STMicroelectronics AN3077 Safety application guide Datasheet

AN3077
Application note
Safety application guide
for SPC56EL54xx/SPC56EL60xx family
Introduction
This document is the safety application guide for the SPC56EL54xx/SPC56EL60xx. It
provides the conditions of use for the SPC56EL54xx/SPC56EL60xx in ASIL D applications.
September 2013
DocID16384 Rev 10
1/82
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1
Contents
AN3077
Contents
1
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
General information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3
2.1
Mission profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2
Safe state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
Failure indication time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4
Error handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.5
Sphere of Replication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Functional safety requirements for application software . . . . . . . . . . 12
3.1
3.2
3.3
2/82
Application software requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1.1
Mandatory software requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1.2
Recommended software requirements . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1.3
Implementation details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
System Status and Configuration Module (SSCM) . . . . . . . . . . . . . . . . . 13
3.2.1
Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2.2
Checking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Self-Test Control Unit (STCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.3.1
Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.3.2
Checking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4
Reset Generation Module (MC_RGM) . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5
Clock configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.6
SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.7
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.8
Interrupt Controller (INTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.9
Semaphore Unit (SEMA4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.10
Enhanced Direct Memory Access (eDMA) requests . . . . . . . . . . . . . . . . 17
3.11
Periodic Interrupt Timer (PIT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.12
Communication peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.13
I/O peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.13.1
Read Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.13.2
Read PWM Input
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
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Contents
3.14
3.13.3
Read Encoder Inputs
3.13.4
Write Digital Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.13.5
Write PWM Outputs
3.13.6
Other requirements for I/O peripherals . . . . . . . . . . . . . . . . . . . . . . . . . 34
4
Synchronize Sequential Read Input . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.15.1
Read Analog Inputs
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.15.2
Other requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.16
Temperature sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.17
Software Watchdog Timer (SWT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.18
Redundancy Control Checking Unit (RCCU) . . . . . . . . . . . . . . . . . . . . . . 47
3.19
Cyclic Redundancy Checker Unit (CRC) . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.20
Clock Monitor Unit (CMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.21
Frequency-Modulated Phase-Locked Loop (FMPLL) . . . . . . . . . . . . . . . 49
3.22
Internal RC Oscillator (IRCOSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.23
Power Management Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
3.24
Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
3.25
Register Protection Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.26
Error Correction Status Module (ECSM) . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.27
Fault Collection and Control Unit (FCCU) . . . . . . . . . . . . . . . . . . . . . . . . 54
Functions of external devices for ASIL D applications . . . . . . . . . . . . 56
4.1
External Watchdog Function (EXWD) . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
4.2
Power Supply and Monitor Function (PSM) . . . . . . . . . . . . . . . . . . . . . . . 56
4.3
Error Out Monitor Function (ERRM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.4
5
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Cross Triggering Unit (CTU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
3.14.1
3.15
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.3.1
Both FCCU pins connected to external device . . . . . . . . . . . . . . . . . . . 57
4.3.2
Single FCCU pin connected to external device . . . . . . . . . . . . . . . . . . . 57
PWM Output monitored by external ASIC (PWMA) . . . . . . . . . . . . . . . . . 58
Scenarios for automotive applications: Motor control . . . . . . . . . . . . 59
5.1
5.2
Application example 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
5.1.1
Functional safety related inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
5.1.2
Functional safety related outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Application example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
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5.3
6
5.2.1
Functional safety related inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
5.2.2
Functional safety related outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Application example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
5.3.1
Functional safety related inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
5.3.2
Functional safety related outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
ECC logic test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
6.1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
6.2
Data pattern - Walking 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
6.3
UTEST mode ECC logic check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6.4
Fault coverage and execution time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7
I/O pin/ball configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
8
Further information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
9
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8.1
Conventions and terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
8.2
Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
8.3
Document references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
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List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Temperature profile for packaged device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Temperature profile for bare die device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Software BIST and/or test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
PMU monitored supplies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Functional safety inputs for application example 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Functional safety outputs for application example 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Functional safety inputs for application example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Functional safety outputs for application example 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Functional safety inputs for application example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Functional safety outputs for application example 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Data pattern used by the ECC logic test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Physical pin displacement on internal die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
List of conventions and terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
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List of figures
AN3077
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
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Double Read Digital Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Double Read PWM Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Double encoder read input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Write Digital Output With Read Back . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Double Write Digital Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Double Write PWM Output configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Single Write PWM Output With Read Back configuration. . . . . . . . . . . . . . . . . . . . . . . . . . 32
Single Read Analog Input configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Software BISTs to test the multiplexing circuitry (ADC_SWTEST_TEST1) . . . . . . . . . . . . 40
Implementation of ADC_SW_TEST1 through the ADC presample feature . . . . . . . . . . . . 41
Software BISTs to test the multiplexing circuitry (ADC_SWTEST_TEST2) . . . . . . . . . . . . 41
Implementation of ADC_SW_TEST2 through the ADC presample feature . . . . . . . . . . . . 41
Series of acquired analog values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Double Read Analog Inputs configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Logic scheme of the LVD_DIG and HVD_DIG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Logic scheme of the LVD_FLASH, LVD_GPIO and LVD_VREG . . . . . . . . . . . . . . . . . . . . 52
Example of QFP144 pin/pad adjacency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
BGA balls non-adjacent, die pads adjacent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
BGA balls adjacent, die pads non-adjacent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
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1
Preface
Preface
This document discusses requirements and assumptions for the use of the Device_Number
Microcontroller Unit (MCU) in ASIL D applications. It prescribes several measures as
mandatory (or mandatory under certain preconditions, for example, if a certain module is
used) whereby the measure described was assumed to be in place when analyzing the
safety of the MCU.
This document considers:
●
The system assembly that contains the Device_Number MCU
●
The “Safety Element out of Context” section in the “Road vehicles - Functional safety Part 10: Guideline [ISO/DIS 26262-10]” standard
●
Certain assumptions about the assembly's functional safety needs based on that
standard
and determines whether a measure is mandatory or not based on these factors.
What this means for designers using the Device_Number MCU is that if they don’t fulfill a
specific Safety Application Guide (SAG) prescription they either have to show to their ISO
26262 assessor that the alternative solution is similarly efficient concerning the safety
requirement in question (for example, provides the same coverage, avoids Common Cause
Failure (CCF) as effectively, and so on), or they have to specify the increased failure
rate/reduced Safe Failure Fraction (SFF) they estimate to incur due to the deviation.
Otherwise, the assessor will not recognize the MCU certificate that the customer received
with the MCU.
This document also contains guidelines on how to configure and operate the
Device_Number for ASIL D applications. These guidelines are preceded by one of the
following bold text statements:
●
Implementation hint
●
Recommended
●
Example
These guidelines are considered to be useful approaches for the specific topics under
discussion, but are not mandatory. The user will need to use discretion in deciding whether
these measures are appropriate for their applications.
This document is valid only under the assumption that the MCU is used in automotive
applications for use cases requiring a fail-silent or a fail-indicate MCU.
Mandatory: This document is only valid if the environmental conditions given in the
Device_Number data sheet are maintained.
The cores in the Device_Number can be configured to operate in either Lock-Step Mode
(LSM) or Decoupled Parallel Mode (DPM). In LSM, the outputs of a set of replicated
modules, identified as the Sphere of Replication (SoR, see Section 2.5, Sphere of
Replication for details), are compared to ensure that the operations or transactions that are
executed are identical on a clock per clock basis.
Mandatory: This document is based on the assumption that the Device_Number is
configured to operate in LSM.
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Preface
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As for all devices, device errata must be taken into account during system design and
implementation. For a safety-related device such as the Device_Number, this also concerns
safety-related activities such as system safety concept development.
Mandatory: The device shall be handled according to JEDEC standards J-STD-020 and JSTD-033.
Mandatory: To cover the ISO-07-6.5.4 and ISO-07-6.4.2.1, customers shall report all field
failures of the devices to silicon supplier.
Mandatory: This document is only valid if the conditions given in the addendum are met
(see Section 8.3: Document references).
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General information
2
General information
2.1
Mission profile
The assumed mission profile is:
●
Lifetime: 20 years
●
Total operating hours: 12000 hours
●
Trip time: 10 hours (Trip time is defined as the maximum time of operation of the MCU
without power-on reset)
●
Fault Tolerant Time Interval (FTTI, also named Process Safety Time (PST)): 10 ms
(maximum time between the first faulty output and a failure indication or reset)
Temperature profiles for packaged devices (Table 1) and bare die (Table 2) are shown
below.
Note:
The temperature profile is an assumption of the Device_Number safety analysis and shall
be fulfilled during integration into an ASIL D compliant system.
Table 1. Temperature profile for packaged device
Temperature range (°C)
Operation time (h)
125–135
120
110–120
960
90–100
7680
30–40
3240
Table 2. Temperature profile for bare die device
2.2
Temperature range (°C)
Operation time (h)
120–125
120
100–110
960
80–90
7680
20–30
3240
Safe state
By definition, the Safe states of the Device_Number are as follows:
●
Completely unpowered
●
Reset
–
●
Operating correctly
–
●
All pins except possibly the error output pins (FCCU_F[0:1]) are tristated.
Outputs depend on application.
Explicitly indicating an internal error
–
Error output pins FCCU_F[0:1] are in a state indicating an error, and the state of
other I/O pins will not be reliable.
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Defining these states as safe for the MCU means that the overall system must react safely
to the Device_Number being in, and entering, any of these states. For the ‘Completely
unpowered’ and ‘Reset’ states the addition of a pullup or pulldown resistor on relevant
signals may be necessary. If an ‘Explicit indication of internal error’ occurs on FCCU_F[0:1],
the application must not depend on the MCU for continued operation. This also means that
the system must be able to remain in a safe state without any additional actions from the
MCU.
Mandatory: The system must transition to a safe state when there is an indication of an
error.
Depending on the configuration the system may disable, or reset, the Device_Number as a
reaction to the error signal.
If a system continuously switches between a standard operating state and the reset state,
without any device shutdown, the system is not considered to be in a Safe state.
Mandatory: The application must identify and signal such switching as a failure condition.
2.3
Failure indication time
The Device_Number failure indication time must be taken into consideration when
determining application safety strategies, because it must be less than the FTTI.
Failure indication time has three components, two of which are influenced by configuration
settings: recognition time + internal processing time + indication time.
Each component of failure indication time is described as follows:
●
Recognition time is the maximum of the recognition time of all involved safety
mechanisms. The three mechanisms with the longest time are:
–
ADC(a) recognition time is the most demanding HW test in terms of timing. The
self-test requires the ADC conversion to complete a full test. A single full test takes
at least 70 µs(b).
–
Recognition time related to the FMPLL loss of clock: it depends on how the
FMPLL is configured, but is approximately 20 µs.
–
Diagnostic cycle time of software self-tests. This time depends closely on the
software implementation.
●
Internal processing time lasts maximum 10 RC clock cycles (RC is the internal safe
clock with nominal frequency of 16 MHz).
●
Indication time, the time to notify an observer about the failure, depends on indication
protocol configured in the Fault Collection and Control Unit (FCCU):
–
Dual Rail protocol and time switching protocol:
–
FCCU configured as “fast switching mode”: indication delay is maximum 64
µs. As soon as FCCU receives a fault signal, FCCU reports the failure to the
outside world via output pin (if properly configured).
a. ADC recognition time shall be used only if ADC is used by the safety function.
b. This value takes into account the steps needed to run the three ADC hardware self-tests.
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General information
–
–
FCCU configured as “slow switching mode”: an indication delay could occur.
The maximum delay is equal to period of the error out signal. This parameter
shall be configured equal to its minimum which is 128 µs.
Bi-stable protocol: indication delay is maximum 64 µs. As soon as the FCCU
receives a fault signal, it reports the failure to the outside world via output pin
(FCCU_F[0:1], if properly configured).
If the configured reaction to a fault is an interrupt, an additional delay (interrupt latency) can
occur until the interrupt handler is able to start executing (for example, higher priority IRQs,
XBAR contention, register saving, and so on).
General failure rate, or the Failure Modes, Effects and Diagnostic Analysis (FMEDA) report,
is available upon request when covered by an NDA (contact your ST representative).
2.4
Error handling
Error handling can be split into two categories:
●
Handling of errors during runtime
●
Handling of errors during boot time (for example, Logic Built-In Self-Test (LBIST),
Memory Built-In Self-Test (MBIST))
Mandatory: Runtime errors shall be handled in a time shorter than the FTTI.
Mandatory: Boot time failures shall be handled before the safety function starts.
Note:
Implementation hint: To satisfy this requirement regarding the LBIST/MIBST, Self-Test
Control Unit (STCU) status condition shall be checked by application software before safety
application starts (See “Integrity SW Operations” section of the “Self-Test Control Unit
(STCU)” chapter in the Device_Number Reference Manual for details).
2.5
Sphere of Replication
Sphere of Replication (SoR) is used for duplicating of critical components on the
Device_Number. The following modules are included in the SoR:
●
e200z4 Cores
●
Enhanced Direct Memory Access (eDMA)
●
Interrupt Controller (INTC)
●
Crossbar Switch (XBAR)
●
Memory Protection Unit (MPU)
●
Flash memory controller
●
Static RAM Controller (SRAMC)
●
System Timer Module (STM)
●
Software Watchdog Timer (WDT)
●
Peripheral Bridge (PBRIDGE)
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Functional safety requirements for application
software
This section gives an overview of necessary, or recommended, measures when using the
individual modules of the Device_Number. If a module is implemented without following the
text of this section, the safety certificate for the module, or the entire MCU, may not be
validated. It is possible to ignore aspects of the text if equivalent measures that are taken
can be shown to manage the same failures.
Modules not explicitly covered by this document do not require any software measures.
The modules covered by the SoR reach very high Diagnostic Coverage (DC) without
dedicated measures at application or system levels.
3.1
Application software requirements
Application software shall be developed according to ASIL D requirements.
3.1.1
Mandatory software requirements
The following sections contain Mandatory design constraints for using the Device_Number
devices in an ASIL D system:
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●
Section 3.2, System Status and Configuration Module (SSCM)
●
Section 3.3: Self-Test Control Unit (STCU)
●
Section 3.4: Reset Generation Module (MC_RGM)
●
Section 3.5: Clock configuration
●
Section 3.7: Flash memory
●
Section 3.8: Interrupt Controller (INTC)
●
Section 3.10: Enhanced Direct Memory Access (eDMA) requests
●
Section 3.11: Periodic Interrupt Timer (PIT)
●
Section 3.13: I/O peripherals
●
Section 3.14: Cross Triggering Unit (CTU)
●
Section 3.15: ADC
●
Section 3.16: Temperature sensors
●
Section 3.17: Software Watchdog Timer (SWT)
●
Section 3.19: Cyclic Redundancy Checker Unit (CRC)
●
Section 3.20: Clock Monitor Unit (CMU)
●
Section 3.21: Frequency-Modulated Phase-Locked Loop (FMPLL)
●
Section 3.22: Internal RC Oscillator (IRCOSC)
●
Section 3.23: Power Management Unit (PMU)
●
Section 3.25: Register Protection Module
●
Section 3.27: Fault Collection and Control Unit (FCCU)
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Functional safety requirements for application software
Recommended software requirements
The following sections contain Recommended design constraints for using the
Device_Number devices in an ASIL D system:
3.1.3
●
Section 3.6: SRAM
●
Section 3.12: Communication peripherals
●
Section 3.13: I/O peripherals
●
Section 3.16: Temperature sensors
●
Section 3.18: Redundancy Control Checking Unit (RCCU)
●
Section 3.19: Cyclic Redundancy Checker Unit (CRC)
●
Section 3.24: Memory Protection Unit (MPU)
●
Section 3.25: Register Protection Module
●
Section 3.26: Error Correction Status Module (ECSM)
Implementation details
The following sections contain implementation details for using the Device_Number devices
in an ASIL D system:
●
Section 3.2: System Status and Configuration Module (SSCM)
●
Section 3.5: Clock configuration
●
Section 3.7: Flash memory
●
Section 3.8: Interrupt Controller (INTC)
●
Section 3.10: Enhanced Direct Memory Access (eDMA) requests
●
Section 3.13: I/O peripherals
●
Section 3.14: Cross Triggering Unit (CTU)
●
Section 3.16: Temperature sensors
●
Section 3.17: Software Watchdog Timer (SWT)
●
Section 3.19: Cyclic Redundancy Checker Unit (CRC)
●
Section 3.20: Clock Monitor Unit (CMU)
●
Section 3.21: Frequency-Modulated Phase-Locked Loop (FMPLL)
●
Section 3.23: Power Management Unit (PMU)
●
Section 3.25: Register Protection Module
●
Section 3.27: Fault Collection and Control Unit (FCCU)
Note:
A section may contain Mandatory constraints, Recommended constraints,
Implementation hints or any combination of the three.
3.2
System Status and Configuration Module (SSCM)
3.2.1
Configuration
Mandatory: Before executing the safety functions, the SSCM shall be configured to inhibit
unintentional execution of the BAM code.
Note:
Rationale: Since BAM code is not intended to be executed by ASIL D applications, any
execution of the BAM, or part of it, must be inhibited.
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Note:
Implementation hint: This requirement is satisfied by writing SSCM_ERROR[RAE] = 1.
Each access to the BAM memory area produces a Machine Check exception.
3.2.2
Checking
Mandatory: After boot, but before executing any safety function, the application software
needs to read SSCM_STATUS[LSM] to verify that the device runs in the selected mode of
operation:
●
Decoupled Parallel Mode (DPM) – SSCM_STATUS[LSM] = 0
●
Lock Step Mode (LSM) – SSCM_STATUS[LSM] = 1
Note:
Rationale: To check if the MCU started in LSM
3.3
Self-Test Control Unit (STCU)
3.3.1
Configuration
The STCU does not require any configuration written by application software. The default
STCU configuration is to execute LBIST/MBIST and to react to detected faults by triggering
a Non-Critical Fault (NCF) that signals the FCCU (See “Self-Test Control Unit (STCU)”
chapter in the Device_Number Reference Manual for details).
