Rohm BD65B60GWL-E2 White led driver Datasheet

Datasheet
Max. 28.5V Output 2Strings(25mA/ch)
White LED Driver
BD65B60GWL
●General Description
BD65B60 is a white LED driver IC that integrates PWM
step-up DC/DC converter with boost-capability of up to
maximum 28.5V and current driver with drive capability of up
to 25mA(Typ.) maximum setting. Precise brightness can be
controlled at wide ranges through the external PWM pulse
input.
This IC features highly accurate current drivers with low
differential current errors between channels, thus, reducing
brightness spots on the LCD panel. Moreover, its small
package is suited for saving space.
●Key Specifications
 Input voltage range:
2.7V to 5.5V
 Output voltage range:
Max. 28.5V
 Operational LED Channel:
2ch or 1ch
 Switching frequency:
0.6MHz/1.1MHz(Typ.)
 LED Current per Channel:
25mA (Max.)
 LED current accuracy:
±3.0% (Max.)
 Quiescent current
0μA (Typ.)
 Operating temperature range:
-40°C to +85°C
●Package
W(Typ.) x D(Typ.) x H(Max.)
UCSP50L1 (12pin) 1.40mm x 1.80mm x 0.55mm
●Features
 High efficiency PWM step-up DC/DC converter
fSW1 = 1.1MHz(Typ.), fSW2 = 0.60MHz(Typ.)
 High accuracy & good matching current drivers (2ch)
 Soft Start function
 Drives up to 8 LEDs in series per channel
 Lower input voltage range requirement (2.7V to 5.5V)
●Applications
Backlight for smartphones, games, digital video cameras,
digital single-lens reflexes, digital still cameras, digital photo
frames, Portable DVD player, etc.
●Pin Configuration (Bottom View)
●Typical Application Circuit
D
SW
VOUT
LED2
C
GND
RESET
LED1
B
VBAT
PWM
SCL
A
ISET
VIO
SDA
1
2
3
10μH
2.7V to 5.5V
COUT
CVBAT
VBAT
1.65V to 3.3V
VOUT
SW
VIO
CVIO
SCL
BD65B60GWL
LED1
Controller
SDA
LED2
RESET
GND
ISET
RSET
PWM
PWMIN
○Product structure：Silicon monolithic integrated circuit
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© 2013 ROHM Co., Ltd. All rights reserved.
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○This product is not designed protection against radioactive rays
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TSZ02201-0G3G0C210420-1-2
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Datasheet
BD65B60GWL
●Pin Descriptions
PIN
No.
PIN
Name
I/O
Terminal
diagram
A1
ISET
In
Resistor Connection for LED Current setting
A
A2
VIO
In
VIO voltage Terminal. Connect a 1.65V to 3.3V
supply to VIO and bypass to GND with a 0.1µF or
greater ceramic capacitor.
B
Function
VBAT
PIN
GND
2
A3
SDA
In
Serial Data input for I C Interface
This pin is needed to connect external pull-up
resistor to VIO pin.
Please refer to P.37 “SDA, SCL Pull-up Resistor
Selection.”
B1
VBAT
In
VBAT voltage Terminal. Connect a 2.7V to 5.5V
supply to VBAT and bypass to GND with a
1.0µF(Typ.) or greater ceramic capacitor.
B2
PWM
In
B3
SCL
In
C1
GND
-
C2
C3
RESET
LED1
In
In
D1
SW
Out
D2
VOUT
In
D3
LED2
In
Input pin for controlling the current driver.
This pin has an internal pull-down resistor.
Please refer to P.35 “Brightness Control”
Serial Clock input for I2C Interface
This pin is needed to connect external pull-up
resistor to VIO pin.
Please refer to P.37 “SDA, SCL Pull-up Resistor
Selection”.
Power Ground for internal switching transistor
Active-low reset. Pull this pin high to enable the IC.
This pin is needed to connect external pull-down
resistor.
Please refer to P.29 “Functional Descriptions”
Input terminal to Internal Current Driver.
LED cathode connection.
Switching terminal where an external inductor is
connected. Internally connects to an NMOS switch.
Connect the inductor as close as possible to SW
terminal to reduce parasitic inductance and
capacitance. Please refer to PCB layout of P.39.
Terminal for monitoring the output voltage of
switching regulator. Also, detects SBD open and
OVP. Please refer to P.31.
Connect VOUT to the positive terminal of the output
capacitor (COUT). Recommended COUT value is
1.0µF(Typ.) for DC mode or 2.2µF(Typ.) for PWM
mode.
Input terminal to Internal Current Driver.
LED cathode connection.
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A
B
C
PIN
GND
B
B
B
VBAT
C
GND
B
C
B
B
B
B
TSZ02201-0G3G0C210420-1-2
3.JUN.2013 Rev.001
Datasheet
BD65B60GWL
●Block Diagram
2.7V to 5.5V
1μF
10μH
2.2μF
VBAT
REF
VOUT
TSD
RESET
x1, x0.8, x0.6, x0.4
UVLO
Output short PROTECT
FAULT
DETECTOR
SW
Output Over Voltage PROTECT
Pre-driver
I2C
31V/28V
23.5V
LED TERMINAL
SHORT DETECTOR
ERRAMP
PWM COMP
GND
Current SENSE
Control
Over Current
SENSE
Vshort=no, 5.4V
LED1
LED
-
RETURN
+
LED2
SELECT
Protect
Soft start
(0.1μF)
FB Voltage setting
+
OSC
VIO
3V
1.1 or 0.6MHz
SCL
SDA
2ch
LOGIC
Controller
8bit
DAC
ISET Driver
+
RESET
+
-
Current ratio setting
Current Driver
ISET
PWM
RSET
PWMIN
●Description of Block
The lowest voltage between LED1 and LED2 pins is detected when IC is powered on. Output voltage is kept constant by
controlling the switching duty through the feedback voltage which is set at 0.3V(Typ.). The PWM Current Mode DC/DC
Converter is controlled by the two inputs of the comparator: one is the differential output from the error amplifier and the
other is the sum of current sensing and the ramp signal generated by the oscillator. These combined signals prevent the
sub-harmonic oscillation in PWM Current Mode. The PWM output controls internal switch N-channel Transistor via the RS
latch. Energy is accumulated in the external inductor when the gate of the N-channel transistor is “ON”, while energy is
transferred to the output capacitor via external SBD when the N-channel transistor is “OFF”.
LED brightness is controlled by the current driver which can be set by: external resistor RSET, 8-bit DAC current ratio and
PWM control that is selectable as DC or pulse input.
Furthermore, this IC has several protection functions such as thermal shutdown, over-current protection, under-voltage
lockout, over-voltage protection, external SBD open detection, LED open and short detection. Their respective detection
signals stop the switching operation instantly.
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Datasheet
BD65B60GWL
●Absolute Maximum Ratings (Ta=+25°C)
Parameter
Symbol
Limits
Unit
Condition
Maximum Applied Voltage 1
VMAX1
7
V
VBAT, VIO, PWM, SDA, SCL,
RESET, ISET
Maximum Applied Voltage 2
VMAX2
34
V
SW, LED1,LED2, VOUT
Power Dissipation
Pd1
Operating Temperature Range
Topr
Storage Temperature Range
Tstg
mW
Power dissipation derates by
5.2mW/ ºC when operating
above 25 ºC (When mounted on
ROHM’s standard board)
Power dissipation is calculated
by formula :
Pd=(Storage temperature max 25°C )/JA
(ex. Pd1=5.2mW/°C)
-40 to +85
°C
-
-55 to +150
°C
-
Unit
Conditions
650
●Recommended Operating Ratings (Ta=+25°C)
Parameter
Power Supply Voltage
VIO Input Voltage (IO)
Symbol
VBAT
VIO
Min.
2.7
1.65
Limits
Typ.
3.6
3.0
Max.
5.5
3.3
V
V
Power supply
I/O power supply (VIO<=VBAT)
●Electrical Characteristics (Unless otherwise specified, VBAT=3.6V, VIO=3.0V, Ta=+25°C)
Limits
Parameter
Symbol
Unit
Conditions
1.0
1.0
4.0
µA
µA
µA
0.80
-
mA
-
0.85
-
mA
IDDVIO
-
-
100
µA
RESET=0V
RESET=0V
RESET=1.8V, ad0Eh, data=00h
RESET=1.8V, VOUT=open
Fsw=1.1MHz, ad03h, data=01h
<No switching>
RESET=1.8V, VOUT=open
Fsw=1.1MHz, ad03h, data=05h
<No switching>
RESET=1.8V, VOUT=open
SDA=SCL=50%@400kHz (3.0V)
VTHL
VTHH
IRSTin
IRSTout
RPWM
1.4
-1
-
300
0.5
1
-
V
V
µA
µA
kΩ
VILI
VIHI
-0.3
0.75xVIO
-
0.25xVIO
VIO+0.3
V
V
VOL
-
-
0.3
V
IOL=3mA
ISin
-3
-
3
µA
Input voltage = from (0.1 x VIO)
to (0.9 x VIO)
Min.
Typ.
Max.
