Diodes AP3845CMTR-G1 Current mode pwm controller Datasheet

Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
General Description
Features
The AP3842C/3C/4C/5C are high performance fixed
frequency current-mode PWM controller series.
·
·
These integrated circuits are optimized for off-line and
DC-DC converter applications with minimum external
components. They feature under-voltage lockout
(UVLO) circuit with low start-up current, trimmed
oscillator for precise duty cycle control, current sense
comparator providing maximum current limiting and a
totem pole output stage for increasing output current.
In addition, these ICs also feature accurate protection
against over-temperature, over-current and maximal
output power.
·
·
·
·
·
The AP3842C and AP3844C have UVLO thresholds
of 16V(on) and 10V(off); The corresponding thresholds for AP3843C and AP3845C are 8.4 V(on) and
7.6V(off).
·
The AP3842C and AP3843C can operate approaching
100% duty cycle; AP3844C and AP3845C can operate
from zero to 50% duty cycle.
·
·
·
·
·
·
Applications
These ICs are available in SOIC-8 and DIP-8 packages.
Option 1
Low Start-up Current: 50μA
Robust VREF Line/Load Regulation
Low Line Regulation : 4mV
Low Load Regulation : 4mV
High Stability of Reference Voltage over a Full
Temperature Range: 0.2mV/ oC
Operating Frequency up to 500kHz
High PWM Frequency Stability over a Full Temperature Range: 2.5%
High PWM Frequency Stability under a Full Supply Voltage Range: 0.2%
Accurate Over-temperature Protection with Hysteresis
UVLO with Hysteresis
Off-line Converter
DC-DC Converter
Voltage Adapter
CRT Monitor Power Supply
Desktop Power Supply
DVD/STB Power Supply
Option 2
SOIC-8
DIP-8
Figure 1. Package Types of AP3842C/3C/4C/5C
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
1
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Pin Configuration
P Package
(DIP-8)
M Package
(SOIC-8)
COMP
1
8
VREF
VFB
2
7
VCC
ISENSE
3
6
OUTPUT
RT/CT
4
5
GND
COMP
1
8
VREF
VFB
2
7
VCC
ISENSE
3
6
OUTPUT
RT/CT
4
5
GND
Figure 2. Pin Configuration of AP3842C/3C/4C/5C (Top View)
Pin Description
Pin Number
Pin Name
Function
1
COMP
2
VFB
The inverting input of the Error Amplifier. It is normally connected to the switching
power supply output through a resistor divider.
3
ISENSE
A voltage proportional to inductor current is connected to this input. The PWM uses
this information to terminate the output switch conduction.
4
RT/CT
The Oscillator frequency and maximum output duty cycle are programmed by connecting resistor RT to VREF and capacitor CT to ground. Operation to 500 kHz is possible.
5
GND
The combined control circuitry and power ground.
6
OUTPUT
7
VCC
The positive supply of the control IC.
8
VREF
This is the reference output. It provides charging current for capacitor CT through
resistor RT.
This pin is the Error Amplifier output and is made available for loop compensation.
This output directly drives the gate of a power MOSFET. Peak currents up to 1.0 A are
sourced and sunk by this pin.
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
2
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Functional Block Diagram
VCC
7
34V
GND
UVLO
S/R
5
5V
REF
8
INTERNAL
BIAS
2.50V
VREF
GOOD
LOGIC
RT/CT
4
OSC
VFB
COMP
ISENSE
3
OUTPUT
(Note)
S
2R
2
1
6
T
OVER TEMP
PROTECT
ERROR
AMP
VREF
R
R
1V
CURRENT
SENSE
COMPARATOR
PWN
LATCH
Note: Toggle flip-flop used
for 3844C/45C only
Figure 3. Functional Block Diagram of AP3842C/3C/4C/5C
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
3
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Ordering Information
AP384XC
-
Circuit Type
E1: Lead Free
G1: Green
2: AP3842C
3: AP3843C
4: AP3844C
5: AP3845C
TR: Tape and Reel
Blank: Tube
Package
M: SOIC-8
P: DIP-8
Package
SOIC-8
Temperature Range
Part Number
Lead Free
AP3842/3/4/5CM-E1
Marking ID
Green
AP3842/3/4/5CM-G1
Lead Free
Green
Packing
Type
3842/3/4/5CM-E1
3842/3/4/5CM-G1
Tube
-40 to 85 C AP3842/3/4/5CMTR-E1 AP3842/3/4/5CMTR-G1 3842/3/4/5CM-E1
3842/3/4/5CM-G1
Tape & Reel
o
DIP-8
AP3842/3/4/5CP-E1
AP3842/3/4/5CP-G1
AP3842/3/4/5CP-E1
AP3842/3/4/5CP-G1
Tube
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with
"G1" suffix are available in green packages.
