AVAGO ALM-32220-BLKG 2 watt high linearity amplifier Datasheet

ALM-32220
1.7 GHz – 2.7 GHz
2 Watt High Linearity Amplifier
Data Sheet
Description
Features
Avago Technologies’ ALM-32220 is a high linearity 2 Watt
PA with good OIP3 performance and exceptionally good
PAE at 1dB gain compression point, achieved through the
use of Avago Technologies’ proprietary 0.25 µm GaAs Enhancement-mode pHEMT process.
• Fully matched, input and output
All matching components are fully integrated within the
module. This makes the ALM-32220 extremely easy to use.
The adjustable temperature-compensated internal bias
circuit allows the device to be operated at either class A
or class AB operation. The ALM-32220 is housed inside a
miniature 7.0 × 10.0 × 1.1 mm3 20-lead multiple-chips-onboard (MCOB) module package.
• High linearity and P1dB
• Unconditionally stable across load condition
• Built-in adjustable temperature compensated internal
bias circuitry
• GaAs E-pHEMT Technology[1]
• 5V supply
• Excellent uniformity in product specifications
• Tape-and-Reel packaging option available
• MSL-3 and Lead-free
Component Image
• High MTTF for base station application
7.0 × 10.0 × 1.1 mm3 20-Lead MCOB Package
Specifications
1
• 14.8 dB Gain
16
2
• 50.0 dBm Output IP3
15
3
• 34.4 dBm Output Power at 1dB gain compression
14
4
13
5
12
6
17
32220
WWYY
XXXX
18
20
19
• 47.5% PAE at P1dB
RF OUT
11
7
10
Vdd2
Top View
2GHz; 5V, 800mA (typical)
Vctrl
Vdd1
9
8
Not Used
Bottom View
Notes:
Package marking provides orientation and identification
“32220” = Device Part Number
“WWYY” = Work week and year of manufacture
“XXXX” = Last 4 digit of lot number
RF IN
• 3.5dB Noise Figure
Applications
• Class A driver amplifier for GSM/PCS/W-CDMA/WiMAX
Base Stations.
• General purpose gain block.
Note:
1. Enhancement mode technology employs positive gate voltage,
thereby eliminating the need of negative gate voltage associated
with conventional depletion mode devices.
2. Good RF practice requires all unused pins to be earthed.
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model = 200 V
ESD Human Body Model = 1000 V
Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
Absolute Maximum Rating [1] TA=25°C
Thermal Resistance [2] θjc = 14 ºC/W
(Vdd=5, Ids=800mA, Tc=85°C)
Symbol
Parameter
Units
Absolute
Max.
Vdd,max
Device Voltage, RF output to ground
V
5.5
Ids,max
Device Drain Current
mA
1500
Vctrl,max
Control Voltage
V
5.5
Pin,max
CW RF Input Power
dBm
28
Pdiss
Total Power Dissipation [3]
W
8.25
Tj, max
Junction Temperature
°C
150
TSTG
Storage Temperature
°C
-65 to 150
Notes:
1. Operation of this device in excess of any of
these limits may cause permanent damage.
2. Thermal resistance measured using Infra-Red
measurement technique.
3. This is limited by maximum Vdd and Ids.
Derate 71.4mW/ °C for Tc> 34.5 °C.
Product Consistency Distribution Charts[4]
LSL
USL
LSL
Std Dev = 0.038
.600
.700
Std Dev = 0.364
.800
.900
1.000
47
48
49
50
51
52
53
Figure 2. OIP3; LSL = 48dBm, nominal = 50dBm
Figure 1. Ids; LSL = 640mA, nominal = 800mA, USL = 910mA
LSL
Std Dev = 0.633
Std Dev = 0.062
33
33.5
34
34.5
35
Figure 3. P1dB; LSL = 33dBm, nominal = 34.4dBm
LSL
40
42
44
46
48
50
52
54
Figure 4. PAE at P1dB; nominal = 47.5%
USL
Std Dev = 0.147
13 13.5
14 14.5
15 15.5
16 16.5
17
Figure 5. Gain; LSL=13.5dB, Nominal = 14.8dB, USL=16.8dB
Note:
4. Distribution data sample size is 500 samples taken from 3 different wafer lots. TA = 25°C, Vdd = 5V, Vctrl = 5V, RF performance at 2GHz unless
otherwise specified. Future wafers allocated to this product may have nominal values anywhere between the upper and lower limits.
