Diodes DMNH4005SPSQ-13 40v n-channel 175c mosfet powerdi Datasheet

DMNH4005SPSQ
40V N-CHANNEL 175°C MOSFET
POWERDI
Green
Product Summary
Features
BVDSS
RDS(ON)
40V
4.0mΩ @ VGS = 10V

ID
TC = +25°C
80A

PPAP Capable (Note 4)

Description and Applications
This MOSFET has been designed to meet the stringent requirements
of Automotive applications. It is qualified to AECQ101, supported by a
PPAP and is ideal for use in:









Rated to +175°C – Ideal for High Ambient Temperature
Environments
100% Unclamped Inductive Switching – Ensures More Reliable
and Robust End Application
Low RDS(ON) – Minimises Power Losses
Low Qg – Minimises Switching Losses
<1.1mm Package Profile – Ideal for Thin Applications
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Engine Management Systems
Body Control Electronics
DC-DC Converters
Mechanical Data






Case: PowerDI5060-8
Case Material: Molded Plastic, ―Green‖ Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram Below
Terminals: Finish – Matte Tin Annealed over Copper Leadframe
Solderable per MIL-STD-202, Method 208
Weight: 0.097 grams (Approximate)
D
PowerDI5060-8
Pin1
G
S
Top View
D
S
D
S
D
G
D
Top View
Pin Configuration
Internal Schematic
Bottom View
S
Ordering Information (Note 5)
Part Number
DMNH4005SPSQ-13
Notes:
Case
PowerDI5060-8
Packaging
2,500 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to http://www.diodes.com/product_compliance_definitions.html.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
D
D
D
D
= Manufacturer’s Marking
H4005SS = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 16 = 2016)
WW = Week Code (01 to 53)
H4005SS
YY WW
S
S
S
G
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DMNH4005SPSQ
Document number: DS38860 Rev. 1 - 2
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DMNH4005SPSQ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 7) VGS = 10V
Steady
State
TC = +25°C
TC = +100°C
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 6)
Avalanche Current (Note 8) L=1mH
Avalanche Energy (Note 8) L=1mH
Value
40
20
80
60
90
80
30
445
ID
IDM
IS
IAS
EAS
Unit
V
V
A
A
A
A
mJ
Thermal Characteristics
Characteristic
Symbol
PD
Total Power Dissipation (Note 6)
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
RθJA
Total Power Dissipation (Note 7)
PD
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 7)
RθJA
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Electrical Characteristics
Unit
W
°C/W
W
°C/W
°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 10V)
Total Gate Charge (VGS = 4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
RθJC
TJ, TSTG
Value
1.6
98
54
2.8
53
29
0.9
-55 to +175
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
IDSS
IGSS
40
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 250µA
VDS = 32V, VGS = 0V
VGS = 16V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
1
—
—
—
3.2
—
3
4.0
1.2
V
m
V
VDS = VGS, ID = 250µA
VGS = 10V, ID = 20A
VGS = 0V, IS = 1A
Ciss
Coss
Crss
Rg
Qg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2847
743
243
2.0
48
23
9.5
11.5
6.6
12.1
18.3
4.9
29
24
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
VDS = 20V, VGS = 0V
f = 1.0MHz

VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDD = 20V, ID = 20A
ns
VDD = 20V, VGS = 10V,
Rg = 1, ID = 20A
ns
nC
IF = 15A, di/dt = 100A/µs
6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
8. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
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DMNH4005SPSQ
Document number: DS38860 Rev. 1 - 2
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DMNH4005SPSQ
50.0
30
VDS=5V
ID, DRAIN CURRENT (A)
40.0
ID, DRAIN CURRENT (A)
25
VGS=10.0V
VGS=5.0V
30.0
VGS=4.5V
VGS=4.0V
20.0
VGS=3.5V
10.0
20
15
10
175℃
85℃
0.004
0.0035
0.003
VGS=10.0V
0.0025
0.002
0.0015
0.001
0
5
10
15
20
25
1
5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
1 1.5 2 2.5 3 3.5 4 4.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
30
35
40
45
0.04
0.03
0.02
ID=20A
0.01
0
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
VGS=10V
175℃
150℃
0.004
125℃
85℃
25℃
0.002
-55℃
6
0.05
50
0.008
2
3
4
5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
0.06
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
0.006
-55℃
0
0.0
0.5
25℃
125℃
VGS=3.0V
0
150℃
5
4
8
12
16
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
20
2
1.8
1.6
1.4
1.2
1
VGS=10V, ID=20A
0.8
0.6
0
1
6
11
16
21
26
31
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Junction Temperature
-50
-25 0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
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0.01
4
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
DMNH4005SPSQ
0.008
0.006
0.004
VGS=10V, ID=20A
0.002
3.5
3
2.5
ID=1mA
2
ID=250µA
1.5
1
0.5
0
0
-50
-50
-25
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
0
25 50 75 100 125 150 175
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
100000
30
175℃
VGS=0V
IDSS, LEAKAGE CURRENT (nA)
25
IS, SOURCE CURRENT (A)
-25
20
15
TJ=175℃
TJ=150℃
10
TJ=125℃
TJ=85℃
5
TJ=25℃
10000
150℃
1000
125℃
100
85℃
10
1
25℃
TJ=-55℃
0
0.1
0
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
1.5
0
5
10
15
20
25
30
35
40
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Drain-Source Leakge Current vs
Voltage
10
10000
8
Ciss
6
VGS (V)
CT, JUNCTION CAPACITANCE (pF)
f=1MHz
1000
Coss
4
VDS=20V, ID=20A
2
Crss
0
100
0
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11. Typical Junction Capacitance
40
0
10
20
30
Qg (nC)
Figure 12. Gate Charge
40
50
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DMNH4005SPSQ
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DMNH4005SPSQ
1000
ID, DRAIN CURRENT (A)
RDS(ON)
Limited
PW =10µs
100
PW =1s
PW =100ms
PW =10ms
PW =1ms
PW =100µs
PW =1µs
TJ(Max)=175℃
TC=25℃
VGS=10V
Single Pulse
DUT on Infinite Heatsink
10
1
0.1
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 13. SOA, Safe Operation Area
100
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.9
D=0.7
D=0.5
0.1
D=0.3
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJC (t)=r(t) * RθJC
RθJC=0.93℃/W
Duty Cycle, D=t1 / t2
D=Single Pulse
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 14. Transient Thermal Resistance
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
D
Detail A
D1
PowerDI5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
b
0.33
0.51
0.41
b2
0.200
0.350 0.273
b3
0.40
0.80
0.60
c
0.230
0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
L
0.51
0.71
0.61
L1
0.100
0.200 0.175
M
3.235
4.035 3.635
M1
1.00
1.40
1.21
Θ
10º
12º
11º
Θ1
6º
8º
7º
All Dimensions in mm
0(4X)
c
A1
E1 E
e
01 (4X)
1
b (8X)
e/2
1
L
b2 (4X)
D3
A
K
D2
E3 E2
M
b3 (4X)
M1
Detail A
L1
G
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI5060-8
X4
Y2
X3
Y3
Y5
Y1
X2
Y4
X1
Y7
Y6
G1
C
X
G
Y(4x)
Dimensions
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Value (in mm)
1.270
0.660
0.820
0.610
4.100
0.755
4.420
5.610
1.270
0.600
1.020
0.295
1.825
3.810
0.180
6.610
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated.
DMNH4005SPSQ
Document number: DS38860 Rev. 1 - 2
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September 2016
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