Mandatory: LBISTs and MBISTs shall be configured to be executed once per trip time (trip
time defined in Section 2.1, Mission profile).
3.3.2
Checking
Mandatory: Once after boot, before the safety application starts, application software shall
carry out some STCU checking steps for ensuring STCU reliability.
Note:
Implementation hint: See “Integrity SW Operations” section of the “Self-Test Control Unit
(STCU)” chapter in the Device_NumberReference Manual for details.
Note:
Rationale: STCU manages the execution, and checks the result, of the LBISTs and
MBISTs. The STCU’s correct behavior must be verified by checking the expected results
with software.
The Integrity SW should confirm that all MBISTs and LBISTs finished successfully with no
additional errors flagged. This software confirmation prevents a fault within the STCU itself
from incorrectly indicating that the self-test passed.
This is an additional safety layer since the STCU propagates the LBIST/MBIST and internal
faults using the NCF signals of the FCCU. So, reading STCU_LBS, STCU_LBE,
STCU_MBSL, STCU_MBSH, STCU_MBEL, STCU_MBEH and STCU_ERR registers helps
increase the STCU auto-test coverage.
3.4
Reset Generation Module (MC_RGM)
A redundant fault notification path is achieved through the use of the MC_RGM and the
FCCU. MC_RGM configuration is application dependent.
Mandatory: However, to have the redundant notification path, both MC_RGM and FCCU
shall be configured to react to critical application faults.
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Note:
Rationale: To have two notification paths in case of an error
3.5
Clock configuration
The system starts by using the internal RC oscillator clock (IRCOSC) as its source (See
“Oscillators” chapter in the Device_Number Reference Manual and Section 3.22, Internal
RC Oscillator (IRCOSC) below for details on IRCOSC configuration).
Mandatory: Before safety functions are executed, the FMPLLs must be configured to use
the external oscillator (XOSC) as their source clock.
Note:
Rationale: Since the IRCOSC is used by the CMUs as reference to monitor the output of
the two PLLs, it can not be used as input of these PLLs.
Note:
Implementation hint: MC_CGM_AC3_SC[SELCTL] and MC_CGM_AC4_SC[SELCTL]
must be set to 1 to select the XOSC.
Mandatory: All safety relevant modules shall be clocked with an FMPLL generated clock
signal.
Note:
Rationale: To reduce the impact of glitches stemming from the external quartz crystal and
its hardware connection to the MCU
Note:
Implementation hint: This requirement is fulfilled by appropriately programming the Clock
Generation Module (MC_CGM) Clock Divider Configuration and Clock Select Control
registers and Mode Entry Module (MC_ME) MC_ME_<mode>_MC registers (See “Clock
Generation Module (MC_CGM)” and “Mode Entry Module (MC_ME)” chapters in the
Device_Number Reference Manual for details).
Mandatory: The bypass functionality of the XOSC must be disabled.
Note:
Rationale: To decrease the interference which may be caused by the crystal oscillator, its
output shall be filtered by the internal oscillator.
Note:
Implementation Hint: To disable the bypass mode, the OSCBYP flag of the OSC_CTL
register shall be set to 0.
3.6
SRAM
The system SRAM is protected against hardware dormant faults by hardware BISTs (See
“MBIST partitioning” section in the “Self-Test Control Unit (STCU)” of the Device_Number
Reference Manual). This test runs at boot, but some software actions are requested (See
Section 3.3: Self-Test Control Unit (STCU)).
Moreover, the system SRAM is also protected by a single error correction/dual error
detection (SEC/DED) ECC scheme. The SRAM SEC/DED concerns data and addresses
and thus provides diagnostic coverage to logic addresses.
3.7
Flash memory
Non-volatile memory (NVM) flash memory is protected with an SEC/DED ECC scheme.
Caution:
The single-bit correction reporting functionality is not available as described for flash
memory ECC (See errata e3320). In case single-bit corrections need to be tracked, the
workaround in the errata shall be used. Be aware that the workaround has a higher
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probability than the original mechanism to miss corrections if several occur within a short
time.
To support the detection of dormant faults in the entire memory array and addressing logic,
and to check the integrity of the logic used for flash memory programming, the following
BISTs must be enabled by software:
●
Mandatory: Array Integrity Self Check – This BIST is based on functionality built into
the flash memory control logic. It calculates a MISR signature over the array content
and thus validates the content of the array as well as the decoder logic. The calculated
MISR value is dependent on the array content and must be validated by software.
Frequency: This check must be performed at boot time.
Note:
Rationale: To check the integrity of the flash memory array content
Note:
Implementation hint: This BIST must be started by application software; its result must be
validated by reading the corresponding registers in the flash memory controller after it has
been finished (See “Array integrity self check” section in the “Flash memory” chapter of the
Device_Number Reference Manual for detailed information about this BIST).
●
Note:
Rationale: To verify that the written data is coherent with the expected data
●
Note:
Mandatory: Write operation – When writing flash memory, the corresponding SW
driver must validate the correctness of the programming of flash memory by checking
the value of C90FL_MCR[PEG]. Furthermore, the data that was written must be read
back, then verified by SW that it compares with the intended data value.
Frequency: After every write operation or after a series of write operations
Mandatory: Flash memory ECC logic test – This BIST tests the (digital) logic within the
flash memory that is responsible for detecting and correcting faults (ECC logic) in the
read data.
Rationale: The intention of this test is to assure that correct data is not accidently modified,
and single-bit errors are correctly updated.
Reading a set of data words from flash memory and comparing it with expected values
is a software initiated function that is controlled by the application.
Frequency: Once per FTTI
Note:
Implementation hint: Section 6, ECC logic test explains how to perform flash memory data
compares with SW.
3.8
Interrupt Controller (INTC)
No specific hardware protection is provided against spurious or missing interrupt requests
caused by Electromagnetic Interface (EMI) on the interrupt lines, or bit flips in the interrupt
registers of the peripherals(c).
Mandatory: Applications that are not resilient against such errors must include detection or
protection measures.
Note:
Rationale: To manage spurious or missing interrupt requests
c.
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INTC is a replicated module. No software action is needed to detect faults inside this module.
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Note:
Implementation hint: A possible way to detect spurious interrupts is to check
corresponding interrupt status in the interrupt status register of the related peripheral before
executing the Interrupt Service Routine (ISR) service code.
3.9
Semaphore Unit (SEMA4)
Semaphore modules are only used in DPM. Failures of the SEMA4 module may cause
unwanted interrupts in LSM. Each SEMA4 unit is connected to both replicated INTC
modules. This means that even in LSM when SEMA4 units are not used, a corrupted
SEMA4 could trigger continuous interrupts to both INTCs. To avoid this possible failure the
INTC shall have the SEMA4 interrupt masked (for example, SEMA4 units have the lowest
priority in the INTCs).
Mandatory: Application software shall keep these interrupt sources masked by
programming the interrupt controller appropriately.
3.10
Enhanced Direct Memory Access (eDMA) requests
Mandatory: For ASIL D applications, protection against spurious or missing safety relevant
eDMA requests must be implemented(d). The methodology used to satisfy this requirement
is application dependent.
Note:
Rationale: To manage spurious or missing eDMA transfer requests
Note:
Implementation hint: Some implementations which can satisfy these requirements are:
●
Counting the number of eDMA transfers triggered inside a control period and compare
this with what is the expected value.
●
If the eDMA is used to manage the analog acquisition with the Cross-Triggering Unit
(CTU) and ADC, the number of the converted ADC channels is saved in the CTU FIFO
together with the acquired value. The eDMA transfers this value from the CTU FIFO to
a respective SRAM location. Spurious or missing transfer requests can be detected by
comparing the converted channel with what is expected.
Mandatory: Designers must not use the Periodic Interrupt Timer (PIT) module to trigger an
eDMA transfer request for ASIL D applications.
Note:
Rationale: To avoid a faulty PIT (which is not redundant) from triggering an unexpected
eDMA transfer
3.11
Periodic Interrupt Timer (PIT)
Mandatory: For ASIL D applications the PIT module must be used in such a way that a
possible failure is detected by the Software Watchdog Timer (SWT).
Note:
Rationale: To catch possible PIT failures
Mandatory: If the PIT is used by ASIL D applications, a checksum of its configuration
registers must be calculated and compared with the expected value to verify that the PIT
d. eDMA is a replicated module. No software action is needed to detect faults inside this module.
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configuration is correct.
Frequency: Once per FTTI
Note:
Rationale: To verify that the PIT remains at its expected configuration
3.12
Communication peripherals
The Device_Number includes the following communication peripherals:
●
FlexCAN
●
DSPI
●
FlexRay
●
LINFlexD
Recommended: An appropriate safety software protocol should be utilized (for example,
Fault Tolerant Communication Layer, FTCOM) for any communication peripheral employed
to meet ASIL D application requirements.
3.13
I/O peripherals
The following sections cover the use of the following peripherals:
●
System Integration Unit Lite (SIUL)
●
eTimer
●
FlexPWM
These modules shall be used to implement the following functions if they are part of the
application safety function:
●
●
Read Inputs
–
Read Digital Inputs
–
Read PWM Inputs
–
Read Encoder Inputs
Write Outputs
–
Write Digital Outputs
–
Write PWM Outputs
These are the safety functions assumed during analysis of the Device_Number.
3.13.1
Read Digital Inputs
For ASIL D applications, digital inputs used for safety purposes are assumed to be acquired
redundantly as described in the following section.
Note:
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Implementation hint: If sufficient diagnostic coverage can be obtained by a plausibility
check on a single acquisition for a specific application, a plausibility check can replace a
redundant acquisition. This hint is a special case of deviating from mandatory requirements
as described in the Preface.
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3.13.1.1
Double Read Digital Inputs
3.13.1.1.1
Hardware elements
Double read operation of a digital input is implemented by two general purpose inputs (GPI)
of the SIUL unit. SIUL must be configured to allow an input signal to be read from it’s
assigned pad. To minimize CCFs, the two input pads must not be physically adjacent (see
Section 7, I/O pin/ball configuration for details).
3.13.1.1.2
Safety Integrity Functions
Mandatory: Safety integrity is achieved by replicated reading and software comparison by
the processing function. The application shall implement the following tests:
●
Note:
Rationale: To verify that the configuration of the two pads used corresponds with the
expected configuration, and to avoid a CCF caused by incorrectly configured pads
●
Note:
SIUL_SWTEST_REGCRC
GPI_SWTEST_CMP
Rationale: To verify that the two input values compare
Figure 1. Double Read Digital Input
Digital In Double
Read Configuration
SIUL
I
3.13.1.1.3
= Input Pad
I
I
GPI[x]
GPI[y]
Software test implementation
●
SIUL_SWTEST_REGCRC
The SIUL configuration registers are read, then a CRC is calculated. The CRC
calculation is compared to the expected CRC value.
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Implementation hint: The eDMA and CRC modules may be used to implement this Safety
Integrity Function (SIF) to avoid overloading the CPU.
●
GPI_SWTEST_CMP
This software test is used to execute the comparison between the double reads
performed by the independent channels.
3.13.1.1.4
Implementation details
The only hardware element that can be used for the safety function is the general purpose
input/output (GPIO).
Note:
Implementation hint: Every I/O pad that is not dedicated to a single function can be
configured as GPIO (ADC pads are an exception to this rule, as they can only be configured
as inputs).
Caution:
Redundant GPIO shall be selected in a non-contiguous way from the pin perspective to
minimize CCF (see Section 7, I/O pin/ball configuration for details).
Mandatory: The pads shall be configured via the appropriate pad configuration registers
(PCRn) in the SIUL module.
Note:
Rationale: To configure pads used by this safety function, and avoid CCF caused by
improper configuration of the pads.
Table 3. Software BIST and/or test
3.13.2
Software BIST or test
Frequency
SIUL_SWTEST_REGCRC
Once after programming
GPI_SWTEST_CMP
Once for every acquisition
Read PWM Input
For ASIL D applications, digital inputs used for safety purposes are always assumed to be
acquired redundantly as described in the following section.
Read PWM Input means any input read related to signal transitions (rise or fall). This may
also include the time that the signal was high, low or both.
3.13.2.1
Double Read PWM Inputs
3.13.2.1.1
Hardware elements
A Double Read PWM Input is implemented by two channels, one channel provided by
eTimer_0 and the other by eTimer_1. The SIUL module must be configured (via the
appropriate SIUL_PCRn) to provide configuration and input direction of the input pads. To
minimize CCFs, these input pads must not be physically adjacent (see Section 7, I/O
pin/ball configuration for details).
3.13.2.1.2
Safety Integrity Functions
Safety integrity is achieved by reading each input then comparing the values in the
processing function (See Figure 2).
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Mandatory: The software tests that the application must implement are:
Note:
●
ETIMER0_SWTEST_REGCRC
●
ETIMER1_SWTEST_REGCRC
●
SIUL_SWTEST_REGCRC
Rationale: To verify that the configuration of the modules used by this safety function
compare to the expected configuration
Mandatory: In addition, the double reads must be compared by the application with the
implementation of the following test: ETIMERI_SWTEST_CMP.
Note:
Rationale: To verify that the two sets of data compare
Figure 2. Double Read PWM Input
PWM In Double Read
Configuration
I
3.13.2.1.3
eTimer_0
eTimer_1
I
I
ETC[x]
ETC[y]
= Input Pad
Software test implementation
●
ETIMER0_SWTEST_REGCRC
The eTimer_0 configuration registers are read and a CRC checksum is computed. The
checksum is compared with the expected value.
●
ETIMER1_SWTEST_REGCRC
The eTimer_1 configuration registers are read and a CRC checksum is computed. The
checksum is compared with the expected value.
●
SIUL_SWTEST_REGCRC
The configuration registers of the SIUL are read and a CRC checksum is computed.
The checksum is compared with the expected value.
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Implementation hint: The eDMA and CRC modules should be used to implement these
SIFs to avoid overloading the CPU.
●
ETIMERI_SWTEST_CMP
This software BIST is used to execute the comparison between the double reads
performed by a channel on eTimer_0 and another channel on eTimer_1. The
comparison must take into account possible approximation because of different
capturing of the input asynchronous signals.
3.13.2.1.4
Implementation details
The following hardware elements shall be used for the safety function:
●
eTimer_0 channels
●
eTimer_1 channels
Mandatory: The user must select one channel from the eTimer_0 module and another from
the eTimer_1.
Note:
Rationale: To avoid CCF (eTimer_0 and eTimer_1 belonging to different lakes)
Mandatory: The pads shall be configured via the appropriate pad configuration registers
(SIUL_PCRn).
Note:
Rationale: To configure pads used by this safety function
Table 4. Software BIST and/or test
3.13.3
Software BIST or test
Frequency
ETIMER0_SWTEST_REGCRC
Once after programming
ETIMER1_SWTEST_REGCRC
Once after programming
SIUL_SWTEST_REGCRC
Once after programming
ETIMERI_SWTEST_CMP
Once for every acquisition
Read Encoder Inputs
For ASIL D applications, encoder inputs used for safety purposes are assumed to be
acquired redundantly as described in the following section.
Read Encoder Input means any input read related to signal transitions (rise or fall). This
may also include signals coming from an encoder.
3.13.3.1
Double Read Encoder Inputs
3.13.3.1.1
Hardware elements
A Double Read Encoder Input is implemented using two channels that can be provided by:
●
eTimer_0
●
eTimer_1
●
SIUL
When both channels are provided by the timer units, the signals of one encoder must be
addressed to eTimer_0 and the signals of the other encoder must be addressed to
eTimer_1. Alternatively, one or both channels can be provided by the SIUL, which supports
interrupt based reading of encoder signals. This means the SIUL must use general purpose
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inputs which have edge detection interrupts (See Figure 3 for details).
Mandatory: One channel must be addressed by eTimer_0, and the other by eTimer_1.
Note:
Rationale: Two different eTimers must be used to avoid CCF (eTimer_0 and eTimer_1
belonging to different lakes).
For each signal, the SIUL can provide additional channels to support interrupt-based
reading.
Mandatory: In this configuration, the SIUL must be correctly configured to forward one or
two interrupt-based event readings.
Note:
Rationale: To configure pads used by this safety function
Mandatory: The input pads must not be physically adjacent (see Section 7, I/O pin/ball
configuration for details).
Note:
Rationale: To minimize CCF
3.13.3.1.2
Safety Integrity Functions
The safety integrity is achieved by duplicate reads and software comparison by the
processing function (See Figure 3).
Mandatory: The application software must implement the following tests:
Note:
●
ETIMER0_SWTEST_REGCRC
●
ETIMER1_SWTEST_REGCRC
●
SIUL_SWTEST_REGCRC
Rationale: To verify that the configuration of the modules used by this safety function
compare with what is expected
Rationale: To avoid CCF caused by improper configuration of the pads
Mandatory: The application software must implement the test ENCI_SWTEST_CMP, which
compares signals acquired from each channel.
Note:
Rationale: To verify that the two sets of data compare
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Figure 3. Double encoder read input
Encoder Input Double
Read Configuration
= Input Pad
I
3.13.3.1.3
eTimer_0
eTimer_1
I
I
ETC[x]
ETC[y]
SIUL
I
EIRQ[x]
I
EIRQ[y]
Software test implementation
●
ETIMER0_SWTEST_REGCRC
The eTimer_0 configuration registers are read, then a CRC checksum is computed.
This computed checksum is compared to the expected value.
●
ETIMER1_SWTEST_REGCRC
The eTimer_1 configuration registers are read, then a CRC checksum is computed.
This computed checksum is compared to the expected value.