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
4
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Absolute Maximum Ratings (Note 1, 2)
Parameter
Symbol
Value
Unit
Supply Voltage
VCC
30
V
Output Current
IO
±1
A
Analog Inputs
V(ANA)
-0.3 to 6.3
V
Error Amp Output Sink Current
ISINK(E.A)
10
mA
Power Dissipation at TA< 25 oC (DIP-8)
PD (Note 3)
1000
mW
Power Dissipation at TA<25 oC (SOIC-8)
PD (Note 3)
460
mW
Junction Operating Temperature
TJ
-40 to 150
oC
Thermal Resistance (Junction to Ambient)
θJA
140
oC/W
SOIC-8
160
oC/W
TSTG
-65 to 150
oC
TLEAD
+300
oC
250
V
Storage Temperature Range
Lead Temperature (Soldering, 10sec)
DIP-8
ESD (Machine Model)
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended
periods may affect device reliability.
Note 2: All voltages are with respect to pin 5 and all currents are positive into specified terminal.
Note 3: Board thickness 1.6mm, board dimension 90mm x 90mm.
Recommended Operating Conditions
Parameter
Oscillation Frequency
Ambient Temperature
Min
Symbol
f
TA
-40
Jul. 2013 Rev. 2. 0
Max
Unit
500
KHz
85
oC
BCD Semiconductor Manufacturing Limited
5
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Electrical Characteristics
(VCC=15V, RT=10kΩ CT=3.3nF, TA=25oC, unless otherwise specified.)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
VREF
TA=25oC, IREF=1mA
4.90
5.00
5.10
V
Line, Load, Temp.
4.82
5.18
V
Line Regulation
ΔVREF
12V ≤ VCC ≤25V
4
15
mV
Load Regulation
ΔVREF
1mA ≤ IREF ≤20mA
4
15
mV
-100
-180
mA
REFERENCE SECTION
Reference Output Voltage
Total Output Variation
Short Circuit Output Current
ISC
Temperature Stability
TA=25oC
(Note 6)
0.3
mV/oC
OSCILLATOR SECTION
Oscillation Frequency
f
Oscillator Amplitude
VOSC
47
TA=25oC
52
57
KHz
Pin 4, peak to peak (Note 6)
1.7
V
Temperature Stability
(Note 6)
2.5
%
Voltage Stability
12V ≤ VCC ≤ 25V
0.2
1
%
Discharge Current
Vpin 4 =2V(Note 7)
8.5
9.5
10.5
mA
VI
Vpin 1=2.5V
2.45
2.50
2.55
V
ISINK
Vpin1=1.1V
ERROR AMPLIFIER SECTION
Input Voltage
Output Sink Current
Output Source Current
ISOURCE
Vpin1=5V
High Output Voltage
VOH
RL=15kΩ to GND
Low Output Voltage
VOL
RL=15kΩ to pin 8
8
mA
-0.8
mA
5
7
V
0.7
1.1
V
2V ≤ VO ≤ 4V
65
90
dB
PSRR
12V ≤ VCC ≤ 25V
60
70
dB
VI(MAX)
Vpin1=5V(Note 4)
0.9
1
1.1
V
(Note 4, 5)
2.85
3
3.15
V/V
Voltage Gain
Power Supply Rejection Ratio
5
-0.5
CURRENT SENSE SECTION
Maximum Input Signal
Gain
Power Supply Rejection Ratio
GV
PSRR
Delay to Output
Input Bias Current
12V≤ VCC≤ 25V (Note 4, 6)
70
Vpin3 = 0 to 2V (Note 6)
150
300
ns
-3
-10
μA
ISINK = 20mA
0.1
0.4
V
ISINK = 200mA
1.4
2.2
V
IBIAS
dB
OUTPUT SECTION
Low Output Voltage
High Output Voltage
VOL
VOH
Rise Time
tR
Fall Time
tF
ISOURCE = 20mA
13
14
V
ISOURCE = 200mA
12
13
V
TA=25oC,
TA=25oC,
CL=1nF (Note 6)
50
150
ns
CL=1nF (Note 6)
50
150
ns
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
6
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Electrical Characteristics (Continued)
Parameter
Symbol
Conditions
UNDER -VOLTAGE LOCKOUT SECTION
Start Threshold
VTH(ST)
Min
Typ
Max
Unit
AP3842C/AP3844C
15
16
17
V
AP3843C/AP3845C
7.8
8.4
9.0
V
VOPR
(Min.)
