TI1 DLPC230-Q1 Automotive dmd controller Datasheet

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DLPC230-Q1
DLPS127 – MAY 2018
DLPC230-Q1 Automotive DMD Controller
1 Features
2 Applications
•
•
•
•
•
•
•
•
•
•
•
Wide Field of View and Augmented Reality
Head-up Display (HUD)
High Resolution Headlight
•
3 Description
The DLPC230-Q1 DMD Display Controller for
automotive applications is part of two DMD chipsets:
DLP5530-Q1 (interior applications, such as HUD) and
DLP5531-Q1 (exterior applications, such as high
resolution headlight). Both chipsets include a 0.55”
DMD and the TPS99000-Q1 System Management
and Illumination controller. The DLPC230-Q1
integrates an embedded processor with error code
correction, enabling host control and real-time
feedback, on-chip diagnostics, and system monitoring
functions. On-chip SRAM is included to remove the
need for external DRAM. Combined with the
TPS99000-Q1, the DLPC230-Q1 supports high
dynamic range dimming of over 5000:1 for HUD
applications. Sub-LVDS 600-MHz DMD interface
allows high DMD refresh rates to generate seamless
and brilliant digital images, while simultaneously
reducing radiated emissions.
Device Information(1)
PART NUMBER
DLPC230-Q1
PACKAGE
BGA (324)
BODY SIZE (NOM)
23.00 × 23.00 mm2
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Standalone System
VBATT
Power
Regulation
Control &
Monitor
TPS99000-Q1
PROJ_ON
1.1V
1.8V
3.3V
6.5V
Power sequencing
and monitoring
Reset &
Power Good
I2C
HOST
IRQ
System Diagnostics:
external watchdogs,
over brightness, and
other monitors
DLPC230-Q1
Host
SPI
MPU
SPI
Internal
Control
Illumination
Control
& feedback
Flash
SPI
6.5V
Ultra wide
dimming LED
Controller
2-TIA, 12bit ADC
DAC, FET Drive, ...
DMD Power
Regulation
OpenLDI
24-bit RGB
& Syncs
External
Monitor
SPI
Image Scaling &
Bezel
adjustment
LED
drive
LED
Control
FET
Drive
F
E
T
s
GPIO
(configurable)
eSRAM
frame buffer
Sub-LVDS
TMP411
I2C
DMD Power
Photodiode
DLP553X-Q1
0.55 s450
1.3MP DMD
Copyright © 2018, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to
change without notice.
ADVANCE INFORMATION
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 2: –40°C to 105°C
Ambient Operating Temperature
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C4B
DMD Display Controller Supporting:
– DLP5530-Q1 Automotive Interior Chipset
– DLP5531-Q1 Automotive Exterior Chipset
Video Processing
– Scales Input Image to Match DMD Resolution
– Bezel Adjustment up ±50% Vertical Image
Position and ±10% Horizontal Reducing the
Need for Mechanical Alignment
– Support for Pixel Doubling or Quadrupling to
Allow Low Resolution Video Input
– Gamma Correction
Embedded Processor With Error Correction
– On-Chip Diagnostic and Self-Test Capability
– System Diagnostics Including Temperature
Monitoring, Device Interface Monitoring, and
Photodiode Monitoring
– Integrated Management of Smooth Dimming
– Configurable GPIO
No External RAM Required, Internal SRAM for
Image Processing
600-MHz Sub-LVDS DMD Interface for Low
Power and Emission
Spread Spectrum Clocking for Reduced EMI
Video Input Interface
– Single OpenLDI (FPD-Link I) Port up
to 110 MHz
– 24-bit RGB Parallel Interface up to 110 MHz
Configurable Host Control Interface
– Serial Peripheral Interface (SPI) 10 MHz
– I2C (400 kHz)
– Host IRQ Signal to Provide Real-Time
Feedback for Critical System Errors
Interface to TPS99000-Q1 System Management
and Illumination Controller
Flash
1
DLPC230-Q1
DLPS127 – MAY 2018
www.ti.com
4 Device and Documentation Support
4.1 Device Support
4.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
4.1.2 Device Nomenclature
4.1.2.1 Device Markings
ADVANCE INFORMATION
Line 1
Line 2
Line 3
Marking Definitions:
Line 1: TI Part Number:
Engineering Samples
TI Part Number:
Production
X = Engineering Samples
DLPC230 = Device ID
blank or A, B, C ... = Part Revision
T = Temperature designator
ZDQ = Package designator
Q1 = Automotive qualified
DLPC230 = Device ID
blank or A, B, C ... = Part Revision
T = Temperature designator
ZDQ = Package designator
Q1 = Automotive qualified
Line 2: Vendor Lot and Fab
Information
XXXXX = Fab lot number
-XX = Fab sub-lot
X (last X) = Assembly sub-lot
The Fab is UMC12A. As such, the first character of the lot number is K
Line 3: Vendor Year and Week
code
YY = Year
WW = Week
Example, 1614 - parts built the 14th week of 2016
4.2 Trademarks
All trademarks are the property of their respective owners.
2
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: DLPC230-Q1
DLPC230-Q1
www.ti.com
DLPS127 – MAY 2018
4.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
4.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
5 Mechanical, Packaging, and Orderable Information
ADVANCE INFORMATION
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: DLPC230-Q1
3
PACKAGE OPTION ADDENDUM
www.ti.com
2-Jun-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DLPC230TZDQQ1
PREVIEW
BGA
ZDQ
324
25
TBD
Call TI
Call TI
-40 to 105
XDLPC230TZDQQ1
ACTIVE
BGA
ZDQ
324
1
TBD
Call TI
Call TI
-40 to 105
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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