1 of 3 Creation Date : November 20, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA4J4C0G2W272J125AE 新製品 TDK item description CGA4J4C0G2W272JT***S Applications Automotive Grade Mid Mid Voltage (100 to 630V) Feature Soft Soft Termination AEC-Q200 AEC-Q200 Series CGA4(2012) [EIA 0805] Status Production Size Length(L) 2.00mm +0.45,-0.20mm Width(W) 1.25mm +0.25,-0.20mm Thickness(T) 1.25mm +0.25,-0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 2.7nF ±5% Rated Voltage 450VDC Temperature Characteristic C0G(0±30ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 Yes Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : November 20, 2017 (GMT) Multilayer Ceramic Chip Capacitors CGA4J4C0G2W272J125AE 新製品 Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance CGA4J4C0G2W272J125AE DC Bias Characteristic CGA4J4C0G2W272J125AE ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Capacitance CGA4J4C0G2W272J125AE Temperature Characteristic CGA4J4C0G2W272J125AE(No Bias) CGA4J4C0G2W272J125AE(DC Bias = 225V) Multilayer Ceramic Chip Capacitors CGA4J4C0G2W272J125AE 新製品 Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : November 20, 2017 (GMT)