Spec. No. : C602A3 Issued Date : 2009.05.14 Revised Date : Page No. : 1/7 CYStech Electronics Corp. General Purpose NPN Epitaxial Planar Transistor BTD1616AA3 BVCEO IC RCESAT(max) 60V 1A 300mΩ Features • High breakdown voltage, BVCEO≥ 60V • Large continuous collector current capability • Low collector saturation voltage • Pb-free and Halogen-free package Symbol Outline BTD1616AA3 TO-92 B：Base C：Collector E：Emitter E CB Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (pulse) Base Current Power Dissipation Thermal Resistance, Junction to Ambient Operating Junction and Storage Temperature Range Symbol VCBO VCEO VEBO IC ICP IB PD RθJA Tj ; Tstg Limits 120 60 7 1 2 (Note) 0.2 750 167 -55~+150 Unit V V V A A A mW °C/W °C Note : Pulse test, pulse width≤300μs, duty cycle≤2% BTD1616AA3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C602A3 Issued Date : 2009.05.14 Revised Date : Page No. : 2/7 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(sat) *VBE(on) *hFE 1 *hFE 2 fT Cob ton tstg tf Min. 120 60 7 600 200 120 100 - Typ. 150 0.9 13 40 500 120 Max. 100 100 300 350 1.2 700 400 18 - Unit V V V nA nA mV mV V mV MHz pF ns Test Conditions IC=50μA IC=1mA IE=50μA VCB=120V VEB=7V IC=1A, IB=50mA IC=1A, IB=20mA IC=1A, IB=50mA VCE=2V, IC=50mA VCE=2V, IC=100mA VCE=2V, IC=1A VCE=2V, IC=100mA, f=100MHz VCB=10V, IE=0A,f=1MHz VCC=30V, IC=1A, IB1=-IB2=33mA, RL=30Ω *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device BTD1616AA3 BTD1616AA3 BTD1616AA3 Package TO-92 ( Pb-free and Halogen-free package) TO-92 ( Pb-free and Halogen-free package) Shipping Marking 2000 pcs / Tape & Box D1616A 1000 pcs / Bag, 10 Bags/Box D1616A CYStek Product Specification Spec. No. : C602A3 Issued Date : 2009.05.14 Revised Date : Page No. : 3/7 CYStech Electronics Corp. Characteristic Curves Emitter Grounded Output Characteristics Emitter Grounded Output Characteristics 2000 700 Collector Current---IC(mA) 1600 Collector Current---IC(A) IB=10mA IB=8mA 1800 IB=6mA 1400 1200 IB=4mA 1000 800 600 IB=2mA 400 IB=2.5mA 600 IB=2mA 500 400 IB=1.5mA 300 IB=1mA 200 IB=500uA 100 200 IB=0 IB=0 0 0 0 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 0 6 Emitter Grounded Output Characteristics 1000 IB=500uA VCE=5V IB=400uA 100 80 IB=300uA 60 IB=200uA Current Gain---HFE Collector Current---IC(mA) 6 Current Gain vs Collector Current 140 120 1 2 3 4 5 Collector-to-Emitter Voltage---VCE(V) 40 VCE=2V 100 VCE=1V IB=100uA 20 IB=0 0 10 0 1 2 3 4 5 6 1 Collector-to-Emitter Voltage---VCE(V) 10000 Saturation Voltage vs Collector Current Saturation Voltage vs Collector Current 10000 10000 VCE(SAT) Saturation Voltage---(mV) Saturation Voltage---(mV) 10 100 1000 Collector Current---IC(mA) 1000 IC=100IB IC=50IB 100 VBE(SAT)@IC=50IB 1000 IC=20IB 10 100 1 BTD1616AA3 10 100 1000 Collector Current---IC(mA) 10000 1 10 100 1000 Collector Current---IC(mA) 10000 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C602A3 Issued Date : 2009.05.14 Revised Date : Page No. : 4/7 Characteristic Curves(Cont.) On Voltage vs Collector Current Power Derating Curve 1000 On Voltage---(mV) Power Dissipation---PD(mW) 800 VCE=2V 100 700 600 500 400 300 200 100 0 1 BTD1616AA3 10 100 1000 Collector Current---IC(mA) 10000 0 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification Spec. No. : C602A3 Issued Date : 2009.05.14 Revised Date : Page No. : 5/7 CYStech Electronics Corp. TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - BTD1616AA3 P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C602A3 Issued Date : 2009.05.14 Revised Date : Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTD1616AA3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C602A3 Issued Date : 2009.05.14 Revised Date : Page No. : 7/7 TO-92 Dimension α2 A Marking: B 1 2 3 D1616A Date Code α3 C □□□□ D H I G α1 E F Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: KFC ; pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD1616AA3 CYStek Product Specification