Sample & Buy Product Folder Support & Community Tools & Software Technical Documents DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 DLP6500 0.65 1080p MVSP Type A DMD 1 Features 2 Applications • • 1 • • • • • • • High Resolution 1080p (1920×1080) Array With >2 Million Micromirrors – 0.65-Inch Micromirror Array Diagonal – 7.56 µm Micromirror Pitch – ±12° Micromirror Tilt Angle (Relative to Flat State) – Designed for Corner Illumination Designed for Use With Broadband Visible Light (400 nm – 700 nm) – Window Transmission 97% (Single Pass, Through Two Window Surfaces) – Micromirror Reflectivity 88% – Array Diffraction Efficiency 86% – Array Fill Factor 92% Two 16-Bit, Low Voltage Differential Signaling (LVDS), Double Data Rate (DDR) Buses Two Dedicated Controller Options at 400 MHz Input Data Clock Rate DLPC900 Digital Controller – Up to 9523 Hz (1-Bit Binary Patterns) – Up to 19.7 Giga-bits Per Second (1-Bit Binary Patterns) – Up to 1031 Hz (8-Bit Gray Patterns PreLoaded With Illumination Modulation), External Input Up to 360 Hz DLPC910 Digital Controller – Up to 11574 Hz (1-Bit Binary Patterns) – Up to 24 Giga-bits Per Second (1-Bit Binary Patterns) – Up to 1446 Hz (8-Bit Gray Patterns With Illumination Modulation) Integrated Micromirror Driver Circuitry Hermetic Package DLPC900 Simplified Diagram Red,Green,Blue PWM PCLK, DE LED Strobes HSYNC, VSYNC LED Driver • • Industrial – 3D Scanners for Machine Vision and Quality Control – 3D Printing – Direct Imaging Lithography – Laser Marking and Repair Medical – Ophthalmology – 3D Scanners for Limb and Skin Measurement – Hyper-spectral Imaging Displays – 3D Imaging Microscopes – Intelligent and Adaptive Lighting 3 Description Featuring over 2 million micromirrors in a hermetic package, the high resolution 0.65 1080p digital micromirror device (DMD) is a spatial light modulator (SLM) that modulates the amplitude, direction, and/or phase of incoming light. The unique capability and value offered by the DLP6500, including operation at 405nm, makes it well suited to support a wide variety of industrial, medical, and advanced imaging applications. Reliable function and operation of the DLP6500 requires that it be used in conjunction with the DLPC900 or the DLPC910 digital controllers. This dedicated chipset provides full HD resolution at high speeds and can be easily integrated into a variety of end equipment solutions. Device Information(1) PART NUMBER DLP6500 PACKAGE (1) For all available packages, see the orderable addendum at the end of the datasheet. DLPC910 Simplified Diagram Illumination Driver LVDS Interface Illumination Sensor Control Signals Flash Status Signals DLPC900 USB 40.6 mm × 31.8 mm × 6 mm FLQ (203) Row and Block Signals 24-bit RGB Data BODY SIZE (NOM) FAN JTAG(3:0) I2C DLPC910 LVD Interface RESET Signals DLPR910 PGM(4:0) DMD CTL, DATA SCP OSC I2C DLP6500FLQ Voltage Supplies SCP Interface DLP6500FLQ CTRL_RSTZ OSC 50 MHz VLED0 VLED1 Power Management 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 7 1 1 1 2 3 8 Absolute Maximum Ratings ...................................... 8 Storage Conditions.................................................... 8 ESD Ratings.............................................................. 9 Recommended Operating Conditions....................... 9 Thermal Information ................................................ 11 Electrical Characteristics......................................... 12 Timing Requirements .............................................. 13 Typical Characteristics ............................................ 17 System Mounting Interface Loads .......................... 18 Micromirror Array Physical Characteristics ........... 19 Micromirror Array Optical Characteristics ............. 20 Window Characteristics......................................... 21 Chipset Component Usage Specification ............. 21 Detailed Description ............................................ 22 7.1 Overview ................................................................. 22 7.2 Functional Block Diagram ....................................... 23 7.3 Feature Description................................................. 24 7.4 7.5 7.6 7.7 8 Device Functional Modes........................................ Window Characteristics and Optics ....................... Micromirror Array Temperature Calculation............ Micromirror Landed-on/Landed-Off Duty Cycle ...... 27 27 28 29 Application and Implementation ........................ 31 8.1 Application Information............................................ 31 8.2 Typical Application ................................................. 31 9 Power Supply Requirements .............................. 33 9.1 9.2 9.3 9.4 DMD DMD DMD DMD Power Supply Requirements ........................ Power Supply Power-Up Procedure .............. Mirror Park Sequence Requirements ............ Power Supply Power-Down Procedure ......... 33 33 33 34 10 Layout................................................................... 37 10.1 Layout Guidelines ................................................. 37 10.2 Layout Example .................................................... 37 11 Device and Documentation Support ................. 42 11.1 11.2 11.3 11.4 11.5 11.6 Device Support...................................................... Documentation Support ....................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 42 43 43 43 43 43 12 Mechanical, Packaging, and Orderable Information ........................................................... 43 4 Revision History Changes from Original (October 2014) to Revision A Page • Updated features to include additional digital controller......................................................................................................... 1 • Added additional symplified diagram...................................................................................................................................... 1 • Removed DLKC_C and DCLK_D, separated TCASE into TARRAY and TWINDOW, added TDELTA, and reduced fclock in Absolute Maximum Ratings...................................................................................................................................... 8 • Separated handling ratings into Storage Conditions and ESD Ratings. ................................................................................ 8 • Changed TDMD to TARRAY, TGRADIENT to TDELTA, and added short term operational values in Recommended Operating Conditions .............................................................................................................................................................. 9 • Updated Micromirror Derating Curve.................................................................................................................................... 11 • Added typical characteristics when DMD is controlled with the DLPC910........................................................................... 17 • Update CL2W constant in Micromirror Array Termperature Calculation. ............................................................................. 28 • Added recommended idle mode operation for maximizing mirror useful life. ...................................................................... 29 • Added additional typical application schematic. ................................................................................................................... 31 • Added DMD Mirror Park Sequence requirements. ............................................................................................................... 33 • Added cross reference to DMD Mirror Park Sequence requirements.................................................................................. 34 • Updated part number description and device markings. ...................................................................................................... 42 2 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 5 Pin Configuration and Functions FLQ Package 203-Pin CLGA Bottom View Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 3 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Pin Functions PIN (1) NO. TYPE (I/O/P) SIGNAL DATA RATE (2) INTERNAL TERM (3) D_AN(0) B10 Input LVDS DDR Differential Data, Negative 557.27 D_AN(1) A13 Input LVDS DDR Differential Data, Negative 558.46 D_AN(2) D16 Input LVDS DDR Differential Data, Negative 556.87 D_AN(3) C17 Input LVDS DDR Differential Data, Negative 555.6 D_AN(4) B18 Input LVDS DDR Differential Data, Negative 555.33 D_AN(5) A17 Input LVDS DDR Differential Data, Negative 555.76 D_AN(6) A25 Input LVDS DDR Differential Data, Negative 556.47 D_AN(7) D22 Input LVDS DDR Differential Data, Negative 555.79 D_AN(8) C29 Input LVDS DDR Differential Data, Negative 556.54 D_AN(9) D28 Input LVDS DDR Differential Data, Negative 555.23 D_AN(10) E27 Input LVDS DDR Differential Data, Negative 555.55 D_AN(11) F26 Input LVDS DDR Differential Data, Negative 556.48 D_AN(12) G29 Input LVDS DDR Differential Data, Negative 555.91 D_AN(13) H28 Input LVDS DDR Differential Data, Negative 556.38 D_AN(14) J27 Input LVDS DDR Differential Data, Negative 559.01 D_AN(15) K26 Input LVDS DDR Differential Data, Negative 556.11 D_AP(0) B12 Input LVDS DDR Differential Data, Positive 555.99 D_AP(1) A11 Input LVDS DDR Differential Data, Positive 556.02 D_AP(2) D14 Input LVDS DDR Differential Data, Positive 556.31 D_AP(3) C15 Input LVDS DDR Differential Data, Positive 555.88 D_AP(4) B16 Input LVDS DDR Differential Data, Positive 556.08 D_AP(5) A19 Input LVDS DDR Differential Data, Positive 556.33 D_AP(6) A23 Input LVDS DDR Differential Data, Positive 556.13 D_AP(7) D20 Input LVDS DDR Differential Data, Positive 555.21 D_AP(8) A29 Input LVDS DDR Differential Data, Positive 555.58 D_AP(9) B28 Input LVDS DDR Differential Data, Positive 555.39 D_AP(10) C27 Input LVDS DDR Differential Data, Positive 556.11 D_AP(11) D26 Input LVDS DDR Differential Data, Positive 555.88 D_AP(12) F30 Input LVDS DDR Differential Data, Positive 556.58 D_AP(13) H30 Input LVDS DDR Differential Data, Positive 556.3 D_AP(14) J29 Input LVDS DDR Differential Data, Positive 557.67 D_AP(15) K28 Input LVDS DDR Differential Data, Positive 555.32 D_BN(0) AB10 Input LVDS DDR Differential Data, Negative 552.46 D_BN(1) AC13 Input LVDS DDR Differential Data, Negative 556.99 D_BN(2) Y16 Input LVDS DDR Differential Data, Negative 545.06 D_BN(3) AA17 Input LVDS DDR Differential Data, Negative 555.44 D_BN(4) AB18 Input LVDS DDR Differential Data, Negative 556.34 D_BN(5) AC17 Input LVDS DDR Differential Data, Negative 547.1 D_BN(6) AC25 Input LVDS DDR Differential Data, Negative 557.92 D_BN(7) Y22 Input LVDS DDR Differential Data, Negative 544.03 NAME DESCRIPTION TRACE (mils) (4) DATA BUS A DATA BUS B (1) (2) (3) (4) 4 The following power supplies are required to operate the DMD: VCC, VCCI, VOFFSET, VBIAS, and VRESET. VSS must also be connected. DDR = Double Data Rate. SDR = Single Data Rate. Refer to the Timing Requirements for specifications and relationships. Internal term = CMOS level internal termination. Refer to Recommended Operating Conditions for differential termination specification. Dielectric Constant for the DMD Type A ceramic package is approximately 9.6. For the package trace lengths shown: Propagation Speed = 11.8 / sqrt(9.6) = 3.808 in/ns. Propagation Delay = 0.262 ns/in = 262 ps/in = 10.315 ps/mm. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 Pin Functions (continued) PIN (1) NO. TYPE (I/O/P) SIGNAL DATA RATE (2) INTERNAL TERM (3) D_BN(8) AA29 Input LVDS DDR Differential Data, Negative 555.9 D_BN(9) Y28 Input LVDS DDR Differential Data, Negative 555.42 D_BN(10) W27 Input LVDS DDR Differential Data, Negative 556.26 D_BN(11) V26 Input LVDS DDR Differential Data, Negative 555.52 D_BN(12) T30 Input LVDS DDR Differential Data, Negative 556 D_BN(13) R29 Input LVDS DDR Differential Data, Negative 557.17 D_BN(14) R27 Input LVDS DDR Differential Data, Negative 555.25 D_BN(15) N27 Input LVDS DDR Differential Data, Negative 555.19 D_BP(0) AB12 Input LVDS DDR Differential Data, Positive 551.93 D_BP(1) AC11 Input LVDS DDR Differential Data, Positive 557.1 D_BP(2) Y14 Input LVDS DDR Differential Data, Positive 544.38 D_BP(3) AA15 Input LVDS DDR Differential Data, Positive 555.98 D_BP(4) AB16 Input LVDS DDR Differential Data, Positive 555.56 D_BP(5) AC19 Input LVDS DDR Differential Data, Positive 547.17 D_BP(6) AC23 Input LVDS DDR Differential Data, Positive 556.47 D_BP(7) Y20 Input LVDS DDR Differential Data, Positive 543.25 D_BP(8) AC29 Input LVDS DDR Differential Data, Positive 555.71 D_BP(9) AB28 Input LVDS DDR Differential Data, Positive 556.32 D_BP(10) AA27 Input LVDS DDR Differential Data, Positive 555.35 D_BP(11) Y26 Input LVDS DDR Differential Data, Positive 555.65 D_BP(12) U29 Input LVDS DDR Differential Data, Positive 555.28 D_BP(13) T28 Input LVDS DDR Differential Data, Positive 557.25 D_BP(14) P28 Input LVDS DDR Differential Data, Positive 555.83 D_BP(15) P26 Input LVDS DDR Differential Data, Positive 556.67 SCTRL_AN C21 Input LVDS DDR Differential Serial Control, Negative 555.14 SCTRL_BN AA21 Input LVDS DDR Differential Serial Control, Negative 555.14 SCTRL_AP C23 Input LVDS DDR Differential Serial Control, Positive 555.13 SCTRL_BP AA23 Input LVDS DDR Differential Serial Control, Positive 555.13 DCLK_AN B22 Input LVDS Differential Clock Negative 555.12 DCLK_BN AB22 Input LVDS Differential Clock Negative 555.12 DCLK_AP B24 Input LVDS Differential Clock Positive 555.13 DCLK_BP AB24 Input LVDS Differential Clock Positive 555.12 NAME DESCRIPTION TRACE (mils) (4) SERIAL CONTROL CLOCKS SERIAL COMMUNICATIONS PORT (SCP) SCP_DO B2 Output LVCMOS SDR SCP_DI F4 Input LVCMOS SDR Serial Communications Port Output 525.78 Pull-Down Serial Communications Port Data Input SCP_CLK E3 Input 509.96 LVCMOS Pull-Down Serial Communications Port Clock SCP_ENZ D4 403.93 Input LVCMOS Pull-Down Active-low Serial Communications Port Enable 464.17 MICROMIRROR RESET CONTROL RESET_ADDR(0) C5 Input LVCMOS Pull-Down Reset Driver Address Select 1088.3 RESET_ADDR(1) E5 Input LVCMOS Pull-Down Reset Driver Address Select 979.26 RESET_ADDR(2) G5 Input LVCMOS Pull-Down Reset Driver Address Select 900.45 RESET_ADDR(3) AC3 Input LVCMOS Pull-Down Reset Driver Address Select 658.56 RESET_MODE(0) D8 Input LVCMOS Pull-Down Reset Driver Mode Select 1012.52 RESET_MODE(1) C11 Input LVCMOS Pull-Down Reset Driver Mode Select 789.83 RESET_SEL(0) T4 Input LVCMOS Pull-Down Reset Driver Level Select 539.64 RESET_SEL(1) U5 Input LVCMOS Pull-Down Reset Driver Level Select 400.3 RESET_STROBE V2 Input LVCMOS Pull-Down Reset Address, Mode, & Level latched on rising-edge 446.34 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 5 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Pin Functions (continued) PIN NAME (1) NO. TYPE (I/O/P) SIGNAL DATA RATE (2) INTERNAL TERM (3) DESCRIPTION TRACE (mils) (4) ENABLES & INTERRUPTS PWRDNZ C3 Input LVCMOS Pull-Down Active-low Device Reset 390.76 RESET_OEZ W1 Input LVCMOS Pull-Down Active-low output enable for DMD reset driver circuits 513.87 RESETZ G3 Input LVCMOS Pull-Down Active-low sets Reset circuits in known VOFFSET state 941.63 RESET_IRQZ T6 Output LVCMOS Active-low, output interrupt to ASIC 403.34 AA11 Input LVCMOS Pull-Up Active-low fault from external VBIAS regulator 858.86 PG_OFFSET Y10 Input LVCMOS Pull-Up Active-low fault from external VOFFSET regulator 822.06 PG_RESET V4 Input LVCMOS Pull-Up Active-low fault from external VRESET regulator 1186.98 EN_BIAS D12 Output LVCMOS Active-high enable for external VBIAS regulator 167.53 EN_OFFSET AB8 Output LVCMOS Active-high enable for external VOFFSET regulator 961.04 H2 Output LVCMOS Active-high enable for external VRESET regulator 566.05 VOLTAGE REGULATOR MONITORING PG_BIAS EN_RESET LEAVE PIN UNCONNECTED MBRST(0) P2 Output Analog Pull-Down For proper DMD operation, do not connect 1167.69 MBRST(1) AB4 Output Analog Pull-Down For proper DMD operation, do not connect 1348.04 MBRST(2) AA7 Output Analog Pull-Down For proper DMD operation, do not connect 1240.35 MBRST(3) N3 Output Analog Pull-Down For proper DMD operation, do not connect 1030.51 MBRST(4) M4 Output Analog Pull-Down For proper DMD operation, do not connect 870.63 MBRST(5) AB6 Output Analog Pull-Down For proper DMD operation, do not connect 1267.73 MBRST(6) AA5 Output Analog Pull-Down For proper DMD operation, do not connect 1391.22 MBRST(7) L3 Output Analog Pull-Down For proper DMD operation, do not connect 1064.01 MBRST(8) Y6 Output Analog Pull-Down For proper DMD operation, do not connect 552.89 MBRST(9) K4 Output Analog Pull-Down For proper DMD operation, do not connect 992.63 MBRST(10) L5 Output Analog Pull-Down For proper DMD operation, do not connect 1063.13 MBRST(11) AC5 Output Analog Pull-Down For proper DMD operation, do not connect 641.44 MBRST(12) Y8 Output Analog Pull-Down For proper DMD operation, do not connect 428.07 MBRST(13) J5 Output Analog Pull-Down For proper DMD operation, do not connect 962.91 MBRST(14) K6 Output Analog Pull-Down For proper DMD operation, do not connect 1093.63 MBRST(15) AC7 Output Analog Pull-Down For proper DMD operation, do not connect 577.13 LEAVE PIN UNCONNECTED RESERVED_PFE AA1 Input LVCMOS Pull-Down For proper DMD operation, do not connect 1293.6 RESERVED_TM B6 Input LVCMOS Pull-Down For proper DMD operation, do not connect 365.64 RESERVED_XI1 D2 Input LVCMOS Pull-Down For proper DMD operation, do not connect 689.96 RESERVED_TP0 Y2 Input Analog For proper DMD operation, do not connect 667.66 RESERVED_TP1 P6 Input Analog For proper DMD operation, do not connect 623.99 RESERVED_TP2 W3 Input Analog For proper DMD operation, do not connect 564.35 LEAVE PIN UNCONNECTED RESERVED_BA U3 Output LVCMOS For proper DMD operation, do not connect 684.44 RESERVED_BB C9 Output LVCMOS For proper DMD operation, do not connect 223.73 RESERVED_TS D10 Output LVCMOS For proper DMD operation, do not connect 90.87 LEAVE PIN UNCONNECTED NO CONNECT 6 H6 For proper DMD operation, do not connect Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 PIN NAME (1) VBIAS NO. TYPE (I/O/P) SIGNAL Power Analog Supply voltage for positive Bias level of Micromirror reset signal. N5, P4, R3, R5 DESCRIPTION VOFFSET G1, J1, L1, N1, R1 Power Analog Supply voltage for HVCMOS logic. Supply voltage for stepped high voltage at Micromirror address electrodes. Supply voltage positive Offset level of Micromirror reset signal. VRESET A3, A5, B4, C7 Power Analog Power supply for negative reset level of mirror reset signal A7, A15, C1 Power Analog Supply voltage for LVCMOS core logic. E1, U1, AB2 Power Analog Supply voltage for normal high level at Micromirror address electrodes. AC9, AC15 Power Analog Supply voltage for positive Offset level of Micromirror reset signal during Power Down sequence. VCCI A21, A27, D30, M30, Y30, AC21, AC27 Power Analog Power supply for LVDS Interface VSS A1, A9, B8, B14, B20, B26, B30, C13, C19, C25, D6, D18, D24, E29, F2, F28, G27, H4, H26, J3, J25, K2, K30, L25, L27, L29, M2, M6, M26, M28, N25, N29, P30, R25, T2, T26, U27, V28, V30, W5, W29, Y4, Y12, Y18, Y24, AA3, AA9, AA13, AA19, AA25, AB14, AB20, AB26, AB30 Power Analog Device Ground. Common return for all power. VCC (1) The following power supplies are required to operate the DMD: VCC, VCCI, VOFFSET, VBIAS, and VRESET. VSS must also be connected. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 7 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) SUPPLY VOLTAGES VCC Supply voltage for LVCMOS core logic (2) (2) VCCI Supply voltage for LVDS receivers VOFFSET Supply voltage for HVCMOS and micromirror electrode (2) VBIAS Supply voltage for micromirror electrode VRESET Supply voltage for micromirror electrode | VCC – VCCI | Supply voltage delta (absolute value) | VBIAS – VOFFSET | Supply voltage delta (absolute value) (5) (3) (2) (2) MIN MAX UNIT –0.5 4 V –0.5 4 V –0.5 9 V –0.5 17 V –11 0.5 V 0.3 V 8.75 V –0.5 VCC + 0.3 V –0.5 VCCI + 0.3 V 700 mV 7 mA (4) INPUT VOLTAGES Input voltage for all other LVCMOS input pins Input voltage for all other LVDS input pins (2) (2) |VID| Input differential voltage (absolute value) (2) IID Input differential current (6) (7) CLOCKS ƒclock Clock frequency for LVDS interface, DCLK_A 440 Clock frequency for LVDS interface, DCLK_B 440 MHz ENVIRONMENTAL Array temperature: operational (8) (9) TARRAY Array temperature: non-operational TWINDOW (8) (9) Window temperature: operational Window temperature: non–operational 0 90 -40 90 0 65 -40 90 °C °C | TDELTA| Absolute termperature delta between the window test point and the ceramic test point TP1 (10) 10 °C RH Relative Humidity, operating and non–operating 95 % (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device is not implied at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure above Recommended Operating Conditions for extended periods may affect device reliability. (2) All voltages are referenced to common ground VSS. Supply voltages VCC, VCCI, VOFFSET, VBIAS, and VRESET are all required for proper DMD operation. VSS must also be connected. (3) VOFFSET supply transients must fall within specified voltages. (4) To prevent excess current, the supply voltage delta |VCCI – VCC| must be less than specified limit. (5) To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified limit. Refer to Power Supply Requirements for additional information. (6) This maximum LVDS input voltage rating applies when each input of a differential pair is at the same voltage potential. (7) LVDS differential inputs must not exceed the specified limit or damage may result to the internal termination resistors. (8) Exposure of the DMD simultaneously to any combination of the maximum operating conditions for case temperature, differential temperature, or illumination power density will reduce device lifetime. Refer to ESD Ratings. (9) The highest temperature of the active array as calculated by the Micromirror Array Temperature Calculation using ceramic test point 1 (TP1) in Figure 15. (10) Temperature delta is the highest difference between the ceramic test point TP1 and window test points TP2 and TP3 in Figure 15. 