AP3842C/AP3844C
8.5
10.0
11.5
V
AP3843C/AP3845C
7.0
7.6
8.2
V
D(Max.)
AP3842C/AP3843C
95
97
100
%
D(Max.)
AP3844C/AP3845C
46
48
50
%
0
%
80
μA
Min. Operation Voltage
(After Turn On)
PWM SECTION
Max. Duty Cycle
Min. Duty Cycle
D(Min.)
TOTAL STANDBY CURRENT SECTION
Start-up Current
IST
ICC(OPR)
Operating Supply Current
Zener Voltage
AP3842C/AP3844C, VCC=14V
50
AP3843C/AP3845C, VCC=6.5V
50
80
Vpin3=Vpin2=0V
8
12
ICC=25mA
VZ
30
mA
34
V
OVER-TEMPERATURE PROTECT SECTION
Shutdown Temperature
TSHUT
(Note 6)
155
oC
Temperature Hysteresis
THYS
(Note 6)
25
oC
Note 4: Parameters are tested at trip point of latch with Vpin2 = 0.
Note 5: Here gain is defined as:
ΔVPin 1
A=
, 0 ≤ Vpin3 ≤ 0.8V
ΔVPin 3
Note 6: These parameters, although guaranteed, are not 100% tested in production.
Note 7: This parameter is measured with RT=10kΩ to VREF, it contributes 0.3mA of current to the measured value.
So the total current flowing into the CT pin will be 0.3mA higher than the measured value approximately.
VREF
4.7k
1k
ERROR AMP
ADJUST
RT
1
COMP
2
VFB
A
VREF
8
VCC
7
VCC
100k
5k
4.7k
AP384XC
2N2222
ISENSE
ADJUST
0.1μF
3
ISENSE OUTPUT
6
4
RT/CT
GND
5
1K
1W
OUTPUT
0.1μF
GND
CT
Figure 4. Basic Test Circuit
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
7
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
ELectrical Characteristics (Continued)
Figure 4 is the basic test circuit for AP384XC. In testing, the high peak currents associated with capacitive loads
necessitate careful grounding techniques. Timing and bypass capacitors should be connected close to pin 5 in a
single point ground. The transistor and 5k potentiometer are used to sample the oscillator waveform and apply an
adjustable ramp to pin 3.
Typical Performance Characteristics
Figure 5. Oscillator Dead Time vs. Timing Capacitor
Figure 6. Timing Resistor vs. Frequency
5.015
4.0
VCC=15V, IO=1mA
o
3.5
Saturation Voltage (V)
Reference Voltage (V)
5.010
5.005
5.000
4.995
4.990
VCC=15V, TA=25 C
3.0
2.5
2.0
1.5
1.0
0.5
4.985
4.980
-40
0.0
-0.5
-20
0
20
40
60
80
100
0
120
o
Ambient Temperature ( C)
50
100
150
200
250
300
350
400
450
500
550
600
Output Sink Current (mA)
Figure 7. Reference Voltage vs. Ambient Temperature
Jul. 2013 Rev. 2. 0
Figure 8. Output Saturation Characteristics
BCD Semiconductor Manufacturing Limited
8
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Typical Performance Characteristics (Continued)
90
90
80
80
o
VCC=15V, TA=25 C
Start-up Current (μA)
Voltage Gain (dB)
70
60
50
40
30
70
AP3842C/44C, VCC=14V
60
50
AP3843C/45C, VCC=6.5V
20
40
10
30
-40
0
10
100
1k
10k
100k
-20
0
20
40
60
80
100
120
1M
o
Ambient Temperature ( C)
Frequency (Hz)
Figure 9. Error Amplifier Open-Loop Frequency Response
Figure 10. Start-up Current vs. Ambient Temperature
80
Start-up Current (μA)
70
60
AP3843C/45C
50
AP3842C/44C
40
30
20
10
0
0
2
4
6
8
10
12
14
16
18
Supply Voltage (V)
Figure 11. Start-up Current vs. Supply Voltage
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
9
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Typical Application
NTC
Bridge Diode
1N4007*4
R19
10
C2
0.01μ
600V
+
R2
1M/
0.25W
J1
AC 90 to 265V
C1 47μ
C14
100μ/400V
R3
39k
2W
C15
2.2n
L3
10μ
T
D1
Byv26e
D3
8TQ100
R4 10
+
C10
1000μ
C11
1μ
R20
2K
Z2
SA12A
+
C9
2200μ
+
D2
1N4001