●
SIUL_SWTEST_REGCRC
The configuration registers of the SIUL are read, then a CRC checksum is computed.
This computed checksum is compared to the expected value.
Note:
Implementation hint: The eDMA and CRC modules should be used to implement this SIF
to avoid overloading the CPU.
●
ENCI_SWTEST_CMP
This software test is used to execute the comparison between the double reads
performed by one of the following:
–
one channel on eTimer_0 and one channel on eTimer_1
–
one channel on eTimer_1 and one channel on the SIUL
–
one channel on eTimer_0 and one channel on the SIUL
–
two channels on the SIUL
The comparison must take into account possible approximation because of different
captured values of the input asynchronous signals and the execution of interrupt based
event reads. Approximation required by different behavior of the encoded inputs must
be handled at the application level.
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3.13.3.1.4
Functional safety requirements for application software
Implementation details
The following hardware elements shall be used for the safety function:
●
eTimer_0 channels
●
eTimer_1 channels
●
External interrupt via GPIO pins (configured via the SIUL)
The user must select one channel from eTimer_0 and one from eTimer_1. The external
interrupt pins are optional.
Mandatory: The pads shall be configured via the appropriate pad configuration registers
(SIUL_PCRn).
Note:
Rationale: To configure pads used by this safety function
Table 5. Software BIST and/or test
3.13.4
Software BIST or test
Frequency
ETIMER0_SWTEST_REGCRC
Once after programming
ETIMER1_SWTEST_REGCRC
Once after programming
SIUL_SWTEST_REGCRC
Once after programming
ENCI_SWTEST_CMP
Once for every acquisition
Write Digital Outputs
For ASIL D applications, digital outputs used for safety purposes are assumed to be written
either redundantly or with read back as described in the following section.
Note:
Application-dependent option: If a sufficient diagnostic coverage can be reached by a
plausibility check on a single output channel for a specific application, a plausibility check
can replace a redundant write or a direct read back.
The element safety function Write Digital Out is implemented as either:
3.13.4.1
●
Single Write Digital Out With Read Back
●
Double Write Digital Out
Single Write Digital Outputs With Read Back
The SIUL hardware element is used to perform a single Write Digital Output With Read
Back.
Mandatory: The read back must be implemented in one of the two modes shown in
Figure 4.
Note:
Rationale: To verify if written data compares with the expected data
Mandatory: The SIUL element must be correctly configured to provide the output write and
the pad directions as follows:
●
External read back – SIUL is configured to read back the signal from an additional pad,
and the loopback is performed outside the device. In this configuration, only half of the
available digital outputs are available as safety outputs.
●
Internal read back(e) – SIUL is configured to read back the pad value via an internal
read path. All pads dedicated to digital input/output are capable of reading the pad
digital status using the input logic.
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Rationale: To verify if written data is coherent with the expected data
Mandatory: The application software must implement the software test to check the correct
configuration of the pads, SIUL_SWTEST_REGCRC, and to compare the read back with
the digital output write. GPOERB_SWTEST_CMP is used for external read back and
GPOIRB_SWTEST_CMP is used for internal read back.
Figure 4. Write Digital Output With Read Back
Digital Out External Readback
Configuration
Digital Out Internal Readback
Configuration
SIUL
SIUL
I
= Input Pad
O
= Output Pad
Pin
I
O
GPI
3.13.4.1.1
Pin
GPO
O
Pin
GPO
Software test implementation
●
SIUL_SWTEST_REGCRC
The SIUL configuration registers are read and a CRC checksum is computed. This
CRC checksum is compared what is expected.
Note:
Rationale: To avoid CCF caused by incorrect configuration of the pads
Note:
Implementation hint: The eDMA and CRC modules should be used to implement this SIF
to avoid overloading the CPU.
●
GPOERB_SWTEST_CMP
This software test is used to execute the comparison between the desired output
values and the value read back via external read back configuration. After writing the
output value, the test must read the value of the digital input.
e. Internal read back does not cover package faults (e.g., wire bond, etc.).
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Functional safety requirements for application software
Rationale: To verify if the read data compares with the written data
●
GPOIRB_SWTEST_CMP
This software test is used to execute the comparison between the desired output
values and the value read back via internal read back configuration. After writing the
output value, the test must read the status of the digital input.
Note:
Rationale: To verify if the read data compares with the written data
3.13.4.1.2
Implementation details
The SIUL hardware element shall be used for the safety function. Every pad that is not
dedicated to a single function can be configured as GPIO. Pads dedicated to ADC are an
exception to this rule, as they can be configured as inputs only.
The pads shall be configured via the appropriate pad configuration registers (PCRn) in the
SIUL module.
Table 6. Software BIST and/or test
3.13.4.2
Software BIST or test
Frequency
SIUL_SWTEST_REGCRC
Once after programming
GPOERB_SWTEST_CMP
Once every write
GPOIRB_SWTEST_CMP
Once every write
Double Write Digital Outputs
The SIUL is used to perform a Double Write Digital Output.
Mandatory: The SIUL must be configured to correctly define the configuration of the output
pads used. The software must perform a double write.
Note:
Rationale: To configure pads used by this safety function
Mandatory: To guarantee the integrity of the two output channels, the application shall test
the SIUL configuration implementing the SIUL_SWTEST_REGCRC.
Note:
Rationale: To avoid a CCF caused by incorrect configuration of the pads
Mandatory: The application must implement the double output write as defined by the
GPODW_SWAPP_WRITE.
Note:
Rationale: To write a digital output by exploiting redundancy
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Figure 5. Double Write Digital Output
Digital Out Double
Configuration
SIUL
O
3.13.4.2.1
= Output Pad
O
O
GPO[x]
GPO[y]
Software test implementation
●
SIUL_SWTEST_REGCRC
The configuration registers of the SIUL are read and a CRC is computed. This CRC
value is compared with what is expected.
Note:
Implementation hint: The eDMA and CRC modules should be used to implement this SIF
to avoid overloading the CPU.
●
GPODW_SWAPP_WRITE
Mandatory: The output write of a redundant channel must be implemented following this
guideline:
●
The two outputs are written with a single instruction to the appropriate register.
●
The output register is read back.
Note:
Rationale: To minimize CCF of the SIUL
Note:
Implementation hint: To write two or more GPIOs with a single instruction, the Masked
Parallel GPIO Pad Data Out register (MPGPDOx) register can be used.
Application software shall verify that the two GPIOs used are in the same MPGPDOx
register.
To protect the value of the other GPIOs that belong to the same MPGPDOx, the MASK field
of the MPGPDOx register needs to be properly configured.
3.13.4.2.2
Implementation details
The only hardware element that can be used for the safety function is the GPIO.
Note:
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Every pad that is not dedicated to a single function can be configured as GPIO. ADCs are
an exception to this rule, as they can be configured as inputs only.
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Functional safety requirements for application software
The pads shall be configured via the appropriate pad configuration registers (PCRn) in the
SIUL module.
Table 7. Software BIST and/or test
3.13.5
Software BIST or test
Frequency
SIUL_SWTEST_REGCRC
Once after programming
GPODW_SWAPP_WRITE
Once every write
Write PWM Outputs
For ASIL D applications, PWM outputs used for safety purposes are assumed to be written
either redundantly or with read back as described in the following section.
The element safety function Write PWM Output is implemented as Double Write PWM
Outputs or Single Write PWM Outputs With Read Back.
3.13.5.1
Double Write PWM Outputs
The hardware elements eTimer_0 and eTimer_1 or FlexPWM_0 and FlexPWM_1 are used
to perform a Double Write PWM Output.
Mandatory: These units must be configured to implement two PWM channels. The SIUL
must be configured to define the configuration of the output pads used. The software must
perform a double write.
Mandatory: Redundant pads must not be adjacent and pad configuration/data registers
must be separate SIUL registers (see Section 7, I/O pin/ball configuration for details).
Note:
Rationale: To avoid CCF
Mandatory: To guarantee the integrity of the two output channels, the application should
test the SIUL configuration implementing the SIUL_SWTEST_REGCRC.
Note:
Rationale: To avoid CCF caused by incorrect configuration of the pads
Mandatory: The application software must implement a test for the eTimer_0 and eTimer_1
configuration (ETIMER0_SWTEST_REGCRC, ETIMER1_SWTEST_REGCRC) or for the
FlexPWM_0 and FlexPWM_1 configuration (FLEXPWM0_SWTEST_REGCRC,
FLEXPWM1_SWTEST_REGCRC) and a software write (PWMDW_SWAPP_WRITE).
Note:
Rationale: To verify that the configuration of the modules used by this safety function
adhere to the expected configuration
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Figure 6. Double Write PWM Output configuration
PWM Out Double Write
Configuration (eTimer)
eTimer_1
Flex
PWM_0
Flex
PWM_1
O
O
O
O
ETC[x]*
ETC[y]*
n[z]*
n[z]*
eTimer_0
O
PWM Out Double Write
Configuration (FlexPWM)
= Output Pad
Note: n[z] represents any FlexPWM output (for example, A[z], B[z] or X[z]), but each
output must be driven by different FlexPWM modules. The same consideration is
valid for the eTimer; any eTimer output may be used, but each output must be driven
by different eTimer module.
3.13.5.1.1
Software test implementation
●
SIUL_SWTEST_REGCRC
The SIUL configuration registers are read and a CRC checksum is computed. The
CRC checksum is compared to the expected value.
●
ETIMER0_SWTEST_REGCRC
The eTimer_0 configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
ETIMER1_SWTEST_REGCRC
The eTimer_1 configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
FLEXPWM0_SWTEST_REGCRC
The FlexPWM_0 configuration registers are read and a CRC checksum is computed.
The checksum is compared to the expected value.
●
FLEXPWM1_SWTEST_REGCRC
The FlexPWM_01 configuration registers are read and a CRC checksum is computed.
The checksum is compared to the expected value.
Note:
Implementation hint: The eDMA and CRC modules should be used to implement this SIF
to avoid overloading the CPU.
●
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Functional safety requirements for application software
Mandatory: The output write of a redundant PWM channel must be implemented by writing
the new output values to both the PWM channels. The customer can decide whether to use
both eTimers (eTimer_0, eTimer_1) or both FlexPWMs (FlexPWM_0, FlexPWM_1), See
Figure 6.
Note:
Rationale: To write a digital output by exploiting redundancy, and modules must belong to
different lakes to decrease the probability of CCF
3.13.5.1.2
Implementation details
The following hardware elements shall be used for the safety function:
●
eTimer_0 channels
●
eTimer_1 channels
●
FlexPWM_0 channels
●
FlexPWM_1 channels
Mandatory: The pads shall be configured via the appropriate pad configuration registers
(PCRn) in the SIUL module.
Note:
Rationale: To configure pads used by this safety function
Table 8. Software BIST and/or test
Software BIST or test
Frequency
SIUL_SWTEST_REGCRC
Once after programming3
ETIMER0_SWTEST_REGCRC1
Once after programming
ETIMER1_SWTEST_REGCRC1
Once after programming
FLEXPWM0_SWTEST_REGCRC2
Once after programming
FLEXPWM1_SWTEST_REGCRC2
Once after programming
PWMDW_SWAPP_WRITE
Once every write
1. This software BIST is needed only if the eTimer channels are used for the safety function
2. This software BIST is needed only if the FlexPWM channels are used for the safety function
3. If a change in a single SIUL configuration register is capable of affecting both the output and the readback paths, then SIUL_SWTEST_REGCRC must be executed every FTTI. In all other cases
configuration errors are covered by the software comparison.
3.13.5.2
Single Write PWM Outputs With Read Back
The hardware elements eTimer_0 and FlexPWM_1 or eTimer_1 and FlexPWM_0 are used
to perform a Write PWM Output With Read Back(f). These units must be configured to
implement one PWM output channel and (via internal read back) the eTimer_0 input PWM
channel. The SIUL must be configured to define the configuration of the output pads used.
The software must perform a write operation followed by a read operation. To guarantee the
integrity of the configuration of the channels, the application should test the SIUL
configuration implementing the SIUL_SWTEST_REGCRC (to avoid a common failure
caused by misconfiguration of the pads).
f.
eTimer_0 and FlexPWM_0 (eTimer_1 and FlexPWM_1) cannot be used in combination due to the same LBIST
partition assignment.
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Implementation hint: A single channel of the eTimer is used with a multiplexing of the
internal read back of the different output of the FlexPWM. The read back paths are limited to
six signals, two for each sub-module of the FlexPWM.
Mandatory: The application software must implement software tests for eTimer_0 and
eTimer_1 configurations:
Note:
●
FLEXPWM0_SWTEST_REGCRC
●
FLEXPWM1_SWTEST_REGCRC
●
ETIMER0_SWTEST_REGCRC
●
ETIMER1_SWTEST_REGCRC
Rationale: To verify that the configuration of the modules used by this safety function
adheres to the expected configuration
Mandatory: The application software must write to the output port and then compare the
written value via the read back (See item PWMRB_SWTEST_CMP below).
Note:
Rationale: To verify that written data is what is expected
Figure 7. Single Write PWM Output With Read Back configuration
PWM Out Single Write External
Readback Configuration
I
= Input Pad
O
= Output Pad
PWM Out Single Write Internal
Readback Configuration
eTimer
Flex
PWM
eTimer
Flex
PWM
I
O
I
O
ETC[x]
n[z]*
* Note: n[z] represents any FlexPWM output.
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3.13.5.2.1
Functional safety requirements for application software
Software test implementation
●
SIUL_SWTEST_REGCRC
The SIUL configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
ETIMER0_SWTEST_REGCRC
The eTimer_0 configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
ETIMER1_SWTEST_REGCRC
The eTimer_1 configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
FLEXPWM0_SWTEST_REGCRC
The FlexPWM_0 configuration registers are read and a CRC checksum is computed.
The checksum is compared to the expected value.
●
FLEXPWM1_SWTEST_REGCRC
The FlexPWM_1 configuration registers are read and a CRC checksum is computed.
The checksum is compared to the expected value.
Note:
Implementation hint: The eDMA and CRC modules should be used to implement this SIF
to avoid overloading the CPU.
●
PWMRB_SWTEST_CMP
This procedure output compares the PWM read back provided by a single channel of
the eTimer_0 (eTimer_1) with the expected values that have been written to the
FlexPWM_1 (FlexPWM_0) output channel.
3.13.5.2.2
Implementation details
The following hardware elements shall be used for the safety function:
●
eTimer_0 channels
●
eTimer_1 channels
●
FlexPWM_0 channels
●
FlexPWM_1 channels
Mandatory: The pads shall be configured via the appropriate pad configuration registers
(PCRn) in the SIUL module.
Note:
Rationale: To configure pads used by this safety function
Table 9. Software BIST and/or test
Software BIST or test
Frequency
SIUL_SWTEST_REGCRC
Once after programming
ETIMER0_SWTEST_REGCRC(1)
Once after programming
(1)
Once after programming
ETIMER1_SWTEST_REGCRC
FLEXPWM0_SWTEST_REGCRC(2)
Once after programming
(2)
Once after programming
FLEXPWM1_SWTEST_REGCRC
PWMRB_SWTEST_CMP
Once every write
1. This software BIST is needed only if the eTimer channels are used for the safety function.
2. This software BIST is needed only if the FlexPWM channels are used for the safety function.
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3.13.6
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Other requirements for I/O peripherals
Mandatory: Other requirements related to I/O peripherals include the following:
●
Note:
In the eTimer module, the capture flag (eTimer_n_STS[ICFn]) must be used.
Rationale: To detect missing eTimer_n acquisition
●
If the eTimer counter is used to decode a primary and secondary external input as
quadrature encoded signals, the eTimer watchdog must be used (See “Counting
Modes” section of the Device_Number Reference Manual).
Note:
Rationale: To detect stalled quadrature counting
3.14
Cross Triggering Unit (CTU)
The CTU generates some triggers based on input events (FlexPWMs, eTimers, and/or
external pins).
The trigger can be caused by:
●
A pulse
●
An interrupt
●
An ADC command (or a stream of consecutive commands)
●
All of these
Mandatory: The CTU shall be appropriately configured so that the output triggers are
generated within the desired time schedule with respect to the input event(s).
Note:
Rationale: To avoid erratic output trigger generation
For each trigger, a set of ADC commands and pulses to be generated can be defined.
If the application safety function includes the read of some inputs synchronized with some
events (FlexPWMs, eTimers, and/or external pins), the customer can use the CTU module
for this purpose. The software needed for targeting the ASIL D is listed in Section 3.14.1:
Synchronize Sequential Read Input.
For a detailed description on how the CTU works (triggered and sequential mode), its
configuration and use, refer to the Device_Number Reference Manual.
3.14.1
Synchronize Sequential Read Input
The CTU can be used if the customer needs to synchronize the reading of some inputs with
some events (FlexPWMs, eTimers, and/or external pins).
Mandatory: If this function is part of the application safety function, the safety integrity is
achieved by a mix of hardware mechanisms and software safety integrity functions
implemented at the application level:
Note:
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●
CTU_HWSWTEST_TRIGGERNUM
●
CTU_SWTEST_TRIGGERTIME
●
CTU_HWSWTEST_TRIGGEROVERRUN
●
CTU_HWSWTEST_ADCCOMMAND (only if the input is an analog signal)
●
CTU_SWTEST_ETIMERCOMMAND
●
CTU_HW_CFGINTEGRITY
These functions are mandatory only if the CTU is used.
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Functional safety requirements for application software
Software test implementation
●
CTU_HWSWTEST_TRIGGERNUM
If the reload signal occurs before all the triggers are generated, an overrun indication is
flagged and the application software must handle the error indication.
Note:
Rationale: Tests if all the triggers configured within a control period have been generated
and serviced.
Note:
Implementation hint: The Cross Triggering Unit Error Flag register (CTUEFR) shows
information about the overrun status.