6.2 Storage Conditions applicable before the DMD is installed in the final product TDMD Storage temperature range (non-operating) RH Relative Humidity (non-condensing) 8 MIN MAX UNIT –40 80 °C 95% Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 6.3 ESD Ratings V(ESD) (1) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) VALUE UNIT ±2000 V JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. 6.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT SUPPLY VOLTAGES (1) (2) VCC Supply voltage for LVCMOS core logic 3.0 3.3 3.6 V VCCI Supply voltage for LVDS receivers 3.0 3.3 3.6 V VOFFSET Supply voltage for HVCMOS and micromirror electrodes (3) 8.25 8.5 8.75 V VBIAS Supply voltage for micromirror electrodes 15.5 16 16.5 V VRESET Mirror electrode voltage –9.5 –10 –10.5 V | VCCI–VCC | Supply voltage delta (absolute value) (4) 0.3 V | VBIAS–VOFFSET | Supply voltage delta (absolute value) (5) 8.75 V VCC + 0.3 V 0.7 V LVCMOS PINS VIH High level Input voltage (6) 1.7 VIL Low level Input voltage (6) –0.3 IOH High level output current at VOH = 2.4 V –20 mA IOL Low level output current at VOL = 0.4 V 15 mA TPWRDNZ PWRDNZ pulse width (7) 2.5 10 ns SCP INTERFACE (5) ƒclock SCP clock frequency (8) tSCP_SKEW Time between valid SCPDI and rising edge of SCPCLK (9) tSCP_DELAY Time between valid SCPDO and rising edge of SCPCLK (9) tSCP_BYTE_INTERVAL_ Time between consecutive bytes tSCP_NEG_ENZ Time between falling edge of SCPENZ and the first rising edge of SCPCLK tSCP_PW_ENZ SCPENZ inactive pulse width (high level) tSCP_OUT_EN Time required for SCP output buffer to recover after SCPENZ (from tri-state) ƒclock SCP circuit clock oscillator frequency (10) –800 500 kHz 800 ns 700 ns 1 µs 30 ns 1 µs 9.6 1.5 ns 11.1 MHz 400 MHz 600 mV LVDS INTERFACE ƒclock Clock frequency DCLK | VID | Input differential voltage (absolute value) VCM Common mode (11) (11) 100 400 1200 mV (1) (2) (3) (4) (5) Supply voltages VCC, VCCI, VOFFSET, VBIAS, and VRESET are all required for proper DMD operation. VSS must also be connected. All voltages are referenced to common ground VSS. VOFFSET supply transients must fall within specified max voltages. To prevent excess current, the supply voltage delta |VCCI – VCC| must be less than specified limit. To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified limit. Refer to Power Supply Requirements for additional information. (6) Tester Conditions for VIH and VIL: Frequency = 60 MHz. Maximum Rise Time = 2.5 ns @ (20% to 80%) Frequency = 60 MHz. Maximum Fall Time = 2.5 ns @ (80% to 20%) (7) PWRDNZ input pin resets the SCP and disables the LVDS receivers. PWRDNZ input pin overrides SCPENZ input pin and tri-states the SCPDO output pin. (8) The SCP clock is a gated clock. Duty cycle shall be 50% ± 10%. SCP parameter is related to the frequency of DCLK. (9) Refer to Figure 3. (10) SCP internal oscillator is specified to operate all SCP registers. For all SCP operations, DCLK is required. (11) Refer to Figure 4, Figure 5, and Figure 6. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 9 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) MIN (11) VLVDS LVDS voltage tLVDS_RSTZ Time required for LVDS receivers to recover from PWRDNZ ZIN Internal differential termination resistance 95 Line differential impedance (PWB/trace) 90 ZLINE ENVIRONMENTAL (12) TARRAY 0 mV 10 ns 105 Ω 110 Ω 10 40 to 65 (16) °C 0 10 °C 10 65 °C 10 °C |TDELTA| Absolute Temperature delta between the window test points (TP2, TP3) and the ceramic test point TP1 (18) ILLVIS Illumination, wavelengths between 420 nm and 700 nm Thermally Limited (19) Relative Humidity (non-condensing) TARRAY 2000 (13) (14) (17) TWINDOW ENVIRONMENTAL UNIT Array temperature, Long-term operational (13) (14) (15) Window Temperature test points TP2 and TP3, Longterm operational. (15) (12) 100 MAX For Illumination Source Between 420 nm and 700 nm Array temperature, Short-term operational RH NOM mW/cm2 95% For Illumination Source Between 400 nm and 420 nm Array temperature, Long-term operational (13) (14) (15) 20 30 (16) °C (13) (14) (17) 0 20 °C 30 °C Array temperature, Short-term operational TWINDOW Window Temperature test points TP2 and TP3, Longterm operational. (15) |TDELTA| Absolute Temperature delta between the window test points (TP2, TP3) and the ceramic test point TP1 (18) 10 °C ILLVIS Illumination, wavelengths between 400 and 420 nm 10 W/cm2 RH Relative Humidity (non-condensing) ENVIRONMENTAL (12) For Illumination Source <400 nm and >700 nm TARRAY 95% Array temperature, Long-term operational (13) (14) (15) 10 40 to 65 (16) °C (13) (14) (17) 0 10 °C 10 65 °C 10 °C Array temperature, Short-term operational TWINDOW Window Temperature test points TP2 and TP3, Longterm operational. (15) |TDELTA| Absolute Temperature delta between the window test points (TP2, TP3) and the ceramic test point TP1 (18) ILLUV Illumination, wavelength < 400 nm 0.68 mW/cm2 ILLIR Illumination, wavelength > 700 nm 10 mW/cm2 RH Relative Humidity (non-condensing) 95% (12) Optimal, long-term performance and optical effciency of the Digital Micromirror Device (DMD) can be affected by various application parameters, including illumination spectrum, illumination power density, micromirror landed duty-cycle, ambient temperature (storage and operating), DMD temperature, ambient humidity (storage and operating), and power on or off duty cycle. TI recommends that application-specific effects be considered as early as possible in the design cycle. (13) Simultaneous exposure of the DMD to the maximum Recommended Operating Conditions for temperature and UV illumination will reduce device lifetime. (14) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point (TP1) shown in Figure 15 and the package thermal resistance Thermal Information using Micromirror Array Temperature Calculation. (15) Long-term is defined as the usable life of the device. (16) Per Figure 1, the maximum operational case temperature should be derated based on the micromirror landed duty cycle that the DMD experiences in the end application. Refer to Micromirror Landed-on/Landed-Off Duty Cycle for a definition of micromirror landed duty cycle. (17) Array and Window temperatures beyond those specified as long-term are recommended for short-term conditions only (power- up). Short-term is defined as cumulative time over the usable life of the device and is less than 500 hours. (18) Temperature delta is the highest difference between the ceramic test point (TP1) and window test points (TP2) and (TP3) in Figure 15. (19) Refer to Thermal Information and Micromirror Array Temperature Calculation. 10 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 Max Recommended DMD Temperature ± Operational ( 0C) www.ti.com 80 70 60 50 40 30 0/100 100/0 5/95 95/5 10/90 15/85 90/10 85/15 20/80 25/75 80/20 75/25 30/70 35/65 40/60 45/55 50/50 70/30 65/35 6040 55/45 Micromirror Landed Duty Cycle Figure 1. Max Recommended DMD Temperature – Derating Curve 6.5 Thermal Information DLP6500 THERMAL METRIC (1) FLQ (CLGA) UNIT 203 PINS Active Area to Case Ceramic Thermal resistance (1) (1) 0.7 °C/W The DMD is designed to conduct absorbed and dissipated heat to the back of the package where it can be removed by an appropriate heat sink. The heat sink and cooling system must be capable of maintaining the package within the temperature range specified in the Recommended Operating Conditions. The total heat load on the DMD is largely driven by the incident light absorbed by the active area; although other contributions include light energy absorbed by the window aperture and electrical power dissipation of the array. Optical systems should be designed to minimize the light energy falling outside the window clear aperture since any additional thermal load in this area can significantly degrade the reliability of the device. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 11 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 6.6 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS (1) DESCRIPTION MIN TYP MAX 2.4 UNIT VOH High-level output voltage VCC = 3 V, IOH = –20 mA VOL Low level output voltage VCC = 3.6 V, IOL = 15 mA 0.4 V V IIH High–level input current (2) (3) VCC = 3.6 V, VI = VCC 250 µA IIL Low level input current VCC = 3.6 V, VI = 0 IOZ High–impedance output current VCC = 3.6 V 10 ICC Supply current (4) VCC = 3.6 V 1076 ICCI Supply current (4) VCCI = 3.6 V 518 IOFFSET Supply current (5) VOFFSET = 8.75 V IBIAS Supply current (5) VBIAS = 16.5 V IRESET Supply current VRESET = –10.5 V ITOTAL Supply current Total Sum 1623 PCC VCC = 3.6 V 3874 PCCI VCCI = 3.6 V 1865 –250 µA µA CURRENT 4 14 11 mA mA mA POWER POFFSET Supply power dissipation PBIAS VOFFSET = 8.75 V 35 VBIAS = 16.5 V PRESET 231 VRESET = –10.5 V mW 116 Supply power dissipation (6) Total Sum 6300 CI Input capacitance ƒ = 1 MHz 10 pF CO Output capacitance ƒ = 1 MHz 10 pF CM Reset group capacitance MBRST(14:0) ƒ = 1 MHz; 1920 × 72 micromirrors 390 pF PTOTAL CAPACITANCE (1) (2) (3) (4) (5) (6) 12 330 All voltages are referenced to common ground VSS. Supply voltages VCC, VCCI, VOFFSET, VBIAS, and VRESET are all required for proper DMD operation. VSS must also be connected. Applies to LVCMOS input pins only. Does not apply to LVDS pins and MBRST pins. LVCMOS input pins utilize an internal 18000 Ω passive resistor for pull-up and pull-down configurations. Refer to Pin Configuration and Functions to determine pull-up or pull-down configuration used. To prevent excess current, the supply voltage delta |VCCI – VCC| must be less than specified limit. To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified limit. Total power on the active micromirror array is the sum of the electrical power dissipation and the absorbed power from the illumination source. See the Micromirror Array Temperature Calculation. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 6.7 Timing Requirements Over Recommended Operating Conditions unless otherwise noted. DESCRIPTION (1) SCP INTERFACE MIN TYP MAX UNIT (2) tr Rise time 20% to 80% 200 ns tƒ Fall time 80% to 20% 200 ns LVDS INTERFACE (2) tr Rise time 20% to 80% 100 400 ps tƒ Fall time 80% to 20% 100 400 ps DCLK_A, 50% to 50% 2.5 DCLK_B, 50% to 50% 2.5 DCLK_A, 50% to 50% 1.19 1.25 DCLK_B, 50% to 50% 1.19 1.25 LVDS CLOCKS (3) tc Cycle time tw Pulse duration ns ns LVDS INTERFACE (3) tsu Setup time tsu Setup time th Hold time th Hold time D_A(15:0) before rising or falling edge of DCLK_A 0.2 D_B(15:0) before rising or falling edge of DCLK_B 0.2 SCTRL_A before rising or falling edge of DCLK_A 0.2 SCTRL_B before rising or falling edge of DCLK_B 0.2 D_A(15:0) after rising or falling edge of DCLK_A 0.5 D_B(15:0) after rising or falling edge of DCLK_B 0.5 SCTRL_A after rising or falling edge of DCLK_A 0.5 SCTRL_B after rising or falling edge of DCLK_B 0.5 ns ns ns ns LVDS INTERFACE (4) tskew (1) (2) (3) (4) Skew time Channel A includes the following LVDS pairs: DCLK_AP and DCLK_AN SCTRL_AP and SCTRL_AN D_AP(15:0) and D_AN(15:0) Channel B relative to Channel A –1.25 Channel B includes the following LVDS pairs: DCLK_BP and DCLK_BN SCTRL_BP and SCTRL_BN D_BP(15:0) and D_BN(15:0) 1.25 ns Refer to Pin Configuration and Functions for pin details. Refer to Figure 7. Refer to Figure 8. Refer to Figure 9. Timing Diagrams The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be taken into account. Figure 2 shows an equivalent test load circuit for the output under test. The load capacitance value stated is only for characterization and measurement of AC timing signals. This load capacitance value does not indicate the maximum load the device is capable of driving. Timing reference loads are not intended as a precise representation of any particular system environment or depiction of the actual load presented by a production test. System designers should use IBIS or other simulation tools to correlate the timing reference load to a system environment. Refer to the Application and Implementation section. Device Pin Output Under Test Tester Channel CLOAD Figure 2. Test Load Circuit Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 13 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com tc SCPCLK fclock = 1 / tc 50% 50% tSCP_SKEW SCPDI 50% tSCP_DELAY SCPD0 50% Not to scale. Refer to SCP Interface section of the Recommended Operating Conditions table. Figure 3. SCP Timing Parameters (VIP + VIN) / 2 DCLK_P , SCTRL_P , D_P(0:?) LVDS Receiver VID VIP DCLK_N , SCTRL_N , D_N(0:?) VCM VIN Refer to the LVDS Interface section of the Recommended Operating Conditions table. Refer to Pin Configuration and Functions for a list of LVDS pins. Figure 4. LVDS Voltage Definitions (References) 14 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 VLVDS max = VCM max + | 1/2 * VID max | VCM VID VLVDS min = VCM min ± | 1/2 * VID max | Not to scale. Refer to the LVDS Interface section of the Recommended Operating Conditions table. Figure 5. LVDS Voltage Parameters DCLK_P , SCTRL_P , D_P(0:?) ESD Internal Termination LVDS Receiver DCLK_N , SCTRL_N , D_N(0:?) ESD Refer to LVDS Interface section of the Recommended Operating Conditions table Refer to Pin Configuration and Functions for list of LVDS pins. Figure 6. LVDS Equivalent Input Circuit LVDS Interface SCP Interface 1.0 * VCC 1.0 * VID VCM 0.0 * VCC 0.0 * VID tr tf tr tf Not to scale. Refer to the Timing Requirements table. Refer to Pin Configuration and Functions for list of LVDS pins and SCP pins. Figure 7. Rise Time and Fall Time Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 15 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com tc tw tw DCLK_P DCLK_N 50% th th tsu tsu D_P(0:?) D_N(0:?) 50% th th tsu tsu SCTRL_P SCTRL_N 50% Not to scale. Refer to LVDS INTERFACE section in the Timing Requirements table. Figure 8. Timing Requirement Parameter Definitions DCLK_P DCLK_N 50% D_P(0:?) D_N(0:?) 50% SCTRL_P SCTRL_N 50% tskew DCLK_P DCLK_N 50% D_P(0:?) D_N(0:?) 50% SCTRL_P SCTRL_N 50% Not to scale. Refer to LVDS INTERFACE in the Timing Requirements table. Figure 9. LVDS Interface Channel Skew Definition 16 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 6.8 Typical Characteristics When the DMD is controlled by the DLPC900, the digital controller has four modes of operation. 1. Video Mode 2. Video Pattern Mode 3. Pre-Stored Pattern Mode 4. Pattern On-The-Fly Mode In video mode, the video source is displayed on the DMD at the rate of the incoming video source. In modes 2, 3, and 4, the pattern rates depend on the bit depth as shown in Table 1. Table 1. DLPC900 with DLP6500 Pattern Rate versus Bit Depth BIT DEPTH VIDEO PATTERN MODE (Hz) PRE-STORED or PATTERN ON-THE-FLY MODE (Hz) 1 2880 9523 2 1440 3289 3 960 2638 4 720 1364 5 480 823 6 480 672 7 360 500 8 247 247 When the DLP6500 DMD is controlled by the DLPC910, the controller operates in pattern mode only. With proper illumination modulation, bit depths greater than 1 can be achieved. Table Table 2 shows the pattern rates for each bit depth. Table 2. DLPC910 with DLP6500 Pattern Rate versus Bit Depth BIT DEPTH PATTERN RATE (Hz) 1 11574 2 5787 3 3858 4 2893 5 2315 6 1929 7 1653 8 1446 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 17 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 6.9 System Mounting Interface Loads PARAMETER Maximum system mounting interface load to be applied to the: MIN NOM MAX UNIT Thermal Interface area (See Figure 10) 25 lbs Electrical Interface area 95 lbs 90 lbs Datum “A” Interface area (1) Thermal Interface Area Electrical Interface Area (all area except thermal area) Other Areas Datum ‘A’ Area Figure 10. System Mounting Interface Loads (1) 18 Combined loads of the thermal and electrical interface areas in excess of Datum “A” load shall be evenly distributed outside the Datum “A” area (95 + 25 – Datum “A). Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 6.10 Micromirror Array Physical Characteristics VALUE UNIT M Number of active columns PARAMETER 1920 micromirrors N Number of active rows 1080 micromirrors P Micromirror (pixel) pitch µm M×P See Figure 11 14.5152 mm Micromirror active array height N×P 8.1648 mm Micromirror active border Pond of micromirror (POM) (1) 14 micromirrors /side M±4 M±3 M±2 M±1 The structure and qualities of the border around the active array includes a band of partially functional micromirrors called the POM. These micromirrors are structurally and/or electrically prevented from tilting toward the bright or ON state, but still require an electrical bias to tilt toward OFF. 0 1 2 3 (1) 7.56 Micromirror active array width 0 1 2 3 DMD Active Array NxP M x N Micromirrors N±4 N±3 N±2 N±1 MxP P Border micromirrors omitted for clarity. Details omitted for clarity. Not to scale. P P P Refer to section Micromirror Array Physical Characteristics table for M, N, and P specifications. Figure 11. Micromirror Array Physical Characteristics Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 19 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 6.11 Micromirror Array Optical Characteristics See Optical Interface and System Image Quality for important information. PARAMETER α Micromirror tilt angle β Micromirror tilt angle tolerance (1) Micromirror tilt direction CONDITIONS DMD landed state –1 Figure 12 Number of out-of-specification micromirrors NOM 44 45 Adjacent micromirrors (7) Typical performance ° ° 46 ° 10 2.5 DMD efficiency within the wavelength range 400 nm to 420 nm (10) 68% DMD photopic efficiency within the wavelength range 420 nm to 700 nm (10) 66% UNIT 1 0 Non-adjacent micromirrors (8) (9) MAX 12 (2) (3) (4) (5) (5) (6) (7) Micromirror crossover time MIN (1) micromirrors μs (1) (2) (3) (4) Measured relative to the plane formed by the overall micromirror array. Additional variation exists between the micromirror array and the package datums. Represents the landed tilt angle variation relative to the nominal landed tilt angle. Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices. (5) For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations, system efficiency variations or system contrast variations. (6) When the micromirror array is landed (not parked), the tilt direction of each individual micromirror is dictated by the binary contents of the CMOS memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in the ON State direction. A binary value of 0 results in a micromirror landing in the OFF State direction. (7) An out-of-specification micromirror is defined as a micromirror that is unable to transition between the two landed states within the specified Micromirror Switching Time. (8) Micromirror crossover time is primarily a function of the natural response time of the micromirrors. (9) Performance as measured at the start of life. (10) Efficiency numbers assume 24-degree illumination angle, F/2.4 illumination and collection cones, uniform source spectrum, and uniform pupil illumination. Efficiency numbers assume 100% electronic mirror duty cycle and do not include optical overfill loss. Note that this number is specified under conditions described above and deviations from the specified conditions could result in decreased efficiency. M±4 M±3 M±2 M±1 illumination 0 1 2 3 Not To Scale 0 1 2 3 On-State Tilt Direction 45° Off-State Tilt Direction N±4 N±3 N±2 N±1 Refer to section Micromirror Array Physical Characteristics table for M, N, and P specifications. Figure 12. Micromirror Landed Orientation and Tilt 20 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 6.12 Window Characteristics PARAMETER (1) CONDITIONS Window material designation Corning 7056 Window refractive index at wavelength 589 nm Window aperture (2) Illumination overfill (3) Window transmittance, single–pass through both surfaces and glass (4) (1) (2) (3) (4) See MIN TYP MAX UNIT 1.487 (2) See (3) At wavelength 405 nm. Applies to 0° and 24° AOI only. 95% Minimum within the wavelength range 420 nm to 680 nm. Applies to all angles 0° to 30° AOI. 97% Average over the wavelength range 420 nm to 680 nm. Applies to all angles 30° to 45° AOI. 97% See Window Characteristics and Optics for more information. For details regarding the size and location of the window aperture, see the package mechanical characteristics listed in the Mechanical ICD in section Mechanical, Packaging, and Orderable Information. Refer to Illumination Overfill. See the TI application report DLPA031, Wavelength Transmittance Considerations for DLP® DMD Window. 6.13 Chipset Component Usage Specification The DLP6500 is a component of one or more DLP chipsets. Reliable function and operation of the DLP6500 requires that it be used in conjunction with the other components of the applicable DLP chipset, including those components that contain or implement TI DMD control technology. TI DMD control technology is the TI technology and devices for operating or controlling a DLP DMD. