BAL-2690D3U 50 / 30+j25 balun transformer for 2.45 GHz ISM band Features ■ 50 Ω nominal input / 30+j25 output differential impedance ■ Low insertion loss ■ Low amplitude imbalance ■ Low phase imbalance ■ Small footprint: BAL-2690D3U < 1 mm² Flip-Chip 4 bumps Benefits ■ Very low profile (<700 µm) ■ High RF performances ■ RF BOM and area reduction Figure 1. Top view Top View Applications A2 A2 GND A1 A1 Balun transformer for applications such as: ■ Bluetooth STLC2690 ■ Mobile phone BAL - ZC C Description B1 B1 B2 B2 SE BAL + Bump Name Description The BAL-2690D3U is a balun designed to transform single ended signals to differential signals in Bluetooth applications. A1 A2 BAL- RF balanced ouput GND Ground B1 BAL+ RF balanced ouput The BAL-2690D3U has been customized for the STLC2690 Bluetooth transceiver with 0.8 dB insertion losses in the bandwidth (2400 MHz - 2500 MHz) and with a specific requirement for the SCC22 parameter. B2 SE RF input The BAL-2690D3U has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performances. Figure 2. Application schematic WLAN PA + SP3T 2.4G Antenna Band Pass Filter BT Balun BT RFIC TM: IPAD is a trademark of STMicroelectronics. February 2010 Doc ID 16056 Rev 2 1/8 www.st.com 8 Electrical characteristics 1 Electrical characteristics Table 1. Absolute maximum ratings (limiting values) Symbol Min. Typ. Max. Unit - - 20 dBm - - V - +85 °C Min. Typ. Max. Unit Nominal differential output impedance - 30 + j25 - Ω ZIN Nominal input impedance - 50 - Ω Table 3. RF performance Min. Typ. Max. Unit 2402 2441 2480 MHz PIN VESD TOP Table 2. Test condition Input power RFIN ESD ratings MIL STD883G (HBM: C = 100 pF, R = 1.5k , air discharge) ESD ratings, machine model (MM: C = 200 pF, R = 25 Ω L = 500 nH) ESD ratings, charged device model (CDM) (JESD22-C101D) Operating temperature ZOUT 2000 500 500 -40 Electrical characteristics (Tamb = 25 °C) impedances Symbol Test condition Symbol Test condition F Frequency range (bandwidth) IL Insertion loss in bandwidth - 0.8 1.1 dB Ripple in bandwidth - - 0.6 dB Return loss in bandwidth 14 - - dB Φ imb Phase imbalance -10 - 10 ° Aimb Amplitude imbalance -1 - 1 dB Common mode rejection ratio (SSC12) 20 - - dB Magnitude for common mode harmonic rejection coefficient @ 2fO 0.7 - 1 ripple RL RCMRR SCC22 2/8 BAL-2690D3U Phase for common mode harmonic rejection coefficient @ 2fO From 4804 MHz to 4960 MHz, 25 Ω is considered as reference for CM Doc ID 16056 Rev 2 ° -45 - 0 BAL-2690D3U Figure 3. Electrical characteristics Insertion loss (Tamb= 25 °C) dB - 0.9 Figure 4. m2 -10 Return loss (Tamb= 25 °C) dB m1 - 1.0 -15 Ripple in band 0.02 dB typ. - 1.1 -20 - 1.2 -25 - 1.3 F(Hz) - 1.4 2.2E9 2.4E9 2.3E9 Figure 5. 2.5E9 2.7E9 2.2E9 Amplitude imbalance (Tamb= 25 °C) Figure 6. dB 1.0 F(Hz) -30 2.6E9 2.3E9 2.4E9 2.6E9 2.5E9 2.7E9 Phase imbalance (Tamb= 25 °C) 10 0.5 5 0.0 0.0 -0.5 -5 F(Hz) -1.0 2.2E9 2.3E9 Figure 7. 2.4E9 2.5E9 2.6E9 2.2E9 2.7E9 Scc22 magnitude @ 2f0 (Tamb = 25 °C) F(Hz) -10 Figure 8. 2.3E9 2.4E9 2.5E9 2.6E9 2.7E9 Scc22 phase @2f0 (Tamb = 25 °C) 0 1.0 - 10 0.9 - 20 - 30 0.8 - 40 F(Hz) 0.7 4.6E9 4.7E9 4.8E9 4.9E9 5.0E9 5.1E9 5.2E9 F(Hz) - 50 4.6E9 Doc ID 16056 Rev 2 4.7E9 4.8E9 4.9E9 5.0E9 5.1E9 5.2E9 3/8 Electrical characteristics Figure 9. BAL-2690D3U Recommend land pattern (used for balun characterization) 35 µm 76 µm 18 µm L1 L2 540 µm No GND under the die in L1 GND under the die in L2 18 µm 76 µm 35um Figure 10. Example of transceiver application board land pattern 4/8 Doc ID 16056 Rev 2 L3 L4 BAL-2690D3U Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 4. Package dimensions (values) Dimensions Millimetres Ref. Inches Min. Typ. Max. Min. Typ. Max. A 0.565 0.63 0.695 0.022 0.025 0.027 A1 0.17 0.205 0.24 0.007 0.008 0.009 A2 - 0.4 - - 0.016 - b 0.215 0.255 0.295 0.008 0.010 0.012 D 0.86 0.91 0.96 0.034 0.036 0.038 D1 - 0.474 - - 0.019 - E 0.86 0.91 0.96 0.034 0.036 0.038 E1 - 0.474 - - 0.019 - SE - 0.237 - - 0.009 - $ - 0.025 - - 0.001 - Figure 11. Package dimensions (definitions) A2 E A1 ZC B2 SE E1 b B1 $ A1 A2 D A 2 Package information D1 Doc ID 16056 Rev 2 5/8 Package information BAL-2690D3U Figure 12. Footprint Figure 13. Marking Dot, ST logo Copper pad diameter: 220 µm recommended ECOPACK® Grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening 300 µm minimum Solder stencil opening: 220 µm recommended x x z y ww Figure 14. Flip-Chip - tape and reel specification 2.0 ± 0.05 4.0 ± 0.1 Ø 1.50 ± 0.10 1.75 ± 0.1 Dot identifying pin A1 location 1.0 ± 0.05 x x z y ww x x z y ww x x z y ww 3.5 ± 0.05 1.0 ± 0.05 8.0 ± 0.3 0.20 ± 0.015 2.0 ± 0.05 0.73± 0.05 All dimensions in mm Note: 6/8 User direction of unreeling More packing information is available in the applications note: AN 2348: “Flip-Chip: package description and recommendations for use” Doc ID 16056 Rev 2 BAL-2690D3U 3 Ordering information Ordering information Table 5. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode BAL-2690D3U RP Flip-Chip 1.02 mg 5000 Tape and reel Revision history Table 6. Document revision history Date Revision Changes 25-Jan-2010 1 First issue. 08-Feb-2010 2 Updated Table 1 and Figure 10. Doc ID 16056 Rev 2 7/8 BAL-2690D3U Please Read Carefully: Information in this document is provided solely in connection with ST products. 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