●
CTU_SWTEST_TRIGGERTIME
Application software must configure one eTimer channel to capture the time at which
each trigger event occurs.
In triggered mode, the time instant of each trigger within one control period is captured
and stored in a FIFO. Application software has to check the FIFO values against the
expected ones according to CTU configuration.
In sequential mode, one eTimer channel is needed to check the correct time of a single
trigger with respect to the corresponding event.
Note:
Rationale: To verify if triggers are generated at the correct time
Note:
Implementation hint: Some eTimer inputs are internally connected to the CTU output.
eTIMER_2 input/outputs are not connected to pins on LQFP144 package. Use eTIMER_2
channels for implementing this safety function to keep the channels from eTIMER_0 or
eTIMER_1 units for functions using port pins (See “Enhanced Motor Control Timer (eTimer)”
in the Device_Number Reference Manual for details).
Note:
Implementation hint: eTimer capture register implements a two entry FIFO, but in CTU
triggered mode up to 8 time values need to be stored. To avoid FIFO overflow condition,
eTimer can be configured to trigger a eDMA transfer to move the captured value to specific
RAM location.
●
CTU_HWSWTEST_TRIGGEROVERRUN
This hardware mechanism checks if a new trigger occurs that requires an action by a
subunit that is currently busy. In this case, an overrun interrupt is generated and the
application software must handle the error condition.
Over-run detection mechanism shall be enabled by software during CTU configuration.
Note:
Rationale: Checks if a new trigger occurs that requires an action by a subunit (such as ADC
command generator) which is currently busy.
Note:
Implementation hint: To enable the over-run detection the IEE flag in the Cross Triggering
Unit Interrupt/eDMA register (CTUIR) register shall be asserted. This interrupt is shared
between several sources of error. The user can discriminate among them by reading the
CTUEFR register.
●
CTU_HWSWTEST_ADCCOMMAND
The CTU stores in its internal FIFOs both the value provided by each ADC conversion
and the channel number. Application software must check the ADC channel number
sequence against what is expected for each FIFO. Moreover, invalid commands issued
by the CTU are flagged and the corresponding error must be handled by the
application software.
Note:
Rationale: To detect if the incorrect channel has been acquired, or if the incorrect ADC
result FIFO is selected
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Implementation hint: To enable invalid command detection, the IEE flag in the CTUIR
register must be asserted.
This interrupt is shared between several sources of error. The user can discriminate among
them by reading the CTUEFR register.
This safety integrity function needs to be implemented only when reading analog
signals.
●
CTU_SWTEST_ETIMERCOMMAND
Application software must configure one channel of eTimer_0 or eTimer_1 to count the
number of eTimer commands generated within a CTU control period and must check
the number against the expected one.
Note:
Rationale: To verify the correctness of the number of generated commands
Note:
Implementation hint: Some eTimer inputs are internally connected to the CTU output (See
the Device_Number Reference Manual for details).
●
CTU_HW_CFGINTEGRITY
This hardware mechanism ensures the consistency of the CTU configuration at the
beginning of each CTU control period.
The configuration registers are all double-buffered. If the configuration is only partial
when the control period starts, the previous configuration is used and an error condition
is flagged, which must be handled by the application software.
Note:
Rationale: Ensures the consistency of the CTU configuration
Note:
Implementation hint: The CTU uses a safe reload mechanism. The General Reload
Enable (GRE) bit in the Cross Triggering Unit Control Register (CTUCR) shall be used to
detect partial or incomplete CTU update.
To enable the interrupt in case of error during reload, the IEE flag in the CTUIR register shall
be asserted.
This interrupt is shared between several sources of error. The user can discriminate among
them by reading the CTUEFR register.
3.14.1.2
Implementation details
The following hardware elements shall be used for the safety function:
●
CTU
●
One eTimer channel
Table 10. Software BIST and/or test
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Software BIST or test
Frequency
CTU_HWSWTEST_TRIGGERNUM
Once for every control period (< FTTI)
CTU_SWTEST_TRIGGERTIME
Once for every CTU control period (triggered
mode) or every trigger (sequential mode)
CTU_HWSWTEST_TRIGGEROVERRUN
Once for every trigger
CTU_HWSWTEST_ADCCOMMAND
Once for every ADC command
CTU_SWTEST_ETIMERCOMMAND
Once for every control period (< FTTI)
CTU_HW_CFGINTEGRITY
Once for every control period (< FTTI)
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3.14.1.3
Functional safety requirements for application software
Other requirements for CTU module usage
Mandatory: The only other requirement related to the CTU is that if the CTU is used to read
an analog signal through the ADC, the software shall verify the Invalid Command Error flag
(CTU_CTUEFR[ICR]) after programming the ADC command lists.
Note:
Rationale: To check the presence of invalid commands
3.15
ADC
If the ADC is used in a safety function, the following sections must be observed if an ADC
BIST is to be performed.
It is important to note that the ADC is part of the temperature measuring safety integrity
function, and it is therefore required that the HWBIST functions be executed once after the
boot even if the ADC is not in application use.
3.15.1
Read Analog Inputs
The customer has two options for reading analog inputs:
●
Single Read Analog Inputs
●
Double Read Analog Inputs
3.15.1.1
Single Read Analog Inputs
3.15.1.1.1
Hardware elements
The single-read analog input uses a single-analog-input channel either of ADC_0 or ADC_1
to acquire an analog voltage signal (See Figure 8).
To support a high diagnostic coverage two known reference supply voltages are utilized by
two software tests which are described in the following sections (ADC_SWTEST_TEST1
and ADC_SWTEST_TEST2).
The reference supply voltages are the following:
●
VDD_HV_ADR0 (ADC_0 high reference voltage)
●
VDD_HV_ADR1 (ADC_1 high reference voltage)
●
VSS_HV_ADR0 (ADC_0 low reference voltage)
●
VSS_HV_ADR1 (ADC_1 low reference voltage)
The SIUL unit must be configured properly to correctly enable the input pads. The pads
used for analog inputs are only of type INPUTS.
3.15.1.1.2
Safety Integrity Functions
Mandatory: The safety integrity is achieved by dedicated hardware BIST(g):
Note:
Rationale: Hardware BIST to check the integrity of the ADC, both analog and digital parts:
●
SUPPLY SELF-TESTRESISTIVE-CAPACITIVE SELF-TESTCAPACITIVE SELF-TEST
g. These hardware BISTs need some software to activate them. This software shall be developed by the
customer.
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Mandatory: By dedicated software test implemented at the application level:
●
ADC_SWTEST_TEST1
●
ADC_SWTEST_TEST2
●
ADC_SWTEST_VALCHK
●
ADC0_SWTEST_REGCRC
●
ADC1_SWTEST_REGCRC
●
SIUL_SWTEST_REGCRC
●
ADC_SWTEST_ADCOVERSAMPLING
Figure 8. Single Read Analog Input configuration
Analog Single Read/Write Internal
Readback Configuration
ADC_x
Reference voltages
(Vdd_HV_ADRx and Vss_HV_ADR)
I
= Input Pad
I
AN[x]
3.15.1.1.3
Hardware BIST
Three types of self-test algorithms have been implemented in the ADC hardware:
●
SUPPLY SELF-TEST
●
RESISTIVE-CAPACITIVE SELF-TEST
●
CAPACITIVE SELF-TEST
3.15.1.1.3.1 Hardware BIST implementation
The hardware BISTs shall be activated by the application in one of the following modes:
●
CPU mode
●
CTU mode
In CPU mode, the application software takes care of the hardware self-test activation and
checks the test flow and the timing.
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In CTU mode, the CTU module takes care of the hardware self-test activation, flow
monitoring, and timing. It is important to note that in this operating mode, the CPU does not
take part in running the hardware self-test.
HW self-tests use analog watchdogs to verify the outcome of self-test conversions. The
reference thresholds of these watchdogs are saved in test sector (See “Test flash memory”
section and “Test flash information” table in the Device_Number Reference Manual).
Mandatory: Before running the HW self-test, the customer must copy these thresholds from
the test sector into the watchdog registers (See “Self test analog watchdog” section of the
Device_Number Reference Manual).
Note:
Rationale: To set the correct threshold for the self-tests
Note:
Implementation hint: Since user can not directly read the test sector an SSCM feature,
called Test Flash Enable, shall be exploited. This action is performed through the following
steps:
1.
If code is executing in flash memory, it jumps to execute from RAM.
2.
Write SSCM_SCTR[TFE] = 1.
3.
Test sector is readable at the offset 0x0 of the flash memory address space (See
“System Status and Configuration Module (SSCM)” of the Reference Manual).
4.
Thresholds are copied from the test sector to the respective register.
5.
Write SSCM_SCTR[TFE] = 0.
6.
Code can continue execution from the flash memory.
BAM implements an access method to read the test sector.
Mandatory: Since the BAM is not developed according to the safety standard, a safety
application is not allowed to read the test sector through the BAM access method.
Additionally, a watchdog timer is implemented to check the sequence of the self-test
algorithms.
Mandatory: The customer must enable the watchdog timer for CPU mode and CTU mode.
The programmable watchdog timeout is the FTTI(h).
Note:
Rationale: To check the sequence of the self-test algorithms
Every hardware BIST is activated via a dedicated command sent to the ADC. Refer to the
“Self-testing” section in the “ADC” chapter of the Device_Number Reference Manual to have
all detailed instructions for implementing one of these modes.
The supply self-test must be executed without interleaved user conversion.
3.15.1.1.4
Software tests
●
ADC_SWTEST_TEST1
This software BIST exploits the presampling feature of the ADC. Presampling allows to
precharge or discharge the ADC internal capacitor before it starts the sampling and
conversion phases of the analog input coming from pads. During presampling phase,
h. This action is not mandatory in case of Double Read Analog Inputs.
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the ADC samples the internally generated voltage while in the sampling phase the ADC
samples analog input coming from pads (See Figure 10).
Reference voltage which can be used during presampling phase is either
VDD_HV_ADR0/1 or VSS_HV_ADR0/1.
If there is an open failure in the analog multiplexing circuitry, the signal converted by
the ADC is not the analog input coming from the pad, but the presampling reference
voltage (VDD_HV_ADR0/1 or VSS_HV_ADR0/1).
This BIST must be run for each analog input used by the safety function.
Since the pads dedicated to analog inputs are of type INPUT, a missing enable from
the SIUL results in an open failure.
Note:
Rationale: To detect open failures of the channel multiplexing circuitry (See Figure 9)
Figure 9. Software BISTs to test the multiplexing circuitry (ADC_SWTEST_TEST1)
Open detection:
Presampling phase
ADC
Conversion phase
ADC
pins
Reference
value 1
Note:
ADC
ADC
pins
Reference
value 1
Implementation hint: Presampling can be enabled on a per channel basis through the
ADC_x_PSR0 register.
ADC_x_PSCR[PREVAL0] selects which reference voltage is used to precharge/discharge
the ADC internal capacitor.
ADC_x_PSCR[PRECONV] register shall be 0 (See “Analog-to-Digital Converter (ADC)”
chapter in the Device_Number Reference Manual for details on the presampling feature).
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Figure 10. Implementation of ADC_SW_TEST1 through the ADC presample feature
Vdd_HV_ADRx
or
Vss_HV_ADRx
Presample
Ch A
Sample
Ch A
Convert
Ch A
Presample
Ch B
Sample
Ch B
Convert
Ch B
t
Note: Either VDD_HV_ADR0/1 or VSS_HV_ADR0/1 can be used as presampling voltage.
●
ADC_SWTEST_TEST2
To detect short failures two different voltages are acquired by the ADC. If these values
are different from the expected ones, a short failure on the multiplexed circuitry has
been detected.
To implement this test a presampling feature of the ADC can be exploited. The
presampling must be configured in such a way that the sampling of the channel is
bypassed and the presampling reference supply voltages are converted.
During the first step the VDD_HV_ADR0/1 is converted and compared with the its
expected value, then the VSS_HV_ADR0/1 is converted and compared with its expected
value (See Figure 12).
Figure 12 includes the conversion of the 2 different presampling reference voltages
(VDD_HV_ADR0/1 and VSS_VH_ADR0/1).
Note:
Rationale: To detect short failures of the channel multiplexing circuitry (See Figure 11)
Figure 11. Software BISTs to test the multiplexing circuitry (ADC_SWTEST_TEST2)
Short detection:
First reference conversion
Second reference conversion
ADC
pins
ADC
ADC
pins
ADC
Reference
value 1
Note:
Reference
value 2
Implementation hint: The implementation hints of the ADC_SWTEST_TEST1 applies also
to the ADC_SWTEST_TEST2
To bypass the conversion of the input channel and convert the presampled values,
ADC_x_PSCR[PRECONV] register shall be set to 1.
Figure 12. Implementation of ADC_SW_TEST2 through the ADC presample feature
Vdd_HV_ADRx
Presample
Ch x
Convert
Ch x
Vss_HV_ADRx
Presample
Ch x
Convert
Ch x
t
Note: Either VDD_HV_ADR0/1 or VSS_HV_ADR0/1 can be used as presampling voltage.
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ADC_SWTEST_VALCHK The goal of this software test is to verify correct operation of
the control and queue logic of the ADC, and also the CTU, if used. This software
measures implementation is dependant on the ADC configuration (for example, CTU or
CPU mode):
When the ADC is used in CPU mode, the acquired value is read by the ADC_CDRn.
This register includes ADC_CDRn[VALID] and ADC_CDRn[RESULT] fields as well as
channel n converted data (ADC_CDRn[CDATA]). These fields provide status
information about the data acquisition. Application software shall read and verify these
fields after every acquisition.
When the ADC conversion is triggered by the CTU, the acquired digital sample data
are stored in a dual queue along with information about the channel that performed the
acquisition. Checking the channel information of the acquisition provides sufficient
coverage of the control logic and, in part, the queue logic.
Note:
Implementation hint: If ADC is configured to work in CTU mode, the conversion results are
stored in CTU FIFOs (See “Cross-Triggering Unit (CTU)” chapter in Device_Number
Reference Manual). Along with the converted data, the converted channel number and ADC
module are stored. CTU includes two sets of registers to read this information (FIFO Right
aligned data, CTU_FRx, and FIFO Left aligned data, CTU_FLx). User must read these
registers to verify if the sequence of the acquired channel is what is expected.
●
ADC_SWTEST_OVERSAMPLING
In case of Single Read Analog Inputs the
ADC_SWTEST_ADCOVERSAMPLING_CMP must be implemented as counter
measure against random fault.
ADC_SWTEST_OVERSAMPLING is an acquisition redundant in time.
It refers to sampling the signal at rate significantly higher than the Nyquist Frequency
related to the input signal. In case of fault the acquired values are not correlated with
themselves.
This SIF compares the acquired value to verify the correlation.
Against random fault, three consecutive analog values are converted for each
acquisition to implement the ADC_SWTEST_OVERSAMPLING The second
acquisition, A2, is faulty because the first converted value is quite different respect the
other two (See Figure 13).
Figure 13. Series of acquired analog values
Faulty Acquisition
t
A1
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●
ADC0_SWTEST_REGCRC
If ADC_0 is used, the ADC_0 configuration registers are read and CRC checksum is
computed. The checksum is compared to the expected value.
●
ADC1_SWTEST_REGCRC
If ADC_1 is used, the ADC_1 configuration registers are read and CRC checksum is
computed. The checksum is compared to the expected value.
●
SIUL_SWTEST_REGCRC
The SIUL configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
3.15.1.1.5
Implementation details
The following hardware elements shall be used for the safety function:
●
Analog input channels AN[0:8] of ADC_0
●
Analog input channels AN[11:14] of ADC_0 and ADC_1 (shared channels)
●
Analog input channels AN[0:8] of ADC_1
The user must select one channel from ADC_0 or from ADC_1. Shared channels can be
used.
Mandatory: The input pads are configured via the appropriate pad configuration registers
(PCRn) in the SIUL module.
Table 11. Software BIST and/or test
Software BIST and/or test
Frequency
SUPPLY SELF-TEST
Once in the FTTI
RESISTIVE-CAPACITIVE SELF-TEST
Once in the FTTI
CAPACITIVE SELF-TEST
Once in the FTTI
ADC_SWTEST_TEST1
Once in the FTTI
ADC_SWTEST_TEST2
Once in the FTTI
ADC_SWTEST_VALCHK
Once for every acquisition
ADC_SWTEST_OVERSAMPLING
Once for every acquisition
ADC0_SWTEST_REGCRC
Once in the FTTI
ADC1_SWTEST_REGCRC
Once in the FTTI
SIUL_SWTEST_REGCRC
Once in the FTTI
3.15.1.2
Double Read Analog Inputs
3.15.1.2.1
Hardware elements
The Double Read Analog Input uses two analog input channels to acquire a replicated
analog input signal. Both ADC units acquire and digitize the two copies of a redundant
analog signal connected to the inputs. In this configuration (if applied to all possible analog
inputs), only half of the analog inputs are available to the applications (AN[0:8] of ADC_0 for
signals, and AN[0:8] of ADC_1 for signal copies).
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Mandatory: The shared channels (AN[11:14]) suffer from CCF because they share pads
between each ADC module. Therefore, they are omitted (considered not safe) for double
reads. The comparison of the results is performed by application software (See Figure 14).
Note:
Rationale: ADC_0 and ADC_1 share a pad for the channels (AN[11:14]). Omitting them
from double read eliminates a possible source of CCF.
Mandatory: After boot but before executing the safety function the following tests shall be
executed to detect latent faults (See Section 3.15.1.1.3, Hardware BIST and
Section 3.15.1.1.3.1, Hardware BIST implementation):
Note:
●
SUPPLY SELF-TEST
●
RESISTIVE-CAPACITIVE SELF-TEST
●
CAPACITIVE SELF-TEST
Rationale: To check the integrity of the ADC modules
Mandatory: Before running the HW self-test, the customer must copy the threshold values
of the analog watchdogs from test sector into the watchdog registers (See “Self test analog
watchdog” section of the “Analog-to-Digital Converter (ADC)” chapter in Device_Number
Reference Manual).