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 21 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 7 Detailed Description 7.1 Overview DLP6500 DMD is a 0.65 inch diagonal spatial light modulator which consists of an array of highly reflective aluminum micromirrors. Pixel array size and square grid pixel arrangement are shown in Figure 11. The DMD is an electrical input, optical output micro-electrical-mechanical system (MEMS). The electrical interface is Low Voltage Differential Signaling (LVDS), Double Data Rate (DDR). DLP6500 DMD consists of a two-dimensional array of 1-bit CMOS memory cells. The array is organized in a grid of M memory cell columns by N memory cell rows. Refer to the Functional Block Diagram. The positive or negative deflection angle of the micromirrors can be individually controlled by changing the address voltage of underlying CMOS addressing circuitry and micromirror reset signals (MBRST). Each cell of the M × N memory array drives its true and complement (‘Q’ and ‘QB’) data to two electrodes underlying one micromirror, one electrode on each side of the diagonal axis of rotation. Refer to Micromirror Array Optical Characteristics. The micromirrors are electrically tied to the micromirror reset signals (MBRST) and the micromirror array is divided into reset groups. Electrostatic potentials between a micromirror and its memory data electrodes cause the micromirror to tilt toward the illumination source in a DLP projection system or away from it, thus reflecting its incident light into or out of an optical collection aperture. The positive (+) tilt angle state corresponds to an 'on' pixel, and the negative (–) tilt angle state corresponds to an 'off' pixel. Refer to Micromirror Array Optical Characteristics for the ± tilt angle specifications. Refer to Pin Configuration and Functions for more information on micromirror reset control. 22 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 7.2 Functional Block Diagram DATA_A SCTRL_A DCLK_A VSS VCC VCCI VOFFSET VRESET VBIAS MBRST PWRDNZ SCP Not to Scale. Details Omitted for Clarity. See Accompanying Notes in this Section. Channel A Interface Column Read & Write Control Bit Lines Control (0,0) Voltage Generators Voltages Word Lines Micromirror Array Row Bit Lines (M-1, N-1) Control Column Read & Write Control DATA_B SCTRL_B DCLK_B VSS VCC VCCI VOFFSET VRESET VBIAS MBRST RESET_CTRL Channel B Interface For pin details on Channels A, and B, refer to Pin Configuration and Functions and Timing Requirements notes 5 through 8. Refer to Micromirror Array Physical Characteristics for dimensions, orientation, and tilt angle. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 23 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 7.3 Feature Description DLP6500 device consists of highly reflective, digitally switchable, micrometer-sized mirrors (micromirrors) organized in a two-dimensional orthogonal pixel array. Refer to Figure 11 and Figure 13. Each aluminum micromirror is switchable between two discrete angular positions, –α and +α. The angular positions are measured relative to the micromirror array plane, which is parallel to the silicon substrate. Refer to Micromirror Array Optical Characteristics and Figure 14. The parked position of the micromirror is not a latched position and is therefore not necessarily perfectly parallel to the array plane. Individual micromirror flat state angular positions may vary. Tilt direction of the micromirror is perpendicular to the hinge-axis. The on-state landed position is directed toward the left-top edge of the package, as shown in Figure 13. Each individual micromirror is positioned over a corresponding CMOS memory cell. The angular position of a specific micromirror is determined by the binary state (logic 0 or 1) of the corresponding CMOS memory cell contents, after the mirror clocking pulse is applied. The angular position (–α and +α) of the individual micromirrors changes synchronously with a micromirror clocking pulse, rather than being coincident with the CMOS memory cell data update. Writing logic 1 into a memory cell followed by a mirror clocking pulse results in the corresponding micromirror switching to a +α position. Writing logic 0 into a memory cell followed by a mirror clocking pulse results in the corresponding micromirror switching to a – α position. Updating the angular position of the micromirror array consists of two steps. First, update the contents of the CMOS memory. Second, apply a micromirror reset to all or a portion of the micromirror array (depending upon the configuration of the system). Micromirror reset pulses are generated internally by the DLP6500 DMD with application of the pulses being coordinated by the digital controller. For more information, see the TI application report DLPA008A, DMD101: Introduction to Digital Micromirror Device (DMD) Technology. 24 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 Feature Description (continued) Incident Illumination Package Pin A1 Corner DMD Micromirror Array 0 (Border micromirrors eliminated for clarity) M±1 Active Micromirror Array 0 N±1 Micromirror Hinge-Axis Orientation Micromirror Pitch P (um) 45° P (um) P (um) ³2Q-6WDWH´ Tilt Direction ³2II-6WDWH´ Tilt Direction P (um) Refer to Micromirror Array Physical Characteristics, Figure 11, and Figure 12. Figure 13. Micromirror Array, Pitch, Hinge Axis Orientation Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 25 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Feature Description (continued) g n t -L i de n ci tio In ina m u Ill Details Omitted For Clarity. ht Not To Scale. Pa th Package Pin A1 Corner DMD Incident Illumination Two ³2Q-6WDWH´ Micromirrors nt t Path ide Inc n-Ligh atio min Illu nt t Path ide Inc n-Ligh tio ina m Illu Projected-Light Path Two ³2II-6WDWH´ Micromirrors For Reference gh Li eat th t S a ff- P O a±b Flat-State ( ³SDUNHG´ ) Micromirror Position t -a ± b Silicon Substrate ³2Q-6WDWH´ Micromirror Silicon Substrate ³2II-6WDWH´ Micromirror Refer to Micromirror Array Optical Characteristics and Figure 12. Figure 14. Micromirror States: On, Off, Flat 26 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 7.4 Device Functional Modes DLP6500 is part of the chipset comprising of the DLP6500 DMD and a DLPC900 or a DLC910 digitial controller. To ensure reliable operation, the DLP6500 must always be used with one of these digital controllers. DMD functional modes are controlled by the digital controller. See the digital controller datasheet listed in Related Documentation. Contact a TI applications engineer for more information. 7.5 Window Characteristics and Optics NOTE TI assumes no responsibility for image quality artifacts or DMD failures caused by optical system operating conditions exceeding limits described previously. 7.5.1 Optical Interface and System Image Quality TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment optical performance involves making trade-offs between numerous component and system design parameters. Optimizing system optical performance and image quality strongly relate to optical system design parameter trades. Although it is not possible to anticipate every conceivable application, projector image quality and optical performance is contingent on compliance to the optical system operating conditions described in the following sections. 7.5.2 Numerical Aperture and Stray Light Control The angle defined by the numerical aperture of the illumination and projection optics at the DMD optical area should be the same. This angle should not exceed the nominal device mirror tilt angle unless appropriate apertures are added in the illumination and/or projection pupils to block out flat-state and stray light from the projection lens. The mirror tilt angle defines DMD capability to separate the "ON" optical path from any other light path, including undesirable flat-state specular reflections from the DMD window, DMD border structures, or other system surfaces near the DMD such as prism or lens surfaces. If the numerical aperture exceeds the mirror tilt angle, or if the projection numerical aperture angle is more than two degrees larger than the illumination numerical aperture angle, objectionable artifacts in the display’s border and/or active area could occur. 7.5.3 Pupil Match TI’s optical and image quality specifications assume that the exit pupil of the illumination optics is nominally centered within 2° (two degrees) of the entrance pupil of the projection optics. Misalignment of pupils can create objectionable artifacts in the display’s border and/or active area, which may require additional system apertures to control, especially if the numerical aperture of the system exceeds the pixel tilt angle. 7.5.4 Illumination Overfill The active area of the device is surrounded by an aperture on the inside DMD window surface that masks structures of the DMD device assembly from normal view. The aperture is sized to anticipate several optical operating conditions. Overfill light illuminating the window aperture can create artifacts from the edge of the window aperture opening and other surface anomalies that may be visible on the screen. The illumination optical system should be designed to limit light flux incident anywhere on the window aperture from exceeding approximately 10% of the average flux level in the active area. Depending on the particular system’s optical architecture, overfill light may have to be further reduced below the suggested 10% level in order to be acceptable. