Datasheet AD Converter Series Successive Approximation A/D Converter 12bit, 0.5M to 1MSPS, 2.7 to 5.25V, 1-channel, SPITM Interface BU1S12S1AG-LB General Description Key Specifications Supply Voltage Range: Sampling Rate: Power Consumption In 1MSPS Operation: This is the product guarantees long time support in Industrial market. The BU1S12S1AG-LB is a general purpose, 12-bit 1-channel successive approximation AD converter. The sampling rate of BU1S12S1AG-LB ranges from 0.5MSPS to 1MSPS. Features Long Time Support Product for Industrial Applications Maximum 1MSPS Sampling Rate Low Power Consumption Small SSOP6 Package Compatible with SOT23-6 Serial Interface Compatible with TM TM TM SPI /QSPI /MICROWIRE Operational Supply Voltage Range: 2.7V to 5.25V Single-ended Input Output Code in Straight Binary Format 2.7V to 5.25V 0.5MSPS to 1MSPS 8mW @VA=5V (Typ) 1.5mW @VA=3V (Typ) INL: -1.1 to +1.0 LSB DNL: -0.9 to +1.0 LSB SNR: 71.5dB @ VA=3V (Typ) SINAD: 71dB @ VA=3V (Typ) Operational Temperature Range: -40°C to +105°C Package SSOP6 W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm Applications Industrial Equipment Instrumentation and Control Systems Motor Control Systems Data Acquisition Systems SSOP6 Figure 1. Package Outline Typical Application Circuit Figure 2 shows a typical application circuit of BU1S12S1AG-LB. VOLTAGE REFERENCE 10µF ANALOG SIGNAL SOURCE VA 0.1µF CSB BU1S12S1AG-LB 330Ω SCLK 330Ω VIN 22Ω MICROPROCESSOR or DSP SDATA GND 1000pF to 0.1µF 100Ω Figure 2. Typical Application Circuit 〇Product structure : Silicon monolithic integrated circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Pin Configuration (TOP VIEW) VA 1 6 CSB GND 2 5 SDATA VIN 3 4 SCLK Figure 3. Pin Configuration Pin Descriptions Pin No. Pin Name Description 1 VA Power supply pin. This voltage is the full scale of the analog input. 2 GND Ground pin. This voltage level is the zero scale of the analog input. 3 VIN Analog input pin. The voltage range must be between 0V and VA. 4 SCLK Digital clock input pin. 5 SDATA Digital data output pin. 6 CSB Chip select pin. A/D conversion starts at the falling edge of this signal. Block Diagram VIN TRACK/HOLD 12-BIT SUCCESSIVE APPROXIMATION ADC SCLK CONTROL LOGIC CSB SDATA Figure 4. Block Diagram www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Ratings Unit Supply Voltage VA 5.7 V Analog Input Voltage VIN -0.3 to VA +0.3 V Digital Input Voltage VDIN -0.3 to 5.7 V (Note1) W Power Dissipation PD 0.54 Junction Temperature TJmax 125 °C Storage Temperature Tstg -55 to +125 °C (Note 1) Derate by 5.4mW/°C when operating above Ta=25°C. (when mounted on a 70mm×70mm×1.6mm, 1-layer, glass-epoxy board.) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operational Conditions Parameter Symbol Ratings Unit Supply Voltage VA 2.7 to 5.25 V Analog Input Voltage VIN 0 to VA V Digital Input Voltage VDIN 0 to 5.25 V Operational Temperature Topr -40 to +105 °C Clock Frequency fSCLK 10 to 20 MHz fS 0.5 to 1 MSPS Sampling Rate www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Electrical Characteristics Unless otherwise specified, Ta=-40°C to +105°C (typical: Ta=25°C), VA=2.7 to 5.25V, fSCLK=20MHz, fS=1MSPS Limits Parameter Symbol Unit Condition Min Typ Max Statistic Converter Characteristics Resolution with No missing codes RES 12 bit VA=2.7 to 3.6V Integral Non-Linearity INL -1.1 +1.0 LSB VA=2.7 to 3.6V Differential Non-Linearity DNL -0.9 +1.0 LSB VA=2.7 to 3.6V Offset Error OE -1.2 ±0.2 +1.2 LSB VA=2.7 to 3.6V Gain Error GE -1.2 ±0.3 +1.2 LSB VA=2.7 to 3.6V Dynamic Converter Characteristics