IQVBAT
IQVIO
ISTB
-
2.0
Current Consumption (VBAT)
for Current Driver 1ch
IBAT1ch
-
Current Consumption (VBAT)
for Current Driver 2ch
IBAT2ch
Current Consumption (VIO)
[General]
Quiescent Current (VBAT)
Quiescent Current (VIO)
Standby Current (VBAT)
[RESET, PWM Terminal]
Low Level Input Voltage
High Level Input Voltage
RESET Input Current
RESET Output Current
PWM Pull down Resistor
[SDA, SCL Terminal]
Low Level Input Voltage
High Level Input Voltage
L level Output Voltage
(for SDA pin)
Input Current
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Datasheet
BD65B60GWL
●Electrical Characteristics (Unless otherwise specified, VBAT=3.6V, VIO=3.0V, Ta=+25°C)
Limits
Parameter
Symbol
Unit
Min.
Typ.
Max.
VLED1
VLED2
VLED3
VLED4
FSW
DMAX
RON
IQSW
0.40
0.88
90.0
-
0.50
0.40
0.30
0.20
1.10
95.0
0.3
0.1
0.60
1.32
99.0
2.0
V
V
V
V
MHz
%
Ω
μA
VRANGE
VBAT+1V
-
OVP-1V
V
VUVLO
VUVLOH
IOcp1
IOcp2
-
2.1
2.3
1000
1700
-
V
V
mA
mA
Over Voltage Limit Input1
VOVP1
29.5
31
33
V
Over Voltage Limit Input2
VOVP2
27
28
29.5
V
Over Voltage Limit Input3
VOVP3
22.5
23.5
24.7
V
Over Voltage Limit Hysteresis
VOVPhys
-
1
-
V
Output Short Protect
VOVPfault
-
0.2
0.5
V
VOUT Leak Current
IOVL
-
0.1
1.0
µA
VSC
4.5
5.4
6.3
V
ILMAX
5.0
-
25.0
mA
ILEDSTP
ILACCU1
-
256
-
±3.0
step
%
[Switching Regulator]
LED Control Voltage1
LED Control Voltage2
LED Control Voltage3
LED Control Voltage4
Switching Frequency Accuracy
Duty Cycle Limit
SW Nch FET RON
SW Transistor Leak Current
VOUT Range
[Protection]
Under Voltage Lock Out (fall)
Under Voltage Lock Out (rise)
Over Current Limit 1
Over Current Limit 2
LED Terminal
Over Voltage Protect
[Current driver]
LED Maximum Current
Setting Range
LED current Step
LED Current Accuracy 1
Conditions
ad02h,data=00h
ad02h,data=01h
ad02h,data=02h
ad02h,data=03h
FOSC(ad02h D2)=1
LED1-2=0.3V, Fsw=1.1MHz
ISW=80mA, VBAT=3.6V
RESET =0V, SW=18V
Under OVP voltage
VBAT falling edge
VBAT rising edge
VBAT=2.7V, ad01h,data=01h *1
VBAT=2.7V, ad01h,data=00h *1
VOUT rising edge,
ad01h,data=10h
VOUT rising edge,
ad01h,data=01h
VOUT rising edge,
ad01h,data=00h or 11h
Detect voltage of VOUT pin
RESET=0V,
VOUT=18V (OVP=31V)
This value is characteristics of
current driver.
LED1, 2
IMAX=15.0mA
range = 10.02mA to 15mA
RSET resistor =15.0mA setting *2
DAC register :
ad05h, data=AAh to FFh
range = 5.04mA to 9.96mA
RSET resistor =15.0mA setting *2
DAC register :
ad05h, data=55h to A9h
LED Current DAC Linearity 1
(Design target )
IDALIN1
-
-
±2.0
%
LED Current DAC Linearity 2
(Design target)
IDALIN2
-
-
±3.0
%
LED Current Matching
ILMAT
-
-
2.0
%
LED Current Limit
ILOCP
-
0
0.1
mA
(Max LED current – average
current) / average current
Current Limit Value at ISET
Resistor 1kΩ Setting
LED Leak Current
IQLED
-
0.1
1.0
µA
RESET=0V, LED1&LED2=18V
*1 This parameter is tested with DC measurement
*2 condition: RSET resistor = 40kΩ, ILED = 15.0mA setting
calculation: IDALIN1=(ILED(XXh)/ILED(FFh) x 256/(XXh+1)) - 1
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Datasheet
BD65B60GWL
●Evaluation Data
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
PWM=0V(GND)
4
0.14
VIO=3.0V
RESET=0V
3.5
3
0.1
2.5
I QVIO (µA)
I QVBAT (µA)
VBAT=3.6V
RESET=0V
0.12
2
1.5
0.08
0.06
0.04
1
VBAT=2.7V
0.5
0
-40
-15
VBAT=3.6V
10
35
VBAT=5.5V
60
0.02
-40
-15
35
60
85
Figure 2. Quiescent Current (VIO) vs
Temperature
5
1
4.5
0.9
VBAT=5.5V
0.8
4
0.7
I BAT1ch (mA)
3.5
I STB (µA)
10
TEM P (°C)
Figure 1. Quiescent Current (VBAT) vs
Temperature
VBAT=3.6V
VIO=3.3V
0
85
TEMP (°C)
VBAT=2.7V
VIO=3.0V
VIO=1.65V
3
2.5
2
0.6
0.5
VBAT=2.7V
VBAT=3.6V
VBAT=5.5V
0.4
0.3
1.5
1
0.2
VIO=3.0V
RESET=1.8V
0.5
VIO=3.0V
RESET=1.8V
0.1
0
0
-40
-15
10
35
60
-40
85
Figure 3. Standby Current (VBAT) vs
Temperature
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TSZ22111・15・001
-15
10
35
60
85
TEM P (°C)
TEM P (°C)
Figure 4. Current Consumption (VBAT) 1CH
vs Temperature
<No switching>
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
1
45
0.9
40
0.8
35
0.7
30
0.6
0.5
VBAT=2.7V
VBAT=3.6V
I DDVIO (µA)
I BAT2ch (mA)
VBAT=3.6V
RESET=1.8V
VBAT=5.5V
0.4
25
20
15
0.3
VIO=3.0V
10
0.2
VIO=3.0V
RESET=1.8V
0.1
VIO=3.3V
VIO=1.65V
5
0
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TEM P (°C)
TEM P (°C)
Figure 5. Current Consumption (VBAT) 2CH
vs Temperature
<No switching>
Figure 6. Current Consumption (VIO) vs
Temperature
1.4
1.4
1.2
1.2
VBAT=5.5V
VBAT=3.6V
VBAT=5.5V
VBAT=3.6V
VTH (V)
1
1
VTH (V)
VBAT=2.7V
0.8
0.8
VBAT=2.7V
0.6
0.6
0.4
0.4
-40
-15
10
35
60
85
-40
TEM P (°C)
10
35
60
85
TEM P (°C)
Figure 7. Reset Threshold Voltage vs
Temperature
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Figure 8. PWM Threshold Voltage vs
Temperature
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
200
350
180
300
160
250
I RSTin / I RSTout (nA)
140
R PWM (kΩ)
120
100
80
60
200
150
100
40
VBAT=3.6V
T=25°C
20
VBAT=3.6V
T=25°C
50
0
0
0
0.6
1.2
1.8
2.4
0
3
0.4
1.2
1.6
2
PWM Voltage (V)
RESET (V)
Figure 9. Reset Input and Output Current vs
Reset Voltage
Figure 10. PWM Pull-Down Resistance vs
PWM Voltage
3
3
2.5
2.5
VIO=3.3V
VIO=3.0V
VIO=3.0V
2
VIO=3.3V
2
VTH (V)
VTH (V)
0.8
1.5
1
0.5
1.5
1
VIO=1.65V
0.5
0
VIO=1.65V
0
-40
-15
10
35
60
85
-40
TEM P (°C)
10
35
60
85
TEM P (°C)
Figure 12. SCL Threshold Voltage vs
Temperature
Figure 11. SDA Threshold Voltage vs
Temperature
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
100
200
180
VBAT=5.5V
80
160
120
I Sin (nA)
VOL (mV)
140
60
VBAT=3.6V
40
100
80
60
VBAT=2.7V
20
40
VBAT=3.6V
VIO=3V
T=25°C
20
0
0
-40
-15
10
35
60
85
0
0.3
TEM P (°C)
0.6
0.9
1.2
1.5
1.8
SDA (V)
Figure 13. SDA “L” Level Output Voltage vs
Temperature
Figure 14. SDA Input Current vs SDA Voltage
0.7
200
180
0.6
VBAT=5.5V
160
0.5
140
VLED1 (V)
I Sin (nA)
120
100
80
60
0.4
VBAT=3.6V
VBAT=2.7V
0.3
0.2
40
VBAT=3.6V
VIO=3V
T=25°C
20
0.1
0
0
0
0.3
0.6
0.9
1.2
1.5
1.8
-40
SCL (V)
10
35
60
85
TEM P (°C)
Figure 16. LED Control Voltage 1 vs Temperature
(Feedback voltage=0.5V setting)
Figure 15. SCL Input Current vs SCL Voltage
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TSZ02201-0G3G0C210420-1-2
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
0.7
0.7
0.6
0.6
VBAT=5.5V
VBAT=5.5V
0.5
0.5
VLED3 (V)
VLED2 (V)
VBAT=3.6V
0.4
0.3
0.4
VBAT=2.7V
0.3
VBAT=3.6V
VBAT=2.7V
0.2
0.2
0.1
0.1
0
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TEM P (°C)
TEM P (°C)
Figure 17. LED Control Voltage 2 vs Temperature
(Feedback voltage=0.4V setting)
Figure 18. LED Control Voltage 3 vs Temperature
(Feedback voltage=0.3V setting)
0.7
1.4
0.6
1.2
VBAT=5.5V
1
0.5
f SW (MHz)
VLED4 (V)
0.4
VBAT=3.6V
VBAT=2.7V
0.3
VBAT=2.7V
VBAT=3.6V
VBAT=5.5V
0.8
0.6
0.2
0.4
0.1