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 27 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 7.6 Micromirror Array Temperature Calculation Figure 15. DMD Thermal Test Points Micromirror array temperature can be computed analytically from measurement points on the outside of the package, the ceramic package thermal resistance, the electrical power dissipation, and the illumination heat load. The relationship between micromirror array temperature and the reference ceramic temperature is provided by the following equations: TARRAY = TCERAMIC + (QARRAY × RARRAY–TO–CERAMIC) QARRAY = QELECTRICAL + QILLUMINATION QILLUMINATION = (CL2W × SL) (1) (2) (3) Where: TARRAY = Computed micromirror array temperature (°C) TCERAMIC = Measured ceramic temperature (°C), TP1 location in Figure 15 RARRAY–TO–CERAMIC = DMD package thermal resistance from micromirror array to outside ceramic (°C/W) specified in Thermal Information QARRAY = Total DMD power; electrical, specified in Electrical Characteristics, plus absorbed (calculated) (W) QELECTRICAL = Nominal DMD electrical power dissipation (W), specified in Electrical Characteristics CL2W = Conversion constant for screen lumens to absorbed optical power on the DMD (W/lm) specified below SL = Measured ANSI screen lumens (lm) Electrical power dissipation of the DMD is variable and depends on the voltages, data rates and operating frequencies. The nominal electrical power dissipation to use when calculating array temperature is 2.9 Watts. Absorbed optical power from the illumination source is variable and depends on the operating state of the micromirrors and the intensity of the light source. Equations shown above are valid for a 1-chip DMD system with total projection efficiency through the projection lens from DMD to the screen of 87%. The conversion constant CL2W is based on the DMD micromirror array characteristics. It assumes a spectral efficiency of 300 lm/W for the projected light and illumination distribution of 83.7% on the DMD active array, and 16.3% on the DMD array border and window aperture. The conversion constant is calculated to be 0.00274 W/lm. Sample Calculation for typical projection application: TCERAMIC = 55°C, assumed system measurement; see Recommended Operating Conditions for specific limits SL = 2000 lm QELECTRICAL = 2.9 W (see the maximum power specifications in Electrical Characteristics) CL2W = 0.00274 W/lm QARRAY = 2.9 W + (0.00274 W/lm × 2000 lm) = 8.38 W TARRAY = 55°C + (8.38 W × 0.7 × C/W) = 60.87°C 28 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 7.7 Micromirror Landed-on/Landed-Off Duty Cycle 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle The micromirror landed-on/landed-off duty cycle (landed duty cycle) denotes the amount of time (as a percentage) that an individual micromirror is landed in the On–state versus the amount of time the same micromirror is landed in the Off–state. As an example, a landed duty cycle of 100/0 indicates that the referenced pixel is in the On–state 100% of the time (and in the Off–state 0% of the time); whereas 0/100 would indicate that the pixel is in the Off–state 100% of the time. Likewise, 50/50 indicates that the pixel is On 50% of the time and Off 50% of the time. Note that when assessing landed duty cycle, the time spent switching from one state (ON or OFF) to the other state (OFF or ON) is considered negligible and is thus ignored. Since a micromirror can only be landed in one state or the other (On or Off), the two numbers (percentages) always add to 100. 7.7.2 Landed Duty Cycle and Useful Life of the DMD Knowing the long-term average landed duty cycle (of the end product or application) is important because subjecting all (or a portion) of the DMD’s micromirror array (also called the active array) to an asymmetric landed duty cycle for a prolonged period of time can reduce the DMD’s usable life. Note that it is the symmetry/asymmetry of the landed duty cycle that is of relevance. The symmetry of the landed duty cycle is determined by how close the two numbers (percentages) are to being equal. For example, a landed duty cycle of 50/50 is perfectly symmetrical whereas a landed duty cycle of 100/0 or 0/100 is perfectly asymmetrical. Individual DMD mirror duty cycles vary by application as well as the mirror location on the DMD within any specific application. DMD mirror useful life are maximized when every individual mirror within a DMD approaches 50/50 (or 1/1) duty cycle. Therefore, for the DLPC900 and DLP6500 chipset, it is recommended that DMD Idle Mode be enabled as often as possible. Examples are whenever the system is idle, the illumination is disabled, between sequential pattern exposures (if possible), or when the exposure pattern sequence is stopped for any reason. This software mode provides a 50/50 duty cycle across the entire DMD mirror array, where the mirrors are continuously flipped between the on and off states. Refer to the DLPC900 Software Programmer’s Guide DLPU018 for a description of the DMD Idle Mode command. For the DLPC910 and DLP6500 chipset, it is recommended the controlling applications processor provide a 50/50 pattern sequence to the DLPC910 for display on the DLP6500 as often as possible, similar to the above examples stated for the DLPC900. The pattern provides a 50/50 duty cycle across the entire DMD mirror array, where the mirrors are continuously flipped between the on and off states. 7.7.3 Landed Duty Cycle and Operational DMD Temperature Operational DMD Temperature and Landed Duty Cycle interact to affect the DMD’s usable life, and this interaction can be exploited to reduce the impact that an asymmetrical Landed Duty Cycle has on the DMD’s usable life. This is quantified in the de-rating curve shown in Figure 1. The importance of this curve is that: • All points along this curve represent the same usable life. • All points above this curve represent lower usable life (and the further away from the curve, the lower the usable life). • All points below this curve represent higher usable life (and the further away from the curve, the higher the usable life). In practice, this curve specifies the Maximum Operating DMD Temperature that the DMD should be operated at for a give long-term average Landed Duty Cycle. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application During a given period of time, the Landed Duty Cycle of a given pixel follows from the image content being displayed by that pixel. For example, in the simplest case, when displaying pure-white on a given pixel for a given time period, that pixel will experience a 100/0 Landed Duty Cycle during that time period. Likewise, when displaying pure-black, the pixel will experience a 0/100 Landed Duty Cycle. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 29 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Micromirror Landed-on/Landed-Off Duty Cycle (continued) Between the two extremes (ignoring for the moment color and any image processing that may be applied to an incoming image), the Landed Duty Cycle tracks one-to-one with the gray scale value, as shown in Table 3. Table 3. Grayscale Value and Landed Duty Cycle GRAYSCALE VALUE LANDED DUTY CYCLE 0% 0/100 10% 10/90 20% 20/80 30% 30/70 40% 40/60 50% 50/50 60% 60/40 70% 70/30 80% 80/20 90% 90/10 100% 100/0 Accounting for color rendition (but still ignoring image processing) requires knowing both the color intensity (from 0% to 100%) for each constituent primary color (red, green, and/or blue) for the given pixel as well as the color cycle time for each primary color, where “color cycle time” is the total percentage of the frame time that a given primary must be displayed in order to achieve the desired white point. During a given period of time, the landed duty cycle of a given pixel can be calculated as follows: Landed Duty Cycle =(Red_Cycle_% × Red_Scale_Value) + (Green_Cycle_% × Green_Scale_Value) + (Blue_Cycle_% × Blue_Scale_Value) Where: Red_Cycle_%, Green_Cycle_%, and Blue_Cycle_%, represent the percentage of the frame time that Red, Green, and Blue are displayed (respectively) to achieve the desired white point. For example, assume that the red, green and blue color cycle times are 50%, 20%, and 30% respectively (in order to achieve the desired white point), then the Landed Duty Cycle for various combinations of red, green, blue color intensities would be as shown in Table 4. Table 4. Example Landed Duty Cycle for Full-Color 30 Red Cycle Percentage 50% Green Cycle Percentage 20% Blue Cycle Percentage 30% Red Scale Value Green Scale Value Blue Scale Value Landed Duty Cycle 0% 0% 0% 0/100 100% 0% 0% 50/50 0% 100% 0% 20/80 0% 0% 100% 30/70 12% 0% 0% 6/94 0% 35% 0% 7/93 0% 0% 60% 18/82 100% 100% 0% 70/30 0% 100% 100% 50/50 100% 0% 100% 80/20 12% 35% 0% 13/87 0% 35% 60% 25/75 12% 0% 60% 24/76 100% 100% 100% 100/0 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The DLP6500 along with a DLPC900 or a DLPC910 digital controller provide solutions for many applications including structured light and video projection. The DMD is a spatial light modulator, which reflects incoming light from an illumination source to one of two directions, with the primary direction being into a projection or collection optic. Each application is derived primarily from the optical architecture of the system and the format of the data coming into the digitial controller. Applications of interest include machine vision, 3D printing, and lithography. 8.2 Typical Application A typical embedded system application using the DLPC900 digital controller and a DLP6500 is shown in Figure 16. In this configuration, the DLPC900 digital controller supports a 24-bit parallel RGB input, typical of LCD interfaces, from an external source or processor. This system configuration supports still and motion video sources plus sequential pattern mode. Refer to Related Documents for the DLPC900 digital controller datasheet. I2C HDMI DP Processor GUI RAM HEARTBEAT FAULT_STATUS PM_ADDR[22:0],WE DATA[15:0],OE,CS USB_DN,DP LED EN[2:0] I2C_SCL1, I2C_SDA1 P1_A[9:0] Digital Receiver P1_B[9:0] P1_C[9:0] HDMI LED PWM[2:0] PWM DMD_A,B[15:0] DMD Control DMD SSP P1A_CLK, P1_DATEN, P1_VSYNC, P1_HSYNC TRIG_OUT[1:0] Camera TRIG_IN[1:0] JTAG POWER RAILS PWRGOOD POSENSE MOSC TDO[1:0],TRST,TCK RMS[1:0],RTCK LEDs DLPC900 DISPLAYPORT Crystal FAN LED Status LED Driver USB Parallel Flash Flex Host I2C_SCL0 I2C_SDA0 Power Management I2C DLP6500FLQ VCC 12V DC IN Figure 16. DLPC900 and DLP6500 Typical Application Schematic A typical embedded system application using the DLPC910 digital controller and a DLP6500 is shown in Figure 17. In this configuration, the DLPC910 digital controller accepts streaming binary patterns from an external source or processor. This system configuration supports high speed pattern mode. Refer to Related Documents for the DLPC910 digital controller datasheet. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 31 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Typical Application (continued) Illumination Driver Illumination Sensor LVDS Interface DCLKIN(A,B), DVALID(A,B), DIN(A,B)[15:0] USER Interface Connectivity USB Ethernet Row and Block Signals ROWMD(1:0), ROWAD(10:0), BLKMD(1:0), BLKAD(3:0), RST2BLKZ APPS FPGA Control Signals COMP_DATA, NS_FLIP, WDT_ENBLZ, PWR_FLOAT Status Signals RST_ACTIVE, INIT_ACTIVE, ECP2_FINISHED DLPC910 JTAG(3:0) DLPR910 Volatile And Non-Volatile Storage PGM(4:0) DOUT(A,B)[15:0] DCLKOUT(A,B) SCTRL(A,B) RESET_ADDR(3:0) RESET_MODE(1:0) RESET_SEL(1:0) RESET_STRB RESET_OEZ RESET_IRQZ SCP BUS(3:0) RESETZ DLP6500 CTRL_RSTZ I2C OSC 50 MHz VLED0 VLED1 Power Management Figure 17. DLPC910 and DLP6500 Typical Application Schematic 8.2.1 Design Requirements Detailed design requirements are located in the digital controller datasheet. Refer to Related Documents. 8.2.2 Detailed Design Procedure See the reference design schematic for connecting together the DLPC900 controller and the DLP6500 DMD. An example board layout is included in the reference design data base. Layout guidelines should be followed for reliability. See the reference design schematic for connecting together the DLPC910 controller and the DLP6500 DMD. An example board layout is included in the reference design data base. Layout guidelines should be followed for reliability. 