7 Formosa MS FFM301-BS THRU FFM307-BS Chip Fast Recovery Rectifiers High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 7 Document ID Issued Date Revised Date Revision Page. DS-121212 2012/10/25 - A 7