0.2
0
0
-40
-15
10
35
60
-40
85
10
35
60
85
Figure 20. Switching Frequency (1.1MHz) vs
Temperature
Figure 19. LED Control Voltage 4 vs Temperature
(Feedback voltage=0.2V setting)
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TEM P (°C)
TEM P (°C)
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
100
0.8
0.7
VBAT=5.5V
98
VBAT=2.7V
VBAT=2.7V
VBAT=3.6V
0.5
D MAX (%)
f SW (MHz)
0.6
0.4
0.3
96
VBAT=5.5V
94
VBAT=3.6V
0.2
92
0.1
0
90
-40
-15
10
35
60
85
-40
-15
TEM P (°C)
10
35
60
85
TEM P (°C)
Figure 21. Switching Frequency (0.6MHz) vs
Temperature
Figure 22. Maximum Duty Cycle Limit vs
Temperature
15
700
600
14
VBAT=2.7V
500
13
12
R ON (mΩ)
D MIN (%)
VBAT=2.7V
VBAT=3.6V
VBAT=5.5V
400
300
VBAT=5.5V
200
11
VBAT=3.6V
100
10
0
-40
-15
10
35
60
85
-40
TEM P (°C)
10
35
60
85
TEM P (°C)
Figure 24. SW Nch FET RON (at ISW=80mA)
vs Temperature
Figure 23. Minimum Duty Cycle Limit vs
Temperature
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BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
2.5
0.1
2.4
rising
2.3
0.08
2.1
UVLO(V)
I QSW (µA)
2.2
0.06
0.04
Temp=25°C
VBAT=3.6V
RESET=0V
SW=25V
0.02
falling
2.0
1.9
1.8
1.7
1.6
0
-40
1.5
-15
10
35
60
85
-40
-15
TEMP (°C)
10
35
60
85
TEMP (°C)
Figure 26. Under Voltage Lock Out (Rise/Fall)
Figure 25. SW Leak Current vs Temperature
2
2
1.8
1.8
1.6
1.6
VBAT=2.7V
1.4
1.4
VBAT=3.6V
1.2
I OCP2 (A)
I OCP1 (A)
VBAT=2.7V
1
0.8
0.6
1.2
1
VBAT=5.5V
0.8
0.6
VBAT=3.6V
0.4
0.4
VBAT=5.5V
0.2
0.2
0
-40
0
-40
-15
10
35
60
85
10
35
60
85
TEMP (°C)
TEM P (°C)
Figure 27. Current Limit (1A) vs Temperature
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Figure 28. Current Limit (1.7A) vs Temperature
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
28
32
27
31
26
30
25
29
VOVP2 (V)
VOVP1 (V)
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
24
23
VBAT=5.5V
VBAT=3.6V
28
VBAT=5.5V
22
26
21
25
20
-40
-15
10
35
60
VBAT=3.6V
VBAT=2.7V
27
VBAT=2.7V
24
-40
85
-15
TEMP (°C)
10
35
60
85
TEMP (°C)
Figure 29. Over Voltage Protection 1 (23.5V)
vs Temperature
Figure 30. Over Voltage Protection 2 (28V)
vs Temperature
35
3.0
34
2.5
33
2.0
VOVPhys(V)
VOVP3 (V)
32
31
30
VBAT=5.5V
VBAT=3.6V
VBAT=2.7V
1.5
1.0
29
VBAT=5.5V
0.5
VBAT=3.6V
VBAT=2.7V
28
27
-40
0.0
-15
10
35
60
85
-40
TEMP (°C)
10
35
60
85
TEMP (°C)
Figure 32. Over Voltage Protection Hysteresis
vs Temperature
Figure 31. Over Voltage Protection 3 (31V)
vs Temperature
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
1000
0.5
800
0.4
VBAT=3.6V
RESET=0V
VOUT=20V
700
600
I OVL (µA)
Output Short Voltage (mV)
900
500
400
0.3
0.2
300
200
0.1
100
VBAT=5.5V
VBAT=3.6V
VBAT=2.7V
VBAT=3.6V
0
-40
-15
10
35
60
0
-40
85
TEMP (°C)
-15
10
35
60
85
TEMP (°C)
Figure 33. Output Short Protect
Figure 34. VOUT Leak Current vs
Temperature
1
6.0
5.8
0.8
5.7
5.6
I QLED (µA)
Over Voltage Protect (mV)
5.9
5.5
5.4
5.3
VBAT=5.5V
VBAT=3.6V
RESET=0V
VOUT=VLED=33V
0.4
VBAT=2.7V
VBAT=3.6V
5.2
0.6
0.2
5.1
5.0
-40
-15
10
35
60
0
-40
85
TEMP (°C)
-15
10
35
60
85
TEMP (°C)
Figure 36. LED1, LED2 Leak Current vs
Temperature
Figure 35. LED Terminal Over Voltage Protect
vs Temperature
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BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VBAT=3.6V
VIO=3.0V
RESET=2.5V
100
10
9
8
7
I LMAT (%)
I LED (mA)
10
1
6
5
4
VBAT=3.6V
Temp=25°C
f_PWM=10kHz
RISET=30kΩ
3
VBAT=3.6V
Temp=25°C
f_PWM=10kHz
RISET=30kΩ
2
1
0.1
0
1
10
100
0
20
PWM Duty (%)
40
60
80
100
PWM Duty Cy cle (%)
Figure 37. LED Current vs PWM Duty
(PWM output mode)
Figure 38. LED Current Matching vs PWM Duty
(PWM output mode)
10
100
9
8
7
I LED (mA)
I LMAT (%)
10
1
6
5
4
VBAT=3.6V
Temp=25°C
f_PWM=20kHz
RISET=30kΩ
3
VBAT=3.6V
Temp=25°C
f_PWM=20kHz
RISET=30kΩ
2
1
0
0.1
1
10
0
100
40
60
80
100
PWM Duty Cy cle (%)
PWM Duty (%)
Figure 40. LED Current Matching vs PWM Duty
(DC output mode)
Figure 39. LED Current vs PWM Duty
(DC output mode)
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and condition. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
25
1.0
0.8
20
0.6
0.2
I LED (mA)
DNL (LSB)
0.4
0.0
-0.2
15
10
-0.4
VBAT=3.6V
Temp=25°C
RISET=30kΩ
-0.6
-0.8
VBAT=3.6V
Temp=25°C
RISET=30kΩ
5
0
-1.0
0
64
128
192
0
256
64
128
192
256
Code
Code
Figure 42. LED Current vs LED Current Ratio
Figure 41. DNL vs LED Current Ratio
5.0
4.5
VBAT=3.6V
Temp=25°C
RISET=30kΩ
4.0
Matching (%)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
64
128
192
256
Code
Figure 43. LED Current Matching vs LED Current Ratio
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Datasheet
BD65B60GWL
●Evaluation Data -continued
Evaluation data is measured using below parts and conditon. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=3.0V
RESET=2.5V
PWM=0V(GND)
30
70
VBAT=3.6V
VBAT=2.7V
60
25
50
VBAT=5.5V
I LED (mA)
I LED (mA)
20
40
30
VBAT=3.6V
15
VBAT=2.7V
10
20
Temp=25°C
VIO=3V
RESET=2.5V
VBAT=5.5V
10
Temp=25°C
VIO=3V
R_ISET=24kΩ
RESET=2.5V
5
0
0
0
15
30
45
60
75
90
0
1
2
3
4
5
I ISET (uA)
VLED (V)
Figure 44. LED Current Limit vs ISET Current
Figure 45. LED Current vs LED Voltage
600
VISET (mV)
580
VBAT=3.6V
VBAT=5.5V
560
VBAT=2.7V
540
520
500
-40
-15
10
35
60
85
TEMP (°C)
Figure 46. ISET Voltage vs Temperature
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Datasheet
BD65B60GWL
●Evaluation Data -continued
LED current is measured using below parts. (Unless otherwise specified)
Coil : 1277AS-H-4R7M
SBD : RB160VA-40
VIO=1.8V
RESET=2.5V
PWM=0V(GND)
6
12.0
5.8
11.5
5.6
11.0
5.4
VBAT=5.5V
VBAT=3.6V
VBAT=2.7V
10.5
I LED (mA)
I LED (mA)
5.2
5
4.8
VBAT=5.5V
VBAT=3.6V
VBAT=2.7V
10.0
9.5
4.6
9.0
4.4
8.5
4.2
4
-40
8.0
-15
10
35
60
85
-40
-15
10
TEMP (°C)
16
2. 0
1. 8
VBAT=5.5V
VBAT=3.6V
VBAT=2.7V
1. 6
15.4
1. 4
LED matching (%)
I LED (mA)
85
Figure 48. LED Current 10mA (RSET=62kΩ)
vs Temperature
15.8
15.2
15
14.8
14.6
1. 2
1. 0
0. 8
0. 6
14.4
0. 4
14.2
0. 2
14
-40
60
TEMP (°C)
Figure 47. LED Current 5mA (RSET=120kΩ)
vs Temperature
15.6
35
VBAT=5.5V
VBAT=3.6V
VBAT=2.7V
0. 0
-15
10
35
60
-40
85
TEMP (°C)
10
35
60
85
TEMP (°C)
Figure 50. LED Current Matching 15mA (RSET=39kΩ)
vs Temperature
Figure 49. LED Current 15mA (RSET=39kΩ)
vs Temperature
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Datasheet
BD65B60GWL
●Typical Performance Curves
Conditions:
VBAT=3.6V, Ta=25°C, Fsw=0.6MHz, LED 6series x 1string and 2strings
(1) FB=0.3V setting
Efficiency is calculated using the following equation:
Efficiency = (VOUT x LED current) / (VBAT x Input current)
LED current is calculated using the following equation:
LED current = max current x ratio x PWM duty
Where:
max current is 12mA set by RSET, which is the resistor connected to ISET terminal.