32 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 9 Power Supply Requirements 9.1 DMD Power Supply Requirements The following power supplies are all required to operate the DMD: VCC, VCCI, VOFFSET, VBIAS, and VRESET. VSS must also be connected. DMD power-up and power-down sequencing is strictly controlled by the digital controller. CAUTION For reliable operation of the DMD, the following power supply sequencing requirements must be followed. Failure to adhere to the prescribed power-up and power-down procedures may affect device reliability. VCC, VCCI, VOFFSET, VBIAS, and VRESET power supplies have to be coordinated during power-up and powerdown operations. VSS must also be connected. Failure to meet any of the below requirements will result in a significant reduction in the DMD’s reliability and lifetime. Refer to Figure 18. 9.2 DMD Power Supply Power-Up Procedure • • • • • During power-up, VCC and VCCI must always start and settle before VOFFSET, VBIAS, and VRESET voltages are applied to the DMD. During power-up, it is a strict requirement that the delta between VBIAS and VOFFSET must be within the specified limit shown in Recommended Operating Conditions. During power-up, VBIAS does not have to start after VOFFSET. During power-up, there is no requirement for the relative timing of VRESET with respect to VOFFSET and VBIAS. Power supply slew rates during power-up are flexible, provided that the transient voltage levels follow the requirements listed in Absolute Maximum Ratings, in Recommended Operating Conditions, and in Figure 18. During power-up, LVCMOS input pins shall not be driven high until after VCC and VCCI have settled at operating voltages listed in Recommended Operating Conditions. 9.3 DMD Mirror Park Sequence Requirements 9.3.1 DLPC900 For correct power down operation of the DLP6500 DMD with the DLPC900, the following power down procedure must be executed. Prior to an anticipated power removal, the controlling applications processor must command the DLPC900 to enter Standby mode by using the Power Mode command and then wait for a minimum of 20 ms to allow the DLPC900 to complete the power down procedure. This procedure will assure the mirrors are in a flat state. Following this procedure, the power can be safely removed. In the event of an unanticipated power loss, the power management system must detect the input power loss, command the DLPC900 to enter Standby mode by using the Power Mode command, and then maintain all operating power levels of the DLPC900 and the DLP6500 DMD for a minimum of 20 ms to allow the DLPC900 to complete the power down procedure. Following this procedure, the power can be allowed to fall below safe operating levels. Refer to the DLPC900 datasheet for more details on power down requirements. In both anticipated power down and unanticipated power loss, the DLPC900 is commanded over the USB/I2C interface, and then the DLPC900 loades the correct power down sequence to the DMD. Communicating over the USB/I2C and loading the power down sequence accounts for most of the 20 ms. Compared to the DLPC910, the controlling processor only needs to assert the PWR_FLOAT pin and wait for a minimum of 500 µs. The controlling applications processor can resume normal operations by commanding the DLPC900 to enter Normal mode. See Power Mode command in the DLPC900 Software Programmer’s Guide DLPU018 for a description of this command. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 33 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com DMD Mirror Park Sequence Requirements (continued) 9.3.2 DLPC910 For correct power down operation of the DLP6500 DMD with the DLPC910, the following power down procedure must be executed. Prior to an anticipated power removal, assert PWR_FLOAT to the DLPC910 for a minimum of 500 μs to allow the DLPC910 to complete the power down procedure. This procedure will assure the DMD mirrors are in a flat state. Following this procedure, the power can be safely removed. In the event of an unanticipated power loss, the power management system must detect the input power loss, assert PWR_FLOAT to the DLPC910, and maintain all operating power levels of the DLPC910 and the DLP6500 DMD for a minimum of 500 μs to allow the DLPC910 to complete the power down procedure. Refer to the DLPC910 datasheet for more details on power down requirements. To restart after assertion of PWR_FLOAT without removing power, the DLPC910 must be reset by setting CTRL_RSTZ low (logic 0) for 50 ms, and then back to high (logic 1), or power to the DLPC910 must be cycled. 9.4 DMD Power Supply Power-Down Procedure Refer to DMD Mirror Park Sequence Requirements for the power down procedure. • During power-down, VCC and VCCI must be supplied until after VBIAS, VRESET, and VOFFSET are discharged to within the specified limit of ground. Refer to Table 5. • During power-down, it is a strict requirement that the delta between VBIAS and VOFFSET must be within the specified limit shown in Recommended Operating Conditions. During power-down, it is not mandatory to stop driving VBIAS prior to VOFFSET. • During power-down, there is no requirement for the relative timing of VRESET with respect to VOFFSET and VBIAS. • Power supply slew rates during power-down are flexible, provided that the transient voltage levels follow the requirements listed in Absolute Maximum Ratings, in Recommended Operating Conditions, and in Figure 18. • During power-down, LVCMOS input pins must be less than specified in Recommended Operating Conditions. 34 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 DMD Power Supply Power-Down Procedure (continued) Note 3 EN_BIAS, EN_OFFSET, and EN_RESET are disabled by DLP controller software or PWRDNZ signal control VBIAS, VOFFSET, and VRESET are disabled by DLP controller software Power Off VCC / VCCI Mirror Park Sequence RESET_OEZ VSS ¸¸ Note 6 VSS VCC / VCCI PWRDNZ ¸¸ VSS VCC VCCI VCC / VCCI VSS EN_BIAS EN_OFFSET EN_RESET VSS VCC / VCCI VBIAS VSS ¸¸ VSS ¸¸ ¸¸ Note 3 VSS VBIAS VBIAS VBIAS < Specification Note 1 Note 1 VSS ¨9 < Specification ¨9 < Specification VOFFSET ¸¸ Note 4 VSS VOFFSET VOFFSET VOFFSET < Specification Note 4 VSS VSS Note 5 VSS Refer to specifications listed in Recommended Operating Conditions. Waveforms are not to scale. Details are omitted for clarity. VRESET < Specification Note 4 VSS VRESET VRESET > Specification VRESET ¸¸ VRESET VCC LVCMOS Inputs ¸¸ VSS VSS Note 2 LVDS Inputs Note 2 ¸¸ VSS VSS Figure 18. DMD Power Supply Sequencing Requirements Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 35 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com DMD Power Supply Power-Down Procedure (continued) 1. To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than specified in Recommended Operating Conditions. OEMs may find that the most reliable way to ensure this is to power VOFFSET prior to VBIAS during power-up and to remove VBIAS prior to VOFFSET during power-down. 2. LVDS signals are less than the input differential voltage (VID) maximum specified in Recommended Operating Conditions. During power-down, LVDS signals are less than the high level input voltage (VIH) maximum specified in Recommended Operating Conditions. 3. When system power is interrupted, the DLP digital controller initiates a power-down sequence that activates PWRDNZ and disables VBIAS, VRESET and VOFFSET after the micromirror park sequence. Software power-down disables VBIAS, VRESET, and VOFFSET after the micromirror park sequence through software control. For either case, enable signals EN_BIAS, EN_OFFSET, and EN_RESET are used to disable VBIAS, VOFFSET, and VRESET, respectfully. 4. Refer to DMD Power Down Sequence Requirements. 5. Figure not to scale. Details have been omitted for clarity. Refer Recommended Operating Conditions. 6. Refer to DMD Mirror Park Sequence Requirements for details on powering down the DMD. Table 5. DMD Power-Down Sequence Requirements MAX UNIT VBIAS Supply voltage level during power–down sequence PARAMETER 4.0 V VOFFSET Supply voltage level during power–down sequence 4.0 V VRESET Supply voltage level during power–down sequence 0.5 V 36 Submit Documentation Feedback MIN –4.0 Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 10 Layout 10.1 Layout Guidelines The DLP6500 along with its dedicated digital controller provides a solution for many applications including structured light and video projection. This section provides layout guidelines for the DLP6500. 10.1.1 General PCB Recommendations The PCB shall be designed to IPC2221 and IPC2222, Class 2, Type Z, at level B producibility and built to IPC6011 and IPC6012, class 2. The PCB board thickness to be 0.062 inches +/- 10%, using standard FR-4 material, and applies after all lamination and plating processes, measured from copper to copper. Two-ounce copper planes are recommended in the PCB design in order to achieve needed thermal connectivity. Refer to Related Documents for the digital controller datasheet for related information on the DMD Interface Considerations. High-speed interface waveform quality and timing on the digital controller (that is, the LVDS DMD interface) is dependent on the following factors: • Total length of the interconnect system • Spacing between traces • Characteristic impedance • Etch losses • How well matched the lengths are across the interface Thus, ensuring positive timing margin requires attention to many factors. As an example, DMD interface system timing margin can be calculated as follows: • Setup Margin = (controller output setup) – (DMD input setup) – (PCB routing mismatch) – (PCB SI degradation) • Hold-time Margin = (controller output hold) – (DMD input hold) – (PCB routing mismatch) – (PCB SI degradation) The PCB SI degradation is the signal integrity degradation due to PCB affects which includes such things as simultaneously switching output (SSO) noise, crosstalk, and inter-symbol-interference (ISI) noise. The I/O timing parameters can be found in the digital controller datasheet. Similarly, PCB routing mismatch can be easily budgeted and met via controlled PCB routing. However, PCB SI degradation is not as easy to determine. In an attempt to minimize the signal integrity analysis that would otherwise be required, the following PCB design guidelines provide a reference of an interconnect system that satisfies both waveform quality and timing requirements (accounting for both PCB routing mismatch and PCB SI degradation). Deviation from these recommendations should be confirmed with PCB signal integrity analysis or lab measurements. 