Note:
Rationale: To set the correct threshold for the self-test
3.15.1.2.2
Safety Integrity Functions
Safety integrity is achieved by replicated acquisition with separate analog input channels
and software comparison by the processing function (See Figure 14).
Mandatory: The following software test must be implemented by the application software:
ADC0_SWTEST_REGCRC, ADC1_SWTEST_REGCRC, SIUL_SWTEST_REGCRC
Note:
Rationale: To verify that the configuration of the module used by this safety function
corresponds with what is expected
Note:
Rationale: To avoid CCF caused by improper configuration of the pads
Mandatory: In addition, the software test ADC_SWTEST_CMP must be implemented to
compare the channel reads.
Note:
Rationale: To verify that the two sets of read data compare
It is important to note that this safety integrity function might be applied in addition to Single
Analog Read Inputs, which increases diagnostic coverage.
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Figure 14. Double Read Analog Inputs configuration
Analog Double Read
Configuration
I
3.15.1.2.3
= Input Pad
ADC_0
ADC_1
I
I
AN[0:8]
AN[0:8]
Software test implementation
●
ADC0_SWTEST_REGCRC
The ADC_0 configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
ADC1_SWTEST_REGCRC
The ADC_1 configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
SIUL_SWTEST_REGCRC
The SIUL configuration registers are read and a CRC checksum is computed. The
checksum is compared to the expected value.
●
ADC_SWTEST_CMP
This software test is used to execute a comparison between the double acquisition
performed by one channel of ADC_0 and one channel of ADC_1. The comparison
must be approximated because of conversion differences.
3.15.1.2.4
Implementation details
The following hardware elements shall be used for the safety function:
●
Analog input channels AN[0:8] of ADC_0
●
Analog input channels AN[0:8] of ADC_1
The user must select one channel from ADC_0 and one from ADC_1.
The input pads are configured via the appropriate pad configuration registers, SIUL_PCRn.
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Table 12. Software BIST and/or test
3.15.2
Software BIST or test
Frequency
SUPPLY SELF-TEST
Once after boot
RESISTIVE-CAPACITIVE SELF-TEST
Once after boot
CAPACITIVE SELF-TEST
Once after boot
ADC0_SWTEST_REGCRC
Once after programming
ADC1_SWTEST_REGCRC
Once after progamming
SIUL_SWTEST_REGCRC
Once after progamming
ADC_SWTEST_CMP
Once for every acquisition
Other requirements
Other requirements related to the ADC modules are:
3.16
●
When an application needs to access the ADC result FIFO, a 32-bit read access shall
be performed to verify the channel number on which the conversion has been
executed.
●
If the ADC analog watchdog function is used for function-safety relevant signal, two
analog watchdog channels must monitor the same signal.
●
If the Sine Wave Generator (SWG) is used, the ADC (in conjunction with CTU) must be
used to check the output signal.
Temperature sensors
There are two temperature sensors: temperature sensor 0 (TSENS_0) mapped to ADC_0
and temperature sensor 1 (TSENS_1) mapped to ADC_1.
Mandatory: During power up, the two temperature sensors need to be read by software
(TSENS_0 from ADC_0 channel 15, TSENS_1 from ADC_1 channel 15), which must verify
that the read values are similar as a means of assessing the functionality of the sensors.
However, nothing prohibits reading the temperature sensors during run time if needed.
Note:
Rationale: A means of assessing functionality of the temperature sensors
Mandatory: In addition, the temperature must be acquired from at least one of the
temperature sensors by software every FTTI during run time. In case of a fault, software
must move the system to a safe state.
Note:
Rationale: To detect over-temperature faults
To set a proper threshold the customer must consider that the maximum operating junction
temperature is 150 °C (See the Device_Number data sheet) and the temperature sensor
accuracy is 10° C.
Note:
Implementation hint: See the Device_Number Reference Manual for details on TSENS_x
implementation in relation to the ADC.
It is important to note that the ADC is part of the temperature measuring safety integrity
function. Therefore, it is required that the BIST of the ADC be executed once after boot even
if the ADC is not used by the application.
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3.17
Functional safety requirements for application software
Software Watchdog Timer (SWT)
Mandatory: These requirements apply to the SWT for ASIL D applications:
●
Note:
Both of the following must be true:
–
The SWT is enabled
–
Configuration registers hard locked to avoid unwanted modification
●
The SWT time window settings must be set to a value less than the FTTI. Detection
latency shall be smaller than FTTI.
●
Before the safety function is executed, software must verify that the SWT is enabled by
reading the SWT control register (SWT_CR[WEN] = 1).
Rationale: To detect a defective program sequence
Mandatory: Control flow monitoring can be implemented by SWT. However, other control
flow monitoring approaches that do not used the SWT may also be used.
Device_Number provides the hardware support (SWT) to implement both control flow and
temporal monitoring methods. Refer to the Device_Number Reference Manual for the SWT
functional description.
Note:
Implementation hint: To enable the SWT, and to hard lock the configuration register,
SWT_CR[WEN] and SWT_CR[HLK] must be asserted (= 1).
The timeout register (SWT_TO) must contain a 32-bit value that represents a timeout less
than the FTTI.
If Windowed mode and Keyed Service mode (two pseudorandom key values used to
service the watchdog) are enabled, it is possible to reach a high effective temporal flow
monitoring.
3.18
Redundancy Control Checking Unit (RCCU)
The task of the RCCU unit is to perform a cycle-by-cycle comparison of the outputs of the
modules included in the SoR. The SoR is the logical part of the device that contains all the
modules that are replicated for functional safety reasons.
The RCCU is able to detect any mismatch between the outputs of two replicated modules.
The error information is forwarded to the MC_RGM and FCCU.
For ASIL D applications, use of the RCCU is indispensable. The use of RCCU’s is
automatically managed by the Device_Number device, users cannot disable the RCCU.
Note:
Rationale: To catch faults in the processing channel
The RCCUs are only enabled when the Device_Number is in LSM. Application software
must determine whether LSM mode is activate. Please refer to Section 3.2.2: Checking for
further details.
3.19
Cyclic Redundancy Checker Unit (CRC)
The CRC module computes CRC checksums, which offloads the CPU. The CRC has the
capability of processing two CRC calculations simultaneously.
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Recommended: The CRC module should be used to detect accidental alteration of data
during transmission or storage. The CRC takes as its input a data stream of any length and
produces a 32-bit output value.
Mandatory: The CRC calculation shall be executed to verify the content of the registers.
Note:
Rationale: The contents of the configuration registers of the safety-related modules must
be checked within the FTTI.
Note:
Theoretically, the CPU could be used instead of the CRC to verify that the value of the
configuration registers have not changed. However, using the CRC is more effective.
Note:
Implementation hint: The CRC of the configuration registers of the modules involved with
the safety function shall be calculated offline.
At run time, the same CRC value shall be calculated by the CRC module within the safety
process time. To avoid overloading the CPU, the eDMA module can be used to support the
data transfer from the registers under check to the CRC module.
The result of the runtime computation is then compared to the value of the offline CRC.
The application must include detection, or protection measures, against possible faults of
the CRC module only if the CRC module is used by any SEF.
3.20
Clock Monitor Unit (CMU)
The main task of the Clock Monitor Unit (CMU) is to supervise the integrity of various clock
sources.
Mandatory: The following supervisor functions shall be used:
Note:
●
Loss of external crystal oscillator clock
●
FMPLL frequency higher than a (programmable) value set as high reference
●
FMPLL frequency lower than a (programmable) value set as low reference
Rationale: To monitor the integrity of the clock signals
This error information is forwarded to the FCCU and to the MC_RGM.
Device_Number includes three CMUs:
●
CMU_0 monitors the clock signal of the SoR modules and the clock from the XOSC
(XOSC_CLK).
●
CMU_1 monitors the clock signal used by the motor control related peripherals (such
as eTimer, FlexPWM, CTU and ADC).
●
CMU_2 monitors the clock signal for the protocol engine of the FlexRay module.
Mandatory: For ASIL D applications, use of the CMU is mandatory. If the related modules
are used by the application safety function, the user shall verify that the CMUs are enabled
and their faults managed by the FCCU.
Note:
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Functional safety requirements for application software
Implementation hint: In general, the following two application-dependent configurations
must be executed before CMU monitoring will be enabled:
●
The first configuration is related to the XOSC_CLK monitor of CMU_0. The software
shall configure CMU_0_CSR[RCDIV] to select a divider for the IRCOSC. The divided
RCOSC frequency will be compared with the XOSC_CLK.
●
The second configuration relates to the other clock signals being monitored. The high
frequency reference (CMU_n_HFREFR_A[HFREF_A]) and low frequency reference
(CMU_n_LFREFR_A[LFREF_A]) shall be configured depending on the SoR (CMU_0),
motor control related peripherals (CMU_1) and FlexRay (CMU_2) clock frequencies.
Once the CMUs are configured, the clock monitoring must be enabled by asserting
CMU_n_CSR[CME_A] (= 1).
3.21
Frequency-Modulated Phase-Locked Loop (FMPLL)
Mandatory: Application software has the responsibility of checking that the system uses the
system FMPLL clock as system clock before running any safety element function
(PLL_SWCHECK).
Note:
Rationale: To decrease the risk of a glitch from the crystal or IRCOSC
Note:
Implementation hint: Application software can verify the current system clock by checking
MC_ME_GS[S_SYSCLK] status. MC_ME_GS[S_SYSCLK] = 0x4 indicates system FMPLL
clock is used as system clock.
Mandatory: Each FMPLL provides a loss of lock error indication which is routed to the
MC_RGM and FCCU. The application software must enable the respective fault and
configure the FCCU to manage the fault.
Note:
Rationale: To check the integrity of the FMPLL clock
Since the system can be driven by the IRCOSC, if there is a system clock fault, an FMPLL
fault is considered a Non-Critical Fault (NCF). If the FMPLL successfully relocks after a
clock fault it will typically stay relocked since the locking process includes built in hysteresis
between loosing and regaining the lock.
Note:
Implementation hint: Software must clear FMPLL_n_CR[PLL_FAIL_MASK] so the pll_fail
output is not masked.
To enable the RGM input related to FMPLL loss of clock, RGM_FERD[D_PLLn] and
RGM_FEAR[AR_PLLn] must be configured.
To enable FCCU fault paths, registers in the FCCU must be configured (NCF_CFG0,
NCFS_CFG0, NCF_TOE0, etc.). Loss of lock signals from FMPLL_0 and FMPLL_1 provide
the FCCU NCF[2] and NCF[3] inputs, respectively.
The MC_RGM and FCCU configuration includes the reaction in case of FMPLL loss of lock.
This reaction is application-dependent.
3.22
Internal RC Oscillator (IRCOSC)
The frequency meter of CMU_0 must be exploited to verify the availability and frequency of
the IRCOSC. This feature allows measuring the IRCOSC frequency using the external
oscillator as the clock source.
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Mandatory: Users must measure the IRCOSC frequency and compare it with what is
expected (16MHz(i)). This test must be performed at least once every FTTI
(IRC_SW_CHECK_SIF).
Note:
Rationale: To check the integrity of the IRCOSC
Note:
If the IRCOSC is not operating due to a fault, the measurement of the IRCOSC frequency
will never complete and the CMU_CSR[SFM] flag will remain set. The application shall
manage detecting this condition. For example, implementing a software watchdog which
monitors the CMU_CSR[SFM] flag status.
Safety analysis assumes that this measurement executes at least once every FTTI. Testing
frequency can be reduced to once after boot if the customer accepts that most safety
mechanisms will be non-functional for the remainder of the operation if the IRCOSC fails.
Safety related modules which work with the RC clock are: FCCU, CMU and SWT. These
modules stop working if the IRCOSC fails.
3.23
Power Management Unit (PMU)
The Power Management Units (PMU) manage the supply voltage of modules on the
Device_Number. The supplies monitored by the PMU and naming conventions are found in
Table 13.
Table 13. PMU monitored supplies
Detector Type
Detector Name
Voltage
Monitored
Alternate
Name
Comments
Flash memory LVD
LVD_MAIN_3
VDDFLASH
LVD_FLASH
A redundant LVD is embedded
I/O LVD
LVD_MAIN_1
VDDIO
LVD_GPIO
A redundant LVD is embedded
VREG LVD
LVD_MAIN_2
VDDREG
LVD_VREG
A redundant LVD is embedded
Core main LVD
LVD_DIG_MAIN
1.2 V digital
—
—
Core main HVD
HVD_DIG_MAIN
1.2 V digital
—
—
Core backup LVD
LVD_DIG_BKUP
1.2 V digital
—
Assists in the self-test of LVD_DIG_MAIN
Core backup HVD HVD_DIG_BKUP
1.2 V digital
—
Assists in the self-test of HVD_DIG_MAIN
If one of the monitored voltages falls below or rises above a fixed threshold, a destructive
reset is initiated. The Low Voltage Detection (LVD) and High Voltage Detection (HVD) fault
indications are forwarded to the MC_RGM.
Since power is critical to the operation of the Device_Number there is built-in redundancy to
the PMU core LVDs and HVDs. LVD_DIG_MAIN and HVD_DIG_MAIN monitor the digital
core voltage and have backups for additional safety protection (LVD_DIG_BKUP and
HVD_DIG_BKUP). Internal architecture allows for testing of the functionality of the main and
back up LVD_DIG and HVD_DIG, as well as trimming circuitries (See Figure 15). The
i.
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PMUCTRL module provides software initialized BISTs which test the digital core supply
HVD and LVD (both main and backup).
Figure 15. Logic scheme of the LVD_DIG and HVD_DIG
reference
voltage 2
HVD_DIG_MAIN/
LVD_DIG_MAIN
digital supply
(1.2V)
reference
voltage 1
to MC_RGM
(destructive reset)
self-test
circuitry
to FCCU
to MC_RGM
HVD_DIG_BKUP/
LVD_DIG_BKUP
Note: This scheme represents only the logical configuration and not the actual
silicon implementation structure.
If the self-test circuitry detects a fault in the main or backup detectors the reaction will be
one of the following (See “Built In Self-test (BIST)” subsection of the “Power Management
Unit (PMU)” section in the Device_Number Reference Manual):
●
●
Critical Fault (CF[21]) triggered and one or more of the following:
–
Main Low Voltage Detector Pending – PMUCTRL_IRQS[MLVDP] = 1
–
Backup Low Voltage Detector Pending – PMUCTRL_IRQS[BLVDP] = 1
–
Main High Voltage Detector Pending – PMUCTRL_IRQS[MHVDP] = 1
–
Backup High Voltage Detector Pending – PMUCTRL_IRQS[BHVDP] = 1
Destructive reset triggered
If the self-test circuitry detects a fault in the main or backup detectors the FCCU will read a
CF.
There are dedicated LVD’s in the flash memory, I/O and VREG providing additional
redundancy. This solution is different from the 1.2 V digital core supply monitoring, but still
provides the same level of safety coverage. The outputs of the first and the second LVD are
logically AND’d in such a way that a single LVD can trigger a fault, even if the other LVD is
not functioning properly (See Figure 16).
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Figure 16. Logic scheme of the LVD_FLASH, LVD_GPIO and LVD_VREG
reference
voltage 2
LVD
self-test
circuitry
3.3 V supply
redundant
LVD
to FCCU
to MC_RGM
(destructive reset)
Note: This scheme represents only the logical configuration and not the
actual silicon implementation structure.
Operation of the LVD_FLASH, LVD_GPIO and LVD_VREG is as follows (software
intervention is not needed):
●
A single LVD (PMU LVD or module LVF) can trigger a fault even if the other LVD is
faulty (this event signals the MC_RGM)
●
During each power on cycle self-test circuitry is able to detect failures on one of the two
LVD’s (this event signals the FCCU).
Mandatory: Core voltage LVD and HVD implement a hardware assisted self-test that needs
to be initiated by software once after the boot.
Note:
Rationale: To check the integrity of the LVD and HVD
Note:
Implementation hint: The hardware assisted self-tests are initiated by configuring
PMUCTRL_CTRL[SILHT[1:0]].
If the self-test passes, an NCF is triggered. If the self-test fails, a PMUCTRL_IRQS flag and
CF are asserted.
Apart from the self-test, the use of the power management unit for ASIL D applications is
transparent to the user, because the operation of the PMU is automatic. The
Device_Number embeds three LVDs which can detect a failure in the 3.3V power supply.
Considering the failure mode “Wrong Power Regulation”, a diagnostic coverage of 90% is
estimated against both a soft error and DC fault.
3.24
Memory Protection Unit (MPU)
The Memory Protection Unit (MPU) provides hardware access control for all memory
references generated in a device. Using pre-programmed region descriptors that define
memory spaces and their associated access rights, the MPU concurrently monitors all
system bus transactions (including those initiated by the eDMA or FlexRay controller) and
evaluates the appropriateness of each transfer.
Memory references that have sufficient access control rights are allowed to complete, while
references that are not mapped to any region descriptor or have insufficient rights are
terminated with a protection error response.
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Functional safety requirements for application software
The MPU implements a set of program-visible region descriptors that monitor all system bus
addresses. The result is a hardware structure with a two-dimensional connection matrix,
where the region descriptors represent one dimension and the individual system bus
addresses and attributes represent the second dimension.
Recommended: For ASIL D applications, the MPU should be used to ensure that only
authorized software routines can configure modules and all other bus masters (eDMA, core,
FlexRay) can access only their allocated resources according to their access rights. For the
non-replicated master FlexRay, a correct MPU setup is highly recommended.
3.25
Register Protection Module
The Register Protection module offers a mechanism to protect defined memory mapped
address locations in a module that has been write protected. The address locations that can
be protected are module specific.