Signal-to-Noise and Distortion Ratio Total Harmonic Distortion Spurious-Free Dynamic Range Effective Number of Bits THD SFDR ENOB Inter-modulation Distortion 1, (Second Order Term) Inter-modulation Distortion 2, (Third Order term) Full Power Band Width 1 Full Power Band Width 2 Aperture Delay Aperture Jitter Clock Frequency Sampling Rate Track/Hold Acquisition Time IMD1 70 68 70.8 68.8 11.3 11.0 - IMD2 - -76 - dB FPBW1 FPBW2 tAD tAJ fSCLK fS tACQ 10 500k - 10.1 7.2 4.3 30 - 20 1M 350 MHz MHz ns ps MHz SPS ns VIN ILEAK CINA 0 -1 - ±0.1 28 4 VA +1 - V µA pF pF VIH VIH VIL VIL IIND CIND 2.4 2.1 -1 - ±0.1 2.5 0.8 0.4 +1 4 V V V V µA pF VA=5.25V VA=3.6V VA=5V VA=3V VIND=0V or VA VOH VOH VOＬ VOＬ IOZ COUT VA-0.2 -10 - VA-0.03 VA-0.1 0.02 0.1 ±0.1 2 0.4 +10 4 V V V V µA pF Isource=200µA Isource=1mA Isink=200µA Isink=1mA VOZ=0V or VA VA IA 2.7 - 1.6 0.5 5.25 2.8 1.2 V mA mA Signal-to-Noise-Ratio Analog Input Characteristics Input Voltage Range Input DC Leakage Current Input Capacitance Digital Input Characteristics High Input Voltage Low Input Voltage Input Current Input Capacitance Digital Output Characteristics Output High Voltage Output Low Voltage High-Z Leakage Current High-Z Output Capacitance Power Supply Characteristics Supply Voltage Operational Current Consumption www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SINAD SNR 4/16 71 70 71.5 71 -80 82 11.5 11.3 -78 - dB dB dB dB dB dB bit bit dB fIN=100kHz, VIN=-0.02dBFS VA=2.7 to 3.6V VA=4.75 to 5.25V VA=2.7 to 3.6V VA=4.75 to 5.25V VA=2.7 to 3.6V VA=2.7 to 3.6V VA=2.7 to 3.6V VA=4.75 to 5.25V VA=5.25V 103.5kHz, 113.5kHz VA=5.25V 103.5kHz, 113.5kHz VA=5V VA=3V VA=5V VA=5V VIN=0V or VA Track mode, VA=5V Hold mode, VA=5V VA=5.25V, fS=1MSPS VA=3.6V, fS=1MSPS TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Timing Specifications Unless otherwise specified, Ta=-40°C to +85°C (Typical: Ta=25°C), VA=2.7 to 5.25V, fSCLK=10 to 20MHz, CL=25pF Parameter Symbol Conversion Time CSB Pulse Width CSB Setup Time SDATA Enable Time SDATA Access Time 1 SDATA Access Time 2 SCLK Low Pulse Width SCLK High Pulse Width SDATA Hold Time 1 SDATA Hold Time 2 SDATA Disable Time 1 SDATA Disable Time 2 CSB Hold Time SCLK Setup Time Quiet Time Power-Up Time Throughput Period Limits Typ 16 1 - Min 10 10 0.4 x tSCLK 0.4 x tSCLK 7 5 6 5 10 10 50 1 tCONV t1 t2 t3 t4 t4 t5 t6 t7 t7 t8 t8 t9 t10 tQUIET tPOWUP tTHROUGHPUT Hold mode Unit Max 20 40 20 25 25 20 SCLK ns ns ns ns ns ns ns ns ns ns ns ns ns ns µs µs Condition VA=2.7 to 3.6V VA=4.75 to 5.25V VA=2.7 to 3.6V VA=4.75 to 5.25V VA=2.7 to 3.6V VA=4.75 to 5.25V Track mode t1 CSB tCONV t9 t2 1 2 3 t6 4 t10 5 13 15 14 16 SCLK t4 t3 SDATA t8 tQUIET ZERO ZERO High-Z t5 t7 ZERO ZERO DB11 DB10 DB2 DB1 DB0 High-Z 4 LEADING ZEROS tTHROUGHPUT (a) If SCLK is high at the falling edge of CSB Hold mode Track mode t1 CSB tCONV t9 t2 1 2 3 4 t6 t10 5 13 15 14 16 SCLK t4 t3 SDATA High-Z t5 t7 t8 tQUIET ZERO ZERO ZERO ZERO DB11 DB10 DB2 DB1 DB0 High-Z 4 LEADING ZEROS tTHROUGHPUT (b) If SCLK is low at the falling edge of CSB Figure 5. Serial Interface Timing Chart (Note 1) When the BU1S12S1AG-LB is used at the sampling frequency of 1MSPS, it is recommended to hold SCLK high at the falling edge of CSB as shown in Figure 5(a). (See also “3. Serial Interface” on page 10.) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Term Definitions ACQUISITION TIME: At the 13th rising edge of SCLK, the mode is changed from Hold mode to Track mode and the sampling capacitor starts to be charged by the analog input voltage. This charge time is defined as the acquisition time. APERTURE DELAY: It is defined as the time from falling edge of CSB to the time when the analog input voltage is acquired. APERTURE JITTER: The variation in the aperture delays in sampling operations. Aperture jitter gets to affect signal-to-noise ratio. INTEGRAL NON-LINEARLITY (INL): It is a measure of the deviation of each individual code from a line drawn from zero scale (0.5 LSB below the first code transition) through full scale (0.5 LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. DIFFERENTIAL NON-LINEARLITY (DNL): It is the measure of the maximum deviation from the ideal step size of 1 LSB. OFFSET ERROR (OE): It is the deviation of the first code transition “(000…000) to (000…001)” from the ideal of 0.5 LSB. FULL SCALE ERROR (FSE): It is the deviation of the last code transition “(111…110) to (111…111)” from the ideal of “VA – 1.5LSB.” GAIN ERROR (GE): It is defined as full scale error minus offset error. TOTAL HARMONIC DISTORTION (THD): It is the ratio, expressed in dB or dBc, of the rms total of the first five harmonic components at the output to the rms level of the input signal frequency as seen at the output. THD is calculated as where Af1 is the RMS power of the input frequency at the output and Af2 through Af6 are the RMS power in the first 5 harmonic frequencies. SIGNAL TO NOISE AND DISTORTION RATIO(SINAD): It is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the sampling frequency, including harmonics but excluding d.c. EFFECTIVE NUMBER OF BITS(ENOB): It is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as “(SINAD – 1.76) / 6.02” and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. SIGNAL TO NOISE RATIO (SNR): It is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below half the sampling frequency, not including harmonics. SPURIOUS FREE DYNAMIC RANGE (SFDR): It is the difference, expressed in dB, between the desired signal amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral component is any signal present in the output spectrum that is not present at the input and may be a harmonic. CONVERSION TIME: It is the required time for the A/D converter to convert the sampled analog input signal to the digital code. THROUGHPUT PERIOD: It is the period that should be used as an interval time between any adjacent conversions. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Typical Performance Characteristics 1.00 1.00 0.75 0.75 0.50 0.50 0.25 0.25 INL [LSB] DNL [LSB] Unless otherwise noted, Ta=25 °C. 0.00 -0.25 0.00 -0.25 -0.50 -0.50 -0.75 -0.75 -1.00 -1.00 0 1024 2048 3072 4096 0 1024 OUTPUT CODE 3072 4096 Figure 7. INL vs OUTPUT CODE (VA=3V, fSCLK=10MHz, fS=500kSPS) 1.00 1.00 0.75 0.75 0.50 0.50 0.25 0.25 INL [LSB] DNL [LSB] Figure 6. DNL vs OUTPUT CODE (VA=3V, fSCLK=10MHz, fS=500kSPS) 0.00 -0.25 0.00 -0.25 -0.50 -0.50 -0.75 -0.75 -1.00 -1.00 0 1024 2048 3072 4096 0 1024 OUTPUT CODE 2048 3072 4096 OUTPUT CODE Figure 8. DNL vs OUTPUT CODE (VA=3V, fSCLK=20MHz, fS=1MSPS) Figure 9. INL vs OUTPUT CODE (VA=3V, fSCLK=20MHz, fS=1MSPS) 1.5 1.5 VA = 5V 1.0 1.0 VA = 5V 0.5 VA = 3V INL [LSB] DNL [LSB] 2048 OUTPUT CODE 0.0 VA = 3V -0.5 VA = 3V 0.5 0.0 VA = 3V -0.5 VA = 5V VA = 5V -1.0 -1.0 -1.5 -1.5 0 5 10 15 0 20 10 15 20 Clock Frequency [MHz] Clock Frequency [MHz] Figure 10. DNL vs CLOCK FREQUENCY www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 Figure 11. INL vs CLOCK FREQUENCY 7/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Typical Performance Characteristics – continued Unless otherwise noted, Ta=25 °C, fIN =100 kHz. 80 75 