10.2 Layout Example 10.2.1 Board Stack and Impedance Requirements Refer to Figure 19 for guidance on the parameters. PCB design: Configuration: Asymmetric dual stripline Etch thickness (T): 1.0-oz copper (1.2 mil) Flex etch thickness (T): 0.5-oz copper (0.6 mil) Single-ended signal impedance: 50 Ω (±10%) Differential signal impedance: 100 Ω (±10%) Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 37 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com Layout Example (continued) PCB stack-up: Reference plane 1 is assumed to be a ground plane for proper return path. Asymmetric dual stripline Reference plane 2 is assumed to be the I/O power plane or ground. 1.0-oz copper (1.2 mil) Dielectric FR4, (Er): 4.2 (nominal) Signal trace distance to reference plane 1 (H1): 5.0 mil (nominal) Signal trace distance to reference plane 2 (H2): 34.2 mil (nominal) Figure 19. PCB Stack Geometries Table 6. General PCB Routing (Applies to All Corresponding PCB Signals) PARAMETER Line width (W) 38 APPLICATION SINGLE-ENDED SIGNALS DIFFERENTIAL PAIRS UNIT Escape routing in ball field 4 (0.1) 4 (0.1) mil (mm) PCB etch data or control 7 (0.18) 4.25 (0.11) mil (mm) PCB etch clocks 7 (0.18) 4.25 (0.11) mil (mm) Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 Layout Example (continued) Table 6. General PCB Routing (Applies to All Corresponding PCB Signals) (continued) PARAMETER APPLICATION SINGLE-ENDED SIGNALS DIFFERENTIAL PAIRS UNIT PCB etch data or control N/A 5.75 (1) –0.15 mil (mm) PCB etch clocks N/A 5.75 (1) –0.15 mil (mm) PCB etch data or control N/A 20 (0.51) mil (mm) PCB etch clocks N/A 20 (0.51) mil (mm) Escape routing in ball field 4 (0.1) 4 (0.1) mil (mm) PCB etch data or control 10 (0.25) 20 (0.51) mil (mm) PCB etch clocks 20 (0.51) 20 (0.51) mil (mm) N/A 12 –0.3 mil (mm) Differential signal pair spacing (S) Minimum differential pair-to-pair spacing (S) Minimum line spacing to other signals (S) Maximum differential pair P-to-N length mismatch (1) Total data Spacing may vary to maintain differential impedance requirements Table 7. DMD Interface Specific Routing SIGNAL GROUP LENGTH MATCHING INTERFACE SIGNAL GROUP REFERENCE SIGNAL MAX MISMATCH UNIT DMD (LVDS) SCTRL_AN, SCTRL_AP D_AP(15:0), D_AN(15:0) DCK_AP/ DCKA_AN ± 150 (± 3.81) mil (mm) DMD (LVDS) SCTRL_BN, SCTRL_BP D_BP(15:0), D_BN(15:0) DCK_BP/ DCK_BN ± 150 (± 3.81) mil (mm) Number of layer changes: • Single-ended signals: Minimize • Differential signals: Individual differential pairs can be routed on different layers but the signals of a given pair should not change layers. Table 8. DMD Signal Routing Length (1) BUS MIN MAX UNIT DMD (LVDS) 50 375 mm (1) Max signal routing length includes escape routing. Stubs: Stubs should be avoided. Termination Requirements: DMD interface: None – The DMD receiver is differentially terminated to 100 Ω internally. Connector (DMD-LVDS interface bus only): High-speed connectors that meet the following requirements should be used: • Differential crosstalk: <5% • Differential impedance: 75 to 125 Ω Routing requirements for right-angle connectors: When using right-angle connectors, P-N pairs should be routed in the same row to minimize delay mismatch. When using right-angle connectors, propagation delay difference for each row should be accounted for on associated PCB etch lengths. Voltage or low frequency signals should be routed on the outer layers. Signal trace corners shall be no sharper than 45 degrees. Adjacent signal layers shall have the predominant traces routed orthogonal to each other. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 39 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com These guidelines will produce a maximum PCB routing mismatch of 4.41 mm (0.174 inch) or approximately 30.4 ps, assuming 175 ps/inch FR4 propagation delay. These PCB routing guidelines will result in approximately 25-ps system setup margin and 25-ps system hold margin for the DMD interface after accounting for signal integrity degradation as well as routing mismatch. Both the digital controller output timing parameters and the DLP6500 DMD input timing parameters include timing budget to account for their respective internal package routing skew. 10.2.1.1 Power Planes Signal routing is NOT allowed on the power and ground planes. All device pin and via connections to this plane shall use a thermal relief with a minimum of four spokes. The power plane shall clear the edge of the PCB by 0.2”. Prior to routing, vias connecting all digital ground layers (GND) should be placed around the edge of the rigid PWB regions 0.025” from the board edges with a 0.100” spacing. It is also desirable to have all internal digital ground (GND) planes connected together in as many places as possible. If possible, all internal ground planes should be connected together with a minimum distance between connections of 0.5”. Extra vias are not required if there are sufficient ground vias due to normal ground connections of devices. NOTE: All signal routing and signal vias should be inside the perimeter ring of ground vias. Power and Ground pins of each component shall be connected to the power and ground planes with one via for each pin. Trace lengths for component power and ground pins should be minimized (ideally, less than 0.100”). Unused or spare device pins that are connected to power or ground may be connected together with a single via to power or ground. Ground plane slots are NOT allowed. Route VOFFSET, VBIAS, and VRESET as a wide trace >20mils (wider if space allows) with 20 mils spacing. 10.2.1.2 LVDS Signals The LVDS signals shall be first. Each pair of differential signals must be routed together at a constant separation such that constant differential impedance (as in section Board Stack and Impedance Requirements) is maintained throughout the length. Avoid sharp turns and layer switching while keeping lengths to a minimum. The distance from one pair of differential signals to another shall be at least 2 times the distance within the pair. 10.2.1.3 Critical Signals The critical signals on the board must be hand routed in the order specified below. In case of length matching requirements, the longer signals should be routed in a serpentine fashion, keeping the number of turns to a minimum and the turn angles no sharper than 45 degrees. Avoid routing long trace all around the PCB. Table 9. Timing Critical Signals GROUP 1 2 40 SIGNAL CONSTRAINTS D_AP(0:15), D_AN(0:15), DCLK_AP, DCLK_AN, SCTRL_AN, SCTRL_AP, D_BP(0:15), D_BN (0:15), DCLK_BP, DCLK_BN, SCTRL_BN, SCTRL_BP RESET_ADDR(0:3), RESET_MODE(0:1), RESET_OEZ, RESET_SEL(0:1) RESET_STROBE, RESET_IRQZ. 3 SCP_CLK, SCP_DO, SCP_DI, SCP_ENZ. 4 Others ROUTING LAYERS Internal signal layers. Avoid layer switching when routing these signals. Refer to Table 6 and Table 7 Internal signal layers. Top and bottom as required. Any No matching/length requirement Submit Documentation Feedback Any Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 10.2.1.4 Flex Connector Plating Plate all the pad area on top layer of flex connection with a minimum of 35 and maximum 50 micro-inches of electrolytic hard gold over a minimum of 150 micro-inches of electrolytic nickel. 10.2.1.5 Device Placement Unless otherwise specified, all major components should be placed on top layer. Small components such as ceramic, non-polarized capacitors, resistors and resistor networks can be placed on bottom layer. All high frequency de-coupling capacitors for the ICs shall be placed near the parts. Distribute the capacitors evenly around the IC and locate them as close to the device’s power pins as possible (preferably with no vias). In the case where an IC has multiple de-coupling capacitors with different values, alternate the values of those that are side by side as much as possible and place the smaller value capacitor closer to the device. 10.2.1.6 Device Orientation It is desirable to have all polarized capacitors oriented with their positive terminals in the same direction. If polarized capacitors are oriented both horizontally and vertically, then all horizontal capacitors should be oriented with the “+” terminal the same direction and likewise for the vertically oriented ones. 10.2.1.7 Fiducials Fiducials for automatic component insertion should be placed on the board according to the following guidelines or on recommendation from manufacturer: • Fiducials for optical auto insertion alignment shall be placed on three corners of both sides of the PWB. • Fiducials shall also be placed in the center of the land patterns for fine pitch components (lead spacing <0.05”). • Fiducials should be 0.050 inch copper with 0.100 inch cutout (antipad). Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 41 DLP6500 DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 www.ti.com 11 Device and Documentation Support 11.1 Device Support 11.1.1 Device Nomenclature Table 10. Package Specific Information PACKAGE TYPE PINS CONNECTOR FLQ 203 LGA DLP6500 _ FLQ Package Type Revision Device Descriptor Figure 20. Part Number Description 11.1.2 Device Markings The device marking will include both human-readable information and a 2-dimensional matrix code. The humanreadable information is described in Figure 21. The 2-dimensional matrix code is an alpha-numeric character string that contains the DMD part number, Part 1 of Serial Number, and Part 2 of Serial Number. The first character of the DMD Serial Number (part 1) is the manufacturing year. The second character of the DMD Serial Number (part 1) is the manufacturing month. The last character of the DMD Serial Number (part 2) is the bias voltage bin letter. TI Internal Numbering 2 Dimensional Matrix Code (DMD Part Number and Serial Number) DMD Part Number YYYYYYY DLP6500 _ FLQ GHXXXXX LLLLLLM LLLLLL Part 2 of Serial Number (7 characters) Part 1 of Serial Number (7 characters) TI Internal Numbering Figure 21. DMD Marking Locations 42 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 DLP6500 www.ti.com DLPS040A – OCTOBER 2014 – REVISED OCTOBER 2016 11.2 Documentation Support 11.2.1 Related Documentation The following documents contain additional information related to the use of the DLP6500 device. Table 11. Related Documents DOCUMENT DLPC900 Digital Controller Datasheet DLPS037 DLPC900 Software Programmer’s Guide DLPU018 DLPC910 Digital Controller Datasheet DLPS064 DMD101: Introduction to Digital Micromirror Device (DMD) Technology DLPA008 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. DLP is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Product Folder Links: DLP6500 43 PACKAGE OPTION ADDENDUM www.ti.com 2-Nov-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) DLP6500BFLQ ACTIVE CLGA FLQ 203 1 TBD Call TI Call TI DLP6500FLQ ACTIVE CLGA FLQ 203 1 Green (RoHS & no Sb/Br) W NIPDAU N / A for Pkg Type Op Temp (°C) Device Marking (4/5) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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