The Register Protection module includes these distinctive features:
●
The Register Protection module restricts write accesses for the module under
protection to supervisor mode only. This access restriction is in addition to any access
restrictions imposed by the protected module.
●
A register cannot be written once Soft Lock Protection is set. Soft Lock Protection can
be cleared by software or system reset.
●
A register cannot be written once Hard Lock Protection is set. Hard Lock Protection can
only be cleared by system reset.
Mandatory: For ASIL D applications, all configuration registers that aren’t modified during
application execution, must be protected with a Hard Lock.
Note:
Rationale: Hard Lock is the last access protection against unwanted writes to some
predefined memory mapped address locations.
Mandatory: Access restrictions must be handled at MPU level.
Note:
Rationale: Access restriction at the MPU level is protection against unwanted read/write
accesses to some predefined memory mapped address locations.
Recommended: It is recommended that only hardware related software (OS, drivers) run in
supervisor mode.
Note:
Implementation hint: Most of the off-platform peripherals have their own Register
Protection module. Register Protection address space is inside the memory space reserved
for the peripherals (please, refer to the “Device_Number registers under protection” section
of the Device_Number Reference Manual).
Each peripheral register that can be protected through the Register Protection module has a
Set Soft Lock bit reserved in the Register Protection address space. This bit shall be
asserted to enable the protection of the related peripheral registers. Moreover, the Hard
Lock Bit (REG_PROT_GCR[HLB] = 1) should be set for best write protection.
3.26
Error Correction Status Module (ECSM)
There is no dedicated ECC module on the Device_Number. ECC functionality is located in,
or near, the different storage modules and may vary slightly depending on the needs (and
size) of the storage. The ECSM is used to detect failures of data stored in memory (SRAM
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only) and addressing failures (See “Error Correction Status Module (ECSM)” in the
Device_Number Reference Manual).
The ECSM can detect and correct single-bit errors, detect two bit faults and detect faults
affecting more than two bits. For SRAM, addressing information is included in the
calculation and evaluation of the ECC to also detect addressing failure of the SRAM arrays.
Single-bit addressing failures that are detected are not corrected. Instead, they are treated
as a detected multi-bit error.
ECC is automatically calculated on memory write accesses and is checked while read
accesses are executed on memory.
The ECSM corrects read data when a single-bit error is detected. Optionally, the user can
raise an interrupt or check the address of last corrected data.
In the case of a multi-bit fault, both the FCCU and MC_RGM modules take appropriate
actions:
●
Activate error out pins
●
Reset
●
NMI is triggered.
The reporting functionality of the ECSM is disabled by default.
Mandatory: Before the safety application starts executing, the error reporting shall be
enabled.
Note:
Implementation hint: Error reporting is enabled by configuring the ECC Configuration
Register (ECR) of the ECSM module (for example, ECSM_ECR[EPR1BR] = 1b, see section
“ECC Configuration Register (ECR)” in the Device_Number Reference Manual for details).
3.27
Fault Collection and Control Unit (FCCU)
The Fault Collection and Control Unit (FCCU) offers a hardware channel to collect faults and
to bring the device into a safe state when a failure has occurred.
Besides the possible initial configuration, no CPU intervention is necessary for collection
and control operation.
The FCCU offers a systematic approach to fault detection and control. The distinctive
features of the module are:
●
Collection of redundant hardware checker results (e.g., the RCCU. See Section 3.18:
Redundancy Control Checking Unit (RCCU))
●
Collection of error information from modules whose behavior is essential with respect
to the safety goal
●
Configurable and graded fault control:
–
–
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Internal reactions
–
No reset reaction
–
IRQ
–
Functional Reset
–
Device_Number safe mode entered
External reaction (failure is reported to the outside world via output pin)
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Functional safety requirements for application software
Mandatory: Only functional resets, or a switch to a Safe state, is appropriate as internal
reaction for ASIL D applications.
Note:
Rationale: Maintain the device in the Safe state in case of failure
The only exception to this rule is when the CMU monitors a FMPLL that is not used or is
used for non-safety critical modules only. In this case, error masking and limited internal
reaction can be tolerated.
External reaction of the FCCU is always enabled and can not be disabled.
Note:
Implementation hint: The application shall configure the FCCU to enable all reactions
related to faults of peripherals used by the application safety function.
Software shall be implemented to avoid cycling between a functional and a fault state. For
example, in case of periodic NCFs, the software could clean the respective status and
periodically move the device from fault state to normal state. This looping shall be avoided.
Mandatory: To prevent permanent cycling between a functional and a fault-state, software
needs to keep track of cleaned faults, stop cleaning and stay in safe mode instead in case of
inacceptable high frequency of necessary fault cleaning. The limit for the number and
frequency of clearances is application dependent.
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4
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Functions of external devices for ASIL D applications
This section describes the external components needed to use the Device_Number for
ASIL D applications.
Mandatory: At system level some countermeasures have to be placed in order to bring the
safety-critical outputs to their safe state (e.g., by pull-up or pull-down resistors) when an
output in high-impedance is not considered safe.
It should be noted that the failure rates of external services are not included in FMEDA of
the Device_Number and have to be included in the system FMEDA by the user himself.
4.1
External Watchdog Function (EXWD)
Mandatory: An external device, acting as the supervisor of operations, must provide a
watchdog to cover CCFs of the Device_Number for ASIL D applications. The watchdog
shall be triggered periodically by safety relevant software running on the Device_Number or
other means demonstrating that the Device_Number is still working.
Note:
Rationale: To detect critical CCF as a complete failure of the power supply
Some common causes of failure (e.g., failure on power supply) are detected because the
software no longer triggers the watchdog.
If a failure is detected, the EXWD moves, and maintains, the system (ECU level) to a Safe
state condition within the FTTI (such as the EXWD disconnects the Device_Number device
from the power supply).
The user can choose how to implement the watchdog communication between the
Device_Number and the external device (for example, communication via serial link, via
toggling pin, or via the FCCU error out signals).
Note:
There must be a signalling path from the safety software to the external system through
which the software can confirm correct initialization. This is not automatically guaranteed by
the FCCU_F[n] signals which communicate the status of the device independently from
software. On the other hand, a different communications interface (such as a serial link) can
be used to detect incorrect software initialization.
4.2
Power Supply and Monitor Function (PSM)
The Device_Number includes some internal monitors which continuously check the various
voltage supplies (See Section 3.23: Power Management Unit (PMU)).
Mandatory: To prevent over voltage conditions causing malfunctions or possibly permanent
damage to the Device_Number, an external device must provide over voltage monitoring for
the Device_Number external 3.3 V supplies (such as I/O and VREG).
Under voltage conditions on the 3.3V supply may be detected indirectly by measurements
from other functionality like the ADC self-test or ECC/ECD logic.
Recommended: To fully monitor all voltage supplies, it is also recommended that an
external device provides under voltage monitoring for the Device_Number external 3.3 V
supplies (such as I/O and VREG).
Note:
56/82
Rationale: To monitor the power supply voltage to ensure it is within the acceptable range
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Functions of external devices for ASIL D applications
If the power supply is out of range, the PSM moves and maintains the system (ECU level) to
a Safe state condition within the FTTI (for example, the PSM disconnects the
Device_Number device from the power supply).
Note:
Working outside the specified voltage range may cause permanent damage to the
Device_Number even if the MCU is held in reset (see Device_Number Data Sheet for
correct voltage operating ranges).
4.3
Error Out Monitor Function (ERRM)
The FCCU has two external pins: FCCU_F[0], FCCU_F[1].
An external device must be connected to the FCCU via FCCU_F[0] and optionally
FCCU_F[1] to continually monitor the error output pins of the FCCU.
If a failure is detected, the ERRM moves and maintains the system (ECU level) to a Safe
state condition within the FTTI (e.g., the ERRM disconnects the Device_Number device
from the power supply)
Mandatory: Depending on user selection, there are two different ways to interface to the
FCCU:
Note:
●
Both FCCU pins connected to the external device
●
Only a single FCCU pin connected to the external device
Rationale: To monitor the error out signals (FCCU_F[x]) for correct functionality
Mandatory: For ASIL D applications, the user can choose between these FCCU
configurations, depending on which best fits the hardware and software system.
Both FCCU configurations work properly with all the supported error out protocols. Refer to
the Device_Number Reference Manual for a list of supported protocols.
Note:
The system (for example, ECU) cannot rely on any pins, other than the Device_Number
error output pins (FCCU_F[n]), when those pins indicate an error.
4.3.1
Both FCCU pins connected to external device
In this case, both pins FCCU_F[0] and FCCU_F[1] are connected to the external device.
Mandatory: The external device must check both signals, taking into account that
FCCU_F[0] = FCCU_F[1].
Note:
Rationale: To check the integrity of the FCCU
In this configuration the external device continuously monitors the output of the FCCU. Thus
it can detect if the FCCU does not work properly.
The advantage of this configuration with respect to the other one is that it does not need any
dedicated software.
Note:
Implementation hint: Monitoring the error out pins through a combinatorial logic (e.g., XOR
port) can generate some glitches. Oversampling these pins reduces the possibility that the
glitches occur.
4.3.2
Single FCCU pin connected to external device
A single pin, FCCU_F[0] (or FCCU_F[1]), is connected to the external device.
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If a fault occurs, the FCCU communicates it to the external device through the FCCU_F[0]
(or FCCU_F[1]) pin.
The functionality of FCCU_F[0] (or FCCU_F[1]) can be verified in 3 ways:
●
FCCU_F[0] (or FCCU_F[1]) output read back (internal connection)
●
FCCU_F[0] (or FCCU_F[1]) output connected externally to a normal GPIO
●
FCCU_F[0] (or FCCU_F[1]) output checked by external device
The customer must choose which solution better fits their requirements.
Mandatory: After boot, but before executing the safety function, the functionality of
FCCU_F[0] (or FCCU_F[1]) pin shall be verified(j).
Note:
Rationale: To check the integrity of the FCCU error out signals
Note:
Implementation hint: To verify the functionality of FCCU_F[0] (or FCCU_F[1]) pin, a fault
may be injected and the behavior of the pin could be checked. Other methods for checking
the functionality of FCCU_F[0] (or FCCU_F[1]) may be implemented.
The advantage of a single FCCU_F[x] signal being used, when compared to using both
FCCU_F[x] signals as in the previous section, is that an external device does not need to be
used for comparing the FCCU_F[x] signals.
4.4
PWM Output monitored by external ASIC (PWMA)
The FlexPWM module integrated in the Device_Number can insert dead time in the
generated PWMs.
Mandatory: An ASIL D compliant application shall include an external device which checks
the PWM output signals.
Note:
Rationale: To check the accuracy of the PWM signals
The distinctive features that must be managed by the external device are:
●
Dead-time must be always positive and greater than the maximum value between TON
and TOFF of the inverter switches
●
Open pins and short to supply or ground shall be detected in case read back is not
performed via input capture functionality on the Device_Number
If a failure is detected, the PWMA moves and maintains the system (ECU level) to a Safe
state condition within the FTTI (e.g., the PWMA disconnects the Device_Number device
from the power supply).
In general, if the safety application uses I/Os to control actuator with short safety time
against wrong control (for example, a motor control application with dead-time requirements
to avoid short circuits destroying the motor), those requirements shall be supervised
externally if the error reaction delay within the Device_Number can exceed the safety time
of the actuators.
Note:
.Implementation hint: In case PWM signals drive the switches of a power stage, eTimer
can not be used to detect dead-time fault because its failure indication time is normally
greater than the time needed to have a physical permanent failure in the power stage.
j.
58/82
Since FCCU is a monitor, it is sufficient to verify the FCCU_F[0] (or FCCU_F[1]) signal only at startup in order
to avoid latent faults.
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5
Scenarios for automotive applications: Motor control
Scenarios for automotive applications: Motor control
This section shows some examples of safety-related inputs and outputs from some motor
control applications.
5.1
Application example 1
5.1.1
●
Application: 3-phase electric motor control
●
Motor control algorithm: Field Oriented Control (FOC)
●
Position sensor(s): Incremental encoder; 3 Hall sensors
●
Current sensor(s): 3 shunts on motor phases or on inverter legs
●
Current sensor(s) for diagnostic: 1 shunt on direct-current (DC) link
Functional safety related inputs
Table 14. Functional safety inputs for application example 1
Destination
Signal description
Input signal
(alias)
Source
(module on
Device_Number
)
Comments
FCCU input
FCCU_F[1]
(if used)
FCCU output pin
FCCU_F[0]
FCCU
FCCU output loop-back signal.
Phase current 1
AN[0]
ASIC or current
sensor
ADC_0
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
Phase current 2
AN[15]
ASIC or current
sensor
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
Phase current 3
AN[11]
ASIC or current
sensor
ADC_0
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
DC voltage for DC
ripple compensation
AN[1]
ASIC
ADC_0
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
DC-link current
AN[16]
ASIC or current
sensor
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
Non-maskable
interrupt
NMI(1)
External
component
(ASIC)
WKPU
Critical interrupt routine or
error/fault signal coming from
external device.
RESET B
External
component
(ASIC,
companion chip)
MC_RGM
Reset signal
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Table 14. Functional safety inputs for application example 1 (continued)
Destination
Input signal
Signal description
(alias)
Source
(module on
Device_Number
)
Comments
Incremental Encoder
management
ETC[0–1]
ETC[0–1]
Incremental
encoder
eTimer_0
eTimer_1
Precautions for usage are
presented in Section 3.13.3.1:
Double Read Encoder Inputs.
Hall sensors
management
ETC[2–4]
ETC[2–4]
Hall sensors
SIUL
Precautions for usage are
presented in Section 3.13.2.1:
Double Read PWM Inputs.
DSPI receive signal
SIN
External
component
(ASIC)
DSPI_0
If DSPI_0 is used, an appropriate
safety protocol must be utilized.
DSPI receive signal
SIN
External
component
(ASIC)
DSPI_1
If DSPI_1 is used, an appropriate
safety protocol must be utilized.
FlexCAN receive
signal
CAN_RX
External
component
(ASIC)
FlexCAN_0
If FlexCAN_0 is used, an
appropriate safety protocol must
be utilized.
FlexCAN receive
signal
CAN_RX
External
component
(ASIC)
FlexCAN_1
If FlexCAN_1 is used, an
appropriate safety protocol must
be utilized.
FlexRay receive
signals
FR_CA_RX
FR_CB_RX
External
component
(ASIC)
FlexRay
If FlexRay is used, an appropriate
safety protocol must be utilized.
1. The NMI input is not intended or certified for use as the sole mechanism to react to the failure of a system component
external to the Device_Number. For ASIL D certification, additional measures at the system level are necessary to handle
failures of non-Device_Number components beyond notification of the Device_Number device via NMI.
5.1.2
Functional safety related outputs
Table 15. Functional safety outputs for application example 1
Source
Signal
description
Output sIgnal
(alias)
(module on
Device_Numbe
r)
FCCU output
FCCU_F[0]
FCCU
FCCU_F[0]
FCCU
FCCU_F[1] =
FCCU_F[0]
FCCU
FCCU output
60/82
Destination
Comments
External
Error out signal that indicates the
component (ASIC) presence of a failure in the device.
Alternative 1:
FCCU_F[1]
FCCU output loop-back signal.
Alternative 2:
Inverted Error out signal that
indicates the presence of a failure
External
component (ASIC) in the device.
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Table 15. Functional safety outputs for application example 1 (continued)
Source
Output sIgnal
Signal
description
(alias)
PWM output signal
Clockout
A[0–2], B[0–2]
CLK_OUT
Clockout inverted
signal
CLK_OUT
Transceiver enable
(for communication
peripherals)
GPO[–]
(module on
Device_Numbe
r)
Destination
Comments
FlexPWM
Precautions for usage are
External
presented in Section 3.13.5.2:
component (ASIC) Single Write PWM Outputs With
Read Back.
MC_CGM
Clockout signal to be used if the
External
external components needs the
component (ASIC) Device_Number clock for internal
usage or for monitoring.
MC_CGM
Inverted clockout signal to be used
External
if the external components needs
component (ASIC) the Device_Number clock for
internal usage or for monitoring.
SIUL
Precautions for usage are
External
presented in Section 3.13.4.1:
component (ASIC,
Single Write Digital Outputs With
transceiver)
Read Back.
Reset signal
GPO[0]
SIUL
Reset signal for the external
component(s)
External
component (ASIC, Precautions for usage are
companion chip) presented in Section 3.13.4.1:
Single Write Digital Outputs With
Read Back.
DSPI transmit
signal
SOUT
DSPI_0
External
If DSPI_0 is used, an appropriate
component (ASIC) safety protocol must be utilized.
DSPI transmit
signal
SOUT
DSPI_1
External
If DSPI_1 is used, an appropriate
component (ASIC) safety protocol must be utilized.
FlexCAN transmit
signal
CAN_TX
FlexCAN_0
If FlexCAN_0 is used, an
External
appropriate safety protocol must
component (ASIC)
be utilized.
FlexCAN transmit
signal
CAN_TX
FlexCAN_1
If FlexCAN_1 is used, an
External
appropriate safety protocol must
component (ASIC)
be utilized.
FlexRay transmit
signals
FR_CA_TX
FR_CB_TX
FlexRay
5.2
External
If FlexRay is used, an appropriate
component (ASIC) safety protocol must be utilized.
Application example 2
●
Application: 3-phase electric motor control
●
Motor control algorithm: Field Oriented Control (FOC)
●
Position sensor(s): Resolver; 3 Hall sensors
●
Current sensor(s): 3 shunts on motor phases or on inverter legs
●
Current sensor(s) for diagnostic: 1 shunt on DC link
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5.2.1
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Functional safety related inputs
Table 16. Functional safety inputs for application example 2
Destination
Signal description
Input Signal
(alias)
Source
(module on
Device_Number
)
Comments
FCCU input
FCCU_F[1]
(if used)
FCCU output pin
FCCU_F[0]
FCCU
FCCU output loop-back signal.