VA = 3V 70 VA = 5V 70 SINAD [dB] SNR [dB] 75 VA = 3V VA = 5V 65 60 65 55 60 0 5 10 15 0 20 5 10 15 20 Clock Frequency [MHz] Clock Frequency [MHz] Figure 12. SNR vs CLOCK FREQUENCY Figure 13. SINAD vs CLOCK FREQUENCY 95 -70 VA = 5V -75 THD [dB] SFDR [dB] 90 VA = 3V 85 -80 VA = 3V -85 -90 80 -95 VA = 5V 75 -100 0 5 10 15 20 0 Clock Frequency [MHz] 10 15 20 Clock Frequency [MHz] Figure 14. SFDR vs CLOCK FREQUENCY Figure 15. THD vs CLOCK FREQUENCY 0 0 -20 -20 Amplitude [dBFS] Amplitude [dBFS] 5 -40 -60 -80 -40 -60 -80 -100 -100 -120 -120 0 50 100 150 200 250 0 Frequency [kHz] 200 300 400 500 Frequency [kHz] Figure 16. SPECTRAL RESPONCE (VA=5V, fSCLK=10MHz, fS=500kSPS) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100 Figure 17. SPECTRAL RESPONCE (VA=5V, fSCLK=20MHz, fS=1MSPS) 8/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Description of Functions 1. Overview of A/D Conversion Process BU1S12S1AG-LB is a successive-approximation A/D converter designed with a charge-redistribution D/A converter. Simplified schematics of the A/D converter are shown in Figure 18 and Figure 19. Figure 18 shows the A/D converter in Track mode: the switch SW1 is in the position A, SW2 is closed and balances the comparator. Then, the sampling capacitor is charged with the analog input voltage VIN. Figure 19 shows the A/D converter in Hold mode. When a conversion starts, the A/D converter goes into Hold mode: SW2 becomes open, SW1 connects the sampling capacitor to ground through the terminal B and the comparator loses its balance. The control logic controls the input voltage of the comparator via the sampling capacitors of the charge-redistribution D/A converter to get the comparator back into a balanced state. A/D conversion finishes when the comparator balances again. The control logic also generates the output code of the A/D converter. CHARGE REDISTRIBUTION DAC VIN A SAMPLING CAPACITOR VIN SW1 A SAMPLING CAPACITOR SW1 CONTROL LOGIC SW2 B GND CHARGE REDISTRIBUTION DAC SW2 B GND VA 2 CONTROL LOGIC VA 2 Figure 18. Track mode Figure 19. Hold mode 2. Ideal Transfer Characteristics Figure 20 shows the ideal transfer characteristics of BU1S12S1AG-LB. Code transitions occur midway between successive integer LSB values, such as 0.5 LSB, 1.5 LSB, and so on. The LSB size for the BU1S12S1AG-LB is VA / 4096. The output code format of the A/D converter is straight binary 111...111 ・・・ ・・ ADC CODE 111...110 111...000 1LSB = VA / 4096 011...111 ・・・ 000...010 000...001 000...000 0.5LSB +VA - 1.5 LSB 0V ANALOG INPUT Figure 20. Ideal Transfer Characteristics www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB 3. Serial Interface The serial interface timing is shown in Figure 21. When CSB goes low, both a conversion process and data transfer are started. At the falling edge of CSB, SDATA changes its state from High-Z to Low, the converter moves from Track mode to Hold mode. A tracked input signal is sampled and held for conversion at this point. The converter returns from Hold mode back to Track mode at the rising edge of SCLK subsequent to the 13th falling edge of it. SDATA goes back to High-Z at the 16th falling edge of SCLK or at the rising edge of CSB. After a conversion, the quiet time t QUIET must be satisfied before the next conversion triggered by the falling edge of CSB. Sixteen SCLK cycles are needed to read a complete data of the A/D conversion from BU1S12S1AG-LB. First, four leading zeros come out from SDATA. Then, the 12bit data comes out bit by bit, starting from the MSB. The first zero is clocked out at the