Diodes DMT6008LFG-13 N-channel enhancement mode mosfet Datasheet

DMT6008LFG
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RDS(ON) max
ID max
TC = +25°C
7.5mΩ @ VGS = 10V
60A
11.5mΩ @ VGS = 4.5V
49A
V(BR)DSS
NEW PRODUCT
ADVANCE
INFORMATION
NEW PRODUCT
60V
Features and Benefits
•
Low RDS(ON) – Ensures on State Losses Are Minimized
•
Excellent Qgd x RDS (ON) Product (FOM)
•
Advanced Technology for DC/DC Converts
•
Small Form Factor Thermally Efficient Package Enables Higher
Density End Products
•
Description
Occupies Just 33% of the Board Area Occupied by SO-8 Enabling
Smaller End Product
This MOSFET has been designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
•
•
ESD Protected Gate
ideal for high efficiency power management applications.
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Applications
100% UIS (Avalanche) rated
•
Synchronous Rectifier
•
Backlighting
Mechanical Data
•
Power Management Functions
•
•
DC-DC Converters
•
®
Case: POWERDI 3333-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
S
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminal Connections Indicator: See diagram
•
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208 e3
•
Weight: 0.008 grams (approximate)
D
Pin 1
S
S
G
G
D
ESD PROTECTED
D
D
D
Bottom View
Top View
Internal Schematic
Gate Protection
Diode
S
Ordering Information (Note 4)
Part Number
DMT6008LFG-7
DMT6008LFG-13
Notes:
Case
POWERDI3333-8
POWERDI3333-8
Packaging
2,000/Tape & Reel
3,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
S6E = Product Type Marking Code
YYWW = Date Code Marking
YY = Last digit of year (ex: 13 = 2013)
WW = Week code (01 ~ 53)
DMT6008LFG
Document number: DS36680 Rev. 2 - 2
1 of 6
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© Diodes Incorporated
DMT6008LFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Drain-Source Voltage
NEW PRODUCT
ADVANCE
INFORMATION
NEW PRODUCT
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
VDSS
Value
60
Units
V
VGSS
±12
V
TA = +25°C
TA = +70°C
ID
13
11
A
TC = +25°C
TC = +70°C
ID
60
48
A
A
Maximum Continuous Body Diode Forward Current (Note 5)
IS
3
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
IDM
80
A
Avalanche Current (Note 6)
IAS
13
A
Avalanche Energy (Note 6)
EAS
25
mJ
Value
2.2
Units
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
TA = +25°C
Total Power Dissipation (Note 5)
PD
RθJC
41
58
35
3
TJ, TSTG
-55 to +150
TC = +25°C
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 5)
RθJA
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
60
—
—
V
VGS = 0V, ID = 1mA
Zero Gate Voltage Drain Current
IDSS
—
—
1
μA
VDS = 48V, VGS = 0V
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
IGSS
—
—
±10
μA
VGS = ±10V, VDS = 0V
VGS(th)
0.7
—
2.0
V
VDS = VGS, ID = 250μA
—
5.0
7.5
RDS(ON)
—
6.5
11.5
—
19
—
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
VSD
—
0.9
1.2
Ciss
—
2713
—
Output Capacitance
Coss
—
822
—
Reverse Transfer Capacitance
Crss
—
57
—
Gate Resistance
Rg
—
0.54
—
Total Gate Charge (VGS = 4.5V)
Qg
—
22.4
—
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Qg
—
50.4
—
Qgs
—
9.6
—
Static Drain-Source On-Resistance
Gate-Drain Charge
Qgd
—
7.8
—
Turn-On Delay Time
tD(on)
—
7.0
—
Turn-On Rise Time
tr
—
4.4
—
Turn-Off Delay Time
tD(off)
—
24.4
—
tf
—
7.0
—
Turn-Off Fall Time
Notes:
VGS = 10V, ID = 20A
mΩ
VGS = 4.5V, ID = 20A
VGS = 3V, ID = 3A
V
VGS = 0V, IS = 20A
pF
VDS = 30V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = 30V, ID = 20A
nS
VDD = 30V, VGS = 10V,
ID = 20A, RG = 3Ω,
5. RΘJA is determined with the device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. RθJC is guaranteed by design
while RΘJA is determined by the user’s board design.
