TI1 BQ25898YFFR I2c controlled single cell 4-a fast charger Datasheet

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bq25898, bq25898D I2C Controlled Single Cell 4-A Fast Charger with MaxCharge™
Technology for High Input Voltage and Adjustable Voltage USB On-the-Go Boost Mode
1 Features
•
1
•
•
•
•
•
•
•
•
•
•
High Efficiency 4-A, 1.5-MHz Switch Mode Buck
Charge
– 92% Charge Efficiency at 3 A and 91% Charge
Efficiency at 2 A Charge Current
– Optimize for High Voltage Input (9 V / 12 V)
– Low Power PFM mode for Light Load
Operations
USB On-the-Go (OTG) with Adjustable Output
from 4.5 V to 5.5 V
– Selectable 500-KHz / 1.5-MHz Boost
Converter with up-to 2.4 A Output
– 93% Boost Efficiency at 5 V at 1 A Output
– Accurate Hiccup Mode Overcurent Protection
Single Input to Support USB Input and Adjustable
High Voltage Adapters
– Support 3.9-V to 14-V Input Voltage Range
– Input Current Limit (100 mA to 3.25 A with 50mA resolution) to Support USB2.0, USB3.0
standard and High Voltage Adapters
– Maximum Power Tracking by Input Voltage
Limit up-to 14V for Wide Range of Adapters
– Auto Detect USB SDP, CDP, DCP, and NonStandard Adapters (bq25898)
– Programmable D+/D- Drivers for Non-Standard
Adapter Handshake
Remote Battery Sensing
Input Current Optimizer (ICO) to Maximize Input
Power without Overloading Adapters
Resistance Compensation (IRCOMP) from
Charger Output to Cell Terminal
Highest Battery Discharge Efficiency with 5-mΩ
Battery Discharge MOSFET up to 9 A
Integrated ADC for System Monitor
(Voltage, Temperature, Charge Current)
Narrow VDC (NVDC) Power Path Management
– Instant-on Works with No Battery or Deeply
Discharged Battery
– Ideal Diode Operation in Battery Supplement
Mode
BATFET Control to Support Ship Mode, Wake Up,
and Full System Reset
Flexible Autonomous and I2C Mode for Optimal
System Performance
•
•
•
•
•
High Integration includes all MOSFETs, Current
Sensing and Loop Compensation
12-µA Low Battery Leakage Current to Support
Ship Mode
High Accuracy
– ±0.5% Charge Voltage Regulation
– ±5% Charge Current Regulation
– ±7.5% Input Current Regulation
Safety
– Battery Temperature Sensing for Charge and
Boost Mode
– Thermal Regulation and Thermal Shutdown
Available in 2.8-mm x 2.5-mm 42-Ball DSBGA
Package
2 Applications
•
•
•
Smart Phone
Tablet PC
Portable Internet Devices
3 Description
The bq25898, bq25898D are highly-integrated 4-A
switch-mode battery charge management and system
power path management devices for single cell Li-Ion
and Li-polymer battery. The devices support high
input voltage fast charging.
Device Information(1)
PACKAGE
BODY SIZE (NOM)
bq25898
PART NUMBER
DSBGA (42)
2.80 mm x 2.50 mm
bq25898D
DSBGA (42)
2.80 mm x 2.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
SYS
3.5V±4.5V
INPUT
3.9V±14V
USB
SW
VBUS
OTG
5V
BTST
SYS
ICHG
BAT
BATSEN
/QON
I2C BUS
Optional
bq25898X
Host
REGN
Host Control
TS
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq25898, bq25898D
SLUSCI7A – MARCH 2016 – REVISED APRIL 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (Continued) ........................................
Device and Documentation Support....................
1
1
1
2
3
4
6.1 Related Links ............................................................ 4
6.2
6.3
6.4
6.5
6.6
7
Device Support ........................................................
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
4
4
4
4
4
Mechanical, Packaging, and Orderable
Information ............................................................. 4
7.1 Package Option Addendum ...................................... 5
4 Revision History
Changes from Original (March 2016) to Revision A
•
2
Page
Updated product preview data sheet to production data ....................................................................................................... 1
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5 Description (Continued)
The low impedance power path optimizes switch-mode operation efficiency, reduces battery charging time and
extends battery life during discharging phase. The I2C Serial interface with charging and system settings makes
the device a truly flexible solution.
The bq25898/98D is a highly-integrated 4-A switch-mode battery charge management and system power path
management device for single cell Li-Ion and Li-polymer battery. It features fast charging with high input voltage
support for a wide range of smartphone, tablet and portable devices. Its low impedance power path optimizes
switch-mode operation efficiency, reduces battery charging time and extends battery life during discharging
phase. It also integrates Input Current Optimizer (ICO) and Resistance Compensation (IRCOMP) to deliver
maximum charging power to battery. The solution is highly integrated with input reverse-blocking FET (RBFET,
Q1), high-side switching FET (HSFET, Q2), low-side switching FET (LSFET, Q3), and battery FET (BATFET, Q4)
between system and battery. It also integrates the bootstrap diode for the high-side gate drive and battery
monitor for simplified system design. The I2C serial interface with charging and system settings makes the device
a truly flexible solution.