5. Measurements are made on a production test board. Input trace losses have not been de-embedded from actual measurements.
2
Electrical Specifications [1]
TA = 25 °C, Vdd =5V, Vctrl =5V, RF performance at 2GHz, measured on demo board (see Figure 7) unless otherwise specified.
Symbol
Parameter and Test Condition
Units
Min.
Typ.
Max.
Ids
Quiescent current
mA
640
800
910
Ictrl
Vctrl current
mA
-
11
-
Gain
Gain
dB
13.5
14.8
16.8
OIP3 [2]
Output Third Order Intercept Point
dBm
48
50
-
OP1dB
Output Power at 1dB Gain Compression
dBm
33.0
34.4
-
PAE
Power Added Efficiency
%
-
47.5
-
NF
Noise Figure (Typ.Vctrl=5.0V)
dB
-
3.5
-
S11
Input Return Loss, 50Ω source
dB
-
-9.0
-
S22
Output Return Loss, 50Ω load
dB
-
-9.0
-
S12
Reverse Isolation
dB
-
-30
-
Notes:
1. Measurements at 2GHz obtained using demo board described in Figure 6 and 7.
2. OIP3 test condition: FRF1 - FRF2 = 10MHz with input power of -5dBm per tone measured at worst side band
3. Use proper biasing, heat sink and de-rating to ensure maximum channel temperature is not exceeded. See absolute maximum ratings and
application note (if applicable) for more details.
3
S-Parameter [1] (Vdd = 5V, Vctrl = 5V, T = 25ºC, matched 50Ω)
Freq (GHz)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6.0
S11 (dB)
-0.12
-0.17
-0.22
-0.27
-0.31
-0.36
-0.40
-0.46
-0.52
-0.62
-0.79
-1.09
-1.63
-2.80
-4.88
-8.64
-12.43
-12.86
-10.82
-9.55
-9.33
-9.87
-11.08
-12.82
-14.28
-14.07
-12.18
-10.02
-8.46
-7.63
-7.58
-8.60
-12.27
-18.53
-16.10
-7.18
-3.72
-2.28
-1.56
-1.24
-1.06
-0.94
-0.86
-0.80
-0.76
-0.73
-0.71
-0.69
-0.68
-0.68
-0.68
-0.68
-0.68
-0.69
-0.70
-0.72
-0.74
-0.76
-0.78
-0.80
S11 (ang)
167.05
154.51
141.94
129.27
116.37
103.12
89.42
75.11
59.95
43.63
25.71
5.58
-17.59
-49.13
-85.12
-135.16
151.26
72.48
15.65
-22.12
-53.81
-84.59
-117.80
-157.62
151.74
94.58
42.86
1.82
-31.95
-62.00
-90.50
-119.31
-151.73
116.33
1.49
-65.40
-97.57
-123.55
-147.17
-164.84
179.56
165.36
152.19
139.80
127.98
116.61
105.59
94.84
84.29
73.89
63.60
53.36
43.12
32.87
22.57
12.17
1.67
-8.98
-19.79
-30.78
S21 (dB)
-72.88
-66.14
-54.09
-42.75
-36.01
-30.60
-24.80
-19.48
-14.26
-9.03
-3.80
1.30
5.96
10.24
12.97
14.60
15.17
15.03
14.63
14.24
13.97
13.80
13.66
13.49
13.20
12.75
12.12
11.35
10.53
9.76
9.15
8.74
8.45
7.94
6.52
3.48
-1.29
-7.21
-14.31
-20.56
-26.60
-32.42
-38.05
-43.54
-48.92
-54.23
-59.32
-64.09
-68.17
-71.08
-72.64
-72.71
-72.21
-71.69
-70.99
-70.50
-70.30
-69.59
-68.40
-67.44
S21 (ang)
-39.59
-158.67
133.83
82.54
46.13
22.23
-0.29
-23.43
-47.47
-73.73
-103.65
-138.69
-179.54
128.61
79.36
29.33
-18.76
-62.58
-101.86
-137.94
-172.34
153.80
119.80
85.33
50.34
15.04
-20.16
-54.87
-88.93
-122.65
-156.82
167.14
127.18
81.10
28.43
-27.36
-79.83
-124.21
-163.92
167.75
143.99
123.38
104.98
88.20
72.49
57.03
40.69
21.68
-0.97
-27.44
-52.75
-75.04
-93.36
-109.91
-123.52
-136.61
-151.08
-161.98
-173.74