falling edge of CSB. The remaining leading 3 zeros and data bits are clocked out to SDATA at the falling edge of SCLK; the host IC, the receiver of the A/D conversion data, is intended to receive the data at the subsequent falling edge of SCLK. To perform A/D conversion properly, the BU1S12S1AG-LB needs at least 16 SCLK cycles while CSB is low. If an A/D conversion is interrupted in the middle of the conversion with CSB going to high before the 16th SCLK falling edge, the following A/D conversion may not be performed normally. Therefore, it is necessary that equal to or more than 16 falling edges of SCLK exist while CSB is low. In addition, SCLK should be held either high or low at the falling edge of CSB. If SCLK is low at the falling edge of CSB, as shown in Figure 21(b), a Hold mode time length is about a half clock period longer than one if SCLK is high as shown in Figure 21(a). Therefore, when the BU1S12S1AG-LB is used at the sampling frequency of 1MSPS, it is recommended to hold SCLK high at the falling edge of CSB, as shown in Figure 21(a), in order to ensure sufficient Track mode time for the maximum acquisition time. Hold mode Track mode CSB 1 2 3 4 5 6 7 8 9 DB11 DB10 DB9 DB8 DB7 10 11 12 13 14 15 16 SCLK SDATA High-Z ZERO ZERO ZERO ZERO DB6 DB5 DB4 DB3 DB2 DB1 DB0 High-Z 4 LEADING ZEROS (a) If SCLK is high at the falling edge of CSB Hold mode Track mode CSB 1 2 3 4 5 6 7 8 9 DB11 DB10 DB9 DB8 DB7 10 11 12 13 14 15 16 SCLK SDATA High-Z ZERO ZERO ZERO ZERO DB6 DB5 DB4 DB3 DB2 4 LEADING ZEROS DB1 DB0 High-Z (b) If SCLK is low at the falling edge of CSB Figure 21. Serial Interface Timing www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB 4. Dummy Conversion Dummy conversions are necessary in the following cases. (1) A/D conversion after power-up The first A/D conversion data after applying power to the BU1S12S1AG-LB is invalid. Therefore, a dummy conversion is necessary after power-up before getting valid data. In addition, the power-up time is satisfied with a cycle of the dummy conversion. after power-up dummy conversion CSB 1 1 16 16 SCLK SDATA VALID DATA INVALID DATA Figure 22. A/D conversion after power-up (2) A/D conversion after a stop period more than the maximum throughput time The BU1S12S1AG-LB may stop performing A/D conversion between some A/D conversion cycles. If the maximum limit of the throughput period of 20μsec is violated, the first A/D conversion data after the resumption is not valid similar to the case after power-up. Therefore, a dummy conversion cycle is necessary when A/D conversions are resumed after a stop period longer than the limit and the results later than the dummy conversion can be used validly. more than max throughput time dummy conversion CSB 1 1 16 16 1 16 SCLK SDATA INVALID DATA VALID DATA VALID DATA Figure 23. A/D conversion after a long suspension 5. Pin Information (1) Analog Input Pin The equivalent analog input circuit is shown in Figure 24. The diodes, D1 and D2, are placed for ESD protection. If the analog input voltage is more than “VA + 0.3V”, or less than “GND – 0.3V”, these diodes are turned on and forward current is generated. This current might cause malfunction or irreversible damage to BU1S12S1AG-LB. The capacitance value of the C1 in Figure 24 is typically 4pF, derived from the package parasitic capacitance. The R1 is the resistance of the track/hold switch, typically 500Ω. The C2 is the sampling capacitance of BU1S12S1AG-LB, and the capacitance value is typically 24pF. VA D1 R1 VIN C1 D2 SW1 OPEN : HOLD MODE CLOSE : TRACK MODE C2 Figure 24. Analog Input Equivalent Circuit (2) Digital Input and Output Pins The equivalent digital input circuit is shown in Figure 25. Digital input pins, CSB and SCLK, don’t have any diodes to VA. Thus, the maximum rating of “VA + 0.3V” is not applied to these digital input pins. Digital input voltage range can vary from ground to 5.25V regardless of the supply voltage V A. This enables BU1S12S1AG-LB to be interfaced with a wide range of logic levels, independent of the supply voltage VA. