Microchip C1410NCUA 0.5a high-speed mosfet driver Datasheet

M
TC1410/TC1410N
0.5A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Will Withstand 500 mA
Reverse Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 0.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 500 pF in 25 nsec
• Short Delay Time: 30 nsec Typ.
• Consistent Delay Times With Changes in Supply
Voltage
• Matched Delay Times
• Low Supply Current
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 16Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1411/TC1412/TC1413
The TC1410/TC1410N are 0.5A CMOS buffers/drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
Switch Mode Power Supplies
Line Drivers
Pulse Transformer Drive
Relay Driver
8-Pin MSOP/PDIP/SOIC
VDD 1
IN 2
NC 3
GND 4
2
8 VDD
7 OUT
6 OUT
5 GND
6,7
Inverting
VDD 1
TC1410N
•
•
•
•
Package Type
TC1410
Applications
As MOSFET drivers, the TC1410/TC1410N can easily
charge a 500 pF gate capacitance in 25 nsec with
matched rise and fall times, and provide low enough
impedance in both the ‘ON’ and ‘OFF’ states to ensure
the MOSFET’s intended state will not be affected, even
by large transients. The leading and trailing edge
propagation delay times are also matched to allow
driving short-duration inputs with greater accuracy.
IN 2
NC 3
GND 4
2
8 VDD
7 OUT
6 OUT
5 GND
6,7
Non-Inverting
NC = No Connection
NOTE: Duplicate pins must be connected together
for proper operation.
 2003 Microchip Technology Inc.
DS21389C-page 1
TC1410/TC1410N
Functional Block Diagram
TC1410
VDD
Inverting
Output
300 mV
Output
Non-Inverting
Output
Input
Effective
Input C = 10 pF
4.7V
TC1410N
GND
DS21389C-page 2
 2003 Microchip Technology Inc.
TC1410/TC1410N
1.0
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Symbol
Absolute Maximum Ratings †
Description
VDD
Supply input, 4.5V to 16V
INPUT
Supply Voltage ..................................................... +20V
Input Voltage ...................... VDD + 0.3V to GND – 5.0V
Power Dissipation (TA ≤ 70°C)
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Control input
NC
Storage Temperature Range.............. -65°C to +150°C
No connection
GND
Ground
GND
Ground
OUTPUT
CMOS push-pull output,
common to pin 7
OUTPUT
CMOS push-pull output,
common to pin 6
Maximum Junction Temperature ...................... +150°C
Supply input, 4.5V to 16V
VDD
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.0
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-1
—
1
µA
-10
—
10
Conditions
Input
0V ≤ VIN ≤ VDD, TA = +25°C
-40°C ≤ TA ≤ +85°C
Output
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance
RO
—
16
22
Ω
—
20
28
—
20
28
IPK
—
0.5
—
A
VDD = 16V
IREV
—
0.5
—
A
Duty cycle ≤ 2%, t ≤ 300 µsec,
VDD = 16V
tR
—
25
35
nsec
—
27
40
0°C ≤ TA ≤ +70°C
—
29
40
—
25
35
-40°C ≤ TA ≤ +85°C, Figure 4-1
TA = +25°C
—
27
40
Peak Output Current
Latch-Up Protection
Withstand Reverse Current
VDD = 16V, IO = 10 mA, TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
Switching Time (Note 1)
Rise Time
Fall Time
tF
Delay Time
Note 1:
tD1
nsec
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
—
29
40
—
30
40
—
33
45
0°C ≤ TA ≤ +70°C
—
35
45
-40°C ≤ TA ≤ +85°C, Figure 4-1
nsec
TA = +25°C
Switching times ensured by design.