Phase current 1
AN[0]
ASIC or current
sensor
ADC_0
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
Phase current 2
AN[15]
ASIC or current
sensor
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
Phase current 3
AN[11]
ASIC or current
sensor
ADC_0
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
DC voltage for DC
ripple compensation
AN[1]
ASIC
ADC_0
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
DC-link current
AN[16]
ASIC or current
sensor
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
Non-maskable
interrupt
NMI(1)
External
component
(ASIC)
Wake-up Unit
Critical interrupt routine or
error/fault signal coming from
external device.
Reset signal
RESET B
External
component
(ASIC,
companion chip)
MC_RGM
Resolver
management
(sine/cosine)
AN[2–3]
AN[17–18]
Resolver
ADC_0
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
Hall sensors
management
ETC[0–2]
ETC[0–2]
Hall sensors
eTimer_0
eTimer_1
Precautions for usage are
presented in Section 3.13.2.1:
Double Read PWM Inputs.
DSPI receive signal
SIN
External
component
(ASIC)
DSPI_0
If DSPI_0 is used, an appropriate
safety protocol must be utilized.
DSPI receive signal
SIN
External
component
(ASIC)
DSPI_1
If DSPI_1 is used, an appropriate
safety protocol must be utilized.
FlexCAN receive
signal
CAN_RX
External
component
(ASIC)
FlexCAN_0
If FlexCAN_0 is used, an
appropriate safety protocol must
be utilized.
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Scenarios for automotive applications: Motor control
Table 16. Functional safety inputs for application example 2 (continued)
Destination
Signal description
Input Signal
(alias)
Source
(module on
Device_Number
)
FlexCAN receive
signal
CAN_RX
External
component
(ASIC)
FlexCAN_1
FlexRay receive
signals
FR_CA_RX
FR_CB_RX
External
component
(ASIC)
FlexRay
Comments
If FlexCAN_1 is used, an
appropriate safety protocol must
be utilized.
If FlexRay is used, an appropriate
safety protocol must be utilized.
1. The NMI input is not intended or certified for use as the sole mechanism to react to the failure of a system component
external to the Device_Number device. For ASIL D certification, additional measures at the system level are necessary to
handle failures of non-Device_Number components beyond notification of the Device_Number device via NMI.
5.2.2
Functional safety related outputs
Table 17. Functional safety outputs for application example 2
Source
Signal
description
Output signal
(alias)
(module on
Device_Numbe
r)
FCCU output
FCCU_F[0]
FCCU
FCCU_F[0]
FCCU
FCCU_F[1] =
FCCU_F[0]
FCCU
FCCU output
PWM output signal
A[0–2], B[0–2]
FlexPWM
Resolver excitation
DA [0]
SWG
Clockout
Clockout inverted
signal
Transceiver enable
(for communication
peripherals)
CLK_OUT
CLK_OUT
GPO[-]
Destination
Comments
External
Error out signal, that indicates the
component (ASIC) presence of a failure in the device.
Alternative 1:
FCCU_F[1]
FCCU output loop-back signal.
Alternative 2:
Inverted Error out signal that
indicates the presence of a failure
External
component (ASIC) in the device.
Precautions for usage are
External
presented in Section 3.13.5.2:
component (ASIC) Single Write PWM Outputs With
Read Back.
Resolver
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
MC_CGM
Clockout signal to be used if the
External
external components need the
component (ASIC) Device_Number clock for internal
usage or for monitoring.
MC_CGM
Inverted clockout signal to be used
External
if the external components need
component (ASIC) the Device_Number clock for
internal usage or for monitoring.
SIUL
Precautions for usage are
External
presented in Section 3.13.4.1:
component (ASIC,
Single Write Digital Outputs With
transceiver)
Read Back.
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Table 17. Functional safety outputs for application example 2 (continued)
Source
Output signal
Signal
description
(alias)
(module on
Device_Numbe
r)
Destination
Comments
Reset signal
GPO[0]
SIUL
Reset signal for the external
component(s).
External
component (ASIC, Precautions for usage are
companion chip) presented in Section 3.13.4.1:
Single Write Digital Outputs With
Read Back.
DSPI transmit
signal
SOUT
DSPI_0
External
If DSPI_0 is used, an appropriate
component (ASIC) safety protocol must be utilized.
DSPI transmit
signal
SOUT
DSPI_1
External
If DSPI_1 is used, an appropriate
component (ASIC) safety protocol must be utilized.
FlexCAN transmit
signal
CAN_TX
FlexCAN_0
If FlexCAN_0 is used, an
External
appropriate safety protocol must
component (ASIC)
be utilized.
FlexCAN transmit
signal
CAN_TX
FlexCAN_1
If FlexCAN_1 is used, an
External
appropriate safety protocol must
component (ASIC)
be utilized.
FlexRay transmit
signals
FR_CA_TX
FR_CB_TX
FlexRay
5.3
External
If FlexRay is used, an appropriate
component (ASIC) safety protocol must be utilized.
Application example 3
5.3.1
●
Application: 3-phase electric motor control
●
Motor control algorithm: Sinusoidal Control (SC) or 6-step mode
●
Position sensor(s): Incremental encoder; 3 Hall sensors
●
Current sensor(s) for diagnostic: 1 shunt on DC link
Functional safety related inputs
Table 18. Functional safety inputs for application example 3
Destination
Signal description
Input signal
(alias)
Source
(module on
Device_Number
)
Comments
FCCU input
FCCU_F[1]
(if used)
FCCU output pin
FCCU_F[0]
FCCU
FCCU output loop-back signal.
DC voltage for DC
ripple compensation
AN[0]
ASIC
ADC_0
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
DC-link current
AN[15]
ASIC or current
sensor
ADC_1
Precautions for usage are
presented in Section 3.15.1.1:
Single Read Analog Inputs.
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Scenarios for automotive applications: Motor control
Table 18. Functional safety inputs for application example 3 (continued)
Destination
Signal description
Input signal
(alias)
Source
(module on
Device_Number
)
Comments
NMI(1)
External
component
(ASIC)
Wake-up Unit
Reset signal
RESET B
External
component
(ASIC,
companion chip)
MC_RGM
Reset signal coming from external
device.
Incremental Encoder
management
ETC[0–1]
ETC[0–1]
Incremental
encoder
eTimer_0
eTimer_1
Precautions for usage are
presented in Section 3.13.3.1:
Double Read Encoder Inputs.
Hall sensors
management
ETC[2–4]
ETC[2–4]
Hall sensors
eTimer_0
eTimer_1
Precautions for usage are
presented in Section 3.13.2.1:
Double Read PWM Inputs.
DSPI receive signal
SIN
External
component
(ASIC)
DSPI_0
If DSPI_0 is used, an appropriate
safety protocol must be utilized.
DSPI receive signal
SIN
External
component
(ASIC)
DSPI_1
If DSPI_1 is used, an appropriate
safety protocol must be utilized.
FlexCAN receive
signal
CAN_RX
External
component
(ASIC)
FlexCAN_0
If FlexCAN_0 is used, an
appropriate safety protocol must
be utilized.
FlexCAN receive
signal
CAN_RX
External
component
(ASIC)
FlexCAN_1
If FlexCAN_1 is used, an
appropriate safety protocol must
be utilized.
FlexRay receive
signals
FR_CA_RX
FR_CB_RX
External
component
(ASIC)
FlexRay
Non-maskable
interrupt
Critical interrupt routine or
error/fault signal coming from
external device.
If FlexRay is used, an appropriate
safety protocol must be utilized.
1. The NMI input is not intended or certified for use as the sole mechanism to react to the failure of a system component
external to the Device_Number device. For ASIL D certification, additional measures at the system level are necessary to
handle failures of non-Device_Number components beyond notification of the Device_Number device via NMI.
5.3.2
Functional safety related outputs
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Table 19. Functional safety outputs for application example 3
Source
Signal
description
Output signal
(alias)
(module on
Device_Numbe
r)
FCCU output
FCCU_F[0]
FCCU
FCCU_F[0]
FCCU
FCCU_F[1] =
FCCU_F[0]
FCCU
FCCU output
PWM output signal
Clockout
Clockout inverted
signal
Transceiver enable
(for communication
peripherals)
A[0–2], B[0–2]
CLK_OUT
CLK_OUT
GPO[–]
Destination
Comments
External
Error out signal, that indicates the
component (ASIC) presence of a failure in the device.
Alternative 1:
FCCU_F[1]
FCCU output loop-back signal.
Alternative 2:
Inverted Error out signal, that
indicates the presence of a failure
External
component (ASIC) in the device.
FlexPWM
Precautions for usage are
External
presented in Section 3.13.5.2:
component (ASIC) Single Write PWM Outputs With
Read Back.
MC_CGM
Clockout signal to be used if the
External
external components need the
component (ASIC) Device_Number clock for internal
usage or for monitoring.
MC_CGM
Inverted clockout signal to be used
External
if the external components need
component (ASIC) the Device_Number clock for
internal usage or for monitoring
SIUL
Precautions for usage are
External
presented in Section 3.13.4.1:
component (ASIC,
Single Write Digital Outputs With
transceiver)
Read Back.
Reset signal
GPO[0]
SIUL
Reset signal for the external
component(s).
External
component (ASIC, Precautions for usage are
companion chip) presented in Section 3.13.4.1:
Single Write Digital Outputs With
Read Back.
DSPI transmit
signal
SOUT
DSPI_0
External
If DSPI_0 is used, an appropriate
component (ASIC) safety protocol must be utilized.
DSPI transmit
signal
SOUT
DSPI_1
External
If DSPI_1 is used, an appropriate
component (ASIC) safety protocol must be utilized.
FlexCAN transmit
signal
CAN_TX
FlexCAN_0
If FlexCAN_0 is used, an
External
appropriate safety protocol must
component (ASIC)
be utilized.
FlexCAN transmit
signal
CAN_TX
FlexCAN_1
If FlexCAN_1 is used, an
External
appropriate safety protocol must
component (ASIC)
be utilized.
FlexRay transmit
signals
FR_CA_TX
FR_CB_TX
FlexRay
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External
If FlexRay is used, an appropriate
component (ASIC) safety protocol must be utilized.
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ECC logic test
6
ECC logic test
6.1
Overview
This appendix describes the required information on how to develop the software for such
ECC logic test.
A flash memory ECC logic test is needed to perform a test to check flash memory ECC logic
every FTTI (10 ms).
The goal is to ensure high coverage of the faults in ECC logic with minimum performance
penalty to customer’s application. Thus, the performance penalty must be less than 2%
which means that the test lasts less than 200 µs considering a FTTI of 10 ms.
The Device_Number flash memory has a UTEST (user-test) mode ECC logic check feature
which can be utilized for this ECC logic test. A data pattern with walking 0 through data and
ECC parity bits can be applied during the ECC logic check procedure to achieve high fault
coverage of the ECC logic and fast execution.
6.2
Data pattern - Walking 0
To reach the needed performances the use of the data pattern with walking 0 through data
and ECC parity bits must be used. Table 20 shows the data vectors.
Table 20. Data pattern used by the ECC logic test(1)
Data vector number
8-bit ECC parity bits
64-bit data bits
0
0xFF
0xFFFF_FFFF_FFFF_FFFE
1
0xFF
0xFFFF_FFFF_FFFF_FFFD
2
0xFF
0xFFFF_FFFF_FFFF_FFFB
3
0xFF
0xFFFF_FFFF_FFFF_FFF7
4
0xFF
0xFFFF_FFFF_FFFF_FFEF
5
0xFF
0xFFFF_FFFF_FFFF_FFDF
6
0xFF
0xFFFF_FFFF_FFFF_FFBF
7
0xFF
0xFFFF_FFFF_FFFF_FF7F
...
...
...
62
0xFF
0xBFFF_FFFF_FFFF_FFFF
63
0xFF
0x7FFF_FFFF_FFFF_FFFF
64
0xFE
0xFFFF_FFFF_FFFF_FFFF
65
0xFD
0xFFFF_FFFF_FFFF_FFFF
...
...
...
71
0x7F
0xFFFF_FFFF_FFFF_FFFF
72
0xFF
0xFFFF_FFFF_FFFF_FFFF
1. Each vector is a 72-bit ECC code-word.
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It is important to note that for double word data = 0xFFFF_FFFF_FFFF_FFFF, the correct
ECC check bits should be 0xFF. Therefore, every data vector in the data pattern in Table 20,
except the last one, contains a single-bit ECC error and will result in a single-bit correction.
6.3
UTEST mode ECC logic check
The procedure to use the UTEST mode ECC logic check is listed as below:
6.4
1.
Write 0xF9F9_9999 to UT0 to enable UTEST mode (UT0[UTE] will be set).
2.
Write UT0[SBCE] to 1 to enable single-bit error correction visibility.
3.
Write UT0[EIE] to 1.
4.
Write UT0[DSI], UT1[DAI] and/or UT2[DAI] bits to provide the current data vector
including the double-word data and check bit values to be read. The data and check bit
values are from the chosen ECC test data pattern, i.e., walking 0 pattern shown above.
5.
Write double-word address to receive the data input in step 4 into the ADR register.
6.
Reads the address stored in ADR register via BIU using a CPU instruction. The
expected data, and corrections or detections should be observed based on data written
into the UT0[DSI], UT1[DAI] and/or UT2[DAI] registers. MCR[EER] and MCR[SBC] will
be checked to evaluate the status of reads done.
7.
Repeat steps 4 to 6 for all the data vectors in the proposed test data pattern.
8.
Once completed, clear the UT0[EIE] bit to 0.
Fault coverage and execution time
The described ECC logic test reaches a 92.7% fault coverage of ECC decode logic.
The execution of the test code takes 176 µs at 80 MHz.
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7
I/O pin/ball configuration
I/O pin/ball configuration
Mandatory: The user must avoid configurations that place redundant signals on
neighboring pads or pins.
Whether two functions on two package pins/balls are adjacent to each other can easily be
determined by looking at the mechanical drawings of the packages (see the
Device_Number Data Sheet) together with the pin/spheres (balls) number information of the
packages as seen in the Device_Number Reference Manuals “System Integration Unit Lite
(SIUL)” section and the “Pin muxing” table.
The internal die pad sequence can be derived from the package pin sequence of the
QFP144 pin package shown in the Device_Number Data Sheet.
Figure 17. Example of QFP144 pin/pad adjacency
For example, the internal die pads supporting the functionality described in Figure 17 are
referred to by “Port Pin” in the first column. From this figure you can see that the port pins
are B[9] and B[10]. Since these two port pins are in sequential order on the same port (Port
B) the die pads are adjacent to each other. The corresponding two QFP144 package pin
numbers are directly adjacent to each other, QFP144 pins 52 and 53. In general, the internal
die pads follow the same sequence as the corresponding package pins for QFP144
packages. If pins on the QFP144 pins are adjacent to each other, the corresponding internal
die pads are also adjacent. Likewise, if package pins are not adjacent to each other the
corresponding die pads are also not adjacent.
An example on the BGA package as shown in Figure 18 has two balls belonging to port pins
B[9] and B[10], which are balls U7 and R8, respectively. They are not directly adjacent to
each other on the BGA package. However, their corresponding die pads are adjacent to
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each other as described above since the same die is used in the QFP144 and BGA
packages.
Figure 18. BGA balls non-adjacent, die pads adjacent
Figure 19. BGA balls adjacent, die pads non-adjacent
In another example looking at balls U4 and U5 in Figure 18. Their functionality is
implemented by Port Pins E[4] and C[2] (QFP144 pins 42 and 45, respectively, shown in
Figure 19). These two spheres are adjacent to each other on the BGA, but not on the
QFP144. Therefore, the two corresponding die pads are not adjacent to each other.
The above examples are valid for corresponding pins on BGA (257 balls) and QFP144
packages only. For a thorough analysis of pin adjacency related to all signals see Table 21.
This table can be used to determine whether two pins are adjacent in the internal die for all
signals and packages. Two pins, identified by the columns ‘Port Name’, are adjacent on the
internal die if the numbers in the ‘Physical Pad Sequence’ column are consecutive (for
example, pad number n and pad number n + 1 are adjacent).