7
R12
100
Vcc
V
CC
J2
12V/5A
C3
0.1μ
VREF
8
R5
10k
2
C5
220p
VFB
1
COMP
5
GND
RT/CT
4
OUTPUT
6
ISENSE
3
C15
100p
R14
130k
U1
AP3842C/3C/4C/5C
R13
15k
R11
820
C4
3.3n
C8
0.22μ
R6
20
R7
1k
C6
2200p/600V
R16
8.2k
Q1
IRF830
U3
AZ431
C7
680p
Z1
1N5819
R15
100
W1
1k
R18
3.9k
R10
0.51/1W
R9
7.5k
R17
2k
U2 PC817
Figure 12. Typical Application of AP3842C/3C/4C/5C
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
10
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Mechanical Dimensions
SOIC-8
4.700(0.185)
5.100(0. 201)
7°
Unit: mm(inch)
0.320(0. 013)
TYP
1.350(0.053)
1.750(0.069)
8°
8°
7°
0.675(0.027)
0.725(0.029)
D
5.800(0. 228)
6.200(0. 244)
1.270(0. 050)
TYP
D
20:1
0.300(0.012)
R0.150(0.006)
0.100(0.004)
Option 1
0°
8°
1.000(0. 039)
TYP
3.800(0.150)
4.000(0.157)
Option 1
0.300(0.012)
0.150(0. 006)
0.250(0. 010)
1°
7°
0.510(0.020)
0.900(0. 035)
TYP
Option 2
R0.150(0.006)
0.450(0. 017)
0.800(0. 031)
0.350(0.014)
TYP
Note: Eject hole , oriented hole and mold mark is optional.
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
11
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Mechanical Dimensions (Continued)
DIP-8
Unit: mm(inch)
0.700(0.028)
7.620(0.300)TYP
1.524(0.060) TYP
6°
5°
6°
3.200(0.126)
3.600(0.142)
3.710(0.146)
4.310(0.170) 4°
4°
0.510(0.020)MIN
3.000(0.118)
3.600(0.142)
0.204(0.008)
0.360(0.014)
8.200(0.323)
9.400(0.370)
0.254(0.010)TYP
2.540(0.100) TYP
0.360(0.014)
0.560(0.022)
0.130(0.005)MIN
6.200(0.244)
6.600(0.260)
R0.750(0.030)
Φ3.000(0.118)
Depth
0.100(0.004)
0.200(0.008)
9.000(0.354)
9.600(0.378)
Note: Eject hole, oriented hole and mold mark is optional.
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
12
Data Sheet
CURRENT MODE PWM CONTROLLER
AP384XC
Mounting Pad Layout
SOIC-8
Unit: mm(inch)
Grid
placement
courtyard
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
1.270/0.050
Jul. 2013 Rev. 2. 0
BCD Semiconductor Manufacturing Limited
13
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
IMPORTANT NOTICE
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
IMPORTANT NOTICE
IMPORTANT
NOTICE
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
BCD Semiconductor
BCD
Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
any products
products or
or specifispecifiother rights nor the rights of others.
cations herein.
cations
herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not assume
assume any
any responsibility
responsibility for
for use
use of
of any
any its
its products
products for
for any
any
particular
particular
purpose,
purpose,
nor
nor
does
does
BCD
BCD
Semiconductor
Semiconductor
Manufacturing
Manufacturing
Limited
Limited
assume
assume
any
any
liability
liability
arising
arising
out
out
of
of
the
the
application
application
or
or
use
use
MAIN SITE
ofHeadquarters
any its
any
its products
products or
or circuits.
circuits. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing
Limited
does not
does
not convey
convey any
any license
license under
under its
its patent
patent rights
rights or
or
-of
- Wafer Limited
Fab
BCD
(Shanghai)
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.
other
other
rights Micro-electronics
rights
nor the
nor
the rights
rightsLimited
of others.
of
others.
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C.