 2003 Microchip Technology Inc.
DS21389C-page 3
TC1410/TC1410N
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Delay Time
Sym
Min
Typ
Max
Units
Conditions
tD2
—
30
40
nsec
—
33
45
0°C ≤ TA ≤ +70°C
—
35
45
-40°C ≤ TA ≤ +85°C, Figure 4-1
—
0.5
1.0
—
0.1
0.15
TA = +25°C
Power Supply
Power Supply Current
Note 1:
IS
mA
VIN = 3V, VDD = 16V
VIN = 0V
Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range (C)
TA
0
—
+70
ºC
ºC
Conditions
Temperature Ranges
Specified Temperature Range (E)
TA
-40
—
+85
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
Thermal Resistance, 8L-MSOP
θJA
—
206
—
ºC/W
Thermal Resistance, 8L-PDIP
θJA
—
125
—
ºC/W
Thermal Resistance, 8L-SOIC
θJA
—
155
—
ºC/W
Package Thermal Resistances
DS21389C-page 4
 2003 Microchip Technology Inc.
TC1410/TC1410N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
500
500
TA = +25°C
400
VIN = 3V
ISUPPLY (µA)
ISUPPLY (µA)
400
300
200
100
0
VSUPPLY = 16V
VIN = 3V
6
8
10
12
14
200
100
VIN = 0V
4
300
0
16
VIN = 0V
-40
-20
0
VDD (V)
FIGURE 2-1:
Quiescent Supply Current
vs. Supply Voltage.
1.6
FIGURE 2-4:
vs. Temperature.
1.6
TA = +25°C
1.4
1.3
VIL
1.2
60
80
Quiescent Supply Current
VSUPPLY = 16V
4
VIH
1.4
1.3
VIL
1.2
6
8
10
12
14
1.1
16
-40
-20
VDD (V)
FIGURE 2-2:
Voltage.
0
20
40
60
80
TEMPERATURE (°C)
Input Threshold vs. Supply
FIGURE 2-5:
Temperature.
50
Input Threshold vs.
50
TA = +85°C
40
RDS-ON (Ohms)
40
RDS-ON (Ohms)
40
1.5
VIH
VTHRESHOLD (V)
VTHRESHOLD (V)
1.5
1.1
20
TEMPERATURE (°C)
TA = +25°C
30
20
TA = -40°C
10
30
20
TA = +85°C
TA = +25°C
10
TA = -40°C
0
0
4
6
8
10
12
VDD (V)
FIGURE 2-3:
High-State Output
Resistance vs. Supply Voltage.
 2003 Microchip Technology Inc.
14
16
4
6
8
10
12
14
16
VDD (V)
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage.
DS21389C-page 5
TC1410/TC1410N
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
100
100
CLOAD = 500 pF
80
60
tFALL (nsec)
tRISE (nsec)
80
TA = +85°C
TA = +25°C
40
20
0
4
6
8
100
10
VDD (V)
60
TA = +85°C
40
TA = +25°C
20
TA = -40°C
FIGURE 2-7:
Voltage.
TA = -40°C
12
14
0
16
Rise Time vs. Supply
4
6
8
FIGURE 2-10:
Voltage.
100
CLOAD = 500 pF
TA = +85°C
tD2 (nsec)
60
TA = +25°C
40
14
16
CLOAD = 500 pF
60
TA = +85°C
TA = +25°C
40
TA = -40°C
20
4
6
8
FIGURE 2-8:
Supply Voltage.
10
VDD (V)
12
14
Propagation Delay vs.
4
TA = +25°C
VDD = 16V
Propagation Delays (nsec)
60
40
20
500
1000
1500
2000
2500
3000
8
3500
DS21389C-page 6
Rise and Fall Times vs.
12
14
16
Propagation Delay vs.
tD2
41
tD1
37
33
29
25
0
500
1000
CLOAD (pF)
FIGURE 2-9:
Capacitive Load.
10
VDD (V)
TA = +25°C
VDD = 16V
tRISE
tFALL
0
6
FIGURE 2-11:
Supply Voltage.
80
0
0
16
45
100
tRISE, tFALL (nsec)
12
Fall Time vs. Supply
TA = -40°C
20
0
10
VDD (V)
80
80
tD1 (nsec)
CLOAD = 500 pF
1500
2000
2500
3000
3500
CLOAD (pF)
FIGURE 2-12:
Capacitive Load.
Propagation Delays vs.
 2003 Microchip Technology Inc.
TC1410/TC1410N
3.0
PIN DESCRIPTIONS
3.3
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
3.1
PIN FUNCTION TABLE
Symbol
CMOS Push-Pull Output
(OUTPUT)
The MOSFET driver output is a low-impedance,
CMOS, push-pull style output, capable of driving a
capacitive load with 0.5 A peak currents.