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I/O pin/ball configuration
Table 21. Physical pin displacement on internal die
Port Name
Pin Number QFP144 Pin Number QFP100
Physical Pad Sequence(1)
A[0]
73
51
94
A[1]
74
52
96
A[10]
118
81
155
A[11]
120
82
159
A[12]
122
83
163
A[13]
136
95
189
A[14]
143
99
197
A[15]
144
100
198
A[2]
84
57
106
A[3]
92
64
118
A[4]
108
75
145
A[5]
14
8
18
A[6]
2
2
2
A[7]
10
4
10
A[8]
12
6
12
A[9]
134
94
186
B[0]
109
76
146
B[1]
110
77
147
B[10]
53
36
70
B[11]
54
37
71
B[12]
55
38
72
B[13]
60
43
81
B[14]
64
44
85
B[15]
62
—
83
B[2]
114
79
151
B[3]
116
80
153
B[4]
89
61
113
B[5]
86
58
108
B[6]
138
96
192
B[7]
43
30
58
B[8]
47
31
62
B[9]
52
35
69
C[0]
66
45
87
C[1]
41
—
56
C[10]
111
78
148
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Table 21. Physical pin displacement on internal die (continued)
Port Name
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Pin Number QFP144 Pin Number QFP100
Physical Pad Sequence(1)
C[11]
80
55
102
C[12]
82
56
104
C[13]
101
71
137
C[14]
103
72
140
C[15]
124
85
167
C[2]
45
—
60
C[4]
11
5
11
C[5]
13
7
14
C[6]
142
98
196
C[7]
15
9
20
D[0]
125
86
168
D[1]
3
3
3
D[10]
76
53
98
D[11]
78
54
100
D[12]
99
70
133
D[14]
105
73
142
D[2]
140
—
194
D[3]
128
89
172
D[4]
129
90
173
D[5]
33
22
44
D[6]
34
23
45
D[7]
37
26
50
D[8]
32
21
43
D[9]
26
15
37
E[0]
68
46
89
E[10]
63
—
84
E[11]
65
—
86
E[12]
67
—
88
E[13]
117
—
154
E[14]
119
—
157
E[15]
121
—
161
E[2]
49
32
64
E[4]
42
—
57
E[5]
44
—
59
E[6]
46
—
61
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I/O pin/ball configuration
Table 21. Physical pin displacement on internal die (continued)
Port Name
Pin Number QFP144 Pin Number QFP100
Physical Pad Sequence(1)
E[7]
48
—
63
E[9]
61
—
82
F[0]
133
—
180
F[10]
24
—
35
F[11]
25
—
36
F[12]
106
—
143
F[13]
112
—
149
F[14]
115
—
152
F[15]
113
—
150
F[3]
139
—
193
F[4]
4
—
4
F[5]
5
—
5
F[6]
8
—
8
F[7]
19
—
29
F[8]
20
—
30
F[9]
23
—
34
FCCU_F[0]
38
27
51
FCCU_F[1]
141
97
195
G[10]
77
—
99
G[11]
75
—
97
G[2]
102
—
139
G[3]
104
—
141
G[4]
100
—
135
G[5]
85
—
107
G[6]
98
—
131
G[7]
83
—
105
G[8]
81
—
103
G[9]
79
—
101
NMI
1
1
1
1. Die pads not relevant for analysis, and non-functional pins (for example, power, JTAG pins) are not shown.
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8
Further information
8.1
Conventions and terminology
Table 22 shows the list of conventions for this document.
Table 22. List of conventions and terminology
Convention
Description
error
Discrepancy between a computed, observed, or measured value or condition and the true, specified
or theoretically correct value or condition.
fault
Abnormal condition that may cause a reduction in, or loss of, the capability of a functional unit to
perform a required function.
failure
8.2
The termination of the ability of a functional unit to perform a required function.
Acronyms and abbreviations
A short list of acronyms and abbreviations used in this document is reported below for
completeness.
Table 23. Acronyms and abbreviations
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Terms
Meanings
ADC
Analog to Digital Converter
BAM
Boot Assist Module
CCF
Common Cause Failure
CF
Critical Fault
CMU
Clock Monitor Unit
CRC
Cyclic Redundancy Check
CTU
Cross-Triggering Unit
DC
Diagnostic Coverage
DED
Dual Error Detection
ECC
Error Correcting Code
ECSM
Error Correction Status Module
eDMA
Enhanced Direct Memory Access
ERRM
Error Out Monitor function
EXWD
External Watchdog function
FCCU
Fault Collection and Control Unit
FMEDA
Failure Modes, Effects and Diagnostic Analysis
FMPLL
Frequency-Modulated Phase-Locked Loop
GPIO
General Purpose Input/Output
LBIST
Logic Built-In Self-Test
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Further information
Table 23. Acronyms and abbreviations (continued)
8.3
Terms
Meanings
LSM
Lock Step Mode
MBIST
Memory Built-In Self-Test
MC_CGM
Clock Generation Module
MC_ME
Mode Entry
MCU
(Microcontroller Unit)
MPU
Memory Protection Unit
NCF
Non-Critical Fault
NMI
Non-Maskable Interrupt
NVM
Non-Volatile Memory
PMU
Power Management Unit
PSM
Power Supply and Monitor function
PWM
Pulse Width Modulation
RCCU
Redundancy Control Checking Unit
MC_RGM
Reset Generation Module
SAG
Safety Application Guide
SEC
Single Error Correction
SEF
Safety Element Function
SFF
Safe Failure Fraction
SIF
Safety Integrity Function
SIL
Safety Integrity Level
SoR
Sphere of Replication
SWG
Sine Wave Generator
SWT
Software Watchdog Timer
Document references
●
Safety application guide for SPC56EL54xx/SPC56EL60xx family reference manual
addendum (TN0973, Doc ID 024163)
●
SPC56EL60 32-bit MCU family built on the embedded Power Architecture® (RM0032,
Doc ID 15265)
●
32-bit Power Architecture® microcontroller for automotive SIL3/ASILD chassis and
safety applications (SPC56EL60x, SPC56EL54x, SPC564L60x, SPC564L54x, Doc ID
15457)
●
SPC56EL60x device errata JTAG_ID = 0x2AEA_3041(SPC56EL60L5, SPC56EL60L3
Errata sheet, Doc ID 023190)
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Revision history
9
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Revision history
Table 24. Document revision history
Date
Revision
16-Nov-2007
1
Initial release
2
First public release
—Editorial updates
— Added annotation to specify “Mandatory” and “Recommended”
software requirements.
3
Updated all document
– Editorial updates
– Technical updates
– Updated “Flash memory” section
4
Updated “Preface” section; transferred tables “List of conventions and
terminology” and “Acronyms and abbreviations” to “Further
information” appendix
Updated “Mission profile” section
Updated “Implementation details” section
Updated “SRAM” section
Updated “Enhanced Direct Memory Access requests (eDMA requests)”
section
Added “Periodic Interrupt Timer (PIT)” section
“READ ANALOG INPUTS” section
– Changed “Single read analog input configuration” figure
– “Software BISTs to test the multiplexing circuitry” figure transferred
from “Software tests” section to “Hardware BIST implementation”
section
– Updated “Hardware BIST implementation” section
– Updated “Software tests” section
– Updated “Software BIST and/or test” table
Updated “Cyclic Redundancy Checker Unit (CRC)” section
Added “Internal RC Oscillator (IRCOSC)” section
Updated “Power Management Unit (PMU)” section
Updated “Power Supply and Monitor Function (PSM)” section
Updated “Both FCCU pins connected to the external device” section
Added “ECC logic test” appendix
Added “Further information” appendix
5-Oct-2009
24-Feb-2010
05-Aug-2010
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Changes
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Revision history
Table 24. Document revision history (continued)
Date
09-Nov-2011
Revision
Changes
5
– Added the paragraph, “Error handling should distinguish the boot
time failure handling from the error handling during run-time. The
latter must be carried out in a time shorter than the process safety
time, while the former must be solved before exiting the boot phase.”
to the end the “Failure indication time” section.
– Added the following to the end of the “Functional safety requirements
for application software” section:
- Mandatory: To cover the ISO-05-7.5.4 and ISO-05-7.4.5.2, the
device shall be handled according to JEDEC standards J-STD-020
and J-STD-033.
- Mandatory: To cover the ISO-07-6.5.4 and ISO-07-6.4.2.1,
customers shall report all field failures of the devices to silicon
supplier.
– Added the paragraph, “The Integrity SW should confirm that all
MBIST and LBIST finished successfully and no further error is
flagged. This software confirmation prevents a fault within the STCU
itself from incorrectly indicating that the self-test passed.” after the
Mandatory paragraph in the “Checking” subsection of the “Self-Test
Control Unit (STCU)” section.
– Added note at the end of the “Preface” section: “This document is
only valid if the environmental conditions given in the data sheet are
maintained.”
– Added the text, “The Device_Number embeds three LVDs which can
detect a failure in the 3.3V power supply. Considering the failure
mode “Wrong Power Regulation”, a diagnostic coverage of 90% is
estimated against both a soft error and DC fault.” to the end of the
last paragraph in the “Power Management Unit” section.
– Added the sentence, “This hint is a special case of deviating from
mandatory requirements as described in the Preface.” to the end of
the NOTE in the “Read Digital Inputs” section.
– Added the following, “Implementation hint: eTimer capture register
implements a two entry FIFO, but in CTU triggered mode up to 8 time
values need to be stored. To avoid FIFO overflow condition, eTimer
can be configured to trigger a eDMA transfer to move the captured
value to specific RAM location.” to the “Software test implementation”
subsection in the “Synchronize Sequential Read Input” section.
– Added the following, “eTIMER_2 input/outputs are not connected to
pins on LQFP144 package. Use eTIMER_2 channels for
implementing this safety function to keep the channels from
eTIMER_0 or eTIMER_1 units for functions using port pins.” after the
first sentence in the “Software test implementation” subsection in the
“Synchronize Sequential Read Input” section.
– Added Implementation hint in the “Checking” subsection of the “SelfTest Control Unit (STCU)” section “Implementation hint: Please refer
to the STCU chapter in the Device_NumberReference Manual,
“Integrity SW Operation” section for details.”
– Replaced the string ‘SIL3’ with ‘ASIL D’ in all locations to show ISO
26262 compliance.
– Changed Objective to Rationale for all Mandatory NOTE’s.Added
“Error handling” subsection in the “General Information” section.
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Table 24. Document revision history (continued)
Date
09-Nov-2011
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Changes
5
(cont.)
– Updated figures “Logic scheme of the LVDD and HVDD” and “Logic
scheme of the LVD_FLASH, LVD_GPIO and LVD_VREG”
– Updated “Single FCCU pin connected to the external device” section
with updated information to include discussion of both FCCU_F[1]
and FCCU_F[0] instead of just FCCU_F[0].
– Updated operating hours from 12500 hours to 12000 hours in the
“Mission profile” section.
– Updated the definition of 'Safe states' in the “Safe state” section.
– Added a Caution note in the “Flash memory” section about ECC
single-bit correction reporting for the flash memory.
– Added footnote to the “Enhanced Direct Memory Access (eDMA)”
section, “eDMA is a replicated module. No software action is needed
to detect faults inside this module.“
– Added footnote to the “Interrupt Controller (INTC)” section, “INTC is
a replicated module. No software action is needed to detect faults
inside this module.“
– Replaced all instances of “double read” with the correct term “dual
read”.
– Updated all instances of F[0] and F[1] to FCCU_F[0] and
FCCU_F[1], respectively, as shown in the Device_Number
Reference Manual.
– Added NOTE stating: “The temperature profile is an assumption of
the Device_Number safety analysis and shall be fulfilled during
integration into an ASIL D system.” before temperature profile tables
in the “Mission profile” section.
– Changed the “Error Correction Code (ECC) module” heading to
“Error Correction Status Module (ECSM)”.
– Updated all occurrences of RGM to MC_RGM.
– Changed “Fail Safe state” to “Safe state” in entire doc.
– Added NOTE: “The system (for example, ECU) cannot rely on any
pins, other than the Device_Number error output pins (FCCU_F[n]),
when those pins indicate an error.” to the “Error Out Monitor Function
(ERRM)” section.
– Added SEF (Safety Element Function) to the “Acronyms and
abbreviations” table.
– Replaced the text “time of more than one input signal. The signals
are called encoder signals.” with “signal coming from an encoder.” in
the “Read Encoder Inputs” section.
– Changed the Frequency field in the “Software BIST and/or test” table
for the ‘GPI_SWTEST_CMP’ entry to ‘Once for every acquisition’.
– Added “PMU Monitored Supplies” table to the “Power Monitor Unit
(PMU)” section.
– Updated Mandatory paragraph in “Temperature sensors” section to
state that only one temp sensor needs to be read during run time,
instead of both temperature sensors.
– Added these bulleted items to the “Checking” subsection in the
“System Status and Configuration Module (SSCM)” section:
- Decoupled Parallel Mode (DPM) – SSCM_STATUS[LSM] = 0
- Lock Step Mode (LSM) – SSCM_STATUS[LSM] = 1
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Revision history
Table 24. Document revision history (continued)
Date
09-Nov-2011
Revision
Changes
5
(cont.)
– Updated Implementation hint in the “Clock configuration” section.
Implementation hint: MC_CGM_AC3_SC[SELCTL] and
MC_CGM_AC4_SC[SELCTL] must be set to 1.
– Added “Each SEMA4 unit is connected to both replicated INTC
modules. This means that even in LSM when SEMA4 units are not
used, a corrupted SEMA4 could trigger continuous interrupts to both
INTCs. To avoid this possible failure the INTC shall have the SEMA4
interrupt masked (for example, SEMA4 units have the lowest priority
in the INTCs)” to the end of the first paragraph in the “Semaphore
Unit (SEMA4)” section.
– Updated the Trip time definition in the “Mission profile” section to be
a maximum time of 10 hours.
– Added the sentence “This means the SIUL must use general
purpose inputs which have edge detection interrupts” to the end of
paragraph after the bullet list in the “Hardware elements” subsection
of the “Read Encoder Inputs” section.
– Updated the acronym of the ADC register PCSR to PSCR as in the
RM.
– Changed the first mandatory paragraph in the “Functional safety
requirements for application software” section to “The device shall be
handled according to JEDEC standards J-STD-020 and J-STD-033.”
– Split the “Software BISTs to test the multiplexing circuitry” figure into
two figures. One representing ADC_SWTEST_TEST1 and the other
ADC_SWTEST_TEST2.
– Added a Note to the “Internal RC Oscillator (IRCOSC)” section:
If the IRCOSC is not operating due to a fault, the measurement of
the IRCOSC frequency will never complete and the CMU_CSR[FSM]
flag will remain set. The application shall manage detecting this
condition. For example, implementing a software watchdog which
monitors the CMU_CSR[FSM] flag status.
– Updated “ADC” section to show that only channels AN[0:8] are used
for external safety functions.Added the text to the “FrequencyModulated Phase-Locked Loop (FMPLL)” section discussing PLL
relock: “If the FMPLL successfully relocks after a clock fault it will
typically stay relocked since the locking process includes built in
hysteresis between loosing and regaining the lock.”
– Added “Sphere of Replication” subsection in the “General
Information” section
– Updated the “Logic scheme of the LVD_DIG and HVD_DIG” figure to
show a separate output for MC_RGM from the ‘self-test circuitry’
block.
– Changed CF to NCF in the “Configuration” subsection of the “SelfTest Control Unit (STCU)” section. The sentence now reads “....by
triggering a Non-Critical Fault (NCF) that signals the FCCU....”
– Changed CF to NCF in the “Checking” subsection of the “Self-Test
Control Unit (STCU)” section. The sentence now reads, “....faults by
triggering a Non-Critical Fault (NCF) that signals the FCCU....”
– Removed “Once in the PST” from the Frequency column of the
FLEXPWM1_SWTEST_REGCRC entry in the “Software BIST
and/or test” table.
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Table 24. Document revision history (continued)
Date
10-Aug-2012
01-Sep-2012
Revision
Changes
6
– Moved Mandatory requirements SAG_Device_Number_002 and
SAG_Device_Number_003 to the end of the “Preface”
– Added section “I/O pin/ball configuration”.
– Updated SSCM_STCR to SSCM_SCTR throughout.
– Replaced each instance of PST with FTTI as per ISO.
– Added “Recommended: To fully monitor all voltage supplies, it is
recommended that an external device also provides under voltage
monitors for the Device_Number external 3.3 V supplies (such as I/O
and VREG).” to the “Power Supply and Monitor Function (PSM)”
section.
– Updated content of SAG_Device_Number_076 in the “Power Supply
and Monitor Function (PSM)” section.
– Updated definitions and content of the “Safe state” section.
7
Section 7, I/O pin/ball configuration
– Added Table 21 “Physical pin displacements on the internal die”, and
included corresponding introductory text.
Section 3.13.3.1.4, Implementation details
– Changed Table 5, “Software BIST and/or test”, to show a ‘Frequency’
of “Once for every acquisition”, instead of “Once after programming”,
for row “ENCI_SWTEST_CMP”.
Section 1, Preface
– Added text, “The cores in the SPC56EL54xx/SPC56EL60xx can be
configured...”
– Added Mandatory text, “This document is based on the assumption
that the SPC56EL54xx/SPC56EL60xxis configured to operate in
LSM.”
Section 3.3.1, Configuration
– Added Mandatory text, “LBISTs and MBISTs shall be configured to
be executed once per trip time as defined in Section “Mission profile”
Section 3.13.5.2, Single Write PWM Outputs With Read Back
– Updated Note in Figure 7 'Single Write PWM Output With Read Back
configuration' to state, “n[z] represents any FlexPWM output.”
Section 3.13.6, Other requirements for I/O peripherals
– Added 'eTimer' to bullet so it now reads, “...signals, the eTimer
watchdog must...”
Section 3.26, Error Correction Status Module (ECSM)
– Added text, “The reporting functionality of the ECSM is disabled by
default.”
– Added Mandatory text, “Before the safety application starts
executing, the error reporting shall be enabled.”
– Added Implementation hint, “Error reporting is enabled by
configuring...”
Chapter 1: Preface
14-Feb-2013
8
Added Mandatory text, “This document is only valid if the
conditions given in the addendum are met.”
Added Section 8.3: Document references
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Table 24. Document revision history (continued)
Date
Revision
Changes
19-Jun-2013
9
Updated Section 8.3: Document references
Section 3.2.1, Configuration, replaced “Implementation hint: This
requirement is satisfied by writing SSCM_ERROR[PAE] = 1.Each
access to the BAM memory area produces a Prefetch or Data Abort
exception” with “This requirement is satisfied by writing
SSCM_ERROR[RAE] = 1. Each access to the BAM memory area
produces a Machine Check exception.”
Section 3.5, Clock configuration, added a new “mandatory” section.
Section 3.13.5.2, Single Write PWM Outputs With Read Back, replaced
“of the two output channels” with “of the configuration of the
channels”
Figure 16 (Logic scheme of the LVD_FLASH, LVD_GPIO and
LVD_VREG), replaced “PMU LVD” WITH “LVD” and “module LVD”
with “redundant LVD”
Section 4.3.2, Single FCCU pin connected to external device, added
one more bullet and updated whole section accordingly and removed
redundant information.
17-Sep-2013
10
Updated Disclaimer
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