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB VA VA SCLK SDATA CSB Figure 25. Equivalent Digital Input Circuit Figure 26. Equivalent Digital Output Circuit 6. Considerations in Application Circuits As shown in Figure 2, a voltage reference IC is used; 0.1μF and 10μF bypass capacitors between VA and GND are used as measures against high and low frequency noise respectively to make the maximum use of the AD converter’s capability. Ceramic capacitors of 0.1μF and 1μF to 10μF are to be used as decoupling capacitor near the AD converter. Especially, the capacitor of 0.1μF should be placed as close to VA pin of BU1S12S1AG-LB as possible. Because the voltages of VA and GND are used as the reference voltages for the A/D converter, the deviation of the supply voltage directly affects the full scale and has much influence on its characteristics. Therefore, the fully stable supply voltage should be connected to VA. The output impedance of the analog input signal source should be small enough. Charge stored internally in the sampling capacitor of the track/hold circuit is swept out to the analog input pin VIN at the transition from Hold mode to Track mode because of the difference of the voltage between the input signal voltage and the sampling capacitor voltage. This charge could cause undesirable voltage deviation. If influence of the deviation remains at the transition from Track mode to Hold mode, it could cause the conversion error. If a buffer amplifier is used to get the analog input to be low impedance, high-speed response is required of the buffer amplifier. A decoupling capacitor and a resister on the VIN analog input could support the amplifier to reduce the influence of the charge. The voltage fluctuation on the supply and ground pins is caused by the charge and discharge of the digital input and output pins through the digital signals. This fluctuation can be reduced by inserting resisters serially to the digital input and output pins. The resistance values must be small enough not to cause critical delay errors. It is more effective to place these resisters as close to the digital pins as possible. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Operational Notes – continued 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. Ordering Information B U 1 S 1 2 S 1 A G - Package G: SSOP6 Part Number LBTR Product class LB for Industrial applications Packaging and forming specifications TR: Embossed tape and reel Marking Diagrams SSOP6(TOP VIEW) BP Part Number Marking 1PIN MARK LOT Number www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Physical Dimension, Tape and Reel Information Package Name SSOP6 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 BU1S12S1AG-LB Revision History Date Revision 04.Jul.2016 001 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes New Release 16/16 TSZ02201-0GSG0GZ10180-1-2 04.Jul.2016 Rev.001 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU1S12S1AG-LB - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU1S12S1AG-LB SSOP6 3000 3000 Taping inquiry Yes