TDK C2012X7R0J685M125AB Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : May 19, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012X7R0J685M125AB
TDK item description C2012X7R0J685MT****
Commercial Grade
Applications
Please refer to Part No. CGA4J1X7R0J685M125AC for Automotive use.
Feature
General General (Up to 50V)
Series
C2012 [EIA 0805]
Status
Production (Not Recommended for New Design)
Size
Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
1.25mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PA)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
Recommended Land Pattern (PB)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
Recommended Land Pattern (PC)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
6.8μF ±20%
Rated Voltage
6.3VDC
Temperature Characteristic
X7R(±15%)
Dissipation Factor (Max.)
10%
Insulation Resistance (Min.)
14MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : May 19, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C2012X7R0J685M125AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C2012X7R0J685M125AB
ESR
C2012X7R0J685M125AB
Capacitance
C2012X7R0J685M125AB
C2012X7R0J685M125AB
Temperature Characteristic
C2012X7R0J685M125AB(No Bias)
DC Bias Characteristic
C2012X7R0J685M125AB(DC Bias =
3.15V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
C2012X7R0J685M125AB(100kHz)
C2012X7R0J685M125AB(500kHz)
C2012X7R0J685M125AB(1MHz)
Multilayer Ceramic Chip Capacitors
C2012X7R0J685M125AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : May 19, 2017 (GMT)
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