CYSTEKEC DI4005SH 1a general purpose rectifier Datasheet

CYStech Electronics Corp.
Spec. No. : C210SH
Issued Date : 2012.09.13
Revised Date :
Page No. : 1/6
1A General Purpose Rectifier
DI4005SH
Features
• High current capability
• Low power loss, high efficiency
• Ultra high-speed switching
• Low profile surface mounted package in order to minimize board space
• Pb-free package
Mechanical data
•Case : Molded plastic, JEDEC SOD-123.
•Epoxy : UL94-V0 rated flame retardant
•Terminals : Plated terminals, solderable per MIL-STD-202 method 208
•Polarity : Indicated by cathode band
•Mounting position : Any
•Weight : approx. 0.04 gram
Symbol
Outline
DI4005SH
2 (Anode)
SOD-123
DI4005SH
CYStek Product Specification
Spec. No. : C210SH
Issued Date : 2012.09.13
Revised Date :
Page No. : 2/6
CYStech Electronics Corp.
Absolute Maximum Ratings (TA=25℃, unless otherwise noted)
Parameters
Repetitive peak reverse voltage
RMS voltage
Continuous reverse voltage
Conditions
Symbol Min
Single phase half wave,
60Hz @TJ=25°C
8.3ms single half sine-wave
superimposed on rated load
(JEDEC method)
Forward rectified current
Forward surge current
Thermal resistance
Junction to Ambient
Storage temperature range
Operating junction temperature range
Typ
Max
Units
VRRM
500
V
VRMS
350
V
VR
500
V
IF(AV)
1
A
IFSM
10
A
RθJA
°C/W
250
Tstg
-55
150
°C
Tj
-55
150
°C
Characteristics (TA=25°C, unless otherwise noted)
Characteristic
Symbol
VR
VF 1
VF 2
IR
IR
CJ
Forward Voltage
Reverse Leakage Current
Junction Capacitance
Condition
IR=100μA
Min.
Typ
Max.
Unit
500
-
-
V
-
5
0.9
1.25
100
10
-
IF=100mA
IF=1A
VR=500V
VR=500V, TA=125°C
VR=1V, f=1MHz
V
nA
μA
pF
Ordering Information
Device
DI4005SH-0-T1-G
DI4005SH
Package
SOD-123
(Pb-free lead plating and halogen-free package)
Shipping
3000 pcs / Tape & Reel
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C210SH
Issued Date : 2012.09.13
Revised Date :
Page No. : 3/6
Typical Characteristics
Power Derating Curve
Forward Current vs Forward Voltage
0.6
Instantaneous Forward Current---IF (mA)
10000
Power Dissipation(W)
0.5
0.4
0.3
0.2
0.1
Pulse width=300μs,
1% Duty cycle
1000
125℃
100
25°C
75°C
10
0℃
-40°C
1
0
0
25
50
75
100
125
150
175
0
200
Ambient Temperature---TA(℃)
0.2
0.4 0.6 0.8 1 1.2 1.4
Forward Voltage---VF(V)
1.6
1.8
Junction Capacitance vs Reverse Voltage
Reverse Leakage Current vs Reverse Voltage
10
1000
Junction Capacitance---C J(pF)
Reverse Leakage Current---I R (nA)
Tj=125℃
100
Tj=75℃
10
Tj=25℃
1
Tj=0°C
0.1
Tj=25℃, f=1.0MHz
Tj=-40°C
1
0.01
0
100
200
300
400
500
Reverse Voltage---VR (V)
0.1
1
10
100
Reverse Voltage---VR (V)
Recommended Soldering Footprint
DI4005SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C210SH
Issued Date : 2012.09.13
Revised Date :
Page No. : 4/6
Reel Dimension
Carrier Tape Dimension
DI4005SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C210SH
Issued Date : 2012.09.13
Revised Date :
Page No. : 5/6
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5 °C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
Time maintained above:
−Temperature (TL)
− Time (tL)
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25 °C to peak temperature
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
10-30 seconds
20-40 seconds
6°C/second max.
6 minutes max.
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
DI4005SH
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C210SH
Issued Date : 2012.09.13
Revised Date :
Page No. : 6/6
SOD-123 Dimension
Marking:
A5
2-Lead SOD-123 Plastic
Surface Mounted Package
CYStek Package Code: SH
Inches
Min.
Max.
0.102
0.110
0.059
0.067
0.041
0.049
DIM
A
B
C
Millimeters
Min.
Max.
2.600
2.800
1.500
1.700
1.050
1.250
Style: Pin 1.Cathode 2.Anode
DIM
D
E
Inches
Min.
Max.
0.018
0.026
0.140
0.152
Millimeters
Min.
Max.
0.450
0.650
3.550
3.850
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DI4005SH
CYStek Product Specification
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