ratio is controlled by register (ad05h D[7:0])
PWM duty is equal to 100%
6series 1string Efficiency (FB=0.3V)
(2) FB=0.5V setting
Efficiency is calculated using the following equation:
Efficiency = (VOUT x (LED1+LED2 current)) / (VBAT x Input current)
LED current is calculated using the following equation:
LED current = max current x ratio x PWM duty
Where:
max current is 25mA set by RSET, which is the resistor connected to ISET terminal.
ratio is controlled by register (ad05h D[7:0])
PWM duty is equal to100%
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BD65B60GWL
●Control Signal Input Timing
2
Timing sequence (VBAT, VIO, RESET, I C (SDA, SCL))
VBAT voltage > VIO voltage
VBAT
t6
t1
t5
VIO
t2
RESET
t4
t3
2
I C IF(SDA, SCL)
IC status
OFF
Standby
Operating (or Standby)
OFF
Figure 51. Timing Diagram
Table 1. Input Timing
Symbol
t1
t2
t3
t4
t5
t6
Name
Power Supply(IC) – Power supply (IO) time
Power Supply(IO) – RESET wait time
RESET – I2C wait time
RESET low width
RESET - Power Supply(IO) time
Power Supply(IO) - Power Supply(IC)
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Unit
µs
µs
µs
µs
µs
µs
Min.
100
0
100
50
0
0
Typ.
-
Max.
-
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Datasheet
BD65B60GWL
●Serial Interface
2
It can interface with I C BUS format compatible.
(1) Slave address
A7
A6
A5
A4
A3
A2
A1
R/W
1
1
0
0
1
0
0
1/0
Figure 52. Slave Address
(2) Bit Transfer
SCL transfers 1-bit data during each clock pulse and data is sampled at “H” state. SDA cannot be changed at the time of bit
transfer. Any changes on the SDA while SCL is in H state, a START condition or a STOP condition will occur and it will be
interpreted as a control signal.
SDA
SCL
SDA line is stable：
Data is valid
Change of data
is allowed
Figure 53. Bit transfer (I2C format)
(3) START and STOP condition
When SDA changes state while SCL is H, data is not transferred on the I2C bus. Two conditions might occur if this happens.
If SDA changes from H to L while SCL is H, it will become START (S) condition which signals the beginning of a new
command. If SDA changes from L to H while SCL is H, it will become STOP (P) condition which signals the end of the
previous command.
SDA
SCL
S
P
STOP condition
START condition
Figure 54. START/STOP condition (I2C format)
(4) Acknowledge
Transfer of 8-bit data occurs after each START condition. After eight bits had been sent, the transmitter opens SDA while
the receiver returns the acknowledge signal by setting SDA to L.
Acknowledge is returned between address 00h and 0Eh.
DATA OUTPUT
BY TRANSMITTER(SDA)
not acknowledge
DATA OUTPUT
BY RECEIVER(SDA)
acknowledge
SCL
1
2
8
9
S
clock pulse for
acknowledgement
START condition
Figure 55. Acknowledge (I2C format)
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BD65B60GWL
(5) Write protocol
A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The 3rd
byte writes data in the internal register written in by the 2nd byte, and after the 4th byte or, the increment of register address
is carried out automatically. However, when a register address turns into the last address 0Eh, it is set to 00h by the next
transmission. After the transmission ends, the increment of the address is carried out.
*1
S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A D7 D6 D5 D4 D3 D2 D1 D0 A
slave address
register address
*1
D7 D6 D5 D4 D3 D2 D1 D0 A P
DATA
DATA
register address
increment
register address
increment
R/W=0(write)
A=acknowledge(SDA LOW)
A=not acknowledge(SDA HIGH)
S=START condition
P=STOP condition
*1: Write Timing
from master to slave
from slave to master
Figure 56. Writing protocol
(6) Read protocol
It reads from the next byte after writing a slave address and R/W bit. The register to read is consider as the following
address accessed at the end, and the data of the address that carried out the increment is read after it. If an address turns
into the last address 0Eh, the next byte will read out 00h. After the transmission end, the increment of the address is carried
out.
S X X X X X X X
1 A D7 D6 D5 D4 D3 D2 D1 D0 A
slave address
D7 D6 D5 D4 D3 D2 D1 D0 A
DATA
DATA
register address
increment
register address
increment
R/W=1(read)
P
A=acknowledge(SDA LOW)
A=not acknowledge(SDA HIGH)
S=START condition
P=STOP condition
from master to slave
from slave to master
Figure 57. Reading protocol
(7) Multiple Read protocol
After specifying an internal address, it reads by repeated START condition and changing the data transfer direction. The
data of the address that carried out the increment is read after it. If an address turns into the last address 0Eh, the next byte
will read out 00h. After the transmission end, the increment of the address is carried out.
S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A Sr X X X X X X X 1 A
slave address
register address
slave address
R/W=0(write)
R/W=1(read)
D7 D6 D5 D4 D3D2 D1D0 A
DATA
D7 D6D5 D4 D3D2 D1D0 A P
DATA
register address
increment
register address
increment
A=acknowledge(SDA LOW)
A=not acknowledge(SDA HIGH)
S=START condition
P=STOP condition
Sr=repeated START condition
from master to slave
from slave to master
Figure 58. Multiple reading protocols
As for read protocol and multiple read protocol, please do Ā(not acknowledge) after doing the final reading operation. It
stops with read when ending by A(acknowledge), and SDA stops in the state of Low when the reading data of that time is 0.
However, this state returns usually when SCL is moved, data is read, and Ā(not acknowledge) is done.
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Datasheet
BD65B60GWL
(8) Timing diagram
SDA
t BUF
t SU;DAT
t LOW
t HD;STA
SCL
t HD;STA
S
t SU;STO
t SU;STA
t HD;DAT
Sr
t HIGH
P
S
Figure 59. Timing Diagram (I2C format)
(9) Electrical Characteristics (Unless otherwise specified, Ta=25 oC, VBAT=3.6V, VIO=1.8V)
Table 2. Electrical Characteristics
Parameter
Symbol
Min.
Standard-mode
Typ.
Max.
Min.
Fast-mode
Typ.
Max.
Unit
2
【I C BUS format】
SCL clock frequency
LOW period of the SCL clock
HIGH period of the SCL clock
Hold time (repeated) START condition
After this period, the first clock
is generated
Set-up time for a repeated START
condition
Data hold time
Data set-up time
Set-up time for STOP condition
Bus free time between a STOP
and START condition
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fSCL
tLOW
tHIGH
0
4.7
4.0
-
100
-
0
1.3
0.6
-
400
-
kHz
μs
μs
tHD;STA
4.0
-
-
0.6
-
-
μs
tSU;STA
4.7
-
-
0.6
-
-
μs
tHD;DAT
tSU;DAT
tSU;STO
0
250
4.0
-
3.45
-
0
100
0.6
-
0.9
-
μs
ns
μs
tBUF
4.7
-
-
1.3
-
-
μs
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Datasheet
BD65B60GWL
●Register List
Table 3. Register List
Add
ress
R/W
Initial
00h
W
01h
Register Data
D4
D3
D7
D6
D5
00h
-
-
-
-
R/W
01h
-
-
-
02h
R/W
02h
SKIPEN
(1)
SKIPEN
(0)
03h
R/W
05h
-
04h
R/W
00h
05h
R/W
06h
Function
D2
D1
D0
-
-
-
SFRST
Software
Reset
OVP(1)
OVP(0)
-
-
ROCP
Common
Setting1
SWSRT
(1)
SWSRT
(0)
-
FOSC
FB(1)
FB(0)
Common
Setting2
-
-
-
-
LED2
SEL
-
LED1
SEL
LED
channel
select
-
-
-
-
-
-
-
-
dummy1
FFh
ILED(7)
ILED(6)
ILED(5)
ILED(4)
ILED(3)
ILED(2)
ILED(1)
ILED(0)
Current
ratio
Setting
R/W
00h
-
-
-
-
-
-
-
-
dummy2
07h
R/W
06h
-
-
PWMEN
-
-
LPFEN
SHORT
-
Control
Setting
08h
R/W
00h
-
-
-
-
-
SRCHG
(2)
SRCHG
(1)
SRCHG
(0)
09h
R/W
00h
-
-
-
-
-
-
-
-
dummy3
0Ah
R/W
00h
-
-
-
-
-
-
-
-
dummy4
0Bh
R/W
00h
-
-
-
-
-
-
-
-
dummy5
0Ch
R/W
00h
-
-
-
-
-
-
-
-
dummy6
0Dh
R/W
00h
-
-
-
-
-
-
-
-
dummy7
0Eh
R/W
00h
-
-
-
-
-
-
-
PON
Slew Rate
changing
Setting
Enable
Setting
Input "0” for "-".
