MMIC Power Splitter/Combiner Die 2 Way-0° EP2W-D+ 50Ω 0.5 to 9.5 GHz The Big Deal • Ultra-Wide Bandwidth, 0.5 to 9.5 GHz • High Power Handling, 2.5W as a splitter Product Overview Mini-Circuits’ EP2W-D+ is a MMIC 2-way 0˚ splitter/combiner Die designed for wideband operation from 0.5 to 9.5 GHz supporting many applications requiring high performance across a wide frequency range including all the LTE bands through WiMax an WiFi, as well as instrumentation and more. This model provides excellent power handling up to 2.5W (as a splitter) with low insertion loss, good isolation, and low phase and amplitude unbalance. Manufactured using GaAs IPD technology, the EP2W-D+ provides a high level of ESD protection and excellent repeatability. Key Features Feature Advantages Wideband, 0.5 to 9.5 GHz One power splitter can be used in all the LTE bands through WiMAX and WiFi, saving component count. Also ideal for wideband applications such as military and instrumentation. Excellent power handling • 2.5W as a splitter • 1.7W internal dissipation as a combiner In power combiner applications, half the power is dissipated internally. EP2W-D+ is designed to handle 1.7W internal dissipation as a combiner allowing reliable operation without excessive temperature rise. Similar splitters implemented as Wilkinson splitters on PCB require big resistors and additional heat sinking. As a splitter, EP2W-D+ can handle up to 2.5W. DC Passing DC current passing is helpful in applications where both RF & DC need to pass through the DUT, such as antenna mounted hardware. Unpackaged Die Enables user to integrate it directly into hybrids. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 1 of 5 MMIC Power Splitter/Combiner Die 2 Way-0° EP2W-D+ 50Ω 0.5 to 9.5 GHz Product Features • Wide bandwidth, 0.5 to 9.5 GHz • Excellent amplitude unbalance, 0.1 dB typ. to 6 GHz • Good phase unbalance, 1 to 3 deg. typ. • DC passing • High ESD level Typical Applications +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications • WIMAX • ISM • Instrumentation • Radar • WLAN • Satellite communications • LTE Ordering Information: Refer to Last Page General Description Mini-Circuits’ EP2W-D+ is a MMIC 2-way 0˚ splitter/combiner Die designed for wideband operation from 0.5 to 9.5 GHz supporting many applications requiring high performance across a wide frequency range including all the LTE bands through WiMax an WiFi, as well as instrumentation and more. This model provides excellent power handling up to 2.5W (as a splitter) with low insertion loss, good isolation, and low phase and amplitude unbalance. Manufactured using GaAs IPD technology, the EP2W-D+ provides a high level of ESD protection and excellent repeatability. Simplified Schematic and Pad Description Bonding Pad Position L4 H2 H1 Pad# Function 1 SUM PORT (RF IN 1) 2 PORT 1 (RF OUT 1) 3 PORT 2 (RF OUT 2) Note: 1. Bond Pad material - Gold 2. Bottom of Die is ground - Gold plated 2 W2 3 W1 1 L2 L3 L1 Dimensions in µm, Typical L1 L2 112 3426 L3 L4 W1 3550 3426 W2 H1 H2 124 3426 1775 3550 Thickness Width Length 200 3550 3550 Bond Pad Bond Pad Size, RF-IN Size, RF-OUT 150 x 175 175 x 175 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] REV. OR M163099 EP2W-D+ MCL NY 171011 Page 2 of 5 EP2W-D+ MMIC Power Splitter/Combiner Die Electrical Specifications at 25°C1 Parameter Frequency (GHz) Frequency Range Insertion Loss, above 3.0 dB Isolation Phase Unbalance Amplitude Unbalance VSWR (Port S) VSWR (Port 1-2) Min. Typ. 0.5 Max. Unit 9.5 GHz 0.5 - 1.5 — 1.0 — 1.5 - 3.0 — 1.3 — 3.0 - 6.0 — 1.8 — 6.0 - 9.5 — 3.4 — 0.5 - 1.5 — 9.3 — 1.5 - 3.0 — 19.8 — 3.0 - 6.0 — 19.4 — 6.0 - 9.5 — 10.2 — 0.5 - 1.5 — 0.5 — 1.5 - 3.0 — 0.9 — 3.0 - 6.0 — 1.7 — 6.0 - 9.5 — 2.5 — 0.5 - 1.5 — 0.1 — 1.5 - 3.0 — 0.1 — 3.0 - 6.0 — 0.1 — 6.0 - 9.5 — 0.5 — 0.5 - 1.5 — 1.6 — 1.5 - 3.0 — 1.5 — 3.0 - 6.0 — 1.6 — 6.0 - 9.5 — 1.7 — 0.5 - 1.5 — 1.3 — 1.5 - 3.0 — 1.3 — 3.0 - 6.0 — 1.4 — 6.0 - 9.5 — 1.5 — dB dB Degree dB :1 :1 1. Measured on Mini-Circuits Die Characterization Test Board. Die packaged in 5x5 mm, 32-lead MCLP package. Maximum Ratings Parameter Ratings Operating Temperature -40°C to 85°C Power Input (as a splitter) Internal Dissipation DC Current 2.5W2 max. 1.75W3 max. 0.4A max 2. Derate linearly to 1.25W at 85°C 3. Derate linearly to 1.1W at 85°C Permanent damage may occur if any of these limits are exceeded. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 3 of 5 EP2W-D+ MMIC Power Splitter/Combiner Die Assembly Diagram Assembly and Handling Procedure 1. Storage Dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. ESD MMIC dice are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static workstation. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter ESD damage to dice. 3. Die Attach The Die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet height and epoxy coverage around total Die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s cure condition. It is recommended to use antistatic Die pick up tools only. 4. Wire Bonding Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the Die to the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 4 of 5 EP2W-D+ MMIC Power Splitter/Combiner Die Additional Detailed Technical Information additional information is available on our dash board. Data Table Performance Data Swept Graphs S-Parameter (S2P Files) Data Set with and without port extension(.zip file) Case Style Die Die Ordering and packaging information (Note 5) Quantity, Package Model No. Small, Gel - Pak: 5,10 Medium†, Partial wafer: 160 Max. Large†, Full wafer EP2W-DG+ EP2W-DP+ EP2W-DF+ Available upon request contact sales representative † Refer to AN-60-067 Environmental Ratings ENV-80 5. Dice taken from PCM good wafer. No RF or DC test performed. ESD Rating** Human Body Model (HBM): Class 2 (2000V to <4000V) in accordance with ANSI/ESD STM 5.1 - 2001 ** Tested in industry standard, 5x5mm, 32-lead MCLP package. Additional Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults. E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known Good Dice (including, without limitation, proper ESD preventative measures, Die preparation, Die attach, wire bond ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental effects on Known Good Dice. F. Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini- Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party Notes trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. third-partyand of Mini-Circuits orcontained its products. B. Electrical specifications performance data in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected] Page 5 of 5