6 .UIS in production with L = 0.3mH, TJ = +25°C
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
DMT6008LFG
Document number: DS36680 Rev. 2 - 2
2 of 6
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July 2014
© Diodes Incorporated
DMT6008LFG
30
30.0
VDS = 5.0V
25.0
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VGS = 4.5V
20.0
20
VGS = 4.0V
VGS = 3.5V
15.0
VGS = 3.0V
TA = 125°C
T A = 85°C
T A = 25°C
10
5.0
TA = -55°C
5
0.0
0.00
VGS = 2.5V
0.50
1.00
1.50
2.00
2.50
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
0
3.00
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
5
0.10
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
1.0
0.09
0.08
VGS = 3.0V
0.07
0.1
0.06
0.05
0.04
VGS = 4.5V
0.01
0.03
VGS = 10V
ID = 20A
0.02
0.01
0.001
0
0.016
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
T A = 150°C
TA = 125°C
0.012
T A = 85°C
0.01
0.008
T A = 25°C
TA = -55°C
0.006
0.004
0
5
10
15
20
25
ID, DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
DMT6008LFG
Document number: DS36680 Rev. 2 - 2
ID = 3.0A
2
3
4
5
6
7
8
9 10 11
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristics
12
2
VGS = 4.5V
0.014
0.002
0.00
30
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
TA = 150°C
15
10.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
NEW PRODUCT
ADVANCE
INFORMATION
NEW PRODUCT
25
VGS = 10V
30
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VGS = 10V
ID = 10A
1.6
VGS = 4.5V
ID = 5A
1.2
0.8
0.4
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
July 2014
© Diodes Incorporated
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
2.4
0.014
0.012
VGS = 4.5V
ID = 5A
0.01
0.008
VGS = 10V
ID = 10A
0.006
0.004
0.002
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 On-Resistance Variation with Temperature
2.2
2
1.8
1.2
1
0.8
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
1000
25
100
15
10
TA = 150°C
T A = 85°C
5
T A = 125°C
0
TA = 25°C
r(t), TRANSIENT THERMAL RESISTANCE
PW = 100µs
10
DC
1
PW = 10s
PW = 1s
0.1
TJ(max) = 150°C
PW = 100ms
PW = 10ms
PW = 1ms
VGS = 4.5V
Single Pulse
DUT on 1 * MRP Board
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
1
RDS(on)
Limited
0.01 TA = 25°C
TA = -55°C
0
ID = 250µA
1.4
30
20
ID = 1mA
1.6
-ID, DRAIN CURRENT (A)
IS, SOURCE CURRENT (A)
NEW PRODUCT
ADVANCE
INFORMATION
NEW PRODUCT
DMT6008LFG
0.001
0.01
0.1
1
10
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 SOA, Safe Operation Area
100
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
0.01
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 122°C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.0001
DMT6008LFG
Document number: DS36680 Rev. 2 - 2
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
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100
1000
July 2014
© Diodes Incorporated
DMT6008LFG
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
®
A
POWERDI 3333-8
Dim Min Max Typ
D
3.25 3.35 3.30
E
3.25 3.35 3.30
D2 2.22 2.32 2.27
E2 1.56 1.66 1.61
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.203
−
−
b
0.27 0.37 0.32
b2
0.20
−
−
L
0.35 0.45 0.40
L1
0.39
−
−
e
0.65
−
−
Z
0.515
−
−
All Dimensions in mm
A3
NEW PRODUCT
ADVANCE
INFORMATION
NEW PRODUCT
A1
D
D2
Pin 1 ID
1
L
(4x)
4
b2
(4x)
E
E2
8
Z (4x)
5
e
L1
(3x)
b (8x)
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
Dimensions
C
G
G1
Y
Y1
Y2
Y3
X
X2
G
Y2
8
5
G1
Y1
Y
1
4
Y3
X2
DMT6008LFG
Document number: DS36680 Rev. 2 - 2
Value (in mm)
0.650
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
C
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© Diodes Incorporated
DMT6008LFG
IMPORTANT NOTICE
NEW PRODUCT
ADVANCE
INFORMATION
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2014, Diodes Incorporated
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DMT6008LFG
Document number: DS36680 Rev. 2 - 2
6 of 6
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July 2014
© Diodes Incorporated
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