A free address has the possibility to assign it to the register for the test.
Access to the register for the test and the undefined register is prohibited.
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BD65B60GWL
●Register Map
Address 00h < Software Reset >
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
00h
W
-
-
-
-
-
-
-
SFRST
Initial Value
00h
-
-
-
-
-
-
-
0
D0:
SFTRST
0:
1:
Software Reset
Reset cancel
Reset (Initializes all registers)
Address 01h < Common Setting1>
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
01h
R/W
-
-
-
OVP(1)
OVP(0)
-
-
ROCP
Initial Value
01h
0
0
0
0
0
0
0
1
D[4:3]:
11b:
Over Voltage Protection Detect Voltage
23.5V (Typ.) this setting is suitable for the parts of 25V Absolute Maximum Ratings
(initial value)
28.0V (Typ.) this setting is suitable for the parts of 30V Absolute Maximum Ratings
31.0V (Typ.) this setting is suitable for the parts of 35V or 50V Absolute Maximum
Ratings
23.5V (Typ.) this setting is suitable for the parts of 25V Absolute Maximum Ratings
ROCP
0:
1:
Over Current Protection Level Setting
1.7A (Typ.)
1A (Typ.) (initial value)
OVP(1:0)
00b:
01b:
10b:
D0:
Address 02h < Slew Rate, Fosc, Feedback voltage >
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
02h
R/W
SKIPEN
(1)
SKIPEN
(0)
SWSRT
(1)
SWSRT
(0)
-
FOSC
FB(1)
FB(0)
Initial Value
02h
0
0
0
0
0
0
1
0
D[7:6]:
SKIPEN(1:0)
00b:
01b:
10b:
11b:
Pulse skip Setting
pulse skip all mode active (initial value)
pulse skip mode1 disable (Minimum duty fix mode)
pulse skip mode2 disable (pulse stop mode)
pulse skip all mode disable
Pulse skip all mode is Min duty fix mode and pulse stop mode.
Pulse skip mode1 is Min duty fix mode.
Pulse skip mode2 is pulse stop mode.
D[5:4]:
SWSRT(1:0)
00b:
01b:
10b:
11b:
Control the rise and fall time of slew rate for SW terminal
x1 (initial value)
x0.8 (design concept)
x0.6 (design concept)
x0.4 (design concept)
D2:
FOSC
0:
1:
Switching Frequency Value Setting
0.6MHz (initial value)
1.1MHz
D[1:0]:
FB(1:0)
00b:
01b:
10b:
11b:
Feedback voltage Setting
0.5V
0.4V
0.3V (initial value)
0.2V
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BD65B60GWL
Address 03h < LED channel select >
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
03h
R/W
-
-
-
-
-
LED2
SEL
-
LED1
SEL
Initial Value
05h
0
0
0
0
0
1
0
1
D2:
LED2SEL
0:
1:
Selection of the current driver and the protection for LED2
unused LED2
used LED2 (initial value)
D0:
LED1SEL
0:
1:
Selection of the current driver and the protection for LED1
unused LED1
used LED1 (initial value)
When this address is selected to 00h, the selected current driver and protection turn off.
(Note:) Set this address before setting address 0Eh to 01h (Power on).
(Note:) Once setting ad0Eh to 01h, this address (LED channel select) is non-functional.
Setting
LED1
channel
LED2
channel
Reset
RESET terminal “H” to “L”
Software Reset (ad00h data=01h)
○
○
Initial
LED1 = used
LED2 = used
ad03h data=05h
○
○
LED1 = used
LED2 = unused
ad03h data=01h
○
×
Power on
ad0Eh data=01h
○
×
LED1 = used
LED2 = unused
ad03h data=04h
○
×
Power off
ad0Eh data=00h
○
×
LED1 = unused
LED2 = used
ad03h data=04h
×
○
Power on
ad0Eh data=01h
×
○
Comment
LED channel select is not changed
LED channel select is changed.
○ : select
× : unselect
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BD65B60GWL
Address 05h < LED Current Ratio Setting >
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
05h
R/W
ILED(7)
ILED(6)
ILED(5)
ILED(4)
ILED(3)
ILED(2)
ILED(1)
ILED(0)
Initial Value
FFh
1
1
1
1
1
1
1
1
D[7:0]:
LED Current Setting
ILEDx(7:0)
This address determines the ratio of the operating LED current with respect to the maximum LED current set by
RSET. The ratio can be varied from 1/256 to 256/256.
data 00h → ratio = 00(0+1)/256 = 001/256 =
0.39%
data 20h → ratio = 0(32+1)/256 = 033/256 =
12.89%
data C7h → ratio = (199+1)/256 = 200/256 =
78.13%
data FFh → ratio = (255+1)/256 = 256/256 =
100%
LED current = max current x ratio x PWM duty (from PWM terminal)
= IMAX x (ILED +1) / 256 x PWM duty
Where:
IMAX is set by RSET, which is the resistor connected to ISET terminal (see LED Current Setting at P.34).
Address 07h <Control Setting>
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
07h
R/W
-
-
PWMEN
-
-
LPFEN
SHORT
-
Initial Value
06h
0
0
0
0
0
1
1
0
D5:
PWM Enable Control (Valid/Invalid)
PWM input is invalid, “H” fixed (initial value)
PWM input is valid
PWMEN
0:
1:
PWMEN=“1”, LPFEN=“0”
PWM
LED Current
L
H
PWMEN=“0”, LPFEN=“0”
PWM
LED Current
H
Figure 60. PWMEN setting
D2:
LPFEN
0:
1:
Low pass filter for Current Driver
Low pass filter isn’t used
Low pass filter is used (initial value)
PWM dimming condition on PWMEN and LPFEN setting
PWMEN
LPFEN
LED Current
D1:
0
0
0
1
DC ( 8bit DAC )
1
0
PWM ( 8bit DAC and PWM duty )
1
1
DC ( 8bit DAC and PWM duty )
SHORT
0:
1:
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DC ( 8bit DAC )
LED Short Protection Setting
Short Protection is Invalid
5.4V (Initial value)
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BD65B60GWL
Address 08h
<Slew Rate Change Setting>
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
08h
R/W
-
-
-
-
-
SRCHG
(2)
SRCHG
(1)
SRCHG
(0)
00h
0
0
0
0
0
0
0
0
Initial Value
D[2:0]:
Address 0Eh
SRCHG(2:0)
000b:
001b:
010b:
011b:
100b:
101b,110b,111b:
Slew Rate Change Setting
Keep the slew rate selected at ad02h D[5:4] (initial value)
Repeat x0.4→x0.6→x0.8→x1.0→x0.8→x0.6 →…
Repeat x0.4→x0.6→x0.8→x0.6→…
Repeat x0.4→x0.6→…
Repeat x0.8→x1.0→…
Repeat x0.6→x0.8→…
<Enable Setting>
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
0Eh
R/W
-
-
-
-
-
-
-
PON
Initial Value
00h
0
0
0
0
0
0
0
0
D0:
PON
0:
1:
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Power control for all blocks
Power off (initial value)
Power on
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BD65B60GWL
●Functional Descriptions
1) Reset
There are two kinds of reset, software reset and hardware reset.
●Software reset
All the registers are initialized by SFTRST = “1”.
SFTRST is an automatically returned to “0”. (Auto Return 0)
●Hardware reset
It shifts to hardware reset by changing RESET pin “H” → “L”.
The condition of all the registers under hardware reset pin is returned to the initial value, and it stops accepting all address.
To release from a state of hardware reset, change RESET pin “L” → “H”.
●Reset Sequence
When hardware reset was done during software reset, software reset is canceled when hardware reset is canceled.
(Because the initial value of software reset is “0”)
2) Pulse skip control
This IC regulates the output voltage using an improved pulse-skip. In “pulse-skip” mode, the error amplifier disables the
oscillator causing the “switching” of the power stages to stop when low output voltage and high input voltage are detected.
The said switching cycle will be reactivated when the IC detects low input voltage.
At light loads, a conventional “pulse-skip” regulation mode is used. The “pulse-skip” regulation minimizes the operating
current because this IC does not switch continuously and hence the losses of the switching are reduced. When the error
amplifier disables “switching”, the load is also isolated from the input. This improved “pulse-skip” control is also referred to
as active-cycle control.
Pulse skip setting can be controlled in four (4) different modes by register (SKIPEN:(ad02h D[7:6])).
minimum
duty fix
pulse stop
output current
minimum
duty
switching duty [%]
SKIPEN(1:0)=00b
VOUT terminal
minimum
duty fix
pulse stop
SW terminal
normal
SKIPEN(1:0)=01b
normal
minimum
duty fix
LED current
Keep current setting
SKIPEN(1:0)=10b
pulse stop
normal
SKIPEN(1:0)=11b
normal
minimum
duty
Figure 61. Pulse-skip
3) Soft start
BD65B60 has a soft start function which prevents large coil current from flowing to the IC. During start-up, in-rush current is
prevented. The “soft start” of this IC controls the over-current setting hence peak current is controlled.
After changing Enable register (PON:(ad0Eh D0)) from “L” to “H”, Soft start takes place within the period of 1.8ms (Typ.)
Once “soft start” is finished, boost condition change to normal state.