170.18
S12 (dB)
-71.31
-81.47
-83.30
-82.65
-81.29
-77.95
-74.29
-69.46
-64.39
-58.93
-53.26
-47.63
-42.41
-37.50
-34.22
-32.08
-31.04
-30.80
-30.88
-30.97
-30.97
-30.88
-30.77
-30.69
-30.73
-30.94
-31.33
-31.85
-32.42
-32.93
-33.29
-33.44
-33.46
-33.69
-34.77
-37.41
-41.67
-46.96
-53.10
-58.09
-62.44
-66.05
-68.88
-71.02
-72.27
-73.27
-74.09
-73.99
-73.51
-73.12
-73.02
-72.84
-72.23
-71.73
-71.21
-70.94
-70.62
-70.28
-69.09
-67.88
S12 (ang)
25.90
113.84
142.58
25.72
-2.31
-26.99
-51.86
-78.75
-104.61
-131.78
-160.90
165.38
126.02
76.05
28.25
-20.60
-67.80
-110.89
-149.49
175.02
141.10
107.62
73.84
39.45
4.36
-31.18
-66.74
-101.95
-136.65
-171.22
153.55
116.26
74.80
26.96
-27.86
-86.28
-141.89
170.25
126.90
96.38
71.41
50.40
33.27
19.99
9.22
-0.11
-11.00
-23.90
-35.51
-50.12
-64.79
-75.81
-87.59
-103.98
-118.95
-133.97
-145.93
-156.21
-169.51
173.43
S22 (dB)
-0.14
-0.21
-0.27
-0.32
-0.37
-0.42
-0.49
-0.58
-0.72
-0.99
-1.52
-2.60
-4.63
-8.36
-12.17
-13.91
-12.65
-10.60
-9.50
-9.24
-9.53
-10.13
-10.81
-11.26
-11.15
-10.40
-9.27
-8.11
-7.17
-6.53
-6.23
-6.32
-6.90
-8.15
-10.02
-10.44
-8.12
-5.17
-3.22
-2.32
-1.80
-1.48
-1.27
-1.13
-1.03
-0.96
-0.90
-0.86
-0.83
-0.81
-0.79
-0.78
-0.77
-0.77
-0.77
-0.78
-0.78
-0.79
-0.81
-0.82
Notes:
1. S-parameter is measured with reference plane at SMA end launch using demo board shown in Figure 7.
2. Demo board 50Ω transmission line is CPWG with W = 21.7 mils, G = 19.2 mils, L = 615.5 mils, 10 mils Rogers RO4350, 0.5oz Cu.
3. Demo board SMA end launch is Johnson 142-0701-851.
4
S22 (ang)
-175.93
162.14
144.44
128.65
113.24
97.62
81.41
64.21
45.51
24.59
0.54
-27.56
-59.95
-101.83
-149.98
147.00
83.78
35.03
-2.71
-35.61
-66.92
-98.77
-132.83
-170.10
150.06
109.90
71.72
36.49
3.96
-26.60
-56.10
-85.65
-117.01
-154.18
152.45
77.07
1.80
-51.70
-92.25
-119.49
-141.97
-161.39
-178.69
165.54
150.91
137.18
124.15
111.68
99.66
87.99
76.60
65.42
54.39
43.48
32.63
21.79
10.94
0.04
-10.92
-21.98
3
Vsense1
Vdd1
8
Vctrl
1,2
R4
To A
R1
R3
To B
C3
C2
C5
C4
Z1
C1
Bias
Input
match
C7
C6
B
13
R2
18
50-Ohms TL
C8
C9
C10
Z2
Size
Value
Description
C1, C10
0805
2.2uF
Ceramic Chip Capacitor
C2, C4, C9
0402
0.1uF
Ceramic Chip Capacitor
C3, C5, C8
0402
10nF
Ceramic Chip Capacitor
C6, C7
0402
Not Used
N/A
R1, R2
1206
0 Ohm
Chip Resistor
R3
0402
Not Used
N/A
R4
0805
0 Ohm
Chip Resistor
Z1, Z2
0805
Optional
Zener Diode 5.6V
(Optional)
A
Vdd2
Module
Output
match
Vsens2
50-Ohms TL
Circuit Symbol
Note:
To supply Vdd1 and Vdd2 individually, remove R4 and supply Vdd1 from
pin 1,2 and Vdd2 from pin 19,20
Figure 6. Demo board application schematics and components table
DC Pin Configuration of 20-pin Connector
Pins pointing out of the page
Unit is on top
20 pin Connector
10
1 2 3 4 5 6 7 8 9 10
1
20 19 18 17 16 15 14 13 12 11
Vdd 1 – Pin 1, 2
Vsense1 – Pin 3
Vdd 2 – Pin 19, 20 (optional)
Vsense2 – Pin 18 (optional)