The device supports a wide range of input sources, including standard USB host port, USB charging port, and
USB compliant adjustable high voltage adapter. To support fast charging using adjustable high voltage adapter,
the bq25898D provides support for MaxCharge™ handshake using D+/D- pins and DSEL pin for USB switch
control. In addition, both bq25898D and bq25898 include interface to support adjustable high voltage adapter
using input current pulse protocol. To set the default input current limit, device uses the built-in USB interface
(bq25898D) or takes the result from detection circuit in the system (bq25898), such as USB PHY device. The
device is compliant with USB 2.0 and USB 3.0 power spec with input current and voltage regulation. In addition,
the Input Current Optimizer (ICO) supports the detection of maximum power point detection of the input source
without overload. The device also meets USB On-the-Go (OTG) operation power rating specification by
supplying 5 V (Adjustable 4.5V-5.5V) on VBUS with current limit up to 2.4 A.
The power path management regulates the system slightly above battery voltage but does not drop below 3.5V
minimum system voltage (programmable). With this feature, the system maintains operation even when the
battery is completely depleted or removed. When the input current limit or voltage limit is reached, the power
path management automatically reduces the charge current to zero. As the system load continues to increase,
the power path discharges the battery until the system power requirement is met. This operation prevents
overloading the input source.
The device initiates and completes a charging cycle without software control. It automatically detects the battery
voltage and charges the battery in three phases: pre-conditioning, constant current and constant voltage. At the
end of the charging cycle, the charger automatically terminates when the charge current is below a preset limit in
the constant voltage phase. When the full battery falls below the recharge threshold, the charger will
automatically start another charging cycle.
The charger provides various safety features for battery charging and system operations, including battery
temperature negative thermistor monitoring, charging safety timer and overvoltage/overcurrent protections. The
thermal regulation reduces charge current when the junction temperature exceeds 120°C (programmable). The
STAT output reports the charging status and any fault conditions. The PG output (bq25898) indicates if a good
power source is present. The INT immediately notifies host when fault occurs.
The device also provides a 7-bit analog-to-digital converter (ADC) for monitoring charge current and
input/battery/system (VBUS, BAT, SYS, TS) voltages. The QON pin provides BATFET enable/reset control to
exit low power ship mode or full system reset function.
The devices are available in a 42-ball, 2.8 mm x 2.5 mm DSBGA package.
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6 Device and Documentation Support
6.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
bq25898
Click here
Click here
Click here
Click here
Click here
bq25898D
Click here
Click here
Click here
Click here
Click here
6.2 Device Support
6.2.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
6.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
6.4 Trademarks
MaxCharge, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
6.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
6.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
4
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SLUSCI7A – MARCH 2016 – REVISED APRIL 2016
7.1 Package Option Addendum
7.1.1 Packaging Information
Orderable Device
(1)
(2)
(3)
(4)
(5)
Status
(1)
Package
Type
Package
Drawing
Pins
Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
BQ25898YFFR
ACTIVE
DSBGA
YFF
42
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1
YEAR
-40 to 85
BQ25898YFFT
ACTIVE
DSBGA
YFF
42
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1
YEAR
-40 to 85
BQ25898DYFFR
ACTIVE
DSBGA
YFF
42
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1
YEAR
-40 to 85
BQ25898DYFFT
ACTIVE
DSBGA
YFF
42
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1
YEAR
-40 to 85
Device Marking (4) (5)
BQ28598
BQ28598D
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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7.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
6
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
BQ25898YFFR
DSBGA
YFF
42
3000
180
8.4
2.66
2.95
0.81
4.0
8.0
Q1
BQ25898YFFT
DSBGA
YFF
42
250
180
8.4
2.66
2.95
0.81
4.0
8.0
Q1
BQ25898DYFFR
DSBGA
YFF
42
3000
180
8.4
2.66
2.95
0.81
4.0
8.0
Q1
BQ25898DYFFT
DSBGA
YFF
42
250
180
8.4
2.66
2.95
0.81
4.0
8.0
Q1
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SLUSCI7A – MARCH 2016 – REVISED APRIL 2016
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ25898YFFR
DSBGA
YFF
42
3000
182
182
20
BQ25898YFFT
DSBGA
YFF
42
250
182
182
20
BQ25898DYFFR
DSBGA
YFF
42
3000
182
182
20
BQ25898DYFFT
DSBGA
YFF
42
250
182
182
20
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Product Folder Links: bq25898 bq25898D
7
PACKAGE OUTLINE
YFF0042
DSBGA - 0.625 mm max height
SCALE 4.500
DIE SIZE BALL GRID ARRAY
B
E
A
BUMP A1
CORNER
D
D: Max = 2.79mm, Min = 2.85mm
E: Max = 2.50mm, Min = 2.56mm
C
0.625 MAX
SEATING PLANE
BALL TYP
0.30
0.12
0.05 C
2 TYP
SYMM
G
F
E
2.4
TYP
SYMM
D
C
42X
B
0.4 TYP
A
1
2
3
4
5
0.3
0.2
0.015
C A
B
6
0.4 TYP
4222067/A 05/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YFF0042
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
42X ( 0.23)
2
1
(0.4) TYP
3
4
5
6
A
B
C
SYMM
D
E
F
G
SYMM
LAND PATTERN EXAMPLE
SCALE:25X
( 0.23)
METAL
0.05 MAX
0.05 MIN
( 0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4222067/A 05/2015
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFF0042
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
42X ( 0.25)
1
A
(0.4)
TYP
METAL
TYP
2
4
3
5
6
B
C
SYMM
D
E
F
G
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4222067/A 05/2015
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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