<The case of PWM dimming>
VBAT
VIO
PON
(ad0Eh D0)
RESET
2
I C IF (SDA, SCL)
Pulse-skip
Finish all setting
Start boost
ON
PWM
1.8ms
ON
OFF(or ON)
T1
Boost condition
OFF
Soft start
normal state
T2
OFF
Soft start
OFF
ON
OFF
ON
OFF
Coil current
Soft Start Time=T1+T2=1.8ms
VOUT
Figure 62. Soft start
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Datasheet
BD65B60GWL
●Protection
PROTECTION TABLE
No
Failure Mode
1
LED1 is used
LED2 is used
LED Short
( LED1 is Short )
LED1 is used
LED2 is used
LED Short
( Both LED1 and LED2
are Short )
LED1 is used
LED2 is used
LED Short
( Both LED1 and LED2
are Short )
LED1 is used
LED2 is unused
LED Short
( LED1 is Short )
LED1 is used
LED2 is unused
LED Short
( LED1 is Short )
2
3
4
5
Detection Mode
LED current
DC/DC
Feedback
DC/DC
Action
After release
Failure
LED1 > 5.4V(Typ.)
LED2 < 0.9V(Typ.)
VSC = 5.4V(Typ.)
<short LED>
stop
<other LED>
Active
<short LED>
Feedback
cut
<other LED>
Feedback
Active
Normal
Output
Latch
LED1 > 5.4V(Typ.)
LED2 > 5.4V(Typ.)
VSC = 5.4V(Typ.)
<short LED>
Active
<short LED>
Feedback
Active
Normal
Output
Auto return
LED1 < 5.4V(Typ.)
LED2 < 5.4V(Typ.)
VSC = 5.4V(Typ.)
<short LED>
Active
<short LED>
Feedback
Active
Normal
Output
Auto return
LED1 > 5.4V(Typ.)
VSC = 5.4V(Typ.)
<short LED>
Active
<short LED>
Feedback
Active
Normal
Output
Auto return
<short LED>
Feedback
Active
Normal
Output
LED1 < 5.4V(Typ.)
VSC = 5.4V(Typ.)
<short LED>
Active
6
LED OPEN
( LED1 is Open )
VOUT > OVP setting
LED2 < 5.4V(Typ.)
VSC = 5.4V(Typ.)
<open LED>
Don’t flow
<other LED>
Active
7
LED OPEN
( LED1 is Open )
VOUT > OVP setting
LED2 > 5.4V(Typ.)
VSC = 5.4V(Typ.)
<open LED>
Don’t flow
<other LED>
Don’t flow
VOUT >OVP setting
Don’t flow
VOUT < 0.2V
8
9
10
LED OPEN
( Both LED1 and LED2
are Open )
VOUT/SW short to
GND
LED VF more than
OVP setting
11
SW current too high
12
<open LED>
Feedback
Active
<other LED>
Feedback
Active
<open LED>
Feedback
Active
<other LED>
Feedback
Active
Auto return
OVP
action
Auto return
LED Short
action
Latch
Active
OVP
action
Auto return
Don’t flow
Active
Stop
Auto return
VOUT > OVP setting
Stop
Active
SW current > OCP
Active
Active
Temperature >
TSD(175°C)
Stop
Active
OVP
action
OCP
action
Stop
Auto return
Auto return
Auto return
Condition: normal state (This state isn’t “soft start”)
The Latch is released by
(1) Input hardware reset signal to RESET terminal
(2) Input the register of software reset by I2C
(3) detect UVLO
Please refer to “Application Deficiency Operation” regarding these functions.
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BD65B60GWL
▪ Over voltage protection (OVP)
When LED is disconnected, it will result to open DC/DC output causing it to over step-up. When VOUT pin exceeds the
absolute maximum rating, the switch N-channel Transistor and IC will break down. To prevent this, the over-voltage limit is
activated when VOUT pin becomes equal or more than the detect voltage thus turning off the switching and stopping the
operation of the DC/DC.
After over voltage protection, as shown in Figure 63, the IC changes from active into non-active, and the output voltage
goes down slowly.
RESET
Hysteresis (1V Typ.)
OVP
VOUT(Output Voltage)
OVP – OVPhys
LED1 voltage
LED1 connection
open
normal
normal
LED2 connection
Feedback
LED2
LED1 current
25mA
LED2 current
25mA
LED1
0mA
0mA
Figure 63. OVP operating description
▪ Over Current Protection
Over current flows in current detect resistor that is connected between internal switching Tr source and GND. When it
increases beyond the detect voltage, over current protect operates. Over current protect prevents the increase of more than
the detect voltage by reducing the “ON” Duty of switching Tr without stopping boosting operation.
Since the over current detector of this IC detects peak current, over current does not flow more than the set value.
▪ External SBD open detect / Output Short protection
If in case external SBD and DC/DC output (VOUT) connections are opened or VOUT is shorted to GND, there is a risk that
the coil and the internal Tr may be destroyed. External SBD open and output short protection activate when VOUT
becomes 200mV(Typ.) or below causing the output Tr to turn off and preventing the destruction of the coil and the IC. No
current will flow (0mA) since the IC changes from active into non-active.
▪ Thermal shut down
This IC has thermal shut down function.
The thermal shut down works at 175C (Typ.) or higher, and the IC changes from active into non-active.
▪ Low voltage detect protection (UVLO)
When supply voltage (VBAT) becomes lower than the detect voltage 2.1V(Typ.), DC/DC converter and constant current
driver are disabled. Moreover, this function can be turned off by boosting supply voltage up to more than hysteresis voltage.
VBAT
10%
2.1 V
2.3 V
DC/DC
Current Driver
Active
reset
Active
Figure 64. UVLO protection
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BD65B60GWL
●Application Deficiency Operation
(1) When 1 LED or 1string is OPEN during the operation
The LED string, which become OPEN will not light (e.g. LED1) but the other LED string will continue its operation.
As shown in Figure 65, LED1 voltage becomes 0V when channel LED1 is opened. This voltage which is below 0.3V
(Typ.) will then be detected as its lowest feedback voltage causing the output voltage to boost up to its over voltage
protection limits.
.
RESET
Hysteresis (1V Typ.)
OVP
VOUT(Output Voltage)
OVP – OVPhys
LED1 voltage
LED1 connection
open
normal
normal
LED2 connection
LED1
LED2
Feedback
LED2
LED1 current
25mA
LED2 current
25mA
LED1
0mA
0mA
Figure 65. LED open protect
(2) When LED short-circuited in multiple
All LED strings are lighted unless LED1 and LED2 terminal voltage is more than 5.4V(Typ.)(SHORT:(ad02h D0)=1).
Only the string that is short-circuited becomes more than 5.4V(Typ.) will be turned off while the other LED string
continues to turn on normally.
As shown in Figure 66, LED1 current (Shorted line) is changed from 25mA(Typ.) to 0mA(Typ.), so LED1 terminal
doesn’t generate heat.
LED short
LED1terminal 0.3V(Typ.)
LED2terminal
5.4V(Typ.)
LED1>LED2
0.3V(Typ.)
VOUT terminal
FeedBack
LED1
LED2
LED1
LED1 current
20mA(Typ.)
LED2 current
20mA(Typ.)
LED2
120μs(Typ.)
0mA(Typ.)
Figure 66. LED short protect
(3) When Schottky diode (SBD) remove
In the situation where the SBD connection is opened while DC/DC is still activated, SW terminal voltage becomes more
than the rated voltage due to lack of parts that can accept the current accumulated inside the coil. Consequently, IC
might be destroyed. To prevent the IC destruction, SBD open protection is operated. The SW terminal will not be
damaged because boost operation will be stopped when VOUT terminal detects less than 0.2V.
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BD65B60GWL
●Selecting the Number of Operational LED Channels
The number of operational LED channels is chosen by modifying D2 and D0 of the register address 03h.
In the example as shown in Figure67, only LED1 channel is active (ad03h, data=01h).
RESET terminal
RESET
2
I C IF(SDA,SCL)
Normal Voltage
VOUT terminal
0.3V(Typ.)
LED1
LED2
0V(Typ.)
LED1 terminal
open
LED2 terminal
LED sel
register
0V(Typ.)
05h
01h
05h
Figure 67. LED selection register is set for open strings
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Datasheet
BD65B60GWL
●LED Current Setting
LED current is set by register (ad05h D[7:0]) and RSET resistor which is computed in the following equation:
LED current = max current x ratio x PWM duty (from PWM terminal)
= IMAX x (ILED +1) / 256 x PWM duty
Where:
IMAX = this is set by the resistor (RSET) connected to ISET terminal and computed in the following equation:
IMAX current = 600 / RSET (A)
IMAX setting example
RSET
IMAX
24kΩ
25.0mA
30kΩ
20.0mA
56kΩ
10.7mA
120kΩ
5.0mA
ratio = this is given by varying ad05h D[7:0]
data 00h → ratio = 00(0+1)/256 =
data 20h → ratio = 0(32+1)/256 =
data C7h → ratio = (199+1)/256 =
data FFh → ratio = (255+1)/256 =
001/256 = 000.39%
033/256 = 012.89%
200/256 = 078.13%
256/256 = 100.00%
PWM duty = PWM “H” duty of PWM pulse. PWM pulse is inputted from PWM terminal.
●Feedback Voltage Setting
Feedback voltage is set by register (ad02h D[1:0]). To improve the efficiency, low feedback voltage which is determined by
the LED current and output voltage (VOUT) ripple should be set.