Tel: +86-021-2416-2266, Fax: +86-021-2416-2277
MAIN SITE
SITE
MAIN
REGIONAL
SALES Manufacturing
OFFICE
- Headquarters
BCD
Semiconductor
Limited
800 Yishan Road, Shanghai 200233, China
Tel: +021-6485-1491, Fax: +86-021-5450-0008
- Wafer
FabSemiconductor Manufacturing Limited
BCD
BCD
Semiconductor
Manufacturing Limited
Shanghai
SIM-BCD
Semiconductor Manufacturing Co., Ltd.
Shenzhen
Office
Taiwan
Office
(Taipei)
- Wafer
Fab
- IC Design
Group
No.
1600, Zi
Xing Road,
Shanghai ZiZhu
Science-basedCo.,
Industrial
Park, 200241,
China
Yi
Shan Road,
Shanghai
200233,
China
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Ltd., Shenzhen
Office
BCD800
Semiconductor
(Taiwan)
Company
Limited
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Limited
Advanced
Analog
Circuits
(Shanghai)
Corporation
Tel:
Fax: +86-21-24162277
Tel: +86-21-6485
1491,
0008Dist.,
Unit
A
1203,Skyworth
Bldg.,
Gaoxin
3F, No.17,
Lane
171,
Sec.
2,
Jiu-Zong
Rd.,Shanghai
Nei-Hu
Taipei(114),
Taiwan, R.O.C
800,+86-21-24162266,
YiRoom
Shan Road,
Shanghai
200233,
ChinaAve.1.S., Nanshan District
8F,
Zone
B, 900,
YiFax:
Shan+86-21-5450
Road,
200233,
China
Shenzhen
518057,1491,
ChinaFax: +86-21-5450 0008
Tel: +886-2-2656
2808
Tel: +86-21-6485
Tel: +86-21-6495
9539, Fax: +86-21-6485 9673
REGIONAL
SALES OFFICE
Tel: +86-0755-8660-4900,
Fax: +86-0755-8660-4958
Fax: +886-2-2656-2806/26562950
Shenzhen OfficeSALES OFFICE
Taiwan Office
USA Office
REGIONAL
Shanghai
SIM-BCD
Semiconductor Manufacturing Co., Ltd., Shenzhen Office
Semiconductor
BCD Office
Semiconductor Corp.
Taiwan
Office
(Hsinchu)
USABCD
Office
Korea Office USA
Shenzhen
Office
Taiwan
Office (Taiwan) Company Limited
Unit
ASemiconductor
Room
1203, Skyworth
Gaoxin
Ave.1.S., Nanshan
Shenzhen,
4F,Semiconductor
298-1,
Guang
Road,(Taiwan)
Nei-Hu District,
Taipei,
30920Semiconductor
Huntwood
Ave.Corporation
Hayward,
BCD
(Taiwan)Bldg.,
Company
Limited
BCD
Corp.
BCD
Semiconductor
Limited Korea
office.
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Co., Ltd.District,
Shenzhen
Office
BCDRui
Semiconductor
Company
Limited
BCD
China
Taiwan
CADigital-Empire
94544,
USA Ave.
8F,
No.176,Analog
Sec. 2, Gong-Dao
5th Road, Corporation
East District Shenzhen Office
48460
Kato
CARoad,
94538,
USA District,
Room
101-1112,
II, 486
Sin-dong,
Advanced
Circuits (Shanghai)
4F,Road,
298-1,Fremont,
Rui Guang
Nei-Hu
Taipei,
30920
Huntwood
Hayward,
Tel:
+86-755-8826
7951
+886-2-2656
2808
Tel
:94544,
+1-510-324-2988
HsinChu
300, Taiwan,
R.O.C 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Tel:Tel:
+1-510-668-1950
Yeongtong-Gu,
Suwon-city,
Gyeonggi-do, Korea
Room
E, City
5F, Noble
Center, No.1006,
Taiwan
CA
U.S.A
Fax:
+86-755-8826
7865
Fax:
+886-2-2656
2806
Fax:
+1-510-324-2788
Tel:
+886-3-5160181,
Fax:
+886-3-5160181
Fax:
+1-510-668-1990
Tel:
+82-31-695-8430
Tel: +86-755-8826 7951
Tel: +886-2-2656 2808
Tel : +1-510-324-2988
Fax: +86-755-8826 7865
Fax: +886-2-2656 2806
Fax: +1-510-324-2788