Description
Supply input, 4.5V to 16V
3.4
Control input
The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
1
VDD
2
INPUT
3
NC
4
GND
Ground
5
GND
Ground
6
OUTPUT
CMOS push-pull output, common
to pin 7
7
OUTPUT
CMOS push-pull output, common
to pin 6
8
VDD
No connection
Ground
Supply input, 4.5V to 16V
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2
Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input also has
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
 2003 Microchip Technology Inc.
DS21389C-page 7
TC1410/TC1410N
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
VDD = 16V
0V
1.0 µF
0.1 µF
1, 8
Input
10%
tD1
VDD
tD2
tF
tR
90%
90%
Output
2
6, 7
Output
10%
10%
0V
Inverting Driver
TC1410
CL = 500 pF
TC1410
TC1410N
+5V
90%
Input
4, 5
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
0V
VDD
10%
tD1 90%
Output
0V
90%
tR
10%
tD2
tF
10%
Non-Inverting Driver
TC1410N
FIGURE 4-1:
DS21389C-page 8
Switching Time Test Circuit.
 2003 Microchip Technology Inc.
TC1410/TC1410N
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
8-Lead MSOP
YWWNNN
Note:
*
Example:
TC1410
COA0346
Example:
1410NE
346057
XXXXXXX
XX...X
YY
WW
NNN
TC1410
CPA057
0346
057
NNN
Legend:
Example:
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
 2003 Microchip Technology Inc.
DS21389C-page 9
TC1410/TC1410N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21389C-page 10
 2003 Microchip Technology Inc.
TC1410/TC1410N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2003 Microchip Technology Inc.
DS21389C-page 11
TC1410/TC1410N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
n
p
MIN
INCHES
NOM
MAX
MILLIMETERS*
NOM
8
0.65 BSC
0.75
0.85
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
0.08
0.22
5°
5°
-
MIN
8
Number of Pins
.026 BSC
Pitch
A
.043
Overall Height
A2
.030
.033
.037
Molded Package Thickness
A1
.006
.000
Standoff
E
.193 TYP.
Overall Width
E1
.118 BSC
Molded Package Width
D
.118 BSC
Overall Length
L
.016
.024
.031
Foot Length
Footprint (Reference)
F
.037 REF
φ
Foot Angle
0°
8°
c
Lead Thickness
.003
.006
.009
B
.009
.012
.016
Lead Width
α
5°
15°
Mold Draft Angle Top
β
5°
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21389C-page 12
 2003 Microchip Technology Inc.
TC1410/TC1410N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Examples:
a)
b)
Device:
TC1410: 0.5A Single MOSFET Driver, Inverting
TC1410N: 0.5A Single MOSFET Driver, Non-Inverting
Temperature Range:
C
E
Package:
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
c)
=
=
0°C to +70°C
-40°C to +85°C
TC1410COA:
0.5A Single MOSFET
driver, SOIC package,
0°C to +70°C.
TC1410CPA:
0.5A Single MOSFET
driver, PDIP package,
0°C to +70°C.
TC1410EUA713: Tape and Reel,
0.5A Single MOSFET
driver, MSOP package,
-40°C to +85°C.
a)
TC1410NCPA:
b)
TC1410NEPA:
c)
TC1410NEUA:
* MSOP package is only available in E-Temp.
0.5A Single MOSFET
driver, PDIP package,
0°C to +70°C.
0.5A Single MOSFET
driver, PDIP package,
-40°C to +85°C.
0.5A Single MOSFET
driver, MSOP package,
-40°C to +85°C.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2003 Microchip Technology Inc.
DS21389C-page 13
TC1410/TC1410N
NOTES:
DS21389C-page 14
 2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2003 Microchip Technology Inc.
DS21389C-page 15
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100
Fax: 86-10-85282104
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
China - Beijing
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Fax: 86-28-86766599
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
Phoenix
China - Shunde
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966
Fax: 480-792-4338
Room 401, Hongjian Building
No. 2 Fengxiangnan Road, Ronggui Town
Shunde City, Guangdong 528303, China
Tel: 86-765-8395507 Fax: 86-765-8395571
San Jose
China - Qingdao
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950
Fax: 408-436-7955
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Toronto
India
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
DS21389C-page 16
Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
07/28/03
 2003 Microchip Technology Inc.
Similar pages