To maintain a VOUT ripple below 50mV, the recommended feedback voltages for each LED current range are shown
below:
Feedback voltage
Feedback voltage
IMAX
0.5V
All range
0.4V
Under 23.0mA
0.3V
Under 15.3mA
0.2V
Under 7.6mA
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Datasheet
BD65B60GWL
●Brightness Control
This IC has several methods of brightness controls such as: maximum current set by RSET resistor connected at ISET
terminal; current ratio set by 8bit DAC and PWM control which can be set as DC or pulse input.
LED1
Current ratio setting
8bit
DAC
ISET Driver
+
-
+
No.
LPFEN
PWMEN
LPFEN
LED Current
0
0
DC ( 8bit DAC )
0
1
DC ( 8bit DAC )
PWMEN
Current Driver
(1)
PWM
ISET
RSET
LED2
+
-
(2)
1
0
PWM ( 8bit DAC and PWM duty )
(3)
1
1
DC ( 8bit DAC and PWM duty )
Current Driver
Figure 68. Brightness control
When PWMEN=“1” by (ad07h D5), PWM pulse can be inputted and vice versa when PWMEN = “0”.
When LPFEN=“0” by (ad07h D2), the capacitor of LPF is disconnected. LED current is as same as PWM pulse.
When LPFEN=“1”, the capacitor of LPF is connected. LED current becomes DC.
(1)DC Dimming controlled by 8bit current DAC, as shown in Figure 68.
This dimming is controlled by 8bit current DAC controlled by current ratio register (ad05h).
The LED current becomes DC, because PWM input is not accepted by PWMEN=“0”.
Setting current is shown as below.
LED current = max. current x ratio
= IMAX x (ILED +1) / 256
(2)PWM Dimming controlled by 8bit current DAC and PWM duty for CABC, as shown in Figure 70.
This dimming is controlled by 8bit current DAC and PWM pulse inputted to PWM terminal. Main brightness is controlled
by 8bit current DAC and the dimming according to contents like movie and picture is controlled by PWM.
LED current flows with the H section of PWM, and does not flow with the L section. Therefore, the average LED current
increases in proportion to duty cycle of PWM signal. Because it becomes to switch the driver, the current tolerance is
low when the PWM brightness is adjusted making it possible to control the brightness until 5μs (Min.10% at 20kHz).
And, do not use for the brightness control, because effect of ISET changeover is big under 5μs ON time and under 5μs
OFF time.
Setting current is shown as below.
LED current = max. current x ratio x PWM duty (from PWM terminal)
= IMAX x (ILED +1) / 256 x PWM duty
(3)DC Dimming controlled by 8bit current DAC and PWM duty for CABC, as shown in Figure 69.
This dimming is controlled by 8bit current DAC and PWM pulse inputted to PWM terminal.
Main brightness is controlled by 8bit current DAC and the dimming according to contents like movie and picture is
controlled by PWM. By LPF, PWM pulse becomes average into BD65B60, according to the duty of PWM pulse.
Therefore, the average LED current increases in proportion to duty cycle of PWM signal. Because LED current
becomes DC, coil current also becomes DC. The noise of this dimming is smaller than that of PWM dimming, but the
current tolerance is worse than PWM dimming. PWM dimming range is from 10% to 100%. If duty changes under 10%,
LED current tolerance become big. Typical PWM frequency is 20kHz to 100kHz.
Setting current is shown as below.
LED current = max. current x ratio x PWM duty (from PWM terminal)
= IMAX x (ILED +1) / 256 x PWM duty
PWM
LED current
Coil current
IC’s active current
ON
OFF
DC
DC
ON
OFF
LED current
ON
OFF
Coil current
ON
OFF
IC’s active current
ON
Figure 69. DC dimming
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Figure 70. PWM dimming
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●Coil Selection
The DC/DC is designed using a coil value equal or greater than 4.7µH. Sub-harmonic oscillation of current mode DC / DC
might happen if the coil “L” value used is equal or lower than 2.2µH.
When the coil “L” value increases, the phase margin of DC / DC becomes zero therefore, output capacitor value should also
be increased. Make the resistor component smaller in order to increase the efficiency of DCR Inductor. Estimation of Coil
Peak Current is shown at the examples below.
Peak Current calculation
<Estimate of the current value which is needed for the normal operation>
As over current detector of this IC is detected the peak current, it have to estimate peak current to flow to the coil by
operating condition.
In case of,
- Supply voltage of coil = VIN
- Inductance value of coil = L
- Switching frequency = fsw
- Output voltage = VOUT
- Total LED current = ILED
- Average current of coil = Iave
- Peak current of coil = Ipeak
- Cycle of Switching = T
- Efficiency = eff
(Please set up having margin)
- ON time of switching transistor = Ton
- ON Duty = D
The relation is shown below:
CCM: Ipeak = (VIN / L) × (1 / fsw) × (1-(VIN / VOUT)), DCM: Ipeak = (VIN / L) × Ton
Iave = (VOUT × IOUT / VIN) / eff
Ton = (Iave × (1- VIN / VOUT) × (1 / fsw) × (L / VIN) × 2)1/2
Each current is calculated.
As peak current varies according to whether there is the direct current superposed, the next is decided.
CCM: (1- VIN / VOUT) × (1 / fsw) < Ton  peak current = Ipeak /2 + Iave
DCM: (1- VIN / VOUT) × (1 / fsw) > Ton  peak current = VIN / L × Ton
(Example 1)
In case of, VIN=3.6V, L=10µH, fsw=0.6MHz, VOUT=26.4V, ILED=50mA, Efficiency=88%
Iave = (26.4V × 50mA / 3.6V) / 88% = 0.4167A
Ton = (0.4167A × (1 - 3.6V / 26.4V) × (1 / 0.6MHz) × (10µH / 3.6V) × 2)1/2 = 1.825µs
(1- VIN / VOUT) × (1 / fsw) =1.439µs < Ton(1.825µs)
CCM
Ipeak = (3.6V / 10µH) × (1 / 0.6MHz) × (1 - (3.6V / 26.4V)) = 0.5182A
Peak current = 0.5182A / 2 + 0.4167A = 0.6758A
(Example 2)
In case of, VIN=3.6V, L=10µH, fsw=0.6MHz, VOUT=19.8V, ILED=11.3mA, Efficiency=88%
Iave = (19.8V × 11.3mA / 3.6V) / 88% = 0.0706A
Ton = (0.0706A × (1 - 3.6V/ 19.8V) × (1 / 0.6MHz) × (10µH / 3.6V) × 2)1/2 = 0.731µs
(1- VIN / VOUT) × (1 / fsw) =1.364µs > Ton(0.731µs)
DCM
Ipeak = VIN / L x Ton = 3.6V / 10µH x 0.731µs = 0.2633A
Peak current = 0.2633A
DCM/CCM calculation
Discontinuous Condition Mode (DCM) and Continuous Condition Mode (CCM) are calculated as following.
CCM:
L > VOUT × D × (1 - D)2 × T / (2 × ILED)
DCM:
L < VOUT × D × (1 - D)2 × T / (2 × ILED)
*D = 1- VIN / VOUT
(Example 1)
In case of, VIN=3.6V, L=10µH, fsw=0.6MHz, VOUT=26.4V, ILED=50mA
VOUT × D × (1 - D)2 × T / (2 × ILED)
= 26.4V × (1–3.6V/26.4V) × (3.6V/26.4V)2 × 1/(0.6×106Hz) / (2×0.05A) =7.066µH < L(10µH)
 CCM
(Example 2)
In case of, VIN=3.6V, L=10µH, fsw=0.6MHz, VOUT=19.8V, ILED=11.3mA
VOUT × D × (1 - D)2 × T / (2 × ILED)
= 19.8V × (1–3.6V/19.8V) × (3.6V/19.8V)2 × 1/(0.6×106Hz) / (2×0.0113A) =39.494µH > L(10µH)
 DCM
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BD65B60GWL
●OUTPUT Capacitor Selection
Output Capacitor smoothly keeps output voltage and supplies LED current. Output Voltage consists of Charge (FET ON)
and Discharge (LED current). So Output voltage has Output ripple Voltage in every FET switching.
Select a capacitor value which allows the output ripple voltage to settle within 50mV.
Output ripple voltage is calculated as follows.
Output ripple Voltage
- Switching cycle = T
- Switching ON duty = D
- Output Capacitor = COUT
- Decreasing ratio of Capacitor = Cerror
- Total LED current = ILED
- Output ripple Voltage = Vripple
- Output Capacitor (real value) = Creal
- Supply voltage of coil = VIN
Creal = COUT × Cerror
(Capacitor value is decreased by Bias)
Creal = ILED × (1-D) × T / Vripple
COUT = ILED × (1-D) × T / Vripple / Cerror
(Example 1)
In case of, VIN=3.6V, fsw=0.6MHz, VOUT=19.8V, ILED=15mA, COUT=1.0µF, Cerror=50%
T = 1 / 0.6MHz
D = 1 – VIN / VOUT = 1 – 3.6V/19.8V = 0.818
Vripple
= ILED × (1-D) × T / (COUT×Cerror)
= 15mA × (3.6V/19.8V) × (1/0.6MHz) / (1.0µF×0.5)
= 9.1mV
COUT
Capa [µF]
Creal
0V
35V
50V
Output voltage
Figure 71. Bias Characteristics of Capacitor
●INPUT Capacitor Selection
1μF ceramic capacitor with 10V (greater than coil voltage) is recommended for the Inductor.
●Schottky Diode Selection
Shottky diode should be used for boost. Maximum peak current should be greater than inductor peak current (1A(Typ.) or
1.7A(Typ.)) to ensure reliable operation. Average current should be greater than the maximum output current. Schottky
diodes with a low forward drop and fast switching speeds are ideal for increasing efficiency in portable applications. Choose
a reverse break down voltage of the Schottky diode significantly larger than the output voltage.