Vctrl – Pin 8
RF
input
Other pins are grounded
Figure 7. Demo board Layout
1. Recommended PCB material is 10 mils Rogers RO4350, with FR4 backing for mechanical strength.
2. Suggested component values may vary according to layout and PCB material.
5
RF
output
ALM-32220 Typical Over-Temperature Performance
Vdd = 5V, Vctrl = 5V, Input Signal = CW unless stated otherwise.
1100
1000
OIP3 (dBm)
Ids (mA)
900
800
700
600
500
-40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
Temperature (˚C)
Figure 8. Over temperature Ids
60
58
56
54
52
50
48
46
44
42
40
1.7
1.8
1.9
2.0
2.1 2.2 2.3
Frequency (GHz)
2.4
2.5
2.6
2.7
Figure 9. Over temperature OIP3 vs Frequency
18
37
85˚C
25˚C
-40˚C
36
35
85˚C
25˚C
-40˚C
17
16
Gain (dB)
P1dB (dBm)
85˚C
25˚C
-40˚C
34
33
15
14
13
12
32
31
1.7
11
1.8
1.9
2.0
2.1 2.2 2.3
Frequency (GHz)
2.4
2.5
2.6
10
1.7
2.7
Figure 10. Over temperature P1dB vs Frequency
-6
2.1 2.2 2.3
Frequency (GHz)
2.4
2.5
2.6
2.7
-6
-9
-12
-15
-9
-12
-15
-18
-18
-21
-21
1.8
1.9
2.0
2.1 2.2 2.3 2.4
Frequency (GHz)
Figure 12. Over temperature S11 vs Frequency
2.5
2.6
85˚C
25˚C
-40˚C
-3
S22 (dB)
S11 (dB)
2.0
0
85˚C
25˚C
-40˚C
-3
6
1.9
Figure 11. Over temperature Gain vs Frequency
0
-24
1.7
1.8
2.7
-24
1.7
1.8
1.9
2.0
2.1 2.2 2.3
Frequency (GHz)
Figure 13. Over temperature S22 vs Frequency
2.4
2.5
2.6
2.7
5
85˚C
25˚C
-40˚C
4
EVM (%)
S12 (dB)
-25
-26
-27
-28
-29
-30
-31
-32
-33
-34
-35
1.7
1.8
1.9
2.0
2.1 2.2 2.3
Frequency (GHz)
2.4
2.5
2.6
2
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
22.0 22.5
85˚C
25˚C
-40˚C
3GPP WCD MA
Test Model 1 +64D PCH
+/- 5MHz Offset
23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0
Output Channel Power (dBm)
85˚C
25˚C
-40˚C
3GPP WCD MA
Test Model 1 +64D PCH
+/- 5MHz Offset
23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0
Output Channel Power (dBm)
Figure 18. Over temperature WCDMA ACPR vs Channel Power @ 2.6GHz
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
22.0 22.5
85˚C
25˚C
-40˚C
3GPP WCD MA
Test Model 1 +64D PCH
+/- 5MHz Offset
23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0
Output Channel Power (dBm)
Figure 17. Over temperature WCDMA ACPR vs Channel Power @ 2.5GHz
ACPR (dBc)
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
22.0 22.5
Figure 15. Over temperature WiMAX EVM vs Output Power @ 2.5GHz
ACPR (dBc)
ACPR (dBc)
3
0
22.0 22.5 23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0
Output Channel Power (dBm)
2.7
Figure 16. Over temperature WCDMA ACPR vs Channel Power @ 2.14GHz
ACPR (dBc)
IEEE 802.16d
64-QAM
BW 20MHz
1
Figure 14. Over temperature S12 vs Frequency
7
85˚C
25˚C
-40˚C
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
22.0 22.5
85˚C
25˚C
-40˚C
3GPP WCD MA
Test Model 1 +64D PCH
+/- 5MHz Offset
23.0 23.5 24.0 24.5 25.0 25.5 26.0 26.5 27.0
Output Channel Power (dBm)
Figure 19. Over temperature WCDMA ACPR vs Channel Power @ 2.7GHz
PCB Layout and Stencil Design
0.90
0.30
3.96
C'fer 0.3X45°
∅0.30
0.30
0.70
4.05
3.64
1.10
0.99
0.70
0.90
0.30
0.81
0.30
3.03
4.05
0.90
1.20
1.40
Stencil Outline
3.96
3.64
0.99
0.81
3.03
0.81
1.26
0.81
1.08
Combined PCB and stencil layout Land Pattern (Top View)
8
1.26
0.60
PCB Land Pattern (Top View)
Note:
All dimensions are in millimeters.
0.81
0.81
1.08
MCOB 7 x 10 Package Dimensions
7.00±0.10
0.60
Pin 1 identification
32220
WWYY
XXXX
10.00±0.10
Top View
1.05±0.10
(4x) 0.90Sq
(2x) 1.40
0.10
18
17
5.00
1
Pin 1
2
3
(6x) 1.20
(2x) 1.10
14
0.07
20
19
16
15
(Gaps between
SM and metal)
Side View
(4x) 1.20
(2x) 0.90
4
13
5
12
6
11
7
10
9
8
5.00
0.10
(All corner)
2.05
2.90
Bottom View
Notes:
1. All dimensions are in milimeters
2. Dimensions are inclusive of plating
3. Dimensions are exclusive of mold flash and metal burr
9
0.16 (SM width)
C'fer 0.3X45°
Part Number Ordering Information
Product Family
Part Number
No. of Devices
Container
ALM-32220-TR1G
1000
ALM-32220-TR2G
3000
ALM-32220-BLKG
100
Frequency Band
13” Reel
Output
Power
700MHz-1GHz
1.7- 2.7GHz
3.3-3.9GHz
13” Reel
0.5W
MGA-30116
MGA-30216
MGA-30316
1W
ALM-31122
ALM-31222
ALM-31322
2W
ALM-32120
ALM-32220
ALM-32320
antistatic bag
Device Orientation
REEL
USER FEED DIRECTION
CARRIER
TAPE
32220
WWYY
XXXX
32220
WWYY
XXXX
32220
WWYY
XXXX
TOP VIEW
USER
FEED
DIRECTION
END VIEW
COVER TAPE
Tape Dimensions
12.00 ± .10
[.472 ± .004]
1.50 + .10
[.059 + .004]
4.00 ± .10
[.157 ± .004]
2.00 ± .10
[.079 ± .004]
1.75 ± .10
[.069 ± .004]
11.50 ± .10
[.453 ± .004]
24.00 + .30 − .10
[.945 + .012 − .004]
1.50 + .25
[.059 + .010]
.330 ± .013
[.0130 ± .0005]
8˚ MAX
10
7˚ MAX
7.11 ± .10
[.280 ± .004]
1.52 ± .10
[.060 ± .004]
10.08 ± .10
[.397 ± .004]
A.
K.
B.
MM
[INCH]
Reel Dimensions – 13 Inch
ESD Label
(See Below)
Recycle Symbol
Detail ‘X’
30.5mm
76.2mm
Embossed Line X2 90.0mm Length
Lines 147.0mm away
Embossed ‘M’ 5.0mm Height
from center point
ESD Label
FRONT VIEW
Ø20.2 (Min)
25.65±1.75**
25.4±1.0*
Recycle Symbol
+0.5
Ø13.1 -0.2
2.2±0.5
See Detail ‘X’
FRONT
BACK
Ø100.0±0.5
Ø331.5 Max
Detail ‘X’
1.0
BACK VIEW
Detail ‘Y’
Slot 10.0±0.5(2x)
Slot 5.0±0.5***(1x)
For product information and a complete list of distributors, please go to our web site:
4.0
30.4*
Max
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-1146EN - March 18, 2013
Detail ‘Y’
(Slot Hole)
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