●LED Selection
Please select LED VF that input voltage is smaller than output voltage (VOUT).
And also select LED VF that output voltage is smaller than OVP voltage -1V.
●SDA, SCL Pull-up Resistor Selection
Please select the most suitable Pull-up resistor value to input I2C frequency. The case Pull-up resistor value is too big, SCL
and SDA pulse are rounded. Therefore high speed transfer is impossible.
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BD65B60GWL
●IC and Coil Power Supply Separation
BD65B60 can operate in a separate power source for the IC and coil. With this application, IC power consumption is
decreased and the applied voltage can be exceeded the IC rating of 5.5V.
Figure 72 shows the separate power sources for coil and IC wherein the coil power supply is connected to a high voltage
source applied from adapters.
10μH
7V
CVBATL
COUT
2.7V to 5.5V
CVBAT
VBAT
1.65V to 3.3V
SW
VOUT
BD65B60GWL
VIO
CVIO
LED1
SCL
Controller
LED2
SDA
RESET
GND
ISET
PWM
RSET
PWMIN
Figure 72. Separate Power Supply Application
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BD65B60GWL
●PCB Layout
PCB layout is very important to achieve the best performance of the IC. Layout pattern can greatly affect some
characteristics of the IC, such as efficiency and ripple.
2.7V to 5.5V
CVBAT
1μF
10μH
SBD
COUT
2.2μF
VBAT
REF
VOUT
TSD
RESET
UVLO
x1, x0.8, x0.6, x0.4
Output short PROTECT
SW
FAULT
DETECTOR
Pre-driver
Output Over Voltage PROTECT
I2C
31V/28V
23.5V
LED TERMINAL
SHORT DETECTOR
ERRAMP
PWM COMP
GND
Current SENSE
Control
Over Current
SENSE
Vshort=no, 5.4V
LED1
LED
-
RETURN
LED2
+
SELECT
Protect
Soft start
(CVIO)
FB Voltage setting
+
OSC
VIO
3V
1.1 or 0.6MHz
2ch
SCL
SDA
LOGIC
Controller
8bit
DAC
ISET Driver
RESET
+
-
Current ratio setting
+
-
Current Driver
PWM
ISET
RSET
PWMIN
Figure 73. Schematic
<Input bypass capacitor CVBAT (1.0μF(Typ.))>
Connect input bypass capacitor CVBAT (1.0μF(Typ.)) as close as possible to coil and GND pin.
<Input bypass capacitor CVIO (0.1μF(Typ.))>
Connect input bypass capacitor CVIO (0.1μF(Typ.)) as close as possible to VIO pin and GND pin.
<Coil>
Connect coil as close as possible to SW pin. When the distance between coil and SW pin is long, the efficiency becomes
incorrect due to the effect of PCB parasitic capacitance.
<Schottky barrier diode SBD>
Connect Schottky barrier diode SBD as close as possible between coil and SW pin.
<Output capacitor COUT>
Connect output capacitor COUT between cathode of SBD and GND.
Make both GND sides of CVBAT and COUT as close as possible.
<Others>
Connect the current setting resistor RSET near the ISET and GND pins. When these pins are not directly connected near
the chip, the performance of BD65B60 may be affected and it may limit the current drive. As for the wire of the inductor,
make sure that its resistance is small enough to reduce the electric power consumption and to increase the entire
efficiency.
Do not connect capacitor between ISET and GND pin.
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BD65B60GWL
●Recommended Layout Pattern
VBATL
GND
CVBATL
COIL
COUT2
COUT1
GND
VOUT
BD65B60GWL
SBD
RSET1
CVIO
RSCL
RSDA
RSET2
CVBAT1
LED2
LED1
VBAT
RESET
VIO
SCL
SDA
PWM
RRESET
Figure 74. Top Copper trace layer
Figure 75. Bottom Copper trace layer
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BD65B60GWL
●Selection of External Parts
Recommended external parts are shown below.
If there are parts that will be used and not listed below, make sure to choose the equivalent parts.
▪Coil
Size (mm)
Value
Manufacturer
Product number
10µH
10µH
10µH
10µH
TDK
TDK
TDK
TDK
10µH
TOKO
4.7μH
TOKO
4.7μH
TOKO
10μH
TOKO
4.7μH
TOKO
10μH
TOKO
VLF302512MT-100M
VLF403212MT-100M
VLF302510MT-100M
VLF403210MT-100M
DEM3532C series
1229AS-H-100M
DFE322512C series
1277AS-H-4R7M
DFE252012C series
1239AS-H-4R7M
DFE252012C series
1239AS-H-100M
DFE322510C series
1276AS-H-4R7M
DFE322510C series
1276AS-H-100M
DC
current
(mA)
690
1000
650
780
DCR
(Ω)
Vertical
Horizontal
3.0
4.0
3.0
4.0
2.5
3.2
2.5
3.2
Height
(MAX)
1.2
1.2
1.0
1.0
3.5
3.7
1.2
750
0.24
3.2
2.5
1.2
1800
0.17
2.5
2.0
1.2
1500
0.24
2.5
2.0
1.2
1000
0.46
3.2
2.5
1.0
1400
0.22
3.2
2.5
1.0
900
0.49
0.25
0.23
0.31
0.26
▪Capacitor
Value
Pressure
Manufacturer
Product number
2.2µF
1.0µF
1.0µF
4.7μF
2.2μF
1.0µF
4.7μF
2.2µF
1.0µF
50V
50V
50V
25V
25V
25V
10V
10V
10V
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
MURATA
GRM31CB31H225K
GRM31MB31H105K
GRM188B31H105K
GRM319R61E475K
GRM219B31E225K
GRM188B31E105K
GRM219B31A475K
GRM188B31A225K
GRM188B11A105K
Vertical
3.2
3.2
1.6
3.2
2.0
1.6
2.0
1.6
1.6
Size (mm)
Horizontal
1.6
1.6
0.8
1.6
1.25
0.8
1.25
0.8
0.8
Height
1.6
1.15
0.8
0.85
0.85
0.8
0.85
0.8
0.8
▪SBD
Pressure
Manufacturer
Product number
30V
30V
30V
40V
40V
40V
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
RB521SM-30
RB550SS-30
RB550VA-30
RB521SM-40
RB160SS-40
RB160VA-40
Vertical
1.6
1.6
2.5
1.6
1.6
2.5
Size (mm)
Horizontal
0.8
0.8
1.3
0.8
0.8
1.3
Height
0.6
0.6
0.6
0.6
0.6
0.6
Io
0.2A
0.5A
1.0A
0.2A
1.0A
1.0A
recommended
the number of LEDs
7series 1string
7series 2strings
7series 2strings
8series 1string
8series 2strings
8series 2strings
The coil is the most influential part to efficiency. Select a coil which has an excellent direct current resistor (DCR) and
current-inductance characteristic. BD65B60 IC is designed for an inductance value of 4.7µH to 10µH. Do not use
inductance values less than 2.2µH. Select a ceramic capacitor type with excellent frequency and temperature
characteristics.
Furthermore, select a capacitor with small direct current resistance and pay sufficient attention to the layout pattern.
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BD65B60GWL
●Application Example
Figure 76 and Figure 77 are Application examples.
10μH
2.7V to 5.5V
CVBATL
(2.2μF/10V)
COUT
(2.2μF/50V)
CVBAT
(1μF/10V)
VBAT
SW
CVIO
(0.1μF/10V)
VOUT
BD65B60GWL
VIO
1.65V to 3.3V
LED1
SCL
LED2
Controller
SDA
RESET
GND
ISET
PWM
PWMIN
RSET
Figure 76. Application example (6 series x 1 string)
4.7μH
2.7V to 5.5V
CVBATL
(2.2uF/10V)
COUT
(2.2μF/50V) x 2
CVBAT
(1uF/10V)
VBAT
CVIO
(0.1uF/10V)
1.65V to 3.3V
SW
VOUT
BD65B60GWL
VIO
LED1
SCL
Controller
LED2
SDA
RESET
GND
ISET
RSET
PWM
PWMIN
Figure 77. Application example (8 series x 2 strings)
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BD65B60GWL
●Attention Point of Board Layout
In board pattern design, power supply line should be low Impedance, especially around DC/DC converter. Insert a bypass
capacitor if necessary.
●About Heat Loss
In heat design, operate the DC/DC converter in the following condition.
(The following temperature is a guarantee temperature, so consider the margin.)
1. Ambient temperature Ta must be less than 85°C.
2. The loss of IC must be less than dissipation Pd.
●Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage (VBAT), temperature range of operating conditions
(Topr), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open
circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take
physical safety measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical
characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the
terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
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(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB
to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After
the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for
protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a
voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to
the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern
from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to
the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal
GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175°C (Typ.) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
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Datasheet
BD65B60GWL
●Ordering Information
B
D
6
5
B
Part Number
6
0
G
W
L
Package
GWL: UCSP50L1
E2
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
UCSP50L1
(TOP VIEW)
1PIN MARK
Part Number Marking
5B60
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BD65B60GWL
●Physical Dimension Tape and Reel Information
Package Name
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BD65B60GWL
●Revision History
Date
Revision
3.Jun.2013
001
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD65B60GWL - Web Page
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Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD65B60GWL